JPH1140977A - Electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To stabilize ground and shield by installing protruding parts which protrude upward and downward from a shielding plate, on the same line which is parallel to the side wall of a frame. SOLUTION: Protruding parts 1h and 1i which protrude upward and downward from a shielding plate 1e are installed on the same line C parallel to the side wall 1c of a frame 1. After aperture parts 1a and 1b of the frame 1 are closed with an upper cover 3 and a lower cover 4, respectively, the protruding parts 1h and 1i are arranged on the same line C, and projecting parts 3c, 4c press always the protruding parts 1h, 1i, so that these pressing forces are canceled in the shielding plate 1e. As the result of canceling, pressure is not applied to solder 5 connecting a grounding pattern 2c with the protruding part 1i, so that the solder 5 is prevented from being exfoliated. As a result, earth and shield can be stabilized.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to electronic equipment,
More specifically, the present invention relates to electronic devices such as high-frequency circuits suitable for use in television receivers, video tape recorders, and the like.

[0002]

2. Description of the Related Art FIG.
This will be described with reference to FIG. As shown in FIG. 2, the rectangular frame 11 made of a metal material has side walls 11c surrounding four sides, an upper opening 11a, and a lower opening 11b.
In the frame 11, a shield plate 11e made of a component different from the frame 11 is disposed, and a linear upper end 11f of the shield plate 11e is provided at an opening 11a above the frame 11. The lower end 11g is located substantially at the center of the side wall 11c. Further, a convex portion 11i projecting downward is provided at a lower end 11g of the shield plate 11e. Also, both ends of the shield plate 11e are frame 1
1 is connected by solder (not shown) or the like.

The printed wiring board 12 is made of a single insulating material, and has an upper surface on which electronic components (not shown) are mounted, and a lower surface on which chip components (not shown) are mounted. At the same time, a ground pattern 12a is formed. The printed wiring board 12 has a projection 11i provided at a lower end 11g of the shield plate 11e.
A hole 12b is provided at a position facing the
The ground pattern 12a is formed around 2b. Further, the printed wiring board 12 has the protrusions 11i inserted through the holes 12b, and the printed wiring board 12
Is housed in the frame 11 with its upper surface in contact with the lower end 11g of the shield plate 11e. The ground pattern 12a and the projection 11i are connected by solder 15 with solder.

The upper cover 13 has a rectangular flat upper wall 13a, and a plurality of spring-like mounting portions 13 which are bent from four edges of the upper wall 13a and extend downward.
b. The upper cover 13 covers the opening 11a on the upper surface side of the frame body 11 with an upper wall 13a, and is mounted in such a manner that the mounting portion 13b is sandwiched between the side walls 11c of the frame body 11.

The lower cover 14 includes a rectangular lower wall 14a, a plurality of spring-like mounting portions 14b which are bent from four edges of the lower wall 14a and extend upward.
A predetermined portion of the lower wall 14a is provided with a protruding portion 14c projecting upward. The lower cover 14 covers the entire opening 11b on the lower surface side of the frame 11 with the lower wall 14a. 14b is attached to the side wall 11c of the frame 11 while being sandwiched therebetween. In this state, the protruding portion 14c of the lower wall 14a of the lower cover 14 is in contact with the end of the convex portion 11i of the shield plate 11e. The protruding portion 14c is configured to constantly press the shield plate 11e upward.

[0006]

A conventional electronic device B is:
Upper and lower covers 1 to ground and shield frame 11
Close with 3 and 14. At this time, in order to stabilize the ground and shield of the frame 11, the shield plate 11e and the lower cover 14 are in contact with each other, and this contact is made between the projection 11i of the shield plate 11e and the protruding portion 1 of the lower cover 14.
4c is in contact therewith. And
This contact is performed by the lower cover 1 that closes the opening 1 b of the frame 11.
When the lower cover 14 is pressed upward when the frame 4 is clamped and attached to the frame 11, the protruding portion 14c of the lower cover 14 comes into contact with the projection 11i, so that the ground is stably maintained.

