JPH1143495A - New curable phosphazene, polymerizable composition and its cured product - Google Patents
New curable phosphazene, polymerizable composition and its cured productInfo
- Publication number
- JPH1143495A JPH1143495A JP21390297A JP21390297A JPH1143495A JP H1143495 A JPH1143495 A JP H1143495A JP 21390297 A JP21390297 A JP 21390297A JP 21390297 A JP21390297 A JP 21390297A JP H1143495 A JPH1143495 A JP H1143495A
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Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、新規硬化性ホスフ
ァゼン、該硬化性ホスファゼンを含有する重合性組成
物、およびその硬化物に関する。The present invention relates to a novel curable phosphazene, a polymerizable composition containing the curable phosphazene, and a cured product thereof.
【0002】[0002]
【従来の技術】現在、エポキシ樹脂は、封止材料、電気
・電子材料、塗料、接着剤、土木・建築材料、航空・宇
宙用複合材料等に広く用いられている。こうした中で、
特に電気・電子材料、航空・宇宙用複合材料等において
は、より高い難燃性・耐熱性等が要求されるため、ハロ
ゲン化合物を使用したり、三酸化アンチモンや水酸化ア
ルミニウムを添加して、高い難燃性を発現している。2. Description of the Related Art At present, epoxy resins are widely used in sealing materials, electric and electronic materials, paints, adhesives, civil engineering and building materials, composite materials for aerospace, and the like. Under these circumstances,
Particularly in electric and electronic materials, composite materials for aerospace and space, etc., higher flame retardancy and heat resistance are required, so use halogen compounds or add antimony trioxide or aluminum hydroxide, Has high flame retardancy.
【0003】ところが、ハロゲン化合物を使用すると、
燃焼時に有毒ガスが発生するといった問題がある。ま
た、三酸化アンチモンの添加は、耐アーク性を低下させ
絶縁性が悪くなったり、水酸化アルミニウムの添加は、
機械的強度を低下させるといった問題がある。However, when a halogen compound is used,
There is a problem that toxic gas is generated during combustion. Also, the addition of antimony trioxide lowers the arc resistance and deteriorates the insulation, and the addition of aluminum hydroxide causes
There is a problem that the mechanical strength is reduced.
【0004】[0004]
【発明が解決しようとする課題】そこで、機械的特性に
優れ、より高い難燃性・耐熱性を示す硬化物及びそれを
与える化合物の開発が待ち望まれている。本発明は、こ
のような硬化物、すなわち機械的特性に優れ、高難燃性
・高耐熱性の硬化物を与える化合物を提供することを目
的としている。Therefore, development of a cured product having excellent mechanical properties and exhibiting higher flame retardancy and heat resistance and a compound providing the same have been desired. An object of the present invention is to provide a compound which gives such a cured product, that is, a cured product having excellent mechanical properties and high flame retardancy and high heat resistance.
【0005】[0005]
【課題を解決するための手段】本発明者らは、前記目的
を達成するため鋭意検討した結果、下記式(A)で表さ
れる繰り返し構造を有する化合物が、目的を実現できる
硬化物を与え、種々の分野において極めて有用であるこ
とを見いだし、本発明を完成した。すなわち本発明は、
(1)式(A)で表される繰り返し構造を有する硬化性
ホスファゼン、Means for Solving the Problems The inventors of the present invention have conducted intensive studies to achieve the above object, and as a result, a compound having a repeating structure represented by the following formula (A) provides a cured product capable of realizing the object. The present invention has been found to be extremely useful in various fields, and has completed the present invention. That is, the present invention
(1) a curable phosphazene having a repeating structure represented by the formula (A),
【0006】[0006]
【化2】 Embedded image
【0007】(式(A)中nは3〜100,000の整
数を表し、Xは脂環式エポキシ基を有する硬化性基、オ
キセタン基を有する硬化性基、脂環式エポキシ基並びに
オキセタン基以外の硬化性基および非硬化性基から選ば
れる1つ以上を表すが、2n個あるXのうち少なくとも
1個は、脂環式エポキシ基またはオキセタン基を有する
硬化性基である。) (2)上記(1)記載の硬化性ホスファゼンを含有する
重合性組成物、(3)上記(2)記載の重合性組成物を
硬化して得られる硬化物に関する。(In the formula (A), n represents an integer of 3 to 100,000, and X represents a curable group having an alicyclic epoxy group, a curable group having an oxetane group, an alicyclic epoxy group, and an oxetane group. Represents at least one selected from a curable group and a non-curable group other than the above, but at least one of the 2n Xs is a curable group having an alicyclic epoxy group or an oxetane group. The present invention relates to a polymerizable composition containing the curable phosphazene described in (1) above, and (3) a cured product obtained by curing the polymerizable composition described in (2) above.
