JP2001292495A - Ultrasonic probe and its manufacturing method - Google Patents
Ultrasonic probe and its manufacturing methodInfo
- Publication number
- JP2001292495A JP2001292495A JP2000103054A JP2000103054A JP2001292495A JP 2001292495 A JP2001292495 A JP 2001292495A JP 2000103054 A JP2000103054 A JP 2000103054A JP 2000103054 A JP2000103054 A JP 2000103054A JP 2001292495 A JP2001292495 A JP 2001292495A
- Authority
- JP
- Japan
- Prior art keywords
- piezoelectric element
- ultrasonic probe
- insulating material
- electrodes
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
Abstract
Description
【発明の属する技術分野】本発明は超音波探触子に関す
るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ultrasonic probe.
【従来の技術】従来、超音波探触子の小型化、高周波化
に伴いリード線の接続による音響特性の低下が問題とな
り、音響特性低下を抑えようとすると配線作業が困難に
なっていた。従来の方法として、特開平５−１５３６９
５号公報に示された例がある。これを、図２０を用いて
簡単に説明する。圧電素子１の表面に形成された表面電
極３を、音響整合層以外の部分まで延長して形成し、該
延長された部分に導電性材料からなる電極端子１３を接
合して、リード線７の接続部による音響特性の低下を防
いでいる。６はバッキング材である。2. Description of the Related Art Hitherto, as ultrasonic probes have become smaller and higher in frequency, there has been a problem of deterioration in acoustic characteristics due to connection of lead wires, and wiring work has been difficult to suppress acoustic characteristics. A conventional method is disclosed in Japanese Patent Application Laid-Open No. HEI 5-15369.
There is an example disclosed in Japanese Patent Publication No. 5 (JP-A-5). This will be briefly described with reference to FIG. The surface electrode 3 formed on the surface of the piezoelectric element 1 is extended to a portion other than the acoustic matching layer, and an electrode terminal 13 made of a conductive material is joined to the extended portion to form a lead wire 7. This prevents deterioration of acoustic characteristics due to the connection. 6 is a backing material.
【発明が解決しようとする課題】しかしながら、図２０
に示す従来の方法では、圧電素子１の表面電極３と電極
端子１３の接合部がデッドスペースとなり、圧電素子全
体を有効に使用できず、超音波探触子がさらに小型化し
ていくと圧電素子１の面積に占める電極端子１３との接
合部の面積の占める割合が大きくなり、圧電素子１の有
効振動径が十分にとれなくなってしまう。本発明は、超
音波探触子の電極およびリード線が音響特性に影響を与
えず、振動有効径を大きくとることを実現でき、高感度
な小型超音波探触子を提供することを目的とする。However, FIG.
In the conventional method shown in (1), the joint between the surface electrode 3 and the electrode terminal 13 of the piezoelectric element 1 becomes a dead space, and the entire piezoelectric element cannot be used effectively. The ratio of the area of the joint with the electrode terminal 13 to the area of the electrode 1 increases, and the effective vibration diameter of the piezoelectric element 1 cannot be sufficiently obtained. An object of the present invention is to provide a high-sensitivity, small-sized ultrasonic probe capable of realizing that an electrode and a lead wire of the ultrasonic probe do not affect acoustic characteristics and have a large effective vibration diameter. I do.
【課題を解決するための手段】このような問題点を解決
するために本発明は、圧電素子の幅方向の周囲を絶縁材
料で囲み、圧電素子と絶縁材料の両面に表面電極を形成
して、絶縁材料側にリード線を接続するものである。あ
るいは、リード線を用いずに、絶縁材料として絶縁フィ
ルムを用いて絶縁フィルムの両面の電極にそれぞれリー
ド線の役目をもたせるものである。これにより、超音波
探触子の電極およびリード線が音響特性に影響を与え
ず、振動有効径を大きくとることを実現でき、高感度な
小型超音波探触子を提供できる。In order to solve such a problem, the present invention encloses the periphery of the piezoelectric element in the width direction with an insulating material and forms surface electrodes on both surfaces of the piezoelectric element and the insulating material. And a lead wire connected to the insulating material side. Alternatively, instead of using a lead wire, an insulating film is used as an insulating material, and electrodes on both surfaces of the insulating film each have a role of a lead wire. Accordingly, the electrodes and the lead wires of the ultrasonic probe do not affect the acoustic characteristics, the effective vibration diameter can be increased, and a small-sized ultrasonic probe with high sensitivity can be provided.
