JPH1147700A - Method for washing substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make a washing time as short as possible even when the size of the substrate increases. SOLUTION: This method consists in changing the moving speed V in a radial direction of a washing implement in such a manner that the speed is slower linearly in the outer peripheral part than the inner peripheral part between the inner peripheral part (inner peripheral end) which is the central side of rotation and the outer peripheral part (outer peripheral end) at the time of washing the substrate while rotating the substrate and while moving the washing means in the radial direction. Since the moving speed of the washing implement is changed according to the peripheral speed of the substrate, the washing time is shortened.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for cleaning a substrate in a process for manufacturing a device such as a liquid crystal or a semiconductor.

[0002]

2. Description of the Related Art Usually, in the process of manufacturing devices such as liquid crystals and semiconductors, a substrate is cleaned by a cleaning apparatus.

Conventionally, as shown in FIG. 4, a rotary table 2 is disposed in a cylindrical casing 1 and a holding table for holding a substrate W on the upper surface of the rotary table 2 as shown in FIG. A plurality of tools 3 are provided, and a cleaning unit 4 for cleaning the substrate W held on the turntable 2 is provided on a side portion of the casing 1 at an inner periphery which is a rotation center side of the substrate W to be rotated. It is provided so as to be swingable (indicated by an arrow a) so as to cross substantially along the radial direction between the portion and the outer peripheral portion.

The washing means 4 includes a support 11 provided along the casing 1, an arm 12 provided on the support 11 so as to be swingable in a horizontal plane, and an arm 12 Cleaning tool provided at the tip of (for example,
A cleaning brush, a high-pressure water spray nozzle, a high-frequency application unit, and the like are used).

In the above configuration, when cleaning the substrate W, first, the substrate W is held on the turntable 2 by the holder 3 and the turntable 2 is rotated. Next, the cleaning tool 13 is operated to clean the surface of the substrate W while swinging the arm unit 12 at a constant speed substantially in the radial direction of the turntable 2.

[0006]

According to the conventional cleaning method described above, the cleaning tool 13 is moved (oscillated) at a constant speed on the rotation radius of the substrate W. Therefore, the degree of cleaning of the outer peripheral portion distant from the rotation center becomes coarse, that is, the outer peripheral portion of the substrate W cannot be reliably cleaned.

For this reason, in order to surely clean the outer peripheral portion, it is necessary to reduce the moving speed (oscillation speed) of the cleaning tool 13, but the cleaning tool 13 is uniformly moved slowly in the radial direction. In such a case, there is a problem that the cleaning time per one substrate W becomes long.

Accordingly, an object of the present invention is to provide a method for cleaning a substrate which can minimize the cleaning time even when the substrate is enlarged (larger size).

[0009]

In order to solve the above-mentioned problems, a cleaning method according to the present invention provides a method for cleaning a substrate while rotating the substrate and moving the cleaning means in a radial direction. In this method, the moving speed in the direction is changed linearly or stepwise between the inner peripheral portion and the outer peripheral portion on the rotation center side so that the outer peripheral portion is slower than the inner peripheral portion.

According to the above-mentioned cleaning method, the moving speed of the cleaning means is changed according to the peripheral speed of the substrate, so that the cleaning time can be reduced.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS According to a first aspect of the present invention, there is provided a method of cleaning a substrate, the method comprising: cleaning a substrate while rotating the substrate and moving the cleaning means in the radial direction; In this method, the moving speed is changed linearly between the inner peripheral portion and the outer peripheral portion on the rotation center side so that the outer peripheral portion is slower than the inner peripheral portion.

According to a second aspect of the present invention, there is provided a method of cleaning a substrate, wherein the cleaning means is moved in a radial direction when the substrate is cleaned while rotating the substrate and moving the cleaning means in the radial direction. Is changed stepwise between the inner peripheral portion and the outer peripheral portion on the rotation center side so that the outer peripheral portion is slower than the inner peripheral portion.

According to the cleaning method of the present invention, when the cleaning means is moved substantially in the radial direction of the rotating substrate, the cleaning means extends from the inner peripheral portion having a lower peripheral speed to the outer peripheral portion having a higher peripheral speed. Since the moving speed is reduced linearly or stepwise, the degree of cleaning can be made substantially constant over the entire surface of the substrate. The cleaning time can be shortened as compared with the case where the delay is uniformly reduced.

Hereinafter, a method for cleaning a substrate according to the first embodiment of the present invention will be described with reference to FIGS.
Since the gist of the present invention lies in a method of cleaning a substrate, a substrate cleaning apparatus having the same configuration as that described in the conventional example is used, and thus the same components are denoted by the same reference numerals. The description thereof is omitted.