【0008】[0008]
【発明の実施の形態】本発明の硬化性ホスファゼンは、
前記式(A)中Xで表される置換基のうち下記式(1)DETAILED DESCRIPTION OF THE INVENTION The curable phosphazene of the present invention comprises:
Among the substituents represented by X in the formula (A), the following formula (1)
【0009】[0009]
【化3】 Embedded image
【0010】で表される脂環式エポキシ基を有する硬化
性基または、下記式(2)A curable group having an alicyclic epoxy group represented by the following formula (2):
【0011】[0011]
【化4】 Embedded image
【0012】で表されるオキセタン基を有する硬化性基
を少なくとも1個有する。前記式(1)で表される基を
有する硬化性基および式(2)で表される基を有する硬
化性基については、骨格に式(1)および式(2)で表
される構造を有する官能基であれば、同一構造でも互い
に異なる構造でもよく、特に制限はないが、例えば式
(1)で表される基を有する硬化性基は、一般式(3)Has at least one curable group having an oxetane group represented by Regarding the curable group having a group represented by the formula (1) and the curable group having a group represented by the formula (2), the structure represented by the formula (1) and the formula (2) is added to the skeleton. As long as it has a functional group, it may have the same structure or different structures, and is not particularly limited. For example, a curable group having a group represented by the formula (1) is represented by the general formula (3)
【0013】[0013]
【化5】 Embedded image
【0014】(式中aは0〜3の整数を、bは1〜3の
整数を、cは0〜4の整数を、R1 は炭素数1〜4のア
ルキレン基を、R2 は炭素数2〜12のアルキレン基お
よびハロゲン化アルキレン基より選ばれる1つ以上を、
R3 は炭素数1〜4のアルキル基およびハロゲン化アル
キル基より選ばれる1つ以上をそれぞれ表す。)で表さ
れる構造から選ばれる1種以上が好ましく、式(2)で
表される基を有する硬化性基は、一般式(4)Wherein a is an integer of 0 to 3, b is an integer of 1 to 3, c is an integer of 0 to 4, R 1 is an alkylene group having 1 to 4 carbon atoms, and R 2 is One or more selected from alkylene groups and halogenated alkylene groups of Formulas 2 to 12,
R 3 represents one or more selected from an alkyl group having 1 to 4 carbon atoms and a halogenated alkyl group. One or more types selected from the structures represented by the formula (2) are preferable, and the curable group having a group represented by the formula (2) is represented by the general formula (4)
【0015】[0015]
【化6】 Embedded image
【0016】(式中dは0〜3の整数を、eは0〜4の
整数を、R4 は水素原子または炭素数1〜4のアルキル
基を、R5 は炭素数1〜4のアルキレン基を、R6 は炭
素数2〜12のアルキレン基およびハロゲン化アルキレ
ン基より選ばれる1つ以上を、R7 は炭素数1〜4のア
ルキル基およびハロゲン化アルキル基より選ばれる1つ
以上をそれぞれ表す。)で表される構造から選ばれる1
種以上が好ましい。前記式(A)中Xで表され、式
(1)及び式(2)で表される基以外の硬化性基(以
下、その他の硬化性基という)については、加熱操作ま
たは紫外線や電子線などの照射により硬化する、不飽和
結合を有する基または開環重合性基であれば、同一構造
でも互いに異なる構造でもよく、特に制限はないが、例
えば一般式(5)Wherein d is an integer of 0 to 3, e is an integer of 0 to 4, R 4 is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and R 5 is an alkylene having 1 to 4 carbon atoms. R 6 is one or more selected from an alkylene group having 2 to 12 carbon atoms and a halogenated alkylene group, and R 7 is one or more selected from an alkyl group having 1 to 4 carbon atoms and a halogenated alkyl group. 1) selected from the structures represented by
More than species are preferred. For the curable group represented by X in the formula (A) and other than the groups represented by the formulas (1) and (2) (hereinafter, referred to as other curable groups), a heating operation or an ultraviolet ray or an electron beam As long as it is a group having an unsaturated bond or a ring-opening polymerizable group that is cured by irradiation such as irradiation, it may have the same structure or different structures, and is not particularly limited.
