JPH1146068A - Evaluation of process of manufacturing multilayered interconnection board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To inspect a multilayered board for evaluation use, which is transferred separately from multilayered boards, which are products and is manufactured at the time of the rise of a process line of manufacturing a multilayered interconnection board, comprising processes of manufacturing the multilayered interconnection board, and to evaluate the conditions of treatments of the processes. SOLUTION: A multilayered interconnection board is manufactured by such a method that before a rise of a process line of manufacturing the multilayer interconnection board, which comprises a wiring board lamination process, a through-hole prime-perforating process, a through-hole plating process and a surface and rear layer-patterning process, an internal layer board arranged with patterns 2 for void inspection use is held between surface and rear boards to laminate wiring boards, a multilayered board 10 for evaluation use with patterns 3 for hole deviation inspection use and patterns 4 for through-hole continuity inspection use, which are respectively formed on the surface and rear of this laminated board, is manufactured separately from multilayered boards, which are products, the above respective patterns 2, 3 and 4 for inspection use of the board 10 are inspected and the conditions of treatments of the above respective processes and the states of the processes are evaluated by the result of this inspection.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for evaluating a manufacturing process of a multilayer wiring board, and more particularly, to a method for evaluating a substrate lamination, a through hole drilling, a pilot plating process, and a front and back layer patterning process.

Inspection of a multilayer wiring board completed through these processes in a multilayer wiring board manufacturing process line,
In the method of evaluating the processing conditions of each process from the inspection results, there are problems such as slow feedback of the inspection results to the line and it is difficult to identify the process source that caused the defective product. It is desired that at least anyone can inspect a substrate on the same basis and evaluate processing conditions quickly and easily on the same scale.

[0003]

2. Description of the Related Art A multi-layered wiring board is prepared by preparing a wiring board having an inner layer wiring pattern formed on one side by a separate process, aligning a plurality of wiring boards with a prepreg sandwiched therebetween, and thermocompression bonding. To form a multilayer wiring board.

A manufacturing process line for manufacturing a multilayer wiring board includes a laminating process for laminating the wiring boards and a drilling of large and small diameter through holes (a large diameter connects lead components, and a small diameter connects between layers). It is configured to include a process, a plating process of plating a lower hole thereof, and a patterning process of forming a wiring pattern including through-hole lands on the front and back layers of the laminated multilayer wiring board.

In the conventional evaluation method, a product (multilayer wiring board) completed through these processes is extracted, and the presence or absence of voids, displacement of through-holes, and plating defects by inspection of continuity of through-holes (if necessary) Sampling cross-section inspection is performed), and the processing and processing conditions of each process are evaluated based on the inspection result.

[0006] The inspection is performed by a specialized inspector or a line worker himself.

[0007]

However, according to the above-mentioned evaluation method, the size, the number of laminated substrates, and
The position and number of through holes, etc., and the shape of the wiring pattern are not constant and cannot be evaluated on a unified scale, or the type of multilayer wiring board is diversified and there are inspection errors such as missing For example, there is a problem that a large number of sample products are required because the parameter to be evaluated is low or the number of through holes is small, for example.

In view of the above problems, the present invention examines a multilayer wiring board manufactured separately from a product at the start of a manufacturing process line and evaluates the processing conditions of each process. The aim is to provide a method.

[0009]

In order to achieve the above object, a method for evaluating a multilayer wiring board manufacturing process according to the present invention comprises a wiring board laminating process, a through-hole preparation process, and a through-hole plating process. Before the start of the manufacturing process line of the multilayer wiring board including the front and back layer patterning process, the inner layer substrate on which the void inspection pattern is arranged is laminated between the front and back substrates,
A multilayer board for evaluation in which a pattern for hole displacement inspection and a pattern for through-hole continuity inspection are formed on the front and back surfaces of the laminated substrate is manufactured separately from the product, and the respective inspection patterns of the multilayer board for evaluation are inspected. The processing conditions and state of each of the processes are evaluated based on the inspection result.

With this configuration, it is possible to check the presence or absence of voids due to residual gas in the laminating process by using the void inspection pattern formed before laminating the substrates. In addition, a hole misalignment inspection pattern is formed with a prepared hole of the through hole formed in the peripheral portion with reference to one of the four corners of the laminated substrate, and the misalignment is inspected. Can be checked for positioning failure and setting failure on the processing table.

