JPH11352147A - Structure of high frequency probe head and its processing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the manufacturing cost by simplifying components and a manufacturing process. SOLUTION: Concerning a high frequency probe head part formed by a semi rigid cable 10 in which an inside central conductor 11, an outside covering conductor 12 and a dielectric 13 inserted between them are placed in the concentric state, a head face forming process in which a vertical cut face, formed by cutting with a vertical plane relative to the central axis direction as a head face 14, is produced, a head slant face forming process in which a first slant cut face 15 is produced successively by cutting the head face 14 with one slant face roughly from the center to the central axis direction, a ring fixing process in which a metal ring 16 is fixed successively around the covering conductor 12 and conducted electrically with the covering conductor 12, and a contact fixing process in which a bump contact by a metal bump 17 is fixed successively to the central conductor 11 exposed on the head face 14, are arranged. By a number of slant cut face forming processes, a visual range of bump-contact contacting parts can be enlarged.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to an inner central conductor,
The present invention relates to a structure of a tip of a high-frequency probe formed of a semi-rigid cable in which an outer coated conductor and a dielectric inserted therebetween are concentric with each other and a method of processing the same, and in particular, simplifies components and a manufacturing process to reduce manufacturing costs. TECHNICAL FIELD The present invention relates to a structure of a tip of a high-frequency probe and a method of processing the same to reduce noise.

[0002]

2. Description of the Related Art Conventionally, the structure of such a high-frequency probe tip and its processing method are disclosed in US Pat. No. 5,506,515.
Some are described in the specification. In the structure of the tip of the high frequency probe according to this method, as shown in FIG. 5, the tip of the coaxial cable 100 is processed.

In a coaxial cable 100, a central conductor 101 at an inner central axis position, a coated conductor 102 facing the outside, and a dielectric 103 inserted therebetween are concentric and cut perpendicular to the coaxial direction. The center contact 111 connected to the center conductor 101 and the external contacts 112 connected to the coated conductor 102 on both sides of the center contact 111 are fixedly connected to the end of the vertical cut surface 104.

A method for processing the tip of the high-frequency probe shown in FIG. 5 will be described with reference to FIG. 6 and FIG.
FIG. 6 is a back view of the perspective view shown in FIG. 5 as viewed from the back side.

[0005] First, in FIG.
0 is cut along a plane perpendicular to the center axis direction to form a vertical cut surface 10
4 shows the result of the process for preparing No. 4.

Next, in FIG. 6 (B), a semi-cylindrical portion is cut by a plane including the central axis and a plane perpendicular to the plane, and a cut surface 105 including the central axis and a cut surface 106 perpendicular to the plane are formed. The result of the process of manufacturing is shown.

[0007] Next, in FIG.
10 is positioned on the cut surface 105 and fixedly connected.
The frame component 110 is formed by collectively manufacturing a center contact 111 and an external contact 112 together with a substrate 113. The external contact 112 is formed on both sides of the center contact Center conductor 10
1 when connecting on the coated conductor 102 on the cut surface 105.
Is positioned by the substrate unit 113 so as to be connected to

Finally, FIG. 6 (D) shows the result of the process in which the substrate 113 serving as an unnecessary component is cut off and the state shown in FIG. 5 is obtained.

[0009]

The above-described structure of the tip of the high-frequency probe and the method of processing the same require a frame part constituting a contactor in addition to the coaxial cable.
After connecting and fixing one center contact to one center conductor and two external contacts to one covered conductor,
Since the process of separating the substrate part is required, the parts to be prepared in advance have a complicated shape, the number of components of the finished product is large, and therefore the manufacturing process becomes complicated and the manufacturing cost increases. is there.

Further, even when the device to be measured is miniaturized and a large number of signal electrodes are arranged at a narrow pitch and the ground electrode comes into contact with a device stage serving as an inspection stage, a frame component constituting a contact other than the coaxial cable is used. Although the tip of the high-frequency probe can be processed by applying the above-described processing method, there is a problem similar to the above.

An object of the present invention is to provide a structure of a tip of a high-frequency probe and a method for processing the same, which can solve the above-mentioned problems, simplify components and a manufacturing process, and reduce the manufacturing cost. .

