JPH1146099A - Setting of camera offset - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of setting a camera offset, which prevents the generation of irregularities in the setting of the camera offset, due to an adjuster and a defective accuracy due to an adjuster and can set the camera offset simply and accurately, at the time of the setting of the camera offset in an electronic component mounting device with a board hole position recognition camera. SOLUTION: This method is executed, wherein a mold of a an insertion tool 7 is made on a gum material 11 set on a positioning table 8 on a board 3 (a first process), the gum material formed with the mold is moved by the table 8 from the position of the tool 7 to the position of a camera 9 as much as the component of a temporary camera offset (a second process), while the projected image, which is enlarged and projected on a monitor 10 by the camera 9, of the cool 7 on the material 11 is seen, the position of the table 8 is finely adjusted (a third process) in such a way that the projected image is positioned in the center of the camera and a setting of the value of a camera offset is made by adding the amount of the fine adjustment in a third process to the component of the temporary camera offset in the second process (a fourth process), and the setting of the camera offset is made simply and accurately.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for setting a camera offset in an electronic component mounting apparatus for automatically inserting electronic components into insertion holes formed at predetermined positions on a substrate.

[0002]

2. Description of the Related Art A conventional electronic component mounting apparatus is shown in FIGS. This electronic component mounting apparatus is capable of positioning an insertion tool 27 for inserting a lead wire 22 of an electronic component 21 into an insertion hole 24 formed at a predetermined position of a substrate 23, and an arbitrary position while holding the substrate 23. Table 28
And a camera 29 and a monitor 30 capable of visually recognizing the insertion hole 24 of the substrate 23 and recognizing the amount of deviation between the center of the insertion hole 24 and the camera center.

The insertion tool 27 forms the lead wire 22 of the electronic component 21 into a predetermined shape, and
4 has an insertion guide 26 formed with a V groove 25 for guiding the lead wire 22.

A method of setting a camera offset in the electronic component mounting apparatus will be described with reference to FIGS. Now, consider a state in which the substrate 23 is held on the table 28 at the origin, and as shown in FIG. 13, the center 34 of the pair of insertion holes 24 formed at predetermined positions.
A to the center 32 of the insertion tool 27 from
(Hereinafter referred to as “a”), and the vector from the center 32 of the insertion tool 27 to the center 33 of the camera 29 is represented by b.
(Hereinafter, referred to as “b”). In this case, “b” is called a camera offset.

Generally, in an electronic component mounting apparatus, electronic components are continuously inserted into a large number of substrates.
The position of the third insertion hole 24 varies as shown by a solid line or a broken line in FIG.
It is assumed that the vector of the displacement between the insertion hole 24 of the substrate 23 and the insertion hole 31 of another substrate (indicated by a broken line) considered as a reference is c (hereinafter, referred to as “c”).

Each time the table 28 is positioned at the same position and moved by "a", the center 34 of the insertion hole 24 coincides with the center 32 of the insertion tool 27. However, when the center 35 of the insertion hole 31 is an insertion hole 31 of another substrate shifted by “c”, the insertion tool 2
Since the center 32 of the insertion hole 31 and the center 32 of the insertion hole 31 are displaced from each other, it causes an insertion error.

Therefore, the camera 29 is used to self-correct the position of the insertion hole 35 for each substrate and perform positioning, thereby improving the reliability at the time of insertion. Next, this self-correction method will be described with reference to FIG.
First, in the first step, the substrate 23 is moved “a” + “b” by the table 28 from the origin state to the camera 29 position. As a result, a vector d (hereinafter simply referred to as “d”) of a deviation between the center 33 of the camera 29 and the center 35 of the insertion hole 31 is recognized, and then the table 28 is once returned to the origin state.

In the second step, as shown in FIG.
In consideration of the position shift “d” of the insertion hole 31 of the board 23 recognized in the process, the table 28 is moved by “a” − “d”. When the setting of the camera offset is completely accurate, “c” "D" coincides with the center 35 of the insertion hole 31 of the substrate 23 and the center 32 of the insertion tool 27.
Will match. The above is the principle of self-correction.

However, as shown in FIGS. 15 and 16, the camera 2 is moved from the center 32 of the actual insertion tool 27.
The “b” heading toward the center 33 of No. 9 is strictly different from the camera offset b ′ (hereinafter simply referred to as “b ′”) on the data specifying the amount of movement of the table 28. This is because the exact value of the camera offset is unknown at this point.

When self-correction is performed, the table 28 is set to "a".
-"D" moves, so that the actual necessary movement amount "a"-"c" is ((a)-"d")-("a"
− “C”) = − “d” + “c”.

Here, as is apparent from FIG.
Since “d” + “c” = “b” − “b ′”, “b”
It can be seen that the difference between “b” and “b ′” is the accuracy of the insertion hole position shift after using the self-correction function.

