JPH1140695A - Ceramic wiring board for optical communication and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiently form or plate outer connection pads by forming wiring through-holes running from the cavity wall formed on the board top surface to the board end face and fixing outer connection pins to the pads. SOLUTION: A cavity 12 for housing optical, communication elements is formed into the top surface 18 of a ceramic board 11. To insert optical communication wirings into the cavity 12, wiring through-holes 14 are formed, running from the cavity wall 12a to the end face 11a of the board 11. The communication elements are coupled with the communication wirings in the cavity 12 to transfer laser beams etc. through the communication wirings. Outer connection pads 15 are formed on the lower surface 19 of the board 11 and outer connection pins 16 for connecting a mother board are fixed to the pads 15 through braze, etc. Inner conductor layer 17a is connected to the pads 15 through through-holes 17b.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ceramic wiring board for optical communication and a method for manufacturing the same, and more particularly, to a ceramic wiring board for optical communication for mounting an optical communication element such as an integrated circuit for optical communication, and the like. It relates to the manufacturing method.

[0002]

2. Description of the Related Art With the recent development of optical communication technology, an optical communication element such as an integrated circuit for optical communication is protected and, at the same time, wiring for optical communication (optical fiber and the like) and electric wiring formed on a motherboard are not required. In order to achieve easy connection, a wiring board (package) on which the optical communication element is mounted is required. Among these wiring boards, ceramic wiring boards have high reliability because of their excellent thermal conductivity, moisture resistance, heat resistance and the like, and have begun to be used in the field of optical communication.

FIG. 5A is a perspective view schematically showing a conventional ceramic wiring board for optical communication, and FIG. 5B is a front view. A cavity 12 for accommodating an optical communication element (not shown) such as an optical integrated circuit is formed on an upper surface 58 of the ceramic substrate 11, and an optical communication wiring (not shown) such as an optical fiber is formed inside the cavity 12. )
A wiring through hole 14 is formed from the wall surface 12 a of the cavity 12 to the end surface 11 a of the ceramic substrate 11. The optical communication element and the optical communication wiring are coupled inside the cavity 12 so as to transmit and receive laser light and the like via the optical communication wiring. Cavity 1
2 has a stepped shape on both side walls sandwiching a wall surface 12a, and an inner pad 13a for connection to a terminal of the optical communication element is formed on a stepped portion 13, and the inner pad 13a is formed of an inner conductor layer. 57. The internal conductor layer 57 reaches the side wall surface 11b and is connected to an external connection pad 55 formed on the side wall surface 11b. An external connection terminal 56 for connecting to the mother board is connected to the external connection pad 55 by brazing or the like. It is fixed. Also,
The inner pads 13a, the external connection pads 55, and the external connection terminals 56 are plated.

FIGS. 6A to 6D are perspective views schematically showing a part of a process for manufacturing a ceramic wiring board 50 for optical communication. Although not shown, first, a plurality of openings for forming the cavities 12 and the wiring through holes 14 shown in FIG. 5 are formed on one large green sheet, and then the inner pads 13a and the inner conductors are formed. A plurality of units of the conductive paste layer for forming the layer 57 are formed, a plurality of green sheets including the green sheet are laminated, and then cut into individual units to produce a green sheet laminate 61 (FIG. 6A )).

[0005] A conductor paste layer 62a for an inner pad is formed on the step portion 62 of the concave portion 66 for the cavity of the green sheet laminate 61. The green sheet laminate 61 has a green sheet from the wall surface 66a of the concave portion 66 for the cavity. A through hole 64 communicating with the end face 61 a of the laminate 61 is formed.

Next, a conductor paste layer 63 for external connection pads is formed on the side wall surface 61b of the green sheet laminate 61 (FIG. 6B). At this time, the individual green sheet laminates 61 are set in a printing device for performing side printing (screen printing or the like), and the printing device is driven to perform printing, and the conductive paste layer for external connection pads is formed on the side wall surface 61b. 63 is formed.

Next, the green sheet laminate 61 having undergone the above steps is subjected to a degreasing treatment and a baking treatment. By the above-described process, the ceramic substrate 11 having the cavity 12 and the like shown in (c) is formed, and the inner pad 13a, the internal conductor layer 57, and the external connection pad 55 are formed on and in the surface of the ceramic substrate 11. Subsequently, the ceramic substrate 11 is immersed in a plating bath for Ni plating to bring the terminals 67 for electrolytic plating into contact with the external connection pads 55, and the inner pads 13a and the external connection pads 55 are subjected to electrolytic Ni plating (FIG. 6). (C)).

