JPH1140552A - Atmospheric pressure cvd equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an atmospheric pressure CVD equipment which is capable of preventing the generation of dust, and to avoid falling of a wafer pallet. SOLUTION: A silicon wafer is placed on a wafer pallet 4 which is fixedly fitted between a pair of slide blocks 20, 20 and a pair of tap plates 21, 21 which are, respectively, arranged in face-to-face relation. The silicon wafer is conveyed to a reactive gas ejection system, by permitting the slide blocks 20, 20 to be moved in accordance with rotation of a pair of two-row endless conveyor chains 15, 15. Then, temperature is raised by means of hot plates each provided inside the conveyor chains 15, 15 to form a film on the silicon wafer. A bridge 30 is provided between the pair of slide blocks 20, 20 to keep the distance therebetween and to connect the blocks 20, 20 with each other.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an atmospheric pressure CVD apparatus used in a manufacturing process for manufacturing a semiconductor device and the like, and more particularly, to a transport mechanism for the apparatus.

[0002]

2. Description of the Related Art Atmospheric pressure CVD (Chemical Vapor Depositio)
n) As shown in FIG. 11, the apparatus places a plurality of wafers 52 on each rectangular thin wafer pallet 51..., and conveys the wafer pallets 51. 54 and CVD
This is an apparatus that deposits an oxide film or the like on the wafer 52 by passing the gas through the head 55 and ejecting a reaction gas in a heated atmosphere.

When an oxide film is deposited on the wafer 52, the oxide film is also deposited on the surface of the wafer pallets 51. Therefore, the wafer pallets 51 ...
After the oxide film is deposited a plurality of times or used for one to two days, it is necessary to remove the oxide film on the surface of the wafer pallet 51 in order to etch away the oxide film.

Therefore, each of the wafer pallets 51 ...
As shown in FIG. 12, are mounted in a bridging manner on slide blocks 56 fixed to both inner sides of the transport chains 53, 53, so that removal is easy.

[0005] Each of the wafer pallets 51 ...
Is rotated by the rotation of the endless transport chain 53,
After the wafer 52 is removed, it is transported downward.
In order to prevent the wafer pallets 51 from falling even when the wafer pallets 51 face downward, the ends of the wafer pallets 51 hung on the slide blocks 56 are held by four holding plates 57. Thereby, the wafer pallet 51
Are fitted and locked by the slide blocks 56 and the pressing plates 57.

Here, when the wafer pallets 51... Face downward, the slide blocks 56.
Due to the weight of the wafer pallet 51 and the like, an acting force acts in the direction of opening outward. Therefore, the wafer pallets 51 tend to fall off the slide blocks 56 and fall.

Therefore, in the conventional atmospheric pressure CVD apparatus, in order to prevent the slide blocks 56, 56 from opening in the horizontal direction and to prevent the wafer pallets 51 from falling, both sides of the slide blocks 56, 56 are required. Are provided at a plurality of locations with guide rollers 58 sliding on the slide blocks 56.

[0008]

However, in the conventional atmospheric pressure CVD apparatus described above, the guide rollers 58, 58 are in sliding contact with the slide blocks 56, so that dust is generated due to the contact wear at that time, and the dust is generated. It accumulates on the guide rollers 58 and near the slide blocks 56 and 56.

As a result, dust generation due to contact wear between the guide rollers 58 and the slide blocks 56 becomes a serious problem in the normal pressure CVD apparatus requiring a dust-free clean environment.

Here, in order to prevent the generation of dust due to the sliding contact between the guide rollers 58, 58 and the slide blocks 56, for example, the guide rollers 58, 58 are eliminated, and the wafer pallets 51 are formed by the holding plates 57. In order to secure the engagement, it is conceivable to form the pressing plates 57 long.

However, in this case, the rubbing portion between the pressing plates 57... And the wafer pallet 51 increases, so that dust is also generated, and the dust adheres to the wafer.