FIG. 1 is a graph showing a moving speed of the cleaning tool, and FIG. 2 is a plan view of a main part showing a moving locus of the cleaning tool. That is, the cleaning method according to the first embodiment linearly changes the moving speed of the cleaning tool 13 in the cleaning unit that moves (oscillates) in an arc along the radial direction of the substrate W to be rotated. The change is such that the outer peripheral portion is slower than the inner peripheral portion on the rotation center side of the substrate W.

The moving speed V of the cleaning tool 13 is expressed by the following equation, and is shown in FIG. 1 by a graph. V = −A × r + B In the formula, r indicates a moving distance (position) of the cleaning tool 13 from the rotation center of the substrate W, and A and B are constants.

Here, the derivation of the above equation will be described. In deriving the above equation, the basic idea is to keep the cleaning probability constant in any region of the substrate W. By doing so, the substrate W The degree of cleaning at the inner peripheral portion and the outer peripheral portion can be smoothed.

As shown in FIG. 2, a certain region S on the substrate W
Assuming that the cleaning probability of _n (n = 1 to 3 in FIG. 2) is x, x is represented by the following equation. During _{x ≒ d × l n / S} n ··· above formulas, l _n is the moving distance of the cleaner 13 (the linear approximation) in the region S _n, d is the nozzle diameter of the spray water cleaning device i.e. cleaning width Is shown. The actual trajectory of the cleaning tool 13 is indicated by a thick line (L).

The above equation is obtained by calculating the rotation angle (Δθ) of the substrate W,
The following equation is obtained by using the moving time (Δt) of the cleaning tool 13 and the moving distance (r) of the cleaning tool 13 in the radial direction.

[0020]

(Equation 1)

In the above equation, since x is constant, if x = k (constant), it can be modified as follows.

[0022]

(Equation 2)

As described above, when the cleaning tool 13 is moved substantially in the radial direction of the rotating substrate W, the inner peripheral portion (the inner peripheral end) having the lower peripheral speed is moved to the outer peripheral portion (the outer peripheral end) having the faster peripheral speed. )
, The moving speed is linearly reduced, so that the degree of cleaning can be made substantially constant over the entire surface of the substrate W. Therefore, in order to reliably clean the outer peripheral portion, the cleaning is performed uniformly in the radial direction. As compared with the case where the moving speed of the cleaning tool 13 is reduced, the cleaning time can be reduced.

Next, a method of cleaning a substrate according to a second embodiment of the present invention will be described with reference to FIG. FIG. 3 is a graph showing the moving speed of the cleaning tool.

In the cleaning method of the first embodiment, the moving speed of the cleaning tool 13 in the radial direction is changed linearly. However, in the cleaning method of the second embodiment,
As shown in FIG. 3, the moving speed V of the cleaning tool 13 is gradually decreased stepwise (stepwise) from the inner peripheral portion (inner peripheral end) to the outer peripheral portion (outer peripheral end). is there.

In this cleaning method, the same effects as in the first embodiment can be obtained.

[0027]

As described above, according to the method for cleaning a substrate according to the present invention, when the cleaning means is moved substantially in the radial direction of the rotating substrate, the inner peripheral portion having a low peripheral speed is used. Since the moving speed is linearly reduced from the portion to the outer peripheral portion where the peripheral speed is fast, the cleaning degree can be made substantially constant over the entire surface of the substrate, and therefore, the cleaning tool can be adjusted in accordance with the peripheral portion speed. The cleaning time can be reduced as compared with the case where the moving speed is uniformly reduced.

[Brief description of the drawings]

FIG. 1 is a graph showing a relationship between a moving distance and a moving speed of a cleaning tool in a cleaning method according to a first embodiment of the present invention.

FIG. 2 is a diagram illustrating the principle of the cleaning method according to the first embodiment.

FIG. 3 is a graph showing a relationship between a moving distance and a moving speed of a cleaning tool in a cleaning method according to a second embodiment of the present invention.

FIG. 4 is a perspective view illustrating a cleaning method in a conventional cleaning apparatus.

[Explanation of symbols]

 W substrate 4 Cleaning means 13 Cleaning tool

Claims (2)

[Claims] When cleaning a substrate while rotating the substrate and moving the cleaning means in the radial direction, the moving speed of the cleaning means in the radial direction is controlled by the inner peripheral portion and the outer peripheral portion which are the rotation center side. Wherein the outer peripheral portion is changed so that the outer peripheral portion is slower than the inner peripheral portion. 2. The cleaning method according to claim 1, wherein when the substrate is cleaned while rotating the substrate and moving the cleaning unit in the radial direction, the moving speed of the cleaning unit in the radial direction is changed between the inner peripheral portion and the outer peripheral portion on the rotation center side. Wherein the outer peripheral portion is changed stepwise so as to be slower than the inner peripheral portion.