However, in this electronic device B, the protruding portion 14c always presses the convex portion 11i upward (in the direction of arrow D) as shown in FIG.
The pressing force is constantly applied to the solder 15 connecting the i and the ground pattern 12a, and the shield plate 11e is pushed upward with the passage of time, and the peeling portion 15a is generated in the solder 15 by the pressing force. There is a problem that there is. Also, when the electronic device B is incorporated into a motherboard of a television receiver, for example, the upper and lower covers 13 and 1
There is a case where a strong pressing force is applied to 4. At this time, the protruding portion 14c comes into contact with the convex portion 11i with a strong force. Then, this pressing force acts to push up the shield plate 11e, which is a component separate from the frame 11, and when the shield plate 11e is pushed up in this way,
This pressing force is applied to the ground pattern 12a of the printed wiring board 12 which is soldered to the projection 11i. From this, the ground pattern 1 of the printed wiring board 12
The solder 15 for connecting the projection 2i and the projection 11i is connected to the lower cover 1
4 projecting portion 14c is peeled off by the upward pressing force, which causes a problem that the ground and the shield become unstable. Accordingly, an object of the present invention is to provide an electronic device which solves the above-mentioned problems and which can maintain good grounding and shielding.

[0008]

According to the present invention, there is provided an electronic apparatus having a frame having an opening on an upper surface and a lower surface and having a side wall, a frame provided in the frame, and protruding upward and downward. A shield plate having a protruding portion extending to the side of the frame, a printed wiring board housed in the frame and having a ground pattern soldered to the protruding portion of the shield plate, and a top surface side of the frame. An upper cover having a protruding portion for closing the opening and abutting on the convex portion, and a lower cover having a protruding portion for closing the opening on the lower surface side of the frame body and abutting on the convex portion; Are provided on the same line parallel to the side wall of the frame body.

Further, the electronic device of the present invention is provided with a plurality of convex portions extending toward the opening. Further, the electronic apparatus of the present invention includes a plurality of shield plates.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIG. As shown in FIG. 1, the electronic device A is made of a flat metal material, and has a rectangular frame 1 provided with openings 1a and 1b on an upper surface and a lower surface, and is housed inside the frame 1. Printed circuit board 2 on which electronic components 2a to be mounted are mounted and a predetermined circuit pattern (not shown) is formed;
An upper cover 3 and a lower cover 4 made of a flat metal material are provided to cover the openings 1a and 1b, respectively.

The frame 1 has side walls 1c surrounding four sides.
In the frame 1, a shield plate 1e made of the same flat metal material as the frame 1 and formed by bending a part of the frame 1 is provided. The upper end 1f of the shield plate 1e is disposed integrally with the side wall 1c.
Extends to the vicinity of the opening 1 a above the frame 1,
g is located substantially at the center of the side wall 1c. The upper end 1f of the shield plate 1e is provided with a protrusion 1h projecting upward, and the lower end 1g is provided with a protrusion 1i projecting downward. Further, the convex portion 1h and the convex portion 1i are provided in parallel with the side wall 1c and vertically opposed on the same line C.

The printed wiring board 2 is made of a single plate-like insulating material, and has an upper surface on which electronic components 2a such as coils and integrated circuits are mounted, and a lower surface on which, for example, a resistor or the like is mounted. A chip component 2b such as a capacitor is mounted, and a ground pattern 2c is formed. Further, the printed wiring board 2 is provided with a through hole 2d at a position where the protrusion 1i provided on the shield plate 1e is inserted, and the ground pattern 2c is provided around the hole 2d. . The printed wiring board 2
Means that the projection 1i is inserted through the hole 2d,
The upper surface of the printed wiring board 2 is the lower end 1g of the shield plate 1e.
Is housed in the frame 1 in a state where the frame body 1 is in contact therewith. Further, the ground pattern 2c and the projection 1i are connected by solder 5.

