JPH1146085A - Computer case body chassis and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a computer chassis which is superior in a recycle property having a transparent property and an effect for electromagnetic shield and so on with less changes with respect to change in time change by making the part of a chassis of lead glass having a transparent and electromagnetic shield property. SOLUTION: All a front cover 2, an upper chassis 3 and a lower chassis 4 is made by molding lead glass containing 35 to 40 wt.% of oxide lead. In the case that a ratio of oxide lead is too low, an obtained effect of anti- electrostatic or electromagnetic shield is reduced. In the case that the component of oxide lead is too high, melting temperature of lead glass is decreased, and the chassis is easily deformed by heating in the case of functioning chassis constructing parts. Therefore a content of oxide lead in lead glass is preferably set to be 15 to 55 wt.%. A nickel layer 12 which is a barrier layer for preventing metal from perfusion is formed on the surfaces of a front cover 2, the upper chassis 3 and the lower cover 4 which are various chassis type parts by vacuum evaporation, and a gold layer is formed on the surface of nickel layer by vacuum evaporation.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a housing forming an outer shell of a computer and a method of manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, as a casing forming an outer shell of a computer, a casing formed by press-molding a metal into a predetermined shape, a casing formed by injection-molding a synthetic resin or the like are used.

[0003]

In these conventional housings, a housing made of metal has an effect of preventing static electricity and shielding electromagnetic waves.
It is necessary to take measures against oxidation such as painting, etc.When recycling these casings, it is necessary to carry out processing such as peeling off these paintings, etc. It was not possible to create a housing having the property.

In a case using a synthetic resin or the like, these resins are inferior to the above metals in terms of weather resistance, and the synthetic resin has a high electric insulating property and does not have an antistatic or electromagnetic shielding effect. To take measures,
It is necessary to adhere a conductive metal foil or the like to the inner surface of the housing, or to apply a conductive paint or the like to the inner surface. If such processing is performed, the housing is recycled. In this case, recycling is not possible unless the metal foil or the conductive paint is removed, which requires a great deal of labor and cost, and is not actually recycled. There has been a problem that it is impossible to create a transparent housing like a metal housing.

The present invention has been made in view of the above-mentioned problems. The present invention has an effect of electromagnetic shielding and the like while being transparent, has little aging, and has a low recyclability. An object is to provide an excellent computer housing and a method for manufacturing the same.

[0006]

In order to solve the above-mentioned problems, a computer housing according to the present invention is a housing forming an outer shell of the computer, and at least a part of the housing is transparent. It is made of lead glass having electromagnetic shielding properties. According to this feature, the lead glass has transparency, and since it has electromagnetic shielding ability, it can be a transparent and electromagnetic shielding effect housing, and the design of the housing can be enhanced, Because lead glass is a very stable compound, it can be used as a permanent housing with little aging,
It can be easily recycled like ordinary glass.

In the computer housing according to the present invention, it is preferable that the lead glass is a lead glass irradiated with an electron beam. With this configuration, lead is selectively deposited on the surface of the lead glass by the browning phenomenon, so that a higher electromagnetic shielding effect and an antistatic effect can be imparted to the housing.

[0008] In the computer housing of the present invention, it is preferable to provide a conductive metal or metal oxide thin film layer on at least one entire surface of the lead glass. By doing so, a casing having a higher electromagnetic shielding effect and a higher static electricity preventing effect can be obtained, and the thin film layer of these metals or metal oxides can be easily removed from the lead glass with a predetermined etching solution. Because it can be done, it does not impair recyclability.

In the computer housing of the present invention, it is preferable that a barrier layer for preventing diffusion of the metal or metal oxide is provided between the metal or metal oxide thin film layer and the lead glass. By doing so, it is possible to prevent the metal or metal oxide thin film layer from being diffused into the lead glass for a long period of time, thereby reducing the electromagnetic shielding effect and the static electricity prevention effect.

The method for manufacturing a computer housing according to the present invention comprises:
The present invention is characterized in that each housing component made of lead glass which is transparent and has electromagnetic shielding properties is bonded and integrated with a low melting point lead glass having a lower melting point than the lead glass forming the housing component. According to this feature, a large-sized housing can be easily manufactured by bonding and integrating a plurality of housing components, and by using a glass frit made of low-melting lead glass, the housing can be manufactured. The body components are not deformed by heating, the housing components can be bonded and integrated with high accuracy, and the glass frit made of these low-melting lead glass is compared to the lead glass of the housing. Since the amount is very small, it is possible to recycle these low-melting-point lead glasses without separation at the time of recycling.

[0011]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is an external perspective view showing a computer housing according to a first embodiment of the present invention.
FIG. 3 is a schematic diagram illustrating a cross-sectional configuration of a computer housing according to the first embodiment of the present invention, and FIG. 3 is a schematic diagram illustrating a method of manufacturing the computer housing according to the first embodiment.