SUMMARY OF THE INVENTION The present invention has been made in consideration of the above-mentioned conventional problems, and has as its object to provide an atmospheric pressure CVD apparatus capable of preventing generation of dust and avoiding falling of a wafer pallet. is there.

[0013]

According to a first aspect of the present invention, there is provided a normal pressure CVD apparatus in which a pair of fitting and locking members arranged opposite to each other are fitted and locked. The wafer is placed on the wafer pallet, and the fitting and locking member is moved with the rotation of the endless rotary transfer belt to transfer the wafer to the reaction gas ejecting device. In a normal-pressure CVD apparatus in which a film is formed on a wafer in a high-temperature state by a plate, a pair of fitting and locking members are fitted between the pair of fitting and locking members so as to maintain a mutual distance between the fitting and locking members. A connection member for connecting the locking member is provided.

That is, after a film is formed on a wafer and the wafer is removed, the wafer pallet is rotationally moved in a state of being suspended on the endless rotary transport band as the endless rotary transport band rotates. I do. At this time, since a force acting in a direction to open outward due to its own weight acts on the pair of fitting and locking members, the fitting and locking of the fitting and locking members to the wafer pallet is released, and the wafer pallet tends to drop. Becomes

Therefore, conventionally, a guide roller that slides on the outside of the fitting / locking member is provided to prevent the outward opening movement, but this causes a problem that dust is generated due to contact wear. was there.

However, according to the above invention, the distance between the pair of fitting and locking members is maintained by the connecting member that connects the two fitting and locking members.

Therefore, with the guide roller removed,
Since the outward movement of the fitting / locking member can be prevented, there is no portion that is worn by contact. For this reason, generation of dust can be prevented.

As a result, it is possible to provide a normal-pressure CVD apparatus capable of preventing generation of dust and avoiding falling of a wafer pallet.

An atmospheric pressure CVD apparatus according to a second aspect of the present invention comprises:
Atmospheric pressure CVD according to claim 1 for solving the above problem.
In the apparatus, the connecting member is attached to a side surface of the pair of fitting and locking members.

According to the above invention, the connecting member is
Because it is attached to the side of a pair of mating locking members,
The distance from the surface of the hot plate increases.

That is, when the connecting member is attached to the back surface of the pair of fitting / locking members, the distance between the connecting member and the front surface of the hot plate is short, and the temperature of the connecting member is easily increased by the hot plate. There is a possibility that the connecting member is easily bent and comes into contact with the hot plate.

However, according to the present invention, since the connecting member is attached to the side surface of the pair of fitting / locking members, the connecting member is spaced apart from the surface of the hot plate. And thus the deflection dimension is also reduced. As a result, contact of the connecting member with the hot plate can be avoided, and generation of dust can be prevented.

The atmospheric pressure CVD apparatus according to the third aspect of the present invention comprises:
In order to solve the above-mentioned problem, in the normal pressure CVD apparatus according to claim 1 or 2, the connecting member is formed of a rigid linear member, and both ends of the rigid linear member are provided on both fitting locking members. It is characterized by being wound around a protruding pin.

According to the above invention, the connecting member is made of a rigid linear member, and both ends of the rigid linear member are wound around the protruding pins provided on both the fitting and locking members.

For this reason, even if the connecting member thermally expands, its expansion is absorbed by the curvature expansion and contraction at the winding portion. Therefore, even if the connecting member thermally expands, the downward bending is reduced. As a result, contact of the connecting member with the hot plate can be avoided, and generation of dust can be prevented.

A normal pressure CVD apparatus according to a fourth aspect of the present invention comprises:
In order to solve the above-mentioned problem, in the atmospheric pressure CVD apparatus according to claim 1 or 2, the connecting member is formed of a plate-like member whose central portion is an upright surface perpendicular to the surface of the hot plate. It is characterized by having.