【発明の実施の形態】本発明の請求項１に記載の発明
は、超音波を送信あるいは受信する超音波探触子におい
て、圧電素子と、前記圧電素子の幅方向の周囲を取り囲
む絶縁材料と、前記圧電素子と前記絶縁材料の両面にそ
れぞれ形成された表面電極と、前記表面電極それぞれに
接続された２つのリード線とを有し、前記リード線は、
いずれも絶縁材料上に形成された表面電極に接続するこ
とを特徴とする超音波探触子であり、超音波探触子の電
極およびリード線が音響特性に影響を与えず、振動有効
径を大きくとることを可能にするという作用を有する。
そして請求項２に記載の発明のように、一方の表面電極
は、一部を絶縁材料の一面から他面へ折り返して形成さ
れ、２つのリード線は、両方とも前記絶縁材料の同じ側
で、異なる電極にそれぞれ接続することを特徴とする請
求項１記載の超音波探触子とするのが、より好適であ
る。請求項３に記載の発明は、圧電素子の周囲の絶縁材
料は、絶縁材料内に前記圧電素子をつけこんで硬化さ
せ、両面を研磨することにより前記圧電素子の両面をむ
き出すことで形成することを特徴とする請求項１または
２記載の超音波探触子であり、あらかじめ用意した圧電
素子が所望の厚みより厚くても研磨時に所望の厚みにす
ることができるので、取り扱いの容易な厚さで絶縁材料
につけることができ、圧電素子にリード線が触れること
もないので、超音波探触子の電極およびリード線が音響
特性に影響を与えず、振動有効径を大きくとることを可
能にするという作用を有する。請求項４に記載の発明
は、超音波を送信あるいは受信する超音波探触子におい
て、圧電素子と、前記圧電素子の幅方向の周囲を取り囲
む絶縁材料と、前記圧電素子と前記絶縁材料の両面にそ
れぞれ形成された表面電極と、前記表面電極の一方に電
気的に接続される電極を外周面に有する筐体と、前記表
面電極それぞれに電気的に接続される２つのリード線と
を有し、前記リード線は、一方を前記筐体の外周面に形
成された電極に接続し、他方を絶縁材料上に形成された
表面電極に接続することを特徴とする超音波探触子であ
り、超音波探触子の電極およびリード線が音響特性に影
響を与えず、振動有効径を大きくとることを可能にする
という作用を有する。請求項５に記載の発明は、絶縁材
料に樹脂を用いることを特徴とする請求項１から４のい
ずれかに記載の超音波探触子であり、樹脂を用いること
により圧電素子の両面に電極を形成する時に、固定する
ための治具等に取り付ける場合においても直接圧電素子
に治具が触れず、安全に圧電素子を取り扱え、振動有効
径を大きくとることを可能にするという作用を有する。
請求項６に記載の発明は、超音波を送信あるいは受信す
る超音波探触子において、圧電素子と、前記圧電素子の
幅方向の周囲を取り囲む絶縁フィルムと、前記圧電素子
と前記絶縁フィルムの両面にそれぞれ形成された表面電
極とを有し、前記絶縁フィルムを前記超音波探触子の外
部まで延びるように形成することを特徴とする超音波探
触子であり、リード線を接続する工程を省くことができ
るとともに、リード線を有さないことから、リード線、
及び超音波探触子の電極が音響特性に影響を与えず、振
動有効径を大きくとることを可能にするという作用を有
する。請求項７に記載の発明は、フィルムに超耐熱ポリ
イミドフィルムを用いることを特徴とする請求項６記載
の超音波探触子であり、電極形成時に温度上昇によるフ
ィルムの形状変化を防止することができるとともに、リ
ード線を有さないことから、リード線、及び超音波探触
子の電極が音響特性に影響を与えず、振動有効径を大き