In the front and back layer patterning process, the through hole continuity test pattern is formed as a single wiring in which a plurality of through holes are connected alternately and continuously on the front and back layers, so that the continuity at two points at both ends is formed. Inspection can check the plating failure of the through hole in the plating process.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The gist of the present invention will be described below in detail with reference to the embodiments shown in the drawings. The evaluation method of the manufacturing process of the multilayer wiring board of the present invention inspects an evaluation multilayer board manufactured separately from a product at the start of the manufacturing process line, and based on the inspection result, a wiring board laminating process and a through hole. The processing conditions and conditions of the pilot hole forming process, the plating process of the pilot hole, and the patterning process of forming a wiring pattern on the front and back surfaces are evaluated.

The inspection target of the multilayer board for evaluation is not a single layer but a stacked multilayer wiring board. Therefore, the presence or absence of voids, the displacement of the prepared hole, or the displacement of the through-hole land with respect to the through-hole are examined. And electrical conduction failure of the through hole.

FIG. 1 is a plan view of an evaluation board according to an embodiment of the present invention. The figure shows a size of 510 mm long x 340 m wide
An example of the evaluation multi-layer substrate 10 having a thickness of 2 mm and a thickness of 2 mm and including front and back layers is illustrated. Positioning holes 1 having a diameter of 5 mm to be set on a processing table of a not-shown drilling device are arranged at four corners of the multilayer substrate 10 for evaluation, and a void inspection pattern 2 (see FIG. 2), a hole shift detecting pattern 3 (see a partial enlarged view of FIG. 3), and a through-hole continuity inspection pattern 4 (see FIG. 4).
(Refer to the partially enlarged view of Figure 2).

First, the void inspection pattern 2 will be described. (Refer to FIG. 1 and FIG. 2) One of the void generation factors is that the flow of the molten prepreg is poor in the lamination process, and the gas remains between the inner layer and the prepreg, resulting in insufficient adhesion. It is easy to occur in the portion surrounded by the wiring pattern and easily in the center of the product substrate.

Therefore, as shown in FIGS. 1 and 2, the void inspection pattern 2 has four key-shaped patterns 21a.
Are symmetrically arranged with a gap G (gas vent passage) having a width of 5 mm, arranged at four corners having a side of 30 mm square, and a grid-shaped solid having a region S (FIG. 2) having a side of 20 mm square without a pattern inside. A plurality of patterns 21 are arranged in a central region B (FIG. 1) of an inner layer (for example, a third or fourth inner layer) in which voids are easily generated. (In FIG. 1, three locations are indicated by solid lines instead of broken lines.) By inspecting the void inspection pattern, the presence or absence of voids can be inspected.

Next, the hole shift detecting pattern 3 will be described. (See FIGS. 1 and 3.) One of the causes of the misalignment of the pilot hole is the drilling accuracy. Due to poor positioning of the drill head of the drilling device in the orthogonal direction and poor setting on the processing table, the thicker the lamination thickness, the more the drill may bend and the rear surface may be displaced.

The hole shift detecting pattern 3 is formed by drilling a plurality of pilot holes 3a in a peripheral portion including four corners of the laminated substrate in a through hole drilling process. As shown in FIG. 3, the diameter of the prepared hole 3a is 0.3 mm, which is the same minimum diameter as the product.
5 mm (shaded area), one side is 0.75 mm minimum dimension
At the center of the square through-hole land 3b.

The pilot hole 3a tends to shift in a certain direction because the hole is formed by stepping one of the four corners of the laminated substrate with respect to the reference (origin P), and the deviation tends to accumulate as the distance from the origin P increases. For this reason, the prepared hole includes four corners of the area A, for example, including two corners of 6 so that inspection can be performed even if any of the four corners is the origin P.
Place them evenly in the place.

By inspecting the hole misalignment detection pattern, if the through hole is not located at the center of the through hole land, it is either the misalignment of the through hole or the misalignment of the through hole land. judge. Alternatively, it is inspected whether the through-hole is laterally shifted between the front and back surfaces.

Next, the through hole conduction inspection pattern 4 will be described. (See FIGS. 1 and 4.) In order to inspect plating defects in the through-holes, the through-hole continuity inspection pattern 4 is arranged in each of the two regions C and D obtained by dividing the laminated substrate into two in the central region B. In addition,
The through hole continuity inspection pattern 4 in the region D is not shown.