【0017】[0017]
【化7】 Embedded image
【0018】(式中fは1〜3の整数を、gは0〜3の
整数を、R8 は水素原子またはメチル基を、R9 は炭素
数2〜12のアルキレン基およびハロゲン化アルキレン
基より選ばれる1つ以上を、R10は炭素数1〜4のアル
キレン基またはハロゲン化アルキレン基を、R11は水素
原子、炭素数1〜4のアルキル基、またはハロゲン化ア
ルキル基をそれぞれ表す。)で表される構造から選ばれ
る1種以上が好ましい。前記式(A)中Xで表される非
硬化性基については、例えば一般式(6)(Wherein f is an integer of 1 to 3, g is an integer of 0 to 3, R 8 is a hydrogen atom or a methyl group, and R 9 is an alkylene group having 2 to 12 carbon atoms and a halogenated alkylene group. R 10 represents an alkylene group having 1 to 4 carbon atoms or a halogenated alkylene group, and R 11 represents a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or a halogenated alkyl group. One or more types selected from the structures represented by the formula (1) are preferable. For the non-curable group represented by X in the formula (A), for example, the general formula (6)
【0019】[0019]
【化8】 Embedded image
【0020】(式中hは0〜5の整数を、R12は炭素数
1〜18のアルキル基またはハロゲン化アルキル基を、
R13は炭素数1〜4のアルキル基、ハロゲン化アルキル
基、ホルミル基、アセチル基、ニトロ基、およびハロゲ
ン原子より選ばれる1つ以上を、Yは酸素原子、硫黄原
子、もしくはイミノ基をそれぞれ表す。)で表される構
造から選ばれる1種以上が好ましい。式(6)で表され
る基の具体例としては、メトキシ基、エトキシ基、プロ
ポキシ基などのアルコキシ基類、メチルチオ基、エチル
チオ基、プロピルチオ基などのアルキルチオ基類、メチ
ルイミノ基、エチルイミノ基、プロピルイミノ基などの
アルキルイミノ基類、フェノキシ基、チオフェニル基、
ホルミルフェノキシ基、アセトフェノキシ基、ニトロフ
ェノキシ基、またはこれらのハロゲン化置換基類などが
挙げられる。Wherein h is an integer of 0 to 5, R 12 is an alkyl group having 1 to 18 carbon atoms or a halogenated alkyl group,
R 13 is at least one selected from an alkyl group having 1 to 4 carbon atoms, a halogenated alkyl group, a formyl group, an acetyl group, a nitro group, and a halogen atom, and Y is an oxygen atom, a sulfur atom, or an imino group, respectively. Represent. One or more types selected from the structures represented by the formula (1) are preferable. Specific examples of the group represented by the formula (6) include alkoxy groups such as methoxy group, ethoxy group and propoxy group, alkylthio groups such as methylthio group, ethylthio group and propylthio group, methylimino group, ethylimino group and propyl group. Alkyl imino groups such as imino group, phenoxy group, thiophenyl group,
Examples include a formylphenoxy group, an acetophenoxy group, a nitrophenoxy group, and halogenated substituents thereof.