くとることを可能にするという作用を有する。請求項８
に記載の発明は、表面電極形成に蒸着またはスパッタ用
いることを特徴とする請求項１から７のいずれかに記載
の超音波探触子であり、圧電素子の周囲がすでに絶縁材
料で覆われているため、マスキング処理が不要か簡単な
処理で済み、また電極を薄くつけることができるため、
超音波探触子の電極が音響特性に影響を与えず、振動有
効径を大きくとることを可能にするという作用を有す
る。請求項９に記載の発明は、圧電素子の幅方向の周囲
を取り囲む絶縁材料を形成する工程と、前記圧電素子と
前記絶縁材料の両面にそれぞれ表面電極を形成する工程
と、前記表面電極それぞれにリード線を接続する工程と
を有し、前記リード線は、いずれも絶縁材料上に形成さ
れた表面電極に接続することを特徴とする超音波探触子
の製造方法であり、超音波探触子の電極およびリード線
が音響特性に影響を与えず、振動有効径を大きくとるこ
とを可能にするという作用を有する。そして請求項１０
に記載の発明のように、一方の表面電極は、一部を絶縁
材料の一面から他面へ折り返して形成され、それぞれの
リード線は、両方とも前記絶縁材料の同じ側で、異なる
電極にそれぞれ接続することを特徴とする請求項９記載
の超音波探触子の製造方法とするのが、より好適であ
る。請求項１１に記載の発明は、圧電素子の周囲の絶縁
材料は、絶縁材料内に前記圧電素子をつけこんで硬化さ
せ、両面を研磨することにより前記圧電素子の両面をむ
き出すことで形成することを特徴とする請求項９または
１０記載の超音波探触子の製造方法であり、あらかじめ
用意した圧電素子が所望の厚みより厚くても研磨時に所
望の厚みにすることができるので、取り扱いの容易な厚
さで絶縁材料につけることができ、圧電素子にリード線
が触れることもないので、超音波探触子の電極およびリ
ード線が音響特性に影響を与えず、振動有効径を大きく
とることを可能にするという作用を有する。請求項１２
に記載の発明は、圧電素子の幅方向の周囲を取り囲む絶
縁材料を形成する工程と、前記圧電素子と前記絶縁材料
の両面にそれぞれ表面電極を形成する工程と、電極を筐
体の外周面に形成して前記表面電極の一方と電気的に接
続する工程と、前記表面電極それぞれと２つのリード線
とを電気的に接続する工程とを有し、前記リード線は、
一方を前記筐体の外周面に形成された電極に接続し、他
方を絶縁材料上に形成された表面電極に接続することを
特徴とする超音波探触子の製造方法であり、超音波探触
子の電極およびリード線が音響特性に影響を与えず、振
動有効径を大きくとることを可能にするという作用を有
する。請求項１３に記載の発明は、絶縁材料に樹脂を用
いることを特徴とする請求項９から１２のいずれかに記
載の超音波探触子の製造方法であり、樹脂を用いること
により圧電素子の両面に電極を形成する時に、固定する
ための治具等に取り付ける場合においても直接圧電素子
に治具が触れず、安全に圧電素子を取り扱え、振動有効
径を大きくとることを可能にするという作用を有する。
請求項１４に記載の発明は、圧電素子の幅方向の周囲を
絶縁フィルムで取り囲む工程と、前記圧電素子と前記絶
縁フィルムの両面にそれぞれ表面電極を形成する工程と
を有し、前記絶縁フィルムを前記超音波探触子の外部ま
で延びるように形成することを特徴とする超音波探触子
の製造方法であり、リード線を接続する工程を省くこと
ができるとともに、リード線を有さないことから、リー
ド線、及び超音波探触子の電極が音響特性に影響を与え
ず、振動有効径を大きくとることを可能にする作用を有