As shown in FIG. 1, the computer housing of the first embodiment includes a front cover 2, an upper housing 3, and a lower housing 4 of a computer main body 1.
The lower housing 4 is made of a low melting point lead glass 1 by a method described later.
4 'adheres and integrates to form a main body housing 1'.

As shown in FIG. 1, the front cover 2 and the main body housing 1 'are joined by a slide-type storage rail 10, and a portion of the rail on the front cover 2 side is provided with: Central processing unit (C) which is the heart of the computer
A main board 6 on which various devices such as a PU 7 and a system memory (SIMM) 8 are mounted is mounted. The front cover 2 and the main board 6 are separated from the main body housing 1 ′ by the sliding storage rail 10. It is possible to withdraw,
A power supply unit 9 is stored inside the main body housing 1 '.

In the first embodiment, the front cover 2, the upper case 3, and the lower case 4 are all made of lead oxide (PbO) of 35-4.
It is made by molding lead glass containing 0% by weight,
If the ratio of the lead oxide is too small, the antistatic effect and the electromagnetic shielding effect of the obtained housing will be reduced, and if the component of the lead oxide is too large, the melting point of the lead glass will be reduced, which will be described later. It is preferable that the lead oxide content of these lead glasses be 15 to 55% by weight, since the housing is likely to be deformed during heating when the housing components are joined.

The method of molding the front cover 2, the upper casing 3, and the lower casing 4 is similar to a conventional molding method of soda glass or the like. After heating to the softening temperature, a method of pressing, molding, and cooling in a molding die having a predetermined shape can be used.
After heating to about 0 degrees, molding is performed in a predetermined mold.

In the first embodiment, the front cover 2 and the upper housing 3, which are various housing parts obtained by the molding,
A nickel (Ni) layer 12 which is a barrier layer for preventing metal diffusion as shown in FIG. 2 on the surface of the lead glass facing the inside of the lower housing 4 as shown in FIG. A gold (Au) layer is formed on the surface of the nickel layer 12 by vacuum evaporation.

If the thickness of each of the metal layers is too small in the nickel layer 12 as the barrier layer, a sufficient barrier effect cannot be obtained, and the gold layer 13 diffuses into the lead glass layer 11. And the gold layer 13 disappears,
If this is too thick, light transmittance will decrease,
The thickness is preferably in the range of 0.05 to 0.2 micron. In the first embodiment, the thickness is set to 0.1 micron. Prevention effect and electromagnetic shielding effect cannot be obtained,
If the thickness is too large, the light transmittance decreases and the cost increases. Therefore, it is preferable that the thickness be in the range of 0.2 to 1 micron. In the first embodiment, the thickness is set to 0.3 micron. And

As described above, the upper housing 3 and the lower housing 4 provided with the respective metal layers are bonded and integrated with the connection surfaces 5 and 5 'by the low melting point lead glass 14' to form the main housing 1 The method of bonding and integrating will be described with reference to FIG. 3. The bonding surface 5 of one of the upper housing 3 and the lower housing 4 (the lower housing 4 in the first embodiment). And the softening temperature is 4
A glass frit 14 in which fine powder of a low melting point lead glass 14 'having a temperature of 50 degrees is dispersed in an organic binder and a solvent is applied and dried (FIG. 3A).

Thereafter, the glass frit is heated to about 450 ° C., which is a temperature at which the glass frit is once softened, to thermally decompose the organic binder.
A part of 4 ′ is softened and leveled, and then cooled once (FIG. 3 (c)).

Next, while the joining surface 5 'of the upper housing 3 is in contact with the joining surface 5 of the lower housing 4 via the low melting point lead glass layer 14', heating is performed to soften the low melting point lead glass layer. Then, bonding and integration are performed, and then the cooling is performed to obtain the main body housing 1 ′.

Examples of the low melting point lead glass 14 'include lead borosilicate glass mixed with boron.

With this configuration, the bonding and integration can be performed at a temperature sufficiently lower than the temperature at which the lead glass constituting the housing is softened, so that there is no problem that the housing is deformed by heating. By using these small casing parts, it is possible to easily perform molding, vapor deposition processing for providing a metal layer, and the like.

In the first embodiment, the metal layer on the surface of the lead glass is formed before the housing parts are bonded and integrated. Processing such as polishing the protrusions may be performed,
In this case, although the connection portion needs to be processed as described above, the speed at which the metal layer diffuses into the lead glass increases at high temperatures. It is preferable because it can be performed.

In the first embodiment, each metal layer is made of a conductive metal such as nickel or gold.
Instead of these metals, a metal oxide having conductivity, for example, a thin film of tin oxide, indium oxide, or the like that exhibits transparency may be used.