Next, the connection portion 68a of the lead frame 68 is soldered to the external connection pad 55 that has been subjected to the Ni plating process, and the ceramic substrate 11 to which the external connection pad 55 has been soldered is placed on a plating bath for Au plating. And another electrolytic plating terminal 69 is brought into contact with the lead frame 68, and the inner pad 13a, the external connection pad 55 and the lead frame 68 are subjected to electrolytic Au plating (FIG. 6).
(D)). Then, the connecting portion 68a of the lead frame 68
Is separated from the connecting portion 68b to form an external connection terminal 56 (FIG. 5).

[0009]

As shown in FIG. 5, a conventional ceramic wiring board 50 for optical communication has a type in which an external connection terminal 56 is fixed to a side wall surface 11b of a ceramic substrate 11 (side blazed type). Therefore, in the manufacturing process, the side wall surface 61b of the green sheet laminate 61
It is necessary to form a conductor paste layer 63 for external connection pads.

[0010] Therefore, after cutting a large green sheet laminate and dividing it into individual green sheet laminates 61, the individual green sheet laminates 61 are set on a printing device for performing side printing, and the side wall surfaces are set. The conductor paste layer 63 for external connection pads was formed on 61b.

As described above, in manufacturing the conventional ceramic wiring board 50 for optical communication, the individual green sheet laminates 61 are set in the printing apparatus, and the conductor paste layer 63 for external connection pads is formed on the side wall surface 61b. Therefore, there has been a problem that the conductor paste layer 63 for external connection pads (external connection pads 55) cannot be efficiently formed.

Also, in the case of performing a plating process, the individual ceramic substrates 11 are immersed in a plating bath, and electrolytic plating terminals 67 and
69, and also when the external connection terminals 56 are fixed, it is necessary to perform the processing for each ceramic substrate 11, so that these processes cannot be performed efficiently and the manufacturing cost is high. There was a problem of sticking.

[0013]

SUMMARY OF THE INVENTION In view of the above problems, the present inventor can efficiently form external connection pads, perform plating, and the like. As a result, the ceramic wiring board for optical communication can be manufactured at low cost. Various investigations were made on a method of manufacturing a ceramic wiring board for optical communication capable of manufacturing an optical communication board. An external connection pad was formed on the lower surface of the ceramic substrate, and an external connection pin was fixed to the external connection pad (bottom). By using a ceramic wiring board for optical communication (blaze type), a large number of external connection pads can be formed, and a large-sized green sheet including a plurality of wiring board portions can be formed at once by a conductor paste for external connection pads. A conductive paste layer such as a layer,
After that, it was found that firing, plating, fixing of external connection pins, etc. could be performed without dividing the large green sheet laminate produced by laminating these green sheets, and the present invention was completed. .

That is, in the ceramic wiring board for optical communication (1) according to the present invention, a cavity for accommodating an optical communication element is formed on the upper surface of the substrate, and a wiring through hole is formed from the cavity wall surface to the end surface of the substrate. On the other hand, an external connection pad is formed on the lower surface of the substrate, and an external connection pin is fixed to the external connection pad.

The ceramic wiring board for optical communication (1)
Is a type in which external connection pins are fixed to the lower surface of the substrate, so that a larger number of external connection pads can be formed as compared with a conventional side-blaze type ceramic wiring board for optical communication, and the terminal of the optical communication element can be formed. It is possible to flexibly cope with the increase in the number. In addition, since inexpensive external connection pins can be used, an inexpensive ceramic wiring board for optical communication can be obtained.

In the ceramic wiring board for optical communication according to the present invention, in the ceramic wiring board for optical communication (1), the inside of the cavity is formed in a step shape, and the inner pad is formed in the step portion. Is formed, and the inner pad and the external connection pad are connected by an internal conductor layer and a through hole.

According to the ceramic wiring board for optical communication (2), since the inner pad and the external connection pad are connected via the internal conductor layer and the through hole, a large number of chips are provided on the lower surface of the substrate. Also when forming the external connection pads, the inner pads and the external connection pads can be connected by increasing the number of internal conductor layers or changing the shape or the like.