The upper cover 3 is made of a metal plate and has a rectangular upper wall 3a, and a plurality of spring-like mounting portions bent downward from four edges of the upper wall 3a and extending downward. 3b, and a protruding portion 3c protruding downward at a predetermined portion of the upper wall 3a. The upper cover 3 covers the opening 1a on the upper surface side of the frame 1 with an upper wall 3a, and is mounted in such a manner that the mounting portion 3b is sandwiched between the side walls 1c of the frame 1. In this state, the protrusion 3c of the upper cover 3 is in contact with the end of the projection 1h of the shield plate 1e.

The lower cover 4 is made of a flat metal material and has a rectangular lower wall 4a, and a spring-like mounting portion 4 which is bent from four edges of the lower wall 4a and extends upward.
b, and a predetermined portion of the lower wall 4a is provided with a protruding portion 4c projecting upward. The lower cover 4 covers the entire opening 1b on the lower surface side of the frame 1 with the lower wall 4a. The mounting portion 4b is attached to the side wall 1c of the frame body 1 while being held therebetween. In this state, the protrusion 4c of the lower cover 4 is in contact with the end of the projection 1i of the shield plate 1e. The protruding portions 3h of the shield plate 1e and the protruding portions 3c of the lower cover 4
The structure is such that i is always sandwiched and suppressed.

In the above-described embodiment, one shield plate 1e disposed in the frame 1 and the shield plate 1e
Has been described, but the present invention is not limited to this, and a plurality of shield plates 1e having the protrusions 1h and 1i may be disposed in the frame body 1.
A plurality (a plurality of pairs) of projections 1h are provided on one shield plate 1e,
Needless to say, 1i may be provided.

[0016]

As described above, since the projections 1h and 1i projecting upward and downward from the shield plate 1e are provided on the same line C parallel to the side wall 1c of the frame 1, the frame 1 After the openings 1a and 1b are closed with the upper and lower covers 3 and 4, the projection 1h and the projection 1i are provided on the same line C, and the protrusions 3c and 4c constantly press the projections 1h and 1i. Therefore, these pressing forces are offset in the shield plate 1e. Therefore, the offset of the pressing force causes the ground pattern 2c.
The pressing force is not applied to the solder 5 that connects the solder 5 and the convex portion 1i, and the solder 5 does not peel off.

The projections 1h and 1i of the shield plate 1e project upward and downward, respectively, and come into contact with the protruding portions 3c and 4c of the upper and lower covers 3 and 4, respectively. Is the shield plate 1
Since the number is doubled as compared with the number of the protruding portions 11i provided only below 1e, it is possible to achieve more stable grounding and shielding of the electronic device. Also,
Since a plurality of protrusions are provided and a plurality of shield plates 1e are provided, the protrusions and the protruding portions of the upper and lower covers come into contact at a plurality of places, so that it is possible to sufficiently ground the electronic device. It works.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating an electronic device of the invention.

FIG. 2 is a cross-sectional view illustrating a conventional electronic device.

FIG. 3 is a cross-sectional view showing a problem of a conventional electronic device.

[Description of Signs] 1 Frame 1a, 1b Opening 1c Sidewall 1e Shield 1h, 1i Convex 2 Printed Wiring Board 2c Ground Pattern 2d Hole 3 Upper Cover 3c Projection 4 Lower Cover 4c Projection 5 Solder

Claims (3)

[Claims] 1. A frame body having an opening on an upper surface side and a lower surface side and having a side wall, and a shield plate provided in the frame body and protruding upward and downward and extending toward the opening side. A printed wiring board housed in the frame and having a ground pattern soldered to the projection protruding from the shield plate, and closing the opening on the upper surface side of the frame and contacting the projection. An upper cover having a protruding portion that contacts, and a lower cover having a protruding portion that closes an opening on the lower surface side of the frame and abuts the protruding portion, and a protruding portion that protrudes above and below the shield plate is provided. An electronic device, wherein the electronic device is provided on a same line parallel to a side wall of the frame. 2. The electronic device according to claim 1, further comprising a plurality of the protrusions extending toward the opening. 3. The electronic device according to claim 1, comprising a plurality of said shield plates.