According to the above invention, the connecting member is formed of a plate-like member whose central portion is an upright surface perpendicular to the surface of the hot plate. Therefore, even if the connecting member made of a plate-shaped member receives a rise in temperature, the bending occurs in the central portion thereof not in the vertical direction but mainly in the horizontal direction in which it is easy to bend.

As a result, contact of the connecting member with the hot plate can be avoided, and generation of dust can be prevented.

[0029]

BEST MODE FOR CARRYING OUT THE INVENTION

[Embodiment 1] An embodiment of the present invention will be described below with reference to FIGS.

The atmospheric pressure CVD (Chemical Vapo
r Deposition apparatus is used, for example, in a manufacturing process of manufacturing a semiconductor device, and forms an oxide film, a PSG film, etc. on a silicon wafer as a semiconductor substrate by a normal pressure vapor deposition method using a reaction gas and a heating atmosphere. A film is applied.

As shown in FIG. 2, the normal pressure CVD apparatus includes a reaction gas ejection device 1 for ejecting a reaction gas,
The apparatus includes a transfer mechanism 10 for guiding the silicon wafer 2 as a wafer to the reaction gas ejecting apparatus 1 and a hot plate 3 for heating the silicon wafer 2 from the back side.

The transport mechanism 10 includes, for example, transport chains 15, 15 as endless rotary transport bands wound around two large-diameter drive sprockets 11, 12 and two small-diameter driven sprockets 13, 14. Are provided in two rows in parallel. The pair of transport chains 15 are configured to rotate and move in synchronization. The transport chain 15 is not limited to this, and may be configured by a transport belt, for example.

As shown in FIG. 1, slide blocks 20 as fitting engagement members are attached to the inside of each of the transport chains 15. In addition, the silicon wafer 2 is placed between these slide blocks 20 in a bridging manner on L-shaped mounting portions 25a formed inside each of the slide blocks 20. Pallet 4 is easily mounted and removed in a state where it is placed and sandwiched.

That is, when an oxide film is deposited on the silicon wafer 2 by the reaction gas ejecting apparatus 1, the oxide film is also deposited on the surface of the wafer pallets 4.. For this reason,
The wafer pallets 4 need to be removed after the oxide film is deposited a plurality of times or after one to two days of use in order to etch away the oxide film on the surface of the wafer pallet 4. For this reason, the transport mechanism 10 has a structure in which the wafer pallet 4 can be easily removed from the slide blocks 20.

In the transfer mechanism 10, the silicon wafer 2 is transferred to the large-diameter drive sprocket 12 on the downstream side.
Even after the silicon wafer 2 is detached in the vicinity, it is transported downward with the rotation of the transport chains 15. Therefore, in order to prevent the silicon wafer 2 from dropping, the slide blocks 20, 20 shown in FIGS.
As shown in FIG. 3, pressing plates 21 as fitting engagement members are provided to press the four corners of the wafer pallet 4. The holding plates 21 have, for example, a substantially semicircular shape, and can be switched between a holding state and a non-holding state by being rotated about a rotation shaft 21a. The slide blocks 20 and the holding plate 2
The wafer pallet 4 is engaged and locked by the steps 1.

Next, as shown in FIGS. 4 and 5, the slide block 20 includes a guide holder 22 having a U-shaped cross section, and a resin rail receiver 23 provided inside the guide holder 22. And a spacer 24 provided above the guide holder 22, and a tray stage 25 further provided thereon. Note that the inner end of the tray stage 25 is provided with the above-mentioned L-shaped mounting portion 2 for fitting and locking the wafer pallet 4.
5a and 25a.

The guide holder 22 of the slide block 20 is mounted and fixed by a not-shown screw on a mounting stay 15a erected on the transport chain 15. And by this, slide block 2
Reference numerals 0 and 20 rotate and move with the rotation of the transport chain 15.

Further, as shown in FIG.
A pair of guide rails 16 are provided between the large-diameter drive sprocket 11 and the large-diameter drive sprocket 12 along the transport chain 15 at the inside.