Further, the method (1) for manufacturing a ceramic wiring board for optical communication according to the present invention is the method for manufacturing a ceramic wiring board (2) for optical communication according to the present invention, wherein a dummy band is provided between the first green sheets. A first conductor paste layer forming step of forming a plurality of units of conductor paste layers for external connection pads in a predetermined arrangement with a dummy band sandwiched between the first band and the second green sheet; An opening forming step of forming a plurality of openings in a predetermined arrangement for forming a sandwich, a cavity or a cavity and a wiring through hole, and a conductive paste layer for an inner pad on the second green sheet; A paste layer for an internal conductor layer to be combined with a conductor paste layer for an inner pad, and a conductor paste layer for a plating tie bar formed in the dummy zone; A second conductive paste layer forming step of forming a conductive paste layer for plating including a connection portion between the conductive paste layer for inverter and the paste layer for the internal conductive layer, and a plurality of green sheets including the second green sheet Stacking on the first green sheet to form a green sheet laminate, and dividing the green sheet into a wiring board portion and a dummy portion including a plating tie bar after sintering. Forming a dividing groove in the body from above and below so as not to cut the paste layer for an internal conductor layer.

According to the method (1) for manufacturing a ceramic wiring board for optical communication, a plurality of units of the external connection pad conductive paste layers are formed in a predetermined arrangement in the first conductive paste layer forming step. In addition, a plurality of units of the external connection pad conductor paste layer can be efficiently formed at one time.

In the first conductive paste layer forming step, the opening forming step, and the second conductive paste layer forming step, the dummy is added to the first green sheet and the second green sheet. Since the plurality of openings and the various conductor paste layers are formed with a band interposed therebetween, and the plating conductor paste layer is formed in the dummy band of the second green sheet,
After firing, a plurality of wiring board portions can be subjected to plating at one time by using the plating conductor layer formed on the manufactured large-sized sintered body for wiring board. Further, the external connection pins can be fixed to the formed plural external connection pads at a time.

Further, in the dividing groove forming step, the dividing grooves are formed in the green sheet laminate from above and below so as not to cut the paste layer for the internal conductor layer. By applying a small bending stress to the large-sized sintered body, it is possible to divide the wiring board portion and the dummy portion, and to manufacture the optical communication ceramic wiring board efficiently and inexpensively by the above steps. be able to.

Further, the method (2) for manufacturing a ceramic wiring board for optical communication according to the present invention is the method for manufacturing a ceramic wiring board for optical communication (1), wherein the plating tie bar at the end of the second green sheet is provided. After forming a terminal portion at an end of the conductive paste layer for use, the green sheets are laminated to form a green sheet laminate, and a conductive paste layer for a plating terminal is formed on a side wall surface including the terminal portion of the green sheet laminate. Is formed.

According to the method (2) for manufacturing a ceramic wiring board for optical communication, the terminal portion is formed at an end of the conductive paste layer for a plating tie bar, and then the green sheet laminate is formed. Since the plating terminal conductor paste layer is formed on the side wall surface including the terminal portion of the sheet laminate, the plating process can be easily performed by using the plating terminal conductor layer formed by firing. .

[0024]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a ceramic wiring board for optical communication according to the present invention and a method for manufacturing the same will be described below with reference to the drawings. FIG. 1A is a perspective view schematically showing a ceramic wiring board for optical communication according to an embodiment, and FIG. 1B is a front view. A cavity 12 for accommodating an optical communication element (not shown) is formed on an upper surface 18 of the ceramic substrate 11, and a cavity 12 is formed inside the cavity 12 for inserting an optical communication wiring (not shown). Of the ceramic substrate 11 from the wall surface 12a
Are formed in the through hole 14 for wiring. The optical communication element and the optical communication wiring are coupled inside the cavity 12 so as to transmit and receive laser light and the like via the optical communication wiring. The interior of the cavity 12
Both side walls sandwiching the wall surface 12a are formed in a step-like manner, and an inner pad 13a for connecting to the terminal of the optical communication element is formed in the step portion 13, and the inner pad 13a is connected to the internal conductor layer 17a. I have. This internal conductor layer 1
7a has reached the side wall surface 11b, and the internal conductor layer 17a has reached the side wall surface 11b. This is for connection with the plating conductor layer (not shown) formed in the dummy portion.

External connection pads 15 are formed on the lower surface 19 of the ceramic substrate 11.
An external connection pin 16 for connecting to the motherboard is fixed to 5, for example, by brazing. The internal conductor layer 17a and the external connection pad 15 are connected via a through hole 17b. The inner pads 13a, the external connection pads 15, and the external connection pins 16 are plated.