【0021】前記式(A)中のnは3〜100,000
の整数を表し、この繰り返し構造は環状および鎖状のい
ずれであってもよいが、環状構造の場合3〜20が好ま
しく、3または4およびこれらの混合物が特に好まし
い。また、鎖状構造の場合20〜100,000が好ま
しく、1,000〜10,000が特に好ましい。N in the formula (A) is 3 to 100,000
The repeating structure may be any of a cyclic structure and a chain structure. In the case of a cyclic structure, 3 to 20 is preferable, 3 or 4 and a mixture thereof are particularly preferable. In the case of a chain structure, it is preferably from 20 to 100,000, particularly preferably from 1,000 to 10,000.
【0022】前記式(A)で表される硬化性フォスファ
ゼンの合成自体は、アルコールとハロゲン化合物との反
応等、公知の方法に従って合成でき、式(1)または式
(2)で表される基を有する硬化性基の導入は、ヘキサ
クロロシクロトリホスファゼン、オクタクロロシクロテ
トラホスファゼンや、これらの開環重合により得られる
ポリジクロロホスファゼン等のクロロホスファゼンと、
式(1)や式(2)で表される基を有し、その末端に水
素原子が結合した化合物等とを、塩基性化合物の存在下
で反応させることによって得られる。The synthesis of the curable phosphazene represented by the formula (A) itself can be performed according to a known method such as a reaction between an alcohol and a halogen compound, and the group represented by the formula (1) or (2) can be synthesized. The introduction of a curable group having a chlorophosphazene such as hexachlorocyclotriphosphazene, octachlorocyclotetraphosphazene, and polydichlorophosphazene obtained by ring-opening polymerization thereof;
It can be obtained by reacting a compound having a group represented by the formula (1) or (2) and having a hydrogen atom bonded to a terminal thereof in the presence of a basic compound.
【0023】式(1)で表される基を有し、その末端に
水素原子が結合した化合物の具体例としては、3,4−
エポキシシクロヘキシルメタノール、2−ヒドロキシエ
チル−3’,4’−エポキシシクロヘキサンカルボキシ
レートなどが、式(2)で表されるを有し、その末端に
水素原子が結合した化合物の具体例としては、3−メチ
ル−3−ヒドロキシメチルオキセタン、3−エチル−3
−ヒドロキシメチルオキセタンなどが挙げられる。Specific examples of the compound having a group represented by the formula (1) and having a hydrogen atom bonded to its terminal include 3,4-
Epoxycyclohexylmethanol, 2-hydroxyethyl-3 ′, 4′-epoxycyclohexanecarboxylate and the like having the formula (2), and specific examples of the compound having a hydrogen atom bonded to its terminal include: -Methyl-3-hydroxymethyloxetane, 3-ethyl-3
-Hydroxymethyloxetane and the like.
【0024】前記の反応は、不活性溶媒、例えばN,N
−ジメチルアセトアミド、ジメチルスルホキシド、ジメ
チルホルムアミド、N−メチルピロリドン、N,N−ジ
メチルイミダゾリドンのような非プロトン性極性溶媒、
トルエン、ヘキサン、ヘプタン等の無極性溶媒、テトラ
ヒドロフラン、ジグライム、1,4−ジオキサン等、ま
たはこれらの混合溶媒中で行ってもよい。これら溶媒の
使用量は、クロロホスファゼン20gに対して、通常0
〜500ml、好ましくは50〜300mlである。ま
た低沸点物を反応系外に除去しながら反応を進行させる
こともできる。The above reaction is carried out in an inert solvent such as N, N
Aprotic polar solvents such as dimethylacetamide, dimethylsulfoxide, dimethylformamide, N-methylpyrrolidone, N, N-dimethylimidazolidone;
It may be carried out in a nonpolar solvent such as toluene, hexane, heptane, etc., tetrahydrofuran, diglyme, 1,4-dioxane or the like, or a mixed solvent thereof. The amount of these solvents used is usually 0 to 20 g of chlorophosphazene.
500500 ml, preferably 50-300 ml. In addition, the reaction can be allowed to proceed while removing low-boiling substances out of the reaction system.
【0025】用い得る塩基性化合物の具体例としては、
水素化ナトリウム、水酸化ナトリウム、水酸化カリウム
などのアルカリ金属化合物、金属ナトリウム、金属カリ
ウムなどのアルカリ金属、ナトリウムメチラートなどの
アルカリ金属アルコラート及び、トリエチルアミン、ト
リプロピルアミン、ピリジンなどの第3級アミンなどが
挙げられ、その使用量は、式(1)や式(2)で表され
る基を有し、その末端に水素原子が結合した化合物1.