する。請求項１５に記載の発明は、絶縁フィルムに超耐
熱ポリイミドフィルムを用いることを特徴とする請求項
１４記載の超音波探触子の製造方法であり、電極形成時
に温度上昇によるフィルムの形状変化を防止することが
できるとともに、リード線を有さないことから、リード
線、及び超音波探触子の電極が音響特性に影響を与え
ず、振動有効径を大きくとることを可能にするという作
用を有する。請求項１６に記載の発明は、表面電極形成
に蒸着またはスパッタ用いることを特徴とする請求項９
から１５のいずれかに記載の超音波探触子の製造方法で
あり、圧電素子の周囲がすでに絶縁材料で覆われている
ため、マスキング処理が不要か簡単な処理で済み、また
電極を薄くつけることができるため、超音波探触子の電
極が音響特性に影響を与えず、振動有効径を大きくとる
ことを可能にするという作用を有する。以下、本発明の
実施の形態について、図１から図７を用いて説明する。 （実施の形態１）図１は本実施の形態における超音波探
触子の構成を示す概略図である。図１において、圧電素
子１の幅方向の周囲には絶縁材料２があり、圧電素子１
と絶縁材料２の上下面にそれぞれ表面電極３が形成さ
れ、一部、下面から上面へ折り返されている。圧電素子
としてはチタン酸鉛系や、高周波ではＬｉＮｂＯ3 など
がある。また絶縁材料２としてエポキシ樹脂等の樹脂な
どがある。電極が形成された圧電素子１と絶縁材料２の
上面にはバッキング材６が、下面には音響整合層４と音
響レンズ５が、それぞれ接着されている。そしてリード
線７が、一本は上面側の表面電極３に、他の一本は下面
側から折り返されて上面に位置する表面電極３に、いず
れも絶縁材料２の上の位置で接続されている。図２〜図
７は図１に示した本実施の形態における超音波探触子の
製造工程を示す。まず、図２のように、圧電素子１を平
板９とリング８で囲まれた中心付近に配置し、その上か
ら絶縁材料２を流し込み硬化させる。なお、板９とリン
グ８は、テフロンなどの剥離性のあるものがよい。平板
９とリング８の隙間には、絶縁材料２が漏れないよう真
空グリス等で処置しておく。また、リング８の内径は音
響レンズ５の外径と同じであるか、それ以下である。次
に、図３のように、硬化した絶縁材料２と圧電素子１を
板９とリング８より取り出し、所望の周波数の厚さまで
研磨して、図４の状態にする。次に、図５のように表面
電極３を形成する。表面電極形成法には、スパッタある
いは蒸着等がある。次に、図６のように、あらかじめ音
響レンズ５に整合層４を接着したものの上に接着する。
そして、図７のように、リード線７を図のように接着す
る。リード線の接着には銀ペーストまたは半田などが用
いる。次に、バッキング材６を接着することによって超
音波探触子が完成する。なお、目的によってはバッキン
グ材なしでもよい。以上のように、図２〜図７に示した
製造工程によって製作した図１のような超音波探触子
は、リード線７が絶縁材料２の上の表面電極３に接続さ
れているため、超音波探触子の電極およびリード線が音
響特性に影響を与えず、振動有効径を大きくとることが
可能となる。 （実施の形態２）図８は本実施の形態における超音波探
触子の構成を示す概略図である。図８において、圧電素
子１の幅方向の周囲には絶縁材料２があり、圧電素子１
と絶縁材料２の上下面にそれぞれ表面電極３が形成され
ている。圧電素子としてはチタン酸鉛系や、高周波では
ＬｉＮｂＯ3などがある。また絶縁材料としてエポキシ
樹脂などがある。電極が形成された圧電素子１と絶縁材