The barrier layer may be made of a material which hardly forms an alloy with lead and which does not easily form an alloy with a metal formed on the surface thereof. Nickel is preferred as a barrier layer from such a viewpoint.

Further, in the first embodiment, the metal layer is formed only on the inner surface of the housing. However, the metal layer may be formed on the front surface of the housing. 1
Although vacuum deposition is used in this method, it may be formed by another method, for example, a process such as electroless plating, and a forming method according to a metal to be formed may be appropriately selected.

When the electromagnetic shielding effect of the computer housing thus manufactured was measured, the attenuation of the electromagnetic wave of 1 GHz was -30 dB at a lead glass thickness of 7 mm, and the visible light transmittance in this case was -30 dB. Is about 6
It was 0%.

(Embodiment 2) In Embodiment 2, instead of providing a metal layer on each of the casing parts molded in Embodiment 1, each of the casing parts is put into an electron beam irradiation apparatus.
After performing electron beam irradiation for a predetermined time in a vacuum, bonding and integration are performed in the same manner as in Example 1 to form a computer housing.

By the above-mentioned electron beam irradiation, the lead glass comes to have a light brownish color, and on the surface thereof, lead oxide in the lead glass is reduced, and the lead glass is precipitated as a single element of lead. Since lead is present at a high concentration on the lead glass surface, the electromagnetic shielding property and the antistatic function are improved as compared with the lead glass alone.

When the electromagnetic shielding effect of the casing obtained in the second embodiment was measured, the attenuation of the electromagnetic wave of 1 GHz was -25 dB at the same lead glass thickness of 7 mm as in the first embodiment. In this case, the visible light transmittance was about 75%.

[0032]

The present invention has the following effects.

(A) According to the first aspect of the present invention, since the lead glass has transparency and electromagnetic shielding ability, the lead glass can be made transparent and has an electromagnetic shielding effect. As well as improving the design of the body, the lead glass is a very stable compound, so it has little aging and can be used as a permanent housing, and it can be recycled like general glass. It can be easily implemented.

(B) According to the second aspect of the invention, the lead is selectively deposited on the surface of the lead glass by the browning phenomenon, so that a higher electromagnetic shielding effect and a higher antistatic effect are imparted to the housing. Can be.

(C) According to the third aspect of the present invention, a casing having a higher electromagnetic shielding effect and a higher static electricity preventing effect can be obtained. Since it can be easily removed from lead glass with an etching solution, the recyclability is not impaired.

(D) According to the invention of claim 4, the thin film layer of the metal or metal oxide is diffused into the lead glass for a long period of time, and the electromagnetic shielding effect and the antistatic effect are reduced. Can be prevented.

(E) According to the fifth aspect of the present invention, a large casing can be easily manufactured by bonding and integrating a plurality of casing components, and a low melting point lead glass can be used. By using the glass frit, the housing components are not deformed by heating, the housing components can be bonded and integrated with high accuracy, and the glass frit made of the low melting point lead glass can be used. Since the amount is small compared to the lead glass of the case,
At the time of recycling, these low melting point lead glasses can be recycled without being separated.

[0038]

[Brief description of the drawings]

FIG. 1 is an external perspective view illustrating a computer housing according to a first embodiment of the present invention.

FIG. 2 is a sectional configuration diagram of a computer housing according to the first embodiment of the present invention.

FIG. 3 is a schematic view illustrating a method for manufacturing a computer housing according to the first embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Computer main body 1 'Main housing 2 Front lid 3 Upper housing 4 Lower housing 5, 5' Adhesive surface 6 Main board 7 Central processing circuit (CPU) 8 System memory (SIMM) 8 9 Power supply unit 10 Retractable slide Rail 11 Lead glass 12 Nickel layer (barrier layer) 13 Gold layer (metal layer) 14 Glass frit 14 'Low melting point lead glass

Claims (5)

[Claims] 1. A computer case forming an outer shell of a computer, wherein at least a part of the case is made of lead glass which is transparent and has electromagnetic shielding properties. 2. The computer housing according to claim 1, wherein the lead glass is a lead glass irradiated with an electron beam. 3. The computer casing according to claim 1, wherein a thin film layer of a conductive metal or metal oxide is provided on at least one side of the lead glass. 4. The computer housing according to claim 3, wherein a barrier layer for preventing diffusion of said metal or metal oxide is provided between said thin film layer of metal or metal oxide and lead glass. 5. Bonding each housing component made of lead glass which is transparent and has electromagnetic shielding properties to a low melting point lead glass having a lower melting point than the lead glass forming said housing component.
A method for manufacturing a computer housing, wherein the method is integrated.