0モルに対して通常1.0モル以上、好ましくは1.2
〜10モルである。Specific examples of the basic compound that can be used include:
Alkali metal compounds such as sodium hydride, sodium hydroxide and potassium hydroxide; alkali metals such as sodium metal and potassium potassium; alkali metal alcoholates such as sodium methylate; and tertiary amines such as triethylamine, tripropylamine and pyridine And the like. The amount of the compound 1 has a group represented by the formula (1) or the formula (2), and a hydrogen atom is bonded to a terminal of the compound 1.
Usually 1.0 mol or more, preferably 1.2 mol, per 0 mol.
10 to 10 mol.
【0026】前記の反応において、塩素は全部置換され
ているのが好ましいが、一部の塩素が残留してもよく、
この残留塩素と、例えば式(5)や式(6)で表される
基を有し、その末端に水素原子が結合した化合物等と
を、前記と同様に反応させ、その他の硬化性基や非硬化
性基を導入することができる。In the above reaction, it is preferable that all chlorine is substituted, but a part of chlorine may remain.
This residual chlorine is reacted with a compound or the like having a group represented by, for example, the formula (5) or the formula (6), and having a hydrogen atom bonded to the terminal thereof in the same manner as described above. Non-curable groups can be introduced.
【0027】式(5)で表される基を有し、その末端に
水素原子が結合した化合物の具体例として、2−ヒドロ
キシエチルメタクリレート、2−ヒドロキシエチルアク
リレート、アクリルアミド、2−ヒドロキシエチルビニ
イルエーテル、4−ヒドロキシブチルビニイルエーテ
ル、グリシドールなどが、また式(6)で表される基を
有し、その末端に水素原子が結合した化合物の具体例と
しては、メタノール、エタノール、プロパノールなどの
アルコール類、およびこれらのハロゲン置換体、メタン
チオール、エタンチオール、プロパンチオールなどのア
ルキルチオール類、およびこれらのハロゲン置換体、メ
チルアミン、エチルアミン、プロピルアミンなどのアル
キルアミン類、およびこれらのハロゲン置換体、フェノ
ール、ハロゲン化フェノール基、チオフェノール、ハロ
ゲン化チオフェノール、ホルミルフェノール、アセトフ
ェノール、ニトロフェノールなどが挙げられる。Specific examples of the compound having a group represented by the formula (5) and having a hydrogen atom bonded to a terminal thereof include 2-hydroxyethyl methacrylate, 2-hydroxyethyl acrylate, acrylamide, and 2-hydroxyethyl vinylyl. Specific examples of compounds having ether, 4-hydroxybutylvinylyl ether, glycidol and the like having a group represented by the formula (6) and a hydrogen atom bonded to the terminal thereof include methanol, ethanol and propanol. Alcohols and their halogen-substituted products, alkylthiols such as methanethiol, ethanethiol and propanethiol, and their halogen-substituted products, alkylamines such as methylamine, ethylamine and propylamine, and their halogen-substituted products , Phenol, halogenated Nord group, thiophenol, halogenated thiophenol, formyl phenol, acetoacetic phenol, nitro phenol.
【0028】次に本発明の重合性組成物につき説明す
る。本発明の硬化性ホスファゼンと硬化剤・硬化促進
剤、及びその他必要に応じて種々の重合性化合物、重合
開始剤、染料、顔料、可塑剤、無機充填剤、溶剤などを
混合して本発明の重合性組成物を得ることができる。硬
化剤・硬化促進剤としては、前記の硬化性基が重合を起
こしうるものであれば特に制限はない。Next, the polymerizable composition of the present invention will be described. The curable phosphazene of the present invention and a curing agent and a curing accelerator, and various other polymerizable compounds, a polymerization initiator, a dye, a pigment, a plasticizer, an inorganic filler, a solvent, etc. A polymerizable composition can be obtained. The curing agent / curing accelerator is not particularly limited as long as the above-mentioned curable group can cause polymerization.