The internal conductor layer 17a and the through hole 1
The shape and the like of 7b are changed according to the number of external connection pads 14 to be formed. In this case, a plurality of internal conductor layers 17a may be formed, and the number of through holes 17b may be increased.

This ceramic wiring board 10 for optical communication is
Since the external connection pins 16 are fixed to the lower surface 19 of the ceramic substrate 11, it is a bottom blazed type, and the conventional side blazed type ceramic wiring board for optical communication 50
Compared to (FIG. 5), a large number of external connection pads 15 can be formed on the lower surface 19, and the increase in the number of terminals of the optical communication element can be dealt with with a margin. In addition, since inexpensive external connection pins 16 can be used, the inexpensive ceramic wiring board 10 for optical communication can be obtained.

Next, a method for manufacturing the ceramic wiring board 10 for optical communication will be described. Ceramic wiring board for optical communication 10
Comprises a first conductive paste layer forming step, an opening forming step, a second conductive paste layer forming step, a green sheet laminate production step, and a dividing groove forming step. Hereinafter, the manufacturing steps including these steps will be sequentially described.

FIG. 2 is a plan view schematically showing the first green sheet in a state where the first conductive paste layer forming step has been completed. In the first conductive paste layer forming step, the dummy band 33a is formed on the first green sheet 31.
Are formed, three units of the conductor paste layer 32 for external connection pads are formed in three rows in two units vertically, and a dummy band 33b is also formed around the first green sheet 31. The shape and number of the external connection pad conductor paste layers 32 may be changed as necessary. Note that the two-dot chain line indicates a portion where the dividing groove 24 is formed, and the portion surrounded by the dividing groove 24 and having the external connection pad conductor paste layer 32 formed therein corresponds to the wiring board portion 36. FIG.
Although not shown, a conductive paste filling layer for through-holes to be connected to the conductive paste layer for external connection pads 32 is formed inside the first green sheet 31.

FIG. 3 is a plan view schematically showing the second green sheet after the opening forming step and the second conductive paste layer forming step have been completed. In the opening forming step, an opening 42 for forming the cavity 12 and the wiring through hole 14 (FIG. 1) in the second green sheet 41 with the dummy bands 43a interposed therebetween.
Are formed three rows horizontally by two units vertically. Next, the second
In the conductor paste layer forming step, the conductor paste layer 44 for the inner pad, the paste layer 45 for the internal conductor layer to be connected to the conductor paste layer for the inner pad 44, and the dummy band 43a are formed on the second green sheet 41. The plating tie bar conductor paste layer 47a and the plating conductor paste layer 47 including the connection portion 47b between the plating tie bar conductor paste layer 47a and the internal conductor layer paste layer 45 are formed. Further, a terminal portion 47c is formed at an end of the plating tie bar conductive paste layer 47a. actually,
By a method such as screen printing, all the above-mentioned conductor paste layers can be formed by one printing. Also,
Only the portion of the inner pad conductor paste layer 44 may be printed using conductor paste having a different composition. In addition,
Although not shown in FIG. 3, similarly to the case of the first green sheet 31, it is combined with the internal conductor layer paste layer 45 and the through-hole conductor paste filling layer formed on the first green sheet 31. A conductive paste filling layer for through holes is formed in advance.

Next, in the green sheet laminate manufacturing step, the plurality of green sheets including the second green sheet 41 are placed on the first green sheet with the surface on which the external connection pad conductive paste layer 32 is formed facing downward. The green sheet laminate 20 (FIG. 4) is formed by laminating the green sheet laminate 31 on the base 31, and the conductive paste layer 21 for plating terminals is formed on the portion of the side wall surface 20 a of the green sheet laminate 20 where the terminal portion 47 c is exposed.

FIG. 4A is a plan view schematically showing the green sheet laminate 20 in a state where the green sheet laminate production step and the division groove forming step have been completed, and FIG. 4B is a front view. FIG.

A plurality of cavity recesses 22 are formed on the upper surface 29a of the green sheet laminate 20 having undergone the green sheet laminate production step, and a step 23 inside the cavity recess 22 has a conductive paste layer for an inner pad. 4
4 are formed, and a cavity 25 that becomes the wiring through-hole 14 (FIG. 1) after firing is formed in the cavity recess 22. On the lower surface 29b of the green sheet laminate 20, a conductor paste layer 32 for external connection pads is formed.
Inside the green sheet laminate 20, a paste layer 45 for the internal conductor layer and a conductor paste layer 4 for the plating tie bar are provided.
7a and plating conductor paste layer 4 including connection portion 47b
7 and the like, and a conductive paste filling layer 26 for through-holes that couples the internal conductive layer paste layer 45 and the external connection pad conductive paste layer 32 is formed.