Here, a conventional camera offset setting method will be described with reference to FIG. 17. In the first step, the substrate is moved from the origin state to the camera position by the table by using "a" +
After moving by “b ′” and recognizing “d”, the table is once returned to the origin state.

In the second step, the table 28 is moved by "a"-"d" in consideration of the position shift of the insertion hole of the substrate 23 recognized in the first step, and the substrate 23 is set at the position of the insertion tool 27. .

In the third step, the V of the insertion guide 26 is actually
Deviation between the position of the groove 25 and the insertion hole 31 of the substrate 23, that is,
“B” − “b ′” are visually read, and the camera offset value “b ′” itself is corrected.

[0015]

However, in the above-described method, the positional deviation between the V-groove 25 of the insertion guide 26 and the insertion hole of the substrate, that is, "b"-"b '" is visually read. At present, it is not possible to improve the accuracy, and there is a variation of about 0.1 mm by the adjuster.
Skill is required to read "b"-"b '" visually.

Therefore, despite the fact that the accuracy of 1/100 mm level can be achieved in the recognition of the insertion hole in the camera, the positioning of the table, and the like, the advantage of the self-correction function due to the variation in the adjustment of the final camera offset value. In some cases, it could not be fully demonstrated.

An object of the present invention is to provide a camera offset setting method capable of solving the above-mentioned problems.

[0018]

According to the present invention, there is provided a first step of forming a mold of an insertion tool in a gum material set on a positioning table of a substrate, and forming the gum material on the positioning table. The second step of moving by a predetermined amount from the position of the insertion tool to the position of the camera by the movement, that is, the temporary camera offset, and while viewing the image of the gum material of the insertion tool enlarged and projected on the monitor by the camera, A third step of finely adjusting the position of the table so that the center of the mold is positioned at the camera center;
The fourth step of setting the camera offset value by adding the fine adjustment amount of the third step to the provisional camera offset in the step. The camera offset setting method makes it possible to easily and accurately set the camera offset. It becomes possible.

The gum material is an elastic material, but is deformed by applying pressure, and is cured by elapse of time, heating, etc. after taking a mold of an insertion tool.

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a method and an apparatus for setting a camera offset according to an embodiment of the present invention will be described with reference to the drawings. First, a setting device according to a first embodiment of the present invention will be described with reference to FIGS.

The camera offset setting device is capable of positioning an insertion tool 7 for inserting the electronic component 1 into an insertion hole 4 formed at a predetermined position of the substrate 3 and an arbitrary position while holding the substrate 3. A table 8 is provided with a camera 9 and a monitor 10 capable of visually recognizing the insertion hole 4 of the substrate 3 and recognizing the amount of displacement between the center of the insertion hole 4 and the camera center.

The insertion tool 7 is used to connect the lead 2 of the electronic component 1
Is formed into a predetermined shape, and has an insertion guide 6 which can be moved up and down and has a V-groove 5 for guiding the lead wire 2 when inserted into a predetermined insertion hole 4 of the substrate 3.

The reference numeral 11 in FIG. 2 denotes an elastic gum material (an example of a mold material) which is set on the table 8 and which is deformed by applying pressure and hardens with the lapse of time. It is.

Next, a method of setting the camera offset will be described with reference to FIGS. First, in the first step, FIG.
As shown in FIG. 7, the gum material 11 is set on the table 8, and the insertion guide 6 of the insertion tool 7 is lowered and pressed against the gum material 11 to conform to the shape of the tip of the insertion tool 7 including the V groove 5. A mold (recess) 12 is formed. Then, the gum material 11 cures while holding the mold 12 accurately.

In the second step, the gum mold 12 is moved from the position of the insertion tool 7 to the position of the camera 9 by the positioning table 8. However, since an accurate camera offset value has not been determined at this time, it is assumed that the camera is moved by f (hereinafter referred to as “f”) as a temporary camera offset as shown in FIG.

In the third step, as shown in FIG. 8, the adjuster displays the image on the monitor 10 while viewing the image of the gum mold 12 of the insertion tool 7 enlarged and projected on the monitor 10 by the camera 9. The position of the table 8 is adjusted so that the table 8 is located at the camera center 13. The adjustment amount at this time is g (hereinafter, referred to as “g”).

In the fourth step, the camera offset value is set mechanically by adding "g" in the third step to "f" in the second step. That is, the camera offset is “f” + “g”.

According to the camera offset setting method in the first embodiment, the gum mold 12 of the insertion guide 6 is enlarged and displayed on the monitor 10, and in this enlarged display state,
Further, since the camera center 13 is centered while being displayed on the same monitor 10, the error of the camera offset setting is small (for example, when the monitor is displayed at 5 magnifications, it is 0.1 mm as described in the related art). Variation in level setting can be suppressed to 1/5 of 0.02 mm), accurate self-correction can be performed, and reliability in inserting the lead wire 2 of the electronic component 1 can be improved.