【0029】硬化剤・硬化促進剤の具体例としては、紫
外線、あるいは可視光線を用いた硬化方法を利用する場
合、光カチオン重合開始剤として、特公昭53−328
31号、特公昭52−14277号、特公昭52−14
278号、特公昭52−14279号、特公昭52−2
5686号、特公昭61−34752号、特開昭54−
53181号、特開昭54−95686号、特公昭61
−36530号、特公昭59−19581号、特公昭6
3−65688号、特開昭55−164204号、特公
昭60−30690号、特公昭63−36332号、特
公平1−39423号、特公平2−10171号、特公
平5−15721号、特公平4−62310号、特公昭
62−57653号、特公平3−12081号、特公平
3−12082号、特公平3−16361号、特公昭6
3−12092号、特公昭63−12093号、特公昭
63−12095号、特公昭63−12094号、特公
平2−37924号、特公平2−35764号、特公平
4−13374号、特公平4−75908号、特公平4
−73428号、特公昭53−32831号、特開平2
−150848号、特開平2−296514号、米国特
許第4,069,055号、米国特許第4,069,0
56号、米国特許第3,703,296号等に記載され
ているスルホニウム塩、ジアゾニウム塩、アンモニウム
塩、ホスホニウム塩、ヨードニウム塩、アルソニウム
塩、鉄・アレーン錯体などが挙げられ、これらと共に、
多価アルコール類を用いてもよい。As a specific example of the curing agent / curing accelerator, when a curing method using ultraviolet light or visible light is used, a cationic photopolymerization initiator may be used as a photo-cationic polymerization initiator.
No. 31, Japanese Patent Publication No. 52-14277, Japanese Patent Publication No. 52-14
No. 278, Japanese Patent Publication No. 52-14279, Japanese Patent Publication No. 52-2
No. 5686, JP-B-61-34752, JP-A-54-54.
53181, JP-A-54-95686, JP-B-61
-36530, JP-B-59-19581, JP-B-6
3-65688, JP-A-55-164204, JP-B-60-30690, JP-B-63-36332, JP-B1-39423, JP-B2-10171, JP-B5-15721, JP-B-5-15721 No. 4-62310, Japanese Patent Publication No. 62-57653, Japanese Patent Publication No. 3-12081, Japanese Patent Publication No. 3-12082, Japanese Patent Publication No. 3-16361, Japanese Patent Publication No. 6
3-12092, JP-B-63-12093, JP-B-63-12095, JP-B-63-12094, JP-B-2-37924, JP-B-2-35764, JP-B-4-13374, JP-B-4 -75908, Tokuhei 4
-73428, JP-B-53-32831, and JP-A-Hei 2
-150848, JP-A-2-296514, U.S. Pat. No. 4,069,055, U.S. Pat.
No. 56, U.S. Pat. No. 3,703,296, and the like, sulfonium salts, diazonium salts, ammonium salts, phosphonium salts, iodonium salts, arsonium salts, iron / arene complexes, and the like.
Polyhydric alcohols may be used.
【0030】また、加熱硬化方法や常温硬化方法を利用
する場合、無水フタル酸、無水トリメリット酸、無水ピ
ロメリット酸、無水マレイン酸などの酸無水物類や、フ
ェノールノボラック類等の他に、多価アルコール類や、
三フッ化ホウ素、二塩化亜鉛、三塩化アルミニウムなど
のルイス酸類を用いてもよい。When a heat curing method or a room temperature curing method is used, acid anhydrides such as phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, and maleic anhydride, phenol novolaks, etc. Polyhydric alcohols,
Lewis acids such as boron trifluoride, zinc dichloride, and aluminum trichloride may be used.
【0031】これらの硬化剤・硬化促進剤は本発明の硬
化性ホスファゼンに対して、通常0.01〜200重量
%、好ましくは1〜100重量%使用され、本発明の硬
化物を得る際に本発明の硬化性ホスファゼンと混合して
もよいし、本発明の重合性組成物中に混合してもよい。These curing agents and curing accelerators are usually used in an amount of 0.01 to 200% by weight, preferably 1 to 100% by weight, based on the curable phosphazene of the present invention. It may be mixed with the curable phosphazene of the present invention, or may be mixed with the polymerizable composition of the present invention.