[0012]

The structure of the tip of the high-frequency probe according to the present invention comprises an inner central conductor, an outer coated conductor,
In the structure of the tip of the high-frequency probe formed of a semi-rigid cable in which each of the dielectrics inserted therebetween is concentric, a vertical surface formed by cutting the semi-rigid cable as a tip surface in a plane perpendicular to the center axis direction. An oblique cut surface obtained by cutting the cut surface from at least one oblique plane from the center with respect to the central axis direction, and a ring made of a conductive material that is fitted around the coated conductor and electrically connects to the coated conductor; And a bump contact attached to the center conductor exposed on the tip end surface. The ring may be provided with a crack on the bump contact side with respect to the central axis.

The method for processing the tip of a high-frequency probe according to the present invention is characterized in that a tip of a high-frequency probe formed of a semi-rigid cable in which an inner central conductor, an outer coated conductor, and a dielectric inserted therebetween are concentric with each other. Forming a vertical cut surface formed by cutting the semi-rigid cable in a plane perpendicular to the central axis direction as a front end surface, and, following the front end surface forming step, the vertical cut surface is substantially centered. A tip slope forming step of forming an oblique cut surface by cutting at least one oblique plane with respect to the center axis direction, and further following this tip slope forming step, a ring made of a conductive material is fitted around the covered conductor. A ring fixing step of obtaining electrical continuity with the coated conductor, and a bump contact with the center conductor exposed on the tip end surface. The a contact mounting step provided for attaching, running the other process after performing either of steps of ring fixing process and contact mounting process.

As a result, the parts to be prepared in addition to the cable are ring and bump contact materials made of a conductive material, so that the components and the manufacturing process can be simplified.

In the tip slope forming step, the vertical cut surface is cut from substantially the center by one inclined plane with respect to the center axis direction, and the surface is cut in a direction in which the tip of the high-frequency probe is pressed against an object to be measured. It may be only the step of creating a diagonal cut surface having. The function can be exhibited also in this one tip slope forming step.

[0016] In the step of forming the inclined front end, the step of forming the oblique cut surface as a first oblique cut surface may include the step of forming the oblique cut surface from one center with respect to the center axis direction substantially from the center. A step of cutting and creating a second oblique cut surface for creating a surface in a direction opposite to the first oblique cut surface may be added. As a result, when measuring the object to be measured, the bump contact at the tip can be visually observed.

Further, in the tip slope forming step, following the step of forming the second oblique cut surface, the vertical cut is formed at an appropriate angle to a plane perpendicular to the first and second oblique cut surfaces. A step of cutting the surface from two centers with respect to the center axis direction from substantially the center and creating a third diagonal cut surface that forms a quadrangular pyramid state with the center conductor exposed at the tip surface as a vertex is added. May be. As a result, when measuring an object to be measured, the periphery of the bump contact at the tip can be visually observed.

The tip slope forming step is a step of forming the cone-shaped tip slope by cutting the vertical cut surface by a number of planes or by continuous rotation while leaving the center conductor as a tip. You may.

[0019]

Next, embodiments of the present invention will be described with reference to the drawings.

FIGS. 1A to 1D are explanatory views showing one embodiment of each step of the present invention.

A semi-rigid cable 10 is used at the tip of the high-frequency probe. Semi-rigid cable 10
In the figure, the inner central conductor 11, the outer coated conductor 12, and the dielectric 13 inserted therebetween are concentric.

First, in the first step, the semi-rigid cable 10 is cut along a plane perpendicular to the coaxial direction.
As a result, as shown in FIG. 1A, the distal end surface 14 forming a vertical cut surface is formed at one end of the semi-rigid cable 10.
Is formed. FIG. 1A is a surface view of the distal end surface 14 of the semi-rigid cable 10 after the first step and a sectional view taken along line AA of this surface view.

In the next second step, the semi-rigid cable 10 is a plane passing through the center of the circular tip surface 14,
It is cut diagonally toward the coaxial direction, and in the example shown, diagonally downward. As a result, the first oblique cut surface 15 is formed as shown in the cross-sectional view of FIG.

In the next third step, a metal ring 16 is fitted as a conductive material ring around the insulated conductor 13 of the semi-rigid cable 10 so as to be electrically conductive. The fitted metal ring 16 is shown in FIG.
As shown in (C), it is fitted in a position where the first oblique cut surface 15 covers a portion where the coated conductor 12 is exposed. FIG. 1C is a surface view of the distal end surface 14 of the semi-rigid cable 10 after the third step, and a cross-sectional view taken along line BB of this surface view.