Therefore, the slide blocks 20 and 2
The reference numeral 0 indicates that the rail receiver 23 is guided by the guide rail 16 so that it is stably transported above the transport chain 15.

Here, as shown in FIG. 1, when the wafer pallet 4 is transported by the transport chain 15 and turned downward, the slide blocks 20 are opened outward due to the weight of the wafer pallet 4. Acting force acts in the direction. For this reason, the wafer pallets 4 tend to fall off the slide blocks 20, 20.

Therefore, in the atmospheric pressure CVD apparatus of the present embodiment, a bridge spring 30 as a connecting member is stretched between the left and right slide blocks 20 so as to be able to oppose the acting force in the outward opening direction. It is suspended. Thus, when the slide blocks 20 are opened, a pulling force acts inward, so that the wafer pallets 4 can be prevented from falling.

In the present embodiment, as shown in FIGS. 6A and 6B, the bridge spring 30 is made of, for example, stainless steel having a small-diameter linear rigidity, as shown in FIG. Further, an end of the bridge spring 30 is wound and attached to a protruding pin 25b provided on the slide block 20/20 on the back surface of the tray stage 25 downward. The material of the bridge spring 30 is selected from stainless steel in consideration of prevention of dust generation due to contact.

Here, the bridge spring 30 is shown in FIG.
As shown in FIG. 7, a circular portion is provided at the end and bent at approximately 90 °.

That is, the bridge spring 30 is thermally expanded and bent by the heating of the hot plate 3 at about 700 ° C., for example. At this time, since the gap between the hot plate 3 and the wafer pallet 4 is, for example, about 5 mm, it is necessary to avoid contact of the bridge spring 30 with the hot plate 3 due to this bending in order to prevent generation of dust.

Therefore, as described above, the bridge spring 30 has a structure in which both ends of the bridge spring 30 are wound around the protruding pins 25b and bent at approximately 90 °, that is, a circular portion is provided at the end. It adopts a curvature expansion and contraction structure. Therefore, even if the bridge spring 30 expands due to thermal expansion, the curvature expansion and contraction structure can absorb the thermal expansion of the wire rod due to the temperature rise and prevent the bridge spring 30 from bending.

Further, by providing a circular portion at the end of the bridge spring 30 and attaching it to the projecting pin 25b, when the bridge spring 30 is detached from the projecting pin 25b, as shown in FIG. As shown in the figure, by manually applying a force to the bridge spring 30 so that the bridge spring 30 has an acute angle θ, the projecting pins 2
5b, a gap ΔL is formed between the bridge spring 30
Can be easily attached to and detached from the protruding pin 25b.

Since the bridge spring 30 is made of a small-diameter linear member, the bridge spring 30 does not block heat from the hot plate 3. Although the bridge spring 30 is formed in a linear shape, the thickness of the bridge spring 30 includes a rod shape.

In the above example, the bridge spring 30
Are wound around projecting pins 25b provided downward on the tray stage 25 of the slide blocks 20. As a result, they are attached to the back surfaces of the slide blocks 20. However, the present invention is not limited to this. For example, as shown in FIG. 7, if there is enough space, it can be wound around the projecting pin 25 c provided on the side surface of the tray stage 25.

Next, the operation of the normal pressure CVD apparatus will be described.

First, as shown in FIG. 2, a wafer cassette 17 accommodating a large number of silicon wafers 2 is provided near the large-diameter drive sprocket 11 in the transfer mechanism 10. Accordingly, the silicon wafers 2 are sequentially taken out of the wafer cassette 17 one by one, and one or more silicon wafers 2 are placed on the wafer pallet 4 by the automatic transfer machine 18.

The silicon wafer 2 placed on the wafer pallet 4 is horizontally transferred in the direction of arrow A along the guide rail 16 by the transfer chain 15 of the transfer mechanism 10. In addition, since the hot plate 3 is provided below the wafer pallet 4 during the transfer, the silicon wafer 2 is gradually heated and finally heated to, for example, about 400 ° C.

