JPH1136020A - Treatment of waste printed circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for the treatment of waste printed circuit boards, etc., capable of efficiently recovering noble metals such as gold, palladium, rhodium and platinum, and recovering the glass fiber reinforced expoxy resin and polyimide, etc., which cannot be dissolved by acids capable of dissolving the metals. SOLUTION: This method includes a metal dissolving process for dissolving the waste printed circuit boards, etc., by feeding the boards, etc., into an acid, such as nitric acid, hydrochloric acid, sulfuric acid, capable of dissolving the metals, a non-pollution treatment stage for gases, etc., for making the vapor and gases generated in this metal dissolving process non-pollutant, a recovering process for the noble metals by adding an alkali to the metal dissolving acids contg. the dissolved metal in the metal dissolving stage described above to adjust the pH thereof to 4 to 5 and recovering the precipitated noble metals, such as Pt, Pd, Rh, Os, Ru and Au, by filtering and a non-dissolved matter removing process for removing the non-dissolved matter, such as glass fiber reinforced expoxy resin and polyimide, which are not dissolved in the metal dissolving process.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to waste home appliances and waste OA
The present invention relates to a method of treating a printed circuit board or the like used for equipment or the like, and a waste printed circuit board or the like of a defective product or the like generated during manufacturing.

[0002]

2. Description of the Related Art Conventionally, since parts using noble metals such as gold, platinum, palladium, and rhodium are assembled on waste printed circuit boards, parts using gold are removed and gold is collected. Things are going on.

[0003]

In the conventional recovery of gold from a waste printed circuit board, it takes time and effort to remove parts using gold from the waste printed circuit board. However, other precious metals and metals cannot be recovered, which is uneconomical and has a drawback that most of them are treated as industrial waste.

The present invention has been made in view of the above-mentioned conventional drawbacks,
It is possible to efficiently collect precious metals such as gold, palladium, rhodium, and platinum, and to recover as a non-dissolved substance such as glass epoxy or polyimide that cannot be dissolved by an acid capable of dissolving metals. It is intended to provide a processing method.

Further, the present invention can efficiently recover noble metals such as gold, palladium, rhodium and platinum and metals such as silver, tin, mercury, lead, manganese, iron, copper, nickel and the like, as well as insoluble materials. It is an object of the present invention to provide a method for treating a waste printed circuit board or the like, which can be processed into artificial stone or the like.

The above and other objects and novel features of the present invention will become more fully apparent when the following description is read in light of the accompanying drawings. However, the drawings are for explanation only, and do not limit the technical scope of the present invention.

[0007]

In order to achieve the above object, the present invention provides a metal dissolving step in which a waste printed circuit board or the like is put into an acid such as nitric acid, hydrochloric acid, sulfuric acid or the like capable of dissolving a metal. A detoxifying process such as a gas for detoxifying steam or gas generated in the metal dissolving process, and adding a alkali to a metal-dissolving acid containing a dissolving metal in the metal dissolving process to adjust the pH to 4 to 5 to precipitate. Pt, Pd, Rh, O
A waste printed circuit board includes a precious metal recovery step of filtering and recovering precious metals such as s, Ru, and Au, and a non-dissolved substance removing step of removing non-dissolved substances such as glass epoxy and polyimide that are not dissolved in the metal dissolving step. And so on.

The present invention also relates to a metal dissolving step in which a waste printed circuit board or the like is introduced into an acid such as nitric acid, hydrochloric acid, sulfuric acid or the like capable of dissolving a metal, and a vapor or gas generated in the metal dissolving step is dissolved. Pt, P deposited at a pH of 4 to 5 by adding alkali to a metal-dissolving acid containing a dissolved metal in the metal-dissolving step of detoxifying a gas or the like to be rendered harmless.
d, Rh, Os, Ru, a noble metal recovery step of filtering and collecting noble metals such as Au, and a non-dissolved substance removing step of removing non-dissolved substances such as glass epochs and polyimides that are not dissolved in the metal dissolving step. A washing and dewatering step of washing and dewatering the non-dissolved matter removed in the non-dissolved matter removing step;
An ultra-high-temperature combustion process of burning in an ultra-high-temperature combustion furnace using a plasma arc or arc discharge of 000 ° C., and a residue remaining in a melted state in the ultra-high-temperature combustion process is molded into a predetermined shape into artificial stone or the like. The processing steps for processing constitute a method of processing a waste printed circuit board or the like.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the embodiments shown in the drawings.