In the last step, a metal bump 17 is attached to the tip of the center conductor 11 exposed on the first oblique cut surface 15. As a result, as shown in FIG. 1D, the metal ring 16
And the metal bumps 17 form independent contacts. That is, the illustrated metal ring 16 is an elastic body and has a crack 18 on the same side as the metal bump 17 in a plane including the metal bump 17 and the central axis of the semi-rigid cable 10. It has perfect continuity with the 10 covered conductors 12 and also serves as a contact.

Therefore, as shown in FIG. 2, when placing the device under test 22 with the surface of the device stage 21 as the inspection device ground, the first oblique cut surface 15 at the tip of the high-frequency probe described in FIG.
When the metal bumps 17 are pressed against the signal electrodes 23 of the device under test 22 so that the metal
Is pressed against the test device ground, which is the device stage 21, to ensure contact on the ground surface. As a result, a signal and a ground can be captured at the high-frequency probe tip.

In the above procedure, it has been described that the metal bump is attached after the metal ring is fitted.
The procedure of this step may be reversed.

Next, referring to FIG. 3 and FIG.
An additional step following (B) will be described.

After forming the first oblique cut surface 15 in FIG. 1B, in this step, the semi-rigid cable 10
Is cut on a plane passing through the center of the circular tip surface 14 obliquely in the direction opposite to the first oblique cut surface 15 in the coaxial direction, and in the illustrated example, obliquely upward. As a result, as shown in FIG.
Together with the first diagonal cut surface 15 form a vertical plane with the plane of the drawing as a plane, and the intersecting straight line is the front end face 1
4, a center line as shown in FIG. 1 (C) is drawn.

After this step, the metal ring 16 of FIG. 1C and the metal bump 17 of FIG. 1D are attached.

As a result of this process, when the semi-rigid cable 10 serving as a high-frequency probe is brought into contact with the object to be measured from an oblique direction as shown in FIG. 2, the contact point at the tip becomes visible from directly above the device stage 21. .

Next, an additional step following FIG. 3 will be described with reference to FIG. 4 and FIGS. 3 and 1. FIG. 4 shows a semi-rigid cable 1 that has completed the steps described in FIG.
0, the surface view of the tip end face 14, the CC cross-sectional view viewed from the side of the surface view, and the D-
It is D sectional drawing.

After the second oblique cut surface 31 is formed in FIG. 3, in this step, the semi-rigid cable 10 forms a quadrangular pyramid having the top end of the central conductor 11 exposed on the front end surface 14 as a vertex. Two diagonal cuts are cut diagonally from the apex toward the coaxial direction, perpendicular to both the first and second diagonal cut surfaces 15, 31 and in directions opposite to each other with respect to the central axis. Surfaces 41 and 42 are formed.

As a result of this step, the semi-rigid cable 1
When the object 0 comes into contact with the object to be measured from an oblique direction, the periphery of the contact point can be viewed from above and from the lateral direction, and positioning can be easily performed.

In the above description, the tip of the semi-rigid cable has a quadrangular pyramid, but it may be formed into a triangular pyramid or a polygonal pyramid or cone.

[0036]

As described above, according to the method of processing the tip of a high-frequency probe according to the present invention, it is possible to obtain the effect that the components and the manufacturing process can be simplified and the manufacturing cost can be reduced.

The reason is that, in addition to the cable, the only components to be prepared in advance are the ring and bump contact materials made of a conductive material, and the manufacturing process involves simply cutting the cable by a flat surface.

In this structure, when the object to be measured is miniaturized and a large number of signal electrodes are arranged at a narrow pitch, and when the ground electrode comes into contact with the surface of the device stage serving as the inspection stage, the bump is connected to the signal electrode or the ring. Since they can be brought into contact with each other, there is an effect that a shape suitable for measuring an object to be measured having such a structure can be obtained.

[Brief description of the drawings]

FIG. 1A is a front view and an AA cross-sectional view at the end of a first step showing one embodiment of the present invention, and FIG.
A-A cross-sectional view at the end of the second step following the second step, (C) is a front view and BB cross-sectional view at the end of the third step following (B), and (D) is the first section following (C). BB at the end of the fourth step
It is sectional drawing.

FIG. 2 is a side view showing an example of a use state of a tip of the high-frequency probe manufactured in the process of FIG. 1 in a device stage.