Next, a camera offset setting method according to the second embodiment of the present invention will be described with reference to FIG.
Note that the configuration of the setting device is the same as in the first embodiment, and a description thereof will be omitted.

In the second embodiment of the present invention, in the first step, as shown in FIG. 7, the insertion guide 6 of the insertion tool 7 is lowered and pressed against the gum material 11 set on the table 8 to form the mold 12. To form The mold 12 of the V groove 5 of the insertion guide 6 is formed in the gum material 11 and hardened.

In the second step, the gum mold 12 of the gum material 11 is moved by a predetermined distance from the position of the insertion tool 7 to the position of the camera 9 by the positioning table 8, but the exact camera offset value has not been determined at this time. Therefore, it is assumed that the camera moves by the temporary camera offset “f”.

In the third step, the adjuster recognizes the center of the gum mold 12 of the insertion tool 7 by the camera 9 and recognizes the shift “g” from the camera center 13. In the fourth step,
The camera offset value is set by adding “g” to “f” in the second step (that is, the camera offset is “f” + “g”).

According to this method, the camera 9 recognizes the center of the gum mold 12 of the insertion tool 7 by the camera 9, so that the camera offset (the distance between the insertion tool 7 and the camera center) can be set independently of the observer. Therefore, more accurate camera offset setting can be performed, and accurate self-correction can be performed to improve insertion reliability.

[0034]

As described above, according to the present invention, the first step of forming the mold of the insertion tool on the mold set on the substrate positioning table, and using the mold from the position of the insertion tool to the position of the camera using the positioning table. A second step of moving by a temporary camera offset, and a third step of fine-adjusting the table position so that it is positioned at the camera center while viewing the image of the mold material enlarged and projected on the monitor by the camera; Since the fourth step of setting the camera offset value by adding the fine adjustment amount of the third step to the provisional camera offset of the second step, the camera offset setting can be performed easily and accurately.

[Brief description of the drawings]

FIG. 1 is an overall perspective view of an electronic component mounting apparatus according to a first embodiment of the present invention.

FIG. 2 is a partially enlarged perspective view of the electronic component mounting apparatus.

FIG. 3 is an enlarged perspective view of an insertion guide portion of the electronic component mounting apparatus.

FIG. 4 is a flowchart of a camera offset setting method.

FIG. 5 is a conceptual plan view showing a part of a flow of a camera offset setting method.

FIG. 6 is a side view conceptually showing a part of a flow of a camera offset setting method.

FIG. 7 is an enlarged perspective view of a state in which a mold for an insertion guide is formed on the gum material.

FIG. 8 is a plan view of a mold similarly projected on a monitor.

FIG. 9 is a flowchart of a camera offset setting method according to the second embodiment of the present invention.

FIG. 10 is an overall perspective view of a conventional electronic component mounting apparatus.

FIG. 11 is a partially enlarged perspective view of the electronic component mounting apparatus.

FIG. 12 is an enlarged perspective view of an insertion guide portion of the electronic component mounting apparatus.

FIG. 13 is an explanatory diagram of self-correction.

FIG. 14 is an explanatory diagram of self-correction.

FIG. 15 is an explanatory diagram of self-correction.

FIG. 16 is an explanatory diagram of a problem of the camera offset setting method.

FIG. 17 is a flowchart of a camera offset setting method.

[Explanation of symbols]

 3 Board 4 Insertion hole 7 Insertion tool 8 Table 9 Camera 10 Monitor 11 Gum material f Temporary camera offset g Gap between center of gum material and center of camera

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Yoshikazu Yoshimura 1006 Kadoma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (3)

[Claims] 1. A method for setting a camera offset value of an electronic component mounting apparatus with a board hole position recognizing camera, comprising: a first step of forming a mold of an insertion tool on a mold set on a board positioning table; The second step of moving the mold material from the position of the insertion tool by the movement of the positioning table to the position of the camera by the temporary camera offset, and the center of the mold while watching the image of the mold material enlarged and projected on the monitor by the camera. A third step of manually fine-adjusting the table position so as to coincide with the camera center; and setting the camera offset value by adding the fine adjustment amount of the third step to the provisional camera offset in the second step. A camera offset setting method including a fourth step. 2. A method for setting a camera offset value of an electronic component mounting apparatus with a board hole position recognizing camera, comprising: a first step of forming a mold of an insertion tool on a mold set on a board positioning table; A second step of moving the mold material from the position of the insertion tool to the position of the camera by moving the positioning table by a temporary camera offset; And a fourth step of setting a camera offset value by adding a shift amount of the third step to the provisional camera offset in the second step. 3. The camera offset setting method according to claim 1, wherein an elastic gum material is used as the molding material.