Next, when the wafer is conveyed to a position immediately below the reaction gas ejection device 1, the reaction gas is ejected from the reaction gas ejection device 1 and an oxide film is deposited on the silicon wafer 2. After that, when the silicon wafer 2 reaches the position near the large-diameter drive sprocket 12 in the transfer mechanism 10 after passing through the reaction gas ejection device 1, the silicon wafer 2 is separated from the guide rail 16 by the automatic transfer machine 19 provided in the vicinity. The wafer is removed from the wafer pallet 4.

Next, in the transfer mechanism 10, the wafer pallet 4 is rotated and returned by the large-diameter drive sprocket 12, and moves in a suspended state.

At this time, as shown by an arrow B, a force to open outward is applied to the slide blocks 20 as shown in FIG. However, in the present embodiment,
Since the bridge spring 30 is provided and the pulling force is constantly applied to the slide blocks 20, the slide blocks 20 do not open.

Therefore, the wafer pallet 4 does not fall off the slide blocks 20.

On the other hand, when an oxide film is deposited on the surface of the silicon wafer 2 by the reactive gas injection device 1, the oxide film is also deposited on the surface of the wafer pallets 4.. For this reason, the wafer pallets 4...
Alternatively, after one or two days of use, the wafer pallet 4 is removed by etching to remove an oxide film on the surface thereof.

At this time, the slide blocks 20 and 2
The wafer pallet 4 can be easily detached from the slide blocks 20 by rotating the pressing plates 21 provided on the rotation axis 21 around the rotation shaft 21a.

As described above, in the normal pressure CVD apparatus according to the present embodiment, between the pair of slide blocks 20 and the pressing plates 21.
In order to maintain the mutual distance between the slide blocks 20 and the holding plates 21, a connecting member for connecting the slide blocks 20 and the holding plates 21 is provided.

That is, a film is formed on the silicon wafer 2, and the wafer pallet 4 after removing the silicon wafer 2 is suspended on the endless transfer chain 15 with the rotation of the endless transfer chain 15. Rotate and move in the state. At this time, the pair of slide blocks 20 and 20 and the pressing plates 21... Act on the pair of slide blocks 20 and 20 and the pressing plates 21.
The wafer pallet 4 is apt to fall off due to the engagement lock.

Therefore, conventionally, in order to prevent the outward opening movement, a pair of slide blocks 20 and 2 are used.
Although the guide rollers are provided so as to be in sliding contact with the outer sides of the pressing plates 21 and the pressing plates 21, there is a problem that dust is generated due to contact wear.

However, in the present embodiment, the distance between the pair of slide blocks 20 and the holding plate 21 is maintained by the bridge spring 30 connecting the slide blocks 20 and the holding plate 21. Is done.

Therefore, with the guide roller removed,
Since the outward movement of the slide blocks 20 and the holding plates 21... Can be prevented, there is no contact wear portion. For this reason, generation of dust can be prevented.

As a result, it is possible to provide a normal-pressure CVD apparatus capable of preventing generation of dust and avoiding falling of the wafer pallet 4.

In the atmospheric pressure CVD apparatus of the present embodiment, the bridge spring 30 is connected to the pair of slide blocks 20.
-It can be attached to the side of 20.

As a result, the distance between the bridge spring 30 and the surface of the hot plate 3 increases.

That is, when the bridge spring 30 is attached to the back surfaces of the pair of slide blocks 20, the temperature of the bridge spring 30 is easily increased by the hot plate 3 because the distance from the surface of the hot plate 3 is short. This may cause the bridge spring 30 to be easily bent and come into contact with the hot plate 3.

However, in this embodiment, the bridge spring 30 is attached to the side surfaces of the pair of slide blocks 20, so that the bridge spring 30 is separated from the surface of the hot plate 3. The degree of temperature rise is reduced, which also reduces the flex dimension. As a result, contact of the bridge spring 30 with the hot plate 3 can be avoided, and generation of dust can be prevented.