In the first embodiment of the present invention shown in FIGS. 1 to 7, reference numeral 1 denotes a waste printed circuit board or the like 2 which is put into an acid 3 such as nitric acid, hydrochloric acid, sulfuric acid or the like capable of dissolving a metal and dissolved. In the metal melting step, the waste printed circuit board 2 used in the metal melting step 1 is made of a printed circuit board used for waste home electric appliances or waste OA equipment, a printed circuit board such as a defective product generated during manufacturing, or a noble metal. It is an electric or electronic component having a used contact or the like.

As shown in FIG. 2, the waste printed circuit board 2 and the like 2 are charged into the acid 3 by disposing a metal dissolved acid storage tank 5 for storing a metal dissolved acid 4 and a filter 6 to the metal dissolved acid storage tank 5. An acid storage tank 9 provided with an on-off valve 8 for supplying the acid 3 through a cylindrical gutter 7 provided, and a waste printed circuit board 2 or the like 2 mounted so as to protrude to an upper portion on the upstream side of the gutter 7. This is performed by using a metal dissolving device 11 including a charging device 10 or directly charging a waste printed circuit board 2 or the like 2 into an acid storage tank 9 in which the acid 3 is stored.

Reference numeral 12 denotes a detoxification process of a gas or the like for detoxifying steam or gas generated in the metal dissolving step 1 so as to be nitrogen or oxygen.
As shown in FIG. 2, a discharge passage 13 for discharging steam and gas generated in the gutter 7 and the metal dissolved acid storage tank 5 to the outside, and a wet scrubber smoke exhaust treatment device provided in the discharge passage 13 are provided. A supply path 1 including a main body 14 and a pump 17 for supplying a neutralizing agent 15 such as sodium hydroxide from a neutralizing agent storage tank 16 to the wet scrubber flue gas treatment apparatus main body 14.
8. The wet scrubber flue gas treatment device 20 is composed of a wet scrubber flue gas treatment device 20 comprising a discharge path 19 for guiding the treated neutralizing agent 15 from the wet scrubber flue gas treatment device main body 14 to the neutralizing agent storage tank 16.

Reference numeral 21 denotes Pt, Pd, and R, which are precipitated by adding an alkaline solution 22 to the metal-dissolving acid 4 containing the dissolving metal in the metal dissolving step 1 to adjust the pH to 4 to 5, as shown in FIG.
In the recovery process of precious metals and the like for filtering and recovering precious metals such as h, Os, Ru, and Au using, for example, a 400-mesh filter paper 23, the alkali liquid 22 used in the recovery process 21 of the precious metals and the like is costly. In order to achieve the reduction, waste papermaking liquid generated in a paper mill can be used. Pt that precipitates in the recovery step 21 of the noble metal and the like, and is collected by filtration;
Extraction of each of the noble metals such as Pd, Rh, Os, Ru, and Au is performed by setting the liquid temperature, recovering a high purity of 99,999% by using a reducing agent, plating, or electrolytic treatment.