FIG. 3 is a vertical cross-sectional view following FIG. 1B after completing a process according to another embodiment different from FIG. 1;

FIG. 4 is a front view, a cross-sectional view taken along a line CC, and a line D-D after a process according to an embodiment different from FIG.
It is sectional drawing.

FIG. 5 is a perspective view showing a structure of a tip of a high-frequency probe showing an example of the related art.

FIG. 6A is a bottom view at the end of a first step showing an example of the related art, FIG. 6B is a bottom view at the end of a second step following FIG. Bottom view at the end of the third step,
(D) is a bottom view at the end of the fourth step following (C).

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Semi-rigid cable 11 Center conductor 12 Insulated conductor 13 Dielectric 14 Tip surface 15 First oblique cut surface 16 Metal ring 17 Metal bump 18 Crack 21 Device stage 22 Device under test 23 Signal electrode 31 Second oblique cut surface 41, 42 Third Diagonal cut surface

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Masao Tanehashi 5-7-1 Shiba, Minato-ku, Tokyo Inside NEC Corporation (72) Inventor Toru Taura 5-7-1 Shiba, Minato-ku, Tokyo Within NEC Corporation (72) Inventor Yuichi Yamagishi 5-10-27 Minamiazabu, Minato-ku, Tokyo Anritsu Corporation (72) Inventor Satoshi Hayakawa 5-10-27 Minamiazabu, Minato-ku, Tokyo Anritsu shares In company

Claims (7)

[Claims] 1. A structure of a tip of a high-frequency probe formed by a semi-rigid cable in which an inner central conductor, an outer sheathed conductor, and a dielectric material inserted therebetween are concentric, wherein the semi-rigid cable is used as a tip surface. A vertical cut surface formed by cutting along a plane perpendicular to the central axis direction, and an oblique cut surface obtained by cutting at least one oblique plane from the center with respect to the central axis direction; A high-frequency probe tip structure comprising: a ring made of a conductive material that is electrically connected to a conductor; and a bump contact attached to the center conductor exposed on the tip surface. 2. The high-frequency probe tip structure according to claim 1, wherein the ring has a crack on the bump contact side with respect to the central axis. 3. A method for processing a tip of a high-frequency probe in which an inner central conductor, an outer sheathed conductor, and a dielectric inserted therebetween are each formed of a semi-rigid cable in a concentric state, wherein the semi-rigid cable is used as a tip surface. A tip surface forming step of creating a vertical cut surface formed by cutting a vertical plane with respect to the center axis direction, and, following the tip surface forming step, the vertical cut surface is substantially centered with respect to the center axis direction. A tip slope forming step of forming an oblique cut surface by cutting at least one oblique plane; further, following this tip slope forming step, a ring made of a conductive material is fitted around the covered conductor to electrically connect with the covered conductor. A ring fixing step of obtaining electrical continuity, and a contact attaching step of attaching a bump contact to the center conductor exposed on the tip end face. A method of processing the tip of a high-frequency probe, wherein one of the ring fixing step and the contact mounting step is performed, and then the other step is performed. 4. The method for processing a tip of a high-frequency probe according to claim 3, wherein, in the step of forming the tip slope, the vertical cut surface is cut by leaving the center conductor as a tip to create a tip slope having a cone shape. A method for processing the tip of a high-frequency probe, comprising: 5. The method for processing a tip of a high-frequency probe according to claim 3, wherein, in the step of forming a slope at the tip, the vertical cut surface is cut from substantially a center by one inclined plane with respect to the central axis direction. A method for processing the tip of a high-frequency probe, which is a step of forming a first oblique cut surface having a surface in a direction in which the tip of the probe is pressed against an object to be measured. 6. The method of processing a tip of a high-frequency probe according to claim 5, wherein, in the step of forming a slope at the tip, the step of forming the first oblique cut surface is substantially the same as the step of forming the first oblique cut surface. Cutting by one oblique plane with respect to the direction, and having a step of creating a second oblique cut surface that creates a surface in the opposite direction to the first oblique cut surface. Processing method. 7. The method for processing a tip of a high-frequency probe according to claim 6, wherein the step of forming the tip slope includes, after the step of forming the second oblique cut face, the first and second oblique cut faces. At an appropriate angle to a plane perpendicular to the plane, the vertical cut surface is cut from the center by two inclined planes with respect to the central axis direction, and a quadrangular pyramid state is formed with the central conductor exposed on the front end surface as a vertex. A method for processing the tip of a high-frequency probe, comprising a step of forming a third oblique cut surface.