In the atmospheric pressure CVD apparatus according to the present embodiment, the bridge spring 30 is formed of a rigid linear member, and both ends of the rigid linear member are provided on the projecting pins 25b provided on both slide blocks 20. It is wound around.

For this reason, even if the bridge spring 30 thermally expands, its expansion is absorbed by the expansion and contraction of the curvature at this winding portion. Therefore, even if the bridge spring 30 thermally expands, the downward bending is reduced. As a result, contact of the bridge spring 30 with the hot plate 3 can be avoided, and generation of dust can be prevented.

[Embodiment 2] Another embodiment of the present invention will be described below with reference to FIGS. For convenience of explanation, the first embodiment is described.
Members having the same functions as the members shown in the drawings are denoted by the same reference numerals, and description thereof will be omitted.

In the first embodiment, the bridge spring 30 is provided to maintain the distance between the slide blocks 20.

However, since the bridge spring 30 is formed of a linear member, it may be insufficient in strength.

Therefore, in the present embodiment, FIG.
As shown in (b), a bridge plate 4 as a plate-like connecting member is provided between the slide blocks 20 by, for example, screws.
0 is stretched. As a result, a member that is stronger in strength than the linear member is obtained. The bridge plate 40 is also made of stainless steel such as SUS304.

As described above, the bridge plate 40 is heated by the hot plate 3 and bends. If this bending occurs downward, it comes into contact with the hot plate 3 and poses a problem.

Therefore, in this embodiment, even if the bridge plate 40 is bent by this heating, the hot plate 3
9 (a), 9 (b) and 9 (c), the central portion 40a of the bridge plate 40 is twisted at a right angle so that the plate surface is perpendicular to the hot plate 3. It is formed so that it becomes.

As a result, as shown in FIG. 10, the central portion 40a of the bridge plate 40 bends in the horizontal direction, which is easy to bend. Therefore, the bending in the vertical direction is small, and the bridge plate 40 does not come into contact with the hot plate 3 even when thermally expanded.

As described above, in the normal pressure CVD apparatus of the present embodiment, the bridge plate 40 is formed of a plate-like member whose central portion 40a is an upright surface perpendicular to the surface of the hot plate 3. . Therefore, even if the bridge plate 40 made of a plate-like member is subjected to a temperature rise, its bending is reduced at its central portion 40a.
Occurs mainly in the horizontal direction that is easy to bend, not in the vertical direction.

As a result, contact of the bridge plate 40 with the hot plate 3 can be avoided, and generation of dust can be prevented.

[0079]

As described above, the atmospheric pressure CVD apparatus according to the first aspect of the present invention is arranged such that the distance between the fitting and locking members is maintained between the pair of fitting and locking members. A connecting member for connecting the two fitting and locking members is provided.

Therefore, the distance between the pair of fitting and locking members is maintained by the connecting member that connects the two fitting and locking members.

Therefore, with the guide roller removed,
Since the outward movement of the fitting / locking member can be prevented, there is no portion that is worn by contact. For this reason, generation of dust can be prevented.

As a result, it is possible to provide a normal-pressure CVD apparatus capable of preventing generation of dust and avoiding falling of a wafer pallet.

The atmospheric pressure CVD apparatus according to the second aspect of the present invention
As described above, in the atmospheric pressure CVD apparatus according to the first aspect, the connecting member is attached to a side surface of the pair of fitting and locking members.

Therefore, by attaching the connecting member to the side surface of the pair of fitting and locking members, the connecting member is separated from the surface of the hot plate, so that the degree of temperature rise is reduced. This also reduces the flex dimension. As a result, there is an effect that the contact of the connecting member with the hot plate can be avoided and generation of dust can be prevented.

The atmospheric pressure CVD apparatus of the invention according to claim 3 is:
As described above, in the normal pressure CVD apparatus according to claim 1 or 2, the connecting member is formed of a rigid linear member, and both ends of the rigid linear member are provided on both fitting locking members. It is wound around a pin.