Reference numeral 24 denotes an alkali solution 22 added to the metal solution 4A in which the noble metal or the like has been recovered in the above-mentioned noble metal or the like recovery step 21 to adjust the pH to approximately 8 as shown in FIG. SnO ₂ suspended by adding ions
Is collected by a ladle 25 or the like, and AgNO ₃ which precipitates and precipitates is collected by filtration using a 400-mesh filter cloth 23, for example.
The SnO ₂ recovered in the silver recovery step 24 is washed with warm water, centrifuged, recovered in high purity by an electrolytic method, and AgNO ₃ is exposed and Cu is introduced as a reducing agent to obtain Ag.
Can be precipitated and recovered, and if the purity is to be further increased, electrolytic scouring is performed.

Reference numeral 26 denotes HgCl ₂ deposited by introducing Fe as a reducing agent into the metal solution 4B in which tin and silver have been recovered in the tin and silver recovery step 24 as shown in FIG. In a mercury recovery step of filtering and recovering using a mesh filter cloth 23, high-purity H is obtained from the HgCl ₂ recovered in the mercury recovery step 26 by iron liquid reduction treatment or the like.
Collect g.

Reference numeral 27 denotes an alkaline solution 2C as shown in FIG.
2 to adjust the pH to approximately 8, Pb (OH) ₂ , Mn (OH) ₂ , Fe
(OH) ₂ , Cu (OH) ₂ , Ni (OH) ₂ , ZnC
In the residual metal recovery step 27 for recovering d, in the remaining metal recovery step 27, first, PbCl ₂ is recovered by filtration and recovered, and Cu is recovered from the remaining metal solution 4D by solvent extraction using a solvent chloroform. Metal solution 4E
From the remaining metal solution 4F by reducing and recovering ZnCd from the remaining metal solution 4F, and Mn (OH) ₂ , Fe (OH) from the remaining metal solution 4G by alkali treatment. Collect ₂ .

[0017] 28 the collected-metal solution 4H residual metal in said remaining metal recovery process 27, when adjusted to approximately 8 with PH by adding an alkali solution 22, as shown in FIG. 7, precipitated the Al ₂ O _{In a} step of collecting aluminum by filtration using, for example, a 400-mesh filter cloth 23, the filtrate remaining in the aluminum collecting step 28 is diluted, completely rendered harmless, and discarded.

Reference numeral 29 denotes a non-dissolved substance removing step for removing non-dissolved substances 30 such as glass epoch and polyimide remaining in the 6 parts of the filter without being dissolved in the metal dissolving step 1. A removable filter frame or basket may be installed in the filter 6 part, and may be removed and collected while flowing into the filter frame or basket.

Reference numeral 31 denotes a washing and dewatering step of washing and dewatering the undissolved material 30 removed and recovered in the undissolved material removing step 29. A first washing step 32 for neutralizing and washing the base 30 with an alkali, a second washing step 33 for washing with water after the first washing step 32, and a centrifugal dehydrator after the second washing step 33. And a dehydration step 34 for dehydration.

Since the cleaning liquid generated in the first cleaning step 32 contains heavy metals, the heavy metals are separated by filtration and ion concentration difference.

35 is an ultra-high temperature combustion process in which the undissolved material washed and dehydrated in the cleaning and dehydration process 31 is burned in an ultra-high temperature incinerator using a plasma arc or arc discharge having a filter core temperature of about 10,000 ° C. It is.

Reference numeral 36 denotes a processing step in which the residue remaining in the melted state in the ultrahigh-temperature combustion step 35 is molded into a predetermined shape using a mold or the like and processed into artificial stone or the like.
Is luminescent (nocturnal) in deep orange red, yellow, blue green, bright blue, purple, etc. from floor stones, wall materials, fence materials, etc. using special techniques
Can be processed into stone and sand.

[0023]

Next, different embodiments of the present invention shown in FIGS. 8 to 11 will be described. In addition,
In the description of the different embodiments of the present invention, the same components as those of the first embodiment of the present invention are denoted by the same reference numerals, and duplicate description will be omitted.