In the dividing groove forming step, the dividing grooves 2 are vertically arranged so as not to cut the internal conductor layer paste layer 45.
4 is formed. By the above processing, the wiring board portion 27 and the dummy portions 28a and 28b are separated by the dividing grooves 24.

Thereafter, the green sheet laminate 20 is subjected to a degreasing treatment and a baking treatment to produce a large-sized sintered body for a wiring board. Since the conductor layer for a plating terminal is formed on the side wall surface of the large-sized sintered body for a wiring board, the large-sized sintered body for a wiring board is immersed in a plating bath for Ni plating. Electrolytic Ni plating is performed using the conductor layer, and the external connection pads 15 and the inner pads 1 are formed.
A Ni plating layer is formed on 3a.

Next, the external connection pins 16 are soldered to the external connection pads 15. In this case, after the paste for brazing is applied to the external connection pads 15, a number of external connection pins are set up in holes formed in the carbon plate or the like, and the external connection pads 15 are positioned on the external connection pins. The external connection pins 16 can be fixed at a time by mounting the large-sized sintered body for a wiring substrate and then performing a heat treatment.

Next, the large-sized sintered body for a wiring board to which the external connection pins 16 are brazed is immersed in a plating bath for Au plating, and is subjected to electrolytic Au plating using the plated terminal conductor layer. , External connection pad 15, inner pad 1
An Au plating layer is formed on 3 a and the external connection pins 16.

Thereafter, a bending stress is applied to the large-sized sintered body for a wiring board to divide it into a wiring board portion and a dummy portion.
By performing post-processing such as polishing, the manufacturing process of the optical communication ceramic substrate 10 is completed.

According to the method of manufacturing the ceramic wiring board 10 for optical communication according to the above-described embodiment, in the first conductive paste layer forming step, a plurality of units of the conductive paste for external connection pads are formed on the first green sheet 31. Since the layers 32 are formed in a predetermined arrangement, the external connection pad conductor paste layer 32 can be efficiently formed at one time.

In the first conductive paste layer forming step, the opening forming step, and the second conductive paste layer forming step, the first green sheet 31 and the second green sheet 41 are provided with a dummy band. 33a, 33
b, 43a, 43b, a plurality of openings 42
And various conductive paste layers, and a terminal portion 47c is formed at an end of the second green sheet 41, and a portion of the side wall surface 20a of the green sheet laminate 20 where the terminal portion 47c is exposed is used for plating terminals. Since the conductive paste layer 21 is formed, a plurality of wiring board portions can be subjected to plating at once by using the plated terminal conductive layer formed on the manufactured large-sized sintered body for a wiring board after firing. . Also,
The external connection pins 1 are connected to the external connection pads 15
6 can be fixed.

Further, in the dividing groove forming step, the paste layer 45 for the internal conductor layer is added to the green sheet laminate 20.
Since the dividing groove 24 is formed from above and below so as not to cut the wiring board, it is possible to divide the wiring board portion and the dummy portion by applying a small bending stress to the large-sized sintered body for a wiring board. Thus, the ceramic wiring board for optical communication 10 can be manufactured efficiently and at low cost.

[0042]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a ceramic wiring board for optical communication according to the present invention and a method of manufacturing the same will be described below.

<Manufacturing conditions> (1) Production of green sheet laminate 20 Green sheet (including first green sheet 31 and second green sheet 41) Alumina powder, resin, solvent, plasticizer, conductor paste (inner pad) Metal particles (Mo particles), resin, solvent Conductive paste (for external connection pads) Metal particles (W particles), resin, organic solvent Number of green sheets to be laminated: 7 sheets (2) Shape and the like of the manufactured green sheet laminate 20 (FIG. 4) Outer shape of the green sheet laminate 20 40 mm × 45 mm × 4 mm Number of wiring board portions 27: 6 Outer shape of wiring board portion 27 15 mm × 9 mm × 4 mm Shape of cavity concave portion 22 9 mm × 6 mm × 2 mm Shape of cavity 25 1 mm × 1 mm × 5 mm Shape of dummy portion 28 a 35 mm × 4 mm × 4 mm (3) Firing of green sheet laminate 20 Firing temperature: 1550 ° C., firing atmosphere: mixed gas atmosphere of nitrogen and hydrogen <Measurement of conduction resistance of ceramic wiring substrate 10 for optical communication>
When the conduction resistance between the inner pad 13a and the external connection pin 16 was measured, it was a value having no problem at all, and it was found that the conduction was complete.