【0032】本発明の硬化物は、本発明の硬化性ホスフ
ァゼンをそのまま、好ましくは本発明の重合性組成物と
して、紫外線、電子線、または放射線の照射、或いは加
熱して得ることができる。The cured product of the present invention can be obtained by irradiating the curable phosphazene of the present invention as it is, preferably as the polymerizable composition of the present invention, with an ultraviolet ray, an electron beam, or a radiation, or by heating.
【0033】[0033]
【実施例】以下に実施例によって本発明を更に詳細に説
明するが、本発明はこれらの実施例に限定されるもので
はない。The present invention will be described in more detail with reference to the following examples, but the present invention is not limited to these examples.
【0034】実施例1 温度計、環流冷却器、滴下ロート、窒素導入装置、攪拌
装置のついた500mlの反応器に、60wt%水素化
ナトリウム20gを仕込み、乾燥窒素を流しながら、1
00mlの脱水したテトラヒドロフランで3回洗浄し
た。その後脱水したテトラヒドロフラン200mlを加
え、室温で撹拌しながら、50gの3,4−エポキシシ
クロヘキシルメタノールを1時間かけて滴下し、さらに
60℃で2時間撹拌し、3,4−エポキシシクロヘキシ
ルメタノールナトリウム塩の分散体を得た。Example 1 20 g of 60 wt% sodium hydride was charged into a 500 ml reactor equipped with a thermometer, a reflux condenser, a dropping funnel, a nitrogen introducing device, and a stirring device.
Washed three times with 00 ml of dehydrated tetrahydrofuran. Thereafter, 200 ml of dehydrated tetrahydrofuran was added, 50 g of 3,4-epoxycyclohexylmethanol was added dropwise over 1 hour while stirring at room temperature, and the mixture was further stirred at 60 ° C. for 2 hours to obtain 3,4-epoxycyclohexylmethanol sodium salt. A dispersion was obtained.
【0035】次に、100mlの脱水したテトラヒドロ
フランに22.5gのヘキサクロロシクロトリホスファ
ゼンを溶かした。この溶液を、前記の3,4−エポキシ
シクロヘキシルメタノールナトリウム塩分散体に、反応
器内を60℃に保ち撹拌しながら、2時間かけて滴下し
た。その後さらに60℃で5時間反応させ、完結させ
た。Next, 22.5 g of hexachlorocyclotriphosphazene was dissolved in 100 ml of dehydrated tetrahydrofuran. This solution was added dropwise to the 3,4-epoxycyclohexylmethanol sodium salt dispersion over a period of 2 hours while maintaining the inside of the reactor at 60 ° C and stirring. Thereafter, the reaction was further performed at 60 ° C. for 5 hours to complete the reaction.
【0036】反応終了後、反応混合液を室温まで冷却し
た後、エバポレーターでテトラヒドロフランを除去し、
水200mlを加え、ジエチルエーテル200mlで3
回抽出した。次いで、抽出したジエチルエーテル溶液を
200mlに濃縮し、水100mlで3回洗浄後、無水
硫酸ナトリウムと活性炭を加え、一晩乾燥・脱色した。
その後、濾過し、ジエチルエーテルを減圧除去し、本発
明の硬化性ホスファゼンを得た(収量25g)。After completion of the reaction, the reaction mixture was cooled to room temperature, and tetrahydrofuran was removed with an evaporator.
Add 200 ml of water, and add 3
Extracted times. Next, the extracted diethyl ether solution was concentrated to 200 ml, washed with 100 ml of water three times, and anhydrous sodium sulfate and activated carbon were added thereto, followed by drying and decoloring overnight.
Thereafter, the mixture was filtered and the diethyl ether was removed under reduced pressure to obtain the curable phosphazene of the present invention (yield: 25 g).