The second embodiment of the present invention shown in FIGS. 8 and 9 is different from the first embodiment of the present invention mainly in that the waste printed circuit board 2 is replaced with polyethylene, polyester and epoxy resin. After performing the synthetic resin material removing step 37 for removing the synthetic resin material such as phenolic resin and polyamide, and then performing the metal dissolving step 1, the waste printed circuit board or the like in which the synthetic resin material removing step 37 is thus performed. By using the treatment method, the synthetic resin material can be recovered.

The synthetic resin material removing step 37 may be performed manually or, as shown in FIG. 9, waste vegetable oil used for tempura at 110 ° C. to 300 ° C. where the synthetic resin material is dissolved. The synthetic resin material used for the waste printed circuit board 2 or the like may be dissolved and floated on an oil surface to be separated and removed by being put into a furnace or a pot 39 capable of heating the 38.

The third embodiment of the present invention shown in FIG. 10 is mainly different from the first embodiment of the present invention in that a solder removing step 40 for removing solder from a waste printed circuit board 2 or the like is performed. After the metal dissolving step 1 is performed, the solder can be recovered by using the processing method for the waste printed circuit board or the like in which the solder removing step 40 is performed.

In the solder removing step 40, the solder may be separated and removed by using a centrifugal separator heated to a temperature at which the solder dissolves, or a waste vegetable oil heated to a temperature at which the solder dissolves. To remove the synthetic resin material and the solder at the same time.

The fourth embodiment of the present invention shown in FIG. 11 is mainly different from the second embodiment of the present invention in that the non-dissolved material washed and dehydrated after the washing and dehydrating step 31 is crushed. At the same time, the synthetic resin material dissolves at 110 ° C to 30 ° C.
In this respect, a synthetic resin material removing step 37 of removing the synthetic resin material remaining inside by putting the waste vegetable oil used for tempura etc. at 0 ° C. into a furnace or a kettle capable of heating is performed as described above. A method of processing a waste printed circuit board or the like using the simple synthetic resin material removing step 37 may be used. In addition, depending on the waste printed circuit board to be treated, the synthetic resin material is dissolved without crushing the undissolved material that has been washed and dehydrated. A furnace or a pot capable of heating waste vegetable oil used for tempura at 110 ° C. to 300 ° C. May be performed.

[0029]

As apparent from the above description, the following effects can be obtained in the present invention.

(1) A metal dissolving step in which a waste printed board or the like is put into an acid such as nitric acid, hydrochloric acid or sulfuric acid capable of dissolving a metal to dissolve the metal, and steam and gas generated in the metal dissolving step are rendered harmless. Pt, Pd, R deposited at a pH of 4 to 5 by adding alkali to a metal-dissolving acid containing a dissolved metal in the metal dissolving step in the metal dissolving step.
a process of recovering a precious metal such as h, Os, Ru, Au or the like by filtration, and a process of removing a non-dissolved material such as a glass epoxy or a polyimide which is not dissolved in the metal dissolving process. Therefore, since the noble metal and the like are recovered after dissolving the metal of the waste printed circuit board and the like, the noble metal can be recovered in a high purity state. Therefore, the merchandise value of the collected product is high, and profit can be obtained.

(2) According to the above (1), a metal in which a waste printed board or the like is dissolved in an acid and a non-dissolved substance such as glass epoxy or polyimide can be easily separated, and post-processing can be easily performed.

(3) According to the above (1), the metal of the waste printed circuit board or the like is dissolved by the acid, so that the expensive noble metal used for the waste printed circuit board or the like can be efficiently recovered.

(4) By the above (1), harmful vapors, gases or processing liquids generated during processing can be made pollution-free,
It can be implemented safely.

(5) Claims 2 to 6 are also the above (1) to (4).
The same effect can be obtained.

[Brief description of the drawings]

FIG. 1 is a process chart of a first embodiment of the present invention.

FIG. 2 is an explanatory view of a metal melting step.

FIG. 3 is an explanatory diagram of a recovery step of precious metals and the like.