This through hole continuity inspection pattern 4
Has a pitch of 2. in the lateral direction X in the piloting process.
A pilot hole 4a having a small diameter of 0.35mm is drilled at the center of a 0.75mm square through-hole land 4b arranged at a pitch of 5.08mm in the vertical direction 54mm and further plated in the pilot hole 4a in the plating process (not shown). ), And furthermore, in a patterning process of etching a copper foil on the front and back surfaces by a known photolithography technique to form a wiring pattern, a connection pattern 4b-1 of the surface layer and the back surface are formed between the through-hole lands 4b. It is composed of one line formed by connecting alternately with the layer connection pattern 4b-2.

By inspecting the continuity of both ends of this single wiring, that is, the pattern of the through-hole continuity inspection pattern, it is possible to inspect a defect of the through-hole plating. Note that the vertical direction Y
A large diameter 0.75 mm for connecting lead components is located in the middle of a prepared hole 4a having a small diameter of 0.35 mm and a pitch of 5.08 mm.
A through hole land 5b having a diameter of 1.10 mm is formed, and the hole displacement and conduction are inspected.

As described above, at the start of the manufacturing process line, the pattern for void inspection is supplied separately from the product.
Inspect the multilayer board for evaluation on which the pattern for hole displacement detection and the pattern for through hole continuity inspection are formed, and based on the inspection results, a wiring board laminating process, a through hole pre-drilling process, and plating of the prepared hole. It is possible to evaluate the process and the processing conditions and conditions of the patterning process for forming a wiring pattern on the front and back surfaces.

Further, since the inspection pattern is formed on the evaluation multilayer substrate according to a predetermined standard, there is almost no inspection error such as oversight, and the same inspection pattern can be used to inspect multilayer wiring substrates having different specifications. Therefore, each process can be evaluated on a unified scale.

Further, the through-holes of the through-hole continuity inspection pattern formed on the evaluation multilayer substrate are, for example, 20 holes.
By forming 000 pieces and connecting them to one wiring, the parameter can be significantly increased, so that the accuracy of the evaluation of the through-hole plating process can be further improved.

[0027]

As described in detail above, according to the present invention,
Inspection patterns formed according to a certain standard on a multilayer board for evaluation manufactured by flowing before the start of the manufacturing process line can be inspected on the same scale by anyone, even non-specialized inspectors, and the inspection results can be lined up at an early stage. By providing feedback to each of the above processes, it is possible to quickly and easily evaluate the processing conditions and conditions of the process in which a defective product has occurred. Demonstrate useful effects.

[Brief description of the drawings]

FIG. 1 is a plan view of an evaluation multilayer substrate according to an embodiment of the present invention.

FIG. 2 is a partially enlarged view of the void inspection pattern of FIG. 1;

FIG. 3 is a partially enlarged view of a hole misalignment detection pattern in FIG. 1;

FIG. 4 is a partially enlarged view of the through-hole continuity inspection pattern and the large-diameter through-hole of FIG. 1;

[Explanation of symbols]

 2: Void inspection pattern 3: Hole misalignment detection pattern 4: Through hole continuity inspection pattern

Claims (2)

[Claims] 1. A multi-layer wiring board manufacturing process line including a wiring board laminating process, a through-hole drilling process, a through-hole plating process, and a front and back layer patterning process, before starting up between the front and back substrates. Laminate the inner layer substrate on which the void inspection pattern is arranged, and produce a multi-layer substrate for evaluation in which a hole deviation inspection pattern and a through hole continuity inspection pattern are formed on the front and back surfaces of the laminated substrate separately from the product, A method for evaluating a manufacturing process of a multilayer wiring board, comprising: inspecting the respective inspection patterns of the evaluation multilayer substrate; and evaluating processing conditions and states of the respective processes based on the inspection results. 2. The void inspection pattern is formed by a solid lattice pattern in which key patterns are arranged at four corners of a square with a gap symmetrically formed therebetween, and the hole displacement inspection pattern is formed at four corners of the laminated substrate. The through-hole continuity inspection pattern is formed by connecting a plurality of through-holes with a connection pattern of a surface layer and a connection pattern of a back surface layer with respect to one corner of the periphery including the corner. The method for evaluating a multilayer wiring board manufacturing process according to claim 1, wherein the wirings are alternately connected to form a single wiring.