Therefore, even if the connecting member thermally expands, its extension is absorbed by the curvature expansion and contraction at the winding portion. Therefore, even if the connecting member thermally expands, the downward bending is reduced. As a result, there is an effect that the contact of the connecting member with the hot plate can be avoided and generation of dust can be prevented.

A normal pressure CVD apparatus according to a fourth aspect of the present invention is:
As described above, in the atmospheric pressure CVD apparatus according to claim 1 or 2, the connecting member is formed of a plate-like member whose central portion is an upright surface perpendicular to the surface of the hot plate. It is.

Therefore, the connecting member made of a plate-like member is
Even if the temperature rises, the bending occurs at the center mainly not in the vertical direction but in the horizontal direction that is easy to bend.

As a result, there is an effect that the contact of the connecting member with the hot plate can be avoided and the generation of dust can be prevented.

[Brief description of the drawings]

FIG. 1 is a view showing a normal pressure CVD apparatus according to the present invention, and is a view taken along line XX of FIG. 2;

FIG. 2 is a schematic diagram showing the normal pressure CVD apparatus.

FIG. 3 is a plan view showing a configuration of a wafer pallet and a slide block of the normal pressure CVD apparatus.

FIG. 4 is a perspective view showing a configuration of a slide block in the normal pressure CVD apparatus.

FIG. 5 is a front view showing a configuration of a slide block in the normal pressure CVD apparatus.

FIGS. 6A and 6B are bottom views showing a configuration of a bridge spring in the normal pressure CVD apparatus, wherein FIG. 6A shows a state where the bridge spring is mounted on a protruding pin, and FIG. It is.

FIG. 7 is a front view of an essential part showing a state in which a bridge spring in the normal pressure CVD apparatus is attached to a side surface of a slide block.

FIGS. 8A and 8B show another embodiment of the atmospheric pressure CVD apparatus according to the present invention, wherein FIG. 8A is a bottom view showing a state in which a bridge plate is attached to a slide block, and FIG. It is a front view which shows the state attached to.

FIG. 9 shows the structure of the bridge plate.
(A) is a front view, (b) is a side view, and (c) is a bottom view.

FIG. 10 is a bottom view showing a state in which the bridge plate bends horizontally.

FIG. 11 is a schematic diagram showing a conventional atmospheric pressure CVD apparatus.

FIG. 12 is a view taken along line YY of FIG. 11;

[Explanation of symbols]

 2 Silicon wafer (wafer) 3 Hot plate 4 Wafer pallet 15 Transport chain (rotational transport band) 20 Slide block (fitting and locking member) 21 Holding plate (fitting and locking member) 25b Projecting pin 30 Bridge spring (connecting member) ) 40 Bridge plate (connection member) 40a Central part

Claims (4)

[Claims] 1. A wafer is placed on a wafer pallet fitted and locked between a pair of fitting and locking members arranged opposite to each other,
The wafer is transferred to the reaction gas ejecting device by moving the fitting and locking member with the rotation of the endless rotary transfer band, and is heated to a high temperature state by a hot plate provided inside the rotary transfer band to form a wafer. Normal pressure CV for film formation
In the D apparatus, a connecting member that connects the two fitting and locking members is provided between the pair of fitting and locking members so as to maintain a distance between the fitting and locking members. Features of atmospheric pressure CVD
apparatus. 2. The atmospheric pressure CVD apparatus according to claim 1, wherein said connecting member is attached to a side surface of said pair of fitting and locking members. 3. The connecting member comprises a rigid linear member,
3. The normal pressure CVD apparatus according to claim 1, wherein both ends of the rigid linear member are wound around protruding pins provided on both of the engagement locking members. 4. The normal pressure as set forth in claim 1, wherein said connecting member is a plate-like member whose central portion is an upright surface perpendicular to the surface of said hot plate. CVD equipment.