FIG. 4 is an explanatory diagram of a tin and silver recovery step.

FIG. 5 is an explanatory diagram of a mercury recovery step.

FIG. 6 is an explanatory view of a residual metal recovery step.

FIG. 7 is an explanatory diagram of an aluminum recovery step.

FIG. 8 is a process chart of the second embodiment of the present invention.

FIG. 9 is an explanatory view of a synthetic resin material removing step.

FIG. 10 is a process chart of a third embodiment of the present invention.

FIG. 11 is a process chart of a fourth embodiment of the present invention.

[Explanation of symbols]

 1: Metal dissolving process, 2: Waste printed circuit board, etc. 3: Acid, 4, 4A to 4H: Metal dissolving liquid, 5: Metal dissolving acid storage tank, 6: Filter, 7: Gutter, 8: On-off valve, 9: Acid storage tank, 10: charging device, 11: metal melting device, 12: detoxification process of gas etc., 13: discharge passage, 14: wet scrubber flue gas treatment device main body, 15: neutralizing agent, 16: neutralization Agent storage tank, 17: pump, 18: supply path, 19: discharge path, 20: wet scrubber flue gas treatment device, 21: recovery process of precious metals, etc., 22: alkaline liquid, 23: filter cloth, 24: tin, silver Recovery step, 25: ladle, 26: mercury recovery step, 27: residual metal recovery step, 28: aluminum recovery step, 29: non-dissolved substance removal step, 30, 30A: non-dissolved substance, 31: washing and dewatering step, 32: A first cleaning step, 3: Second washing step, 34: Dehydration step, 35: Ultra high temperature combustion step, 36: Processing step, 37: Synthetic resin material removing step, 38: Waste vegetable oil, 39: Furnace or pot, 40: Solder removal Process.

Claims (6)