【0037】上記化合物は、IRスペクトルにより、
3,4−エポキシシクロヘキシルメタノールに対して水
酸基(3400cm-1付近)が消失し、P=N結合(1
240cm-1)が出現することを確認した。また、FA
Bマススペクトルにより、ヘキサクロロシクロトリホス
ファゼン中の全ての塩素および5個の塩素が、3,4−
エポキシシクロヘキシルメタノールで置換されたものの
混合物であることを確認した。The above compound is represented by the IR spectrum
The hydroxyl group (around 3400 cm -1 ) disappears from 3,4-epoxycyclohexylmethanol, and the P = N bond (1
240 cm -1 ) was confirmed. Also, FA
According to the B mass spectrum, all chlorine and 5 chlorines in hexachlorocyclotriphosphazene were 3,4-
It was confirmed that the mixture was substituted with epoxycyclohexylmethanol.
【0038】[0038]
【発明の効果】本発明の硬化性ホスファゼンは、難燃性
・耐熱性の硬化物を与え、オーバーコート剤、撥水コー
ト剤、表面改質剤、接着剤、機能性フィラー、塗料、封
止材、電解質隔膜などの用途に適し、電気・電子材料分
野、土木・建築材料分野や、航空・宇宙用複合材料分野
などの種々の分野で極めて有用である。The curable phosphazene of the present invention gives a flame-retardant and heat-resistant cured product, and is used as an overcoat agent, a water-repellent coat agent, a surface modifier, an adhesive, a functional filler, a paint, and a sealant. It is suitable for applications such as materials and electrolyte diaphragms, and is extremely useful in various fields such as electric / electronic materials, civil engineering / building materials, and aviation / space composite materials.
Claims (3)
硬化性ホスファゼン。 【化1】 (式(A)中nは3〜100,000の整数を表し、X
は脂環式エポキシ基を有する硬化性基、オキセタン基を
有する硬化性基、脂環式エポキシ基並びにオキセタン基
以外の硬化性基および非硬化性基から選ばれる1つ以上
を表すが、2n個あるXのうち少なくとも1個は、脂環
式エポキシ基またはオキセタン基を有する硬化性基であ
る。)1. A curable phosphazene having a repeating structure represented by the formula (A). Embedded image (In the formula (A), n represents an integer of 3 to 100,000;
Represents one or more selected from a curable group having an alicyclic epoxy group, a curable group having an oxetane group, a curable group other than an alicyclic epoxy group and an oxetane group, and a non-curable group; At least one of certain X is a curable group having an alicyclic epoxy group or an oxetane group. )
する重合性組成物。2. A polymerizable composition containing the curable phosphazene according to claim 1.
られる硬化物。3. A cured product obtained by curing the polymerizable composition according to claim 2.
Priority Applications (1)
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JP21390297A JP3916300B2 (en) | 1997-07-25 | 1997-07-25 | New curable phosphazene |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21390297A JP3916300B2 (en) | 1997-07-25 | 1997-07-25 | New curable phosphazene |
Publications (2)
Publication Number | Publication Date |
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JPH1143495A true JPH1143495A (en) | 1999-02-16 |
JP3916300B2 JP3916300B2 (en) | 2007-05-16 |
Family
ID=16646923
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JP21390297A Expired - Fee Related JP3916300B2 (en) | 1997-07-25 | 1997-07-25 | New curable phosphazene |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0538381A1 (en) * | 1990-07-11 | 1993-04-28 | Harman Int Ind | Loudspeaker suspension. |
JP2002317101A (en) * | 2001-04-23 | 2002-10-31 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and semiconductor device |
JP2003064241A (en) * | 2001-08-27 | 2003-03-05 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and semiconductor device |
JP2003082195A (en) * | 2001-09-10 | 2003-03-19 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and semiconductor device |
-
1997
- 1997-07-25 JP JP21390297A patent/JP3916300B2/en not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0538381A1 (en) * | 1990-07-11 | 1993-04-28 | Harman Int Ind | Loudspeaker suspension. |
JP2002317101A (en) * | 2001-04-23 | 2002-10-31 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and semiconductor device |
JP2003064241A (en) * | 2001-08-27 | 2003-03-05 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and semiconductor device |
JP2003082195A (en) * | 2001-09-10 | 2003-03-19 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JP3916300B2 (en) | 2007-05-16 |
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