According to the above embodiment, the ceramic wiring board 10 for optical communication according to the embodiment is of a bottom blazed type, so that a plurality of wiring board portions 36 are formed in the manufacturing process of the ceramic wiring board 10 for optical communication. , 46
Large green sheet (first green sheet 3
A conductive paste layer such as the external connection pad conductive paste layer 32 can be formed on the first and second green sheets 41) at a time. Further, since the green sheet laminate 20 produced by laminating these green sheets can be subjected to a baking treatment without dividing, the plating treatment and the fixing of the external connection pins 16 can be performed thereafter. The ceramic wiring board 10 for optical communication can be manufactured efficiently and inexpensively.

[Brief description of the drawings]

FIG. 1A is a perspective view schematically showing a ceramic wiring board for optical communication according to an embodiment of the present invention;
(B) is a front view.

FIG. 2 is a plan view schematically showing a first green sheet in a state where a first conductive paste layer forming step has been completed.

FIG. 3 is a plan view schematically showing a second green sheet in a state where an opening forming step and a second conductive paste layer forming step are completed.

FIG. 4A is a plan view schematically showing a green sheet laminate in a state where a green sheet laminate production step and a division groove forming step are completed, and FIG. 4B is a front view.

FIG. 5A is a perspective view schematically showing a conventional ceramic wiring board for optical communication, and FIG. 5B is a front view.

FIGS. 6A to 6D are perspective views schematically showing a part of a process when manufacturing a ceramic wiring board for optical communication.

[Explanation of symbols]

 Reference Signs List 10 ceramic wiring substrate for optical communication 11 ceramic substrate 11a end face 12 cavity 12a wall surface 13 step 13a inner pad 14 wiring through hole 15 external connection pad 16 external connection pin 17a internal conductor layer 17b through hole 18 upper surface 19 lower surface 20 lower surface green sheet lamination Body 20a Side wall surface 21 Conductive paste layer for plating terminal 24 Dividing groove 31 First green sheet 32 Conductive paste layer for external connection pad 33a, 33b, 43a, 43b Dummy band 41 Second green sheet 42 Opening 44 For inner pad Conductive paste layer 45 Paste layer for internal conductor layer 47 Conductive paste layer for plating 47a Conductive paste layer for plating tie bar 47b Connection 47c Terminal

Claims (4)

[Claims] A cavity for receiving an optical communication element is formed on an upper surface of a substrate; a through hole for wiring is formed from a wall surface of the cavity to an end surface of the substrate; external connection pads are formed on a lower surface of the substrate; An external connection pin is fixed to the external connection pad. 2. The method according to claim 1, wherein the inside of the cavity is formed in a step shape, an inner pad is formed in the step portion, and the inner pad and the external connection pad are connected by an internal conductor layer and a through hole. The ceramic wiring board for optical communication according to claim 1, wherein: 3. A first conductive paste layer forming step of forming a plurality of units of external connection pad conductive paste layers in a predetermined arrangement on a first green sheet with dummy bands interposed therebetween; An opening forming step of forming a plurality of openings in a predetermined arrangement for forming the cavity or the cavity and the wiring through-hole in the green sheet, with the dummy band having the same arrangement as the dummy band interposed therebetween, and A conductive paste layer for an inner pad on the second green sheet, a paste layer for an internal conductive layer bonded to the conductive paste layer for the inner pad, and a conductive paste layer for a plating tie bar formed in the dummy zone; Second conductors each forming a plating conductor paste layer including a connection portion between the plating tie bar conductor paste layer and the internal conductor layer paste layer A green sheet laminate forming step of forming a green sheet laminate by laminating a plurality of green sheets including the second green sheet on the first green sheet, and a wiring board after sintering. Forming a dividing groove in the green sheet laminate from above and below so as not to cut the internal conductor layer paste layer in order to divide the portion into a dummy portion including a plating tie bar. 3. The method for manufacturing a ceramic wiring board for optical communication according to claim 2, wherein: 4. After forming a terminal portion at an end of the plating tie bar conductive paste layer at an end of the second green sheet, the green sheets are laminated to produce a green sheet laminate. 4. The method of manufacturing a ceramic wiring board for optical communication according to claim 3, wherein a conductor paste layer for a plated terminal is formed on a side wall surface including the terminal portion of the laminate.