[Claims] 1. A metal dissolving step in which a waste printed circuit board or the like is dissolved in an acid such as nitric acid, hydrochloric acid, sulfuric acid or the like capable of dissolving a metal, and a process of detoxifying steam or gas generated in the metal dissolving step. Pt, Pd, Rh, O deposited by adding alkali to a metal-dissolving acid containing a dissolving metal in the metal dissolving step to make the PH 4-5.
s, Ru, a noble metal or the like that filters and recovers a noble metal such as Au, and a non-dissolved matter removing step of removing undissolved matter such as glass epoxy or polyimide that is not dissolved in the metal dissolving step. A method for treating waste printed circuit boards and the like. 2. A synthetic resin material removing step for removing a synthetic resin material such as polyethylene, polyester, epoxy resin, phenol resin, or polyimide from a waste printed circuit board or the like, and the synthetic resin material is removed in the synthetic resin material removing step. A metal dissolving process in which waste printed circuit boards and the like are dissolved by adding them to an acid such as nitric acid, hydrochloric acid, and sulfuric acid capable of dissolving metals, and a harmless gas and the like that detoxifies steam and gas generated in the metal dissolving process. Noble metals such as Pt, Pd, Rh, Os, Ru, and Au that are precipitated by adding alkali to a metal-dissolving acid containing a dissolving metal in the metal dissolving step and adding a alkali to the metal-dissolving acid containing the dissolving metal in the metal dissolving step are filtered. Waste printed circuit board comprising a step of recovering precious metals and the like to be recovered and a non-dissolved substance removing step of removing undissolved substances such as glass epoxy and polyimide which are not dissolved in the metal dissolving step. Processing method. 3. A solder removing step for removing solder from a waste printed circuit board or the like, and the waste printed circuit board or the like from which the solder has been removed in the solder removing step is treated with an acid such as nitric acid, hydrochloric acid, sulfuric acid or the like capable of dissolving metal. A metal dissolving step for introducing and dissolving, a detoxifying step such as a gas for detoxifying steam and gas generated in the metal dissolving step, and adding alkali to the metal dissolving acid containing the dissolved metal in the metal dissolving step. , Pt, Rh, Os, R deposited at a pH of 4-5
and a step of removing a noble metal such as a noble metal such as u, Au and the like by filtration, and a step of removing a non-dissolved substance such as a glass epoxy or a polyimide which is not dissolved in the metal dissolving step. Of waste printed circuit boards. 4. A metal dissolving step of disposing a waste printed board or the like by dissolving it in an acid such as nitric acid, hydrochloric acid, sulfuric acid or the like capable of dissolving a metal, and detoxifying steam or gas generated in the metal dissolving step. Pt, Pd, Rh, O deposited by adding alkali to a metal-dissolving acid containing a dissolving metal in the metal dissolving step to make the PH 4-5.
a process of recovering a precious metal such as s, Ru, Au or the like by filtering, and an alkali is added to a solution of the metal which has been recovered such as a precious metal in the process of recovering the precious metal to adjust the pH to about 8;
And add Cl ions to float the Sn
A step of recovering O ₂ and filtering and recovering AgNO ₃ which precipitates and precipitates. A step of recovering tin and silver, and a step of adding Fe or Fe as a reducing agent to a metal solution in which tin or silver has been recovered in the step of recovering tin or silver. A mercury recovery step of filtering and recovering HgCl ₂ deposited by introducing the above, and adding an alkali to the molten metal solution in which mercury has been recovered in this mercury recovery step to adjust the pH to about 8, to precipitate or remove the solvent. Pb (OH) ₂ ,
Mn (OH) ₂ , Fe (OH) ₂ , Cu (OH) ₂ , N
A waste printed circuit board comprising: a residual metal recovery step of recovering i (OH) ₂ and ZnCd; and a non-dissolved substance removing step of removing undissolved substances such as glass epoxy and polyimide which are not dissolved in the metal dissolving step. Processing method. 5. A vegetable plant heated to a temperature at which a synthetic resin material such as polyethylene, polyester, epoxy resin, phenol resin, or polyimide is dissolved and suspended from a waste printed circuit board and solder is dissolved and precipitated. Synthetic resin that is put into oil to remove the synthetic resin material and solder, a solder removing step, and metal of the synthetic resin material and the waste printed board from which the solder has been removed in the solder removing step can dissolve metals. A metal dissolving step of dissolving by pouring into an acid such as nitric acid, hydrochloric acid, sulfuric acid, etc .; a detoxifying step of a gas or the like for detoxifying steam or gas generated in the metal dissolving step; P is precipitated by adding alkali to a metal-dissolving acid containing
a process of recovering a precious metal such as t, Pd, Rh, Os, Ru, and Au by filtration and a process of removing a non-dissolved material that removes a non-dissolved material such as a glass epoxy or a polyimide that is not dissolved in the metal dissolving step. And a method for treating a waste printed circuit board or the like. 6. A metal dissolving step in which a waste printed circuit board or the like is introduced and dissolved in an acid such as nitric acid, hydrochloric acid, sulfuric acid or the like capable of dissolving a metal, and a process for detoxifying steam or gas generated in the metal dissolving step. Pt, Pd, Rh, O deposited by adding alkali to a metal-dissolving acid containing a dissolving metal in the metal dissolving step to make the PH 4-5.
a process of recovering a precious metal such as s, Ru, Au or the like by filtration, a process of removing a non-dissolved material such as glass epoxy or polymid which is not dissolved in the metal dissolving process, and a process of removing the undissolved material. A washing and dehydrating step of washing and dewatering the non-dissolved matter removed in the substance removing step, and a furnace core having a temperature of about 10,000 ° C.
An ultra-high-temperature combustion process of burning in an ultra-high-temperature combustion furnace by plasma arc and arc discharge, and a processing process of molding the residue remaining in the molten state in this ultra-high-temperature combustion process into a predetermined shape and processing it into artificial stone etc. And a method for treating a waste printed circuit board or the like.