料２の上面にはバッキング材６が、下面には音響整合層
４と音響レンズ５が、それぞれ接着されている。なお、
予め音響整合層４の上面には表面電極３が形成されてお
り、圧電素子１の下面に形成された表面電極３とは、接
着することでオーミックコンタクトにより導通を得てい
る。そしてリード線７が、一本は絶縁材料２の上の位置
で上面側の表面電極３に接続されている。他の一本は、
筐体である筒１１の内側から、一旦、穴を通して、筒１
１の外側に形成され圧電素子１の下面に導通する電極に
接続されている。図９〜図１４は図８に示した本実施の
形態における超音波探触子の製造工程を示す。まず、図
９のように、予め音響レンズ５と音響整合層４を接着し
たものに、図のように表面電極３を形成する。表面電極
形成法には、スパッタあるいは蒸着等がある。次に、図
１０のように、片面に表面電極３を形成した圧電素子１
を音響整合層４の上に接着する。圧電素子１の片面に形
成した電極と、音響レンズ５と音響整合層４を接着した
ものに形成した表面電極３は、オーミックコンタクトに
より導通をとる。次に、図１１のように、リング８を取
り付け、圧電素子１とリング８との間に絶縁材料２を流
し込み硬化させる。リング８はテフロン（登録商標）な
どの剥離性のあるものがよい。次に、図１２のように、
絶縁材料２が硬化したらリング８をはずし、上面に表面
電極３を形成して、探触子の主要部を構成する。また、
筐体として用いる筒１１をあらかじめ用意し、図１３の
ように、筒１１の側面に穴をあけ、穴から下にむかって
帯状に電極を形成しておく。筒１１は絶縁材料を用い
る。次に、図１４のように、筒１１を図１２の状態にあ
る探触子の主要部に接着し、導電性材料１２によって音
響レンズ５の側面の電極と、筒１３上の帯状の電極との
導通をとる。導電性材料１２には、半田や銀ペースト等
を用いる。そして、図８で示したように、リード線を、
一本は筒１１の内側から例えばエポキシ樹脂等の絶縁材
料２の上に位置する表面電極３に接続し、他の一本は筒
１１の内側から外側に抜けて筒１１上の帯状の電極に接
着する。バッキング材６は必要であれば接着する。以上
のように、図９〜図１４に示した製造工程によって製作
した図８のような超音波探触子は、リード線７が絶縁材
料２の上の表面電極３に接続されているため、超音波探
触子の電極およびリード線が音響特性に影響を与えず、
振動有効径を大きくとることが可能となる。 （実施の形態３）図１５は本実施の形態における超音波
探触子の構成を示す概略図である。図１５において、圧
電素子１の幅方向の周囲には絶縁フィルム１０があり、
圧電素子１と絶縁フィルム１０の上下両面それぞれに表
面電極３が形成されている。圧電素子としてはチタン酸
鉛系や、高周波ではＬｉＮｂＯ3などがある。また絶縁
フィルムとしてポリイミドフィルムなどがある。電極が
形成された圧電素子１と絶縁フィルム１０の上面にはバ
ッキング材６が、下面には音響整合層４と音響レンズ５
が、それぞれ接着されている。図１６〜図１９は図１５
に示した本実施の形態における超音波探触子の製造工程
を示す。まず、図１６のように、圧電素子１の厚みと同
じかまたは薄い絶縁フィルム１０に圧電素子１が入る寸
法の穴をあけ、圧電素子１を絶縁フィルム１０の穴には
める。次に、図１７のように、両面に表面電極３を形成
する。表面電極形成法には、スパッタあるいは蒸着等が
ある。次に、図１８のように、片面にバッキング材６、
もう片面に音響整合層４と音響レンズ５を接着する。次
に、図１９のように、バッキング材６よりはみでた絶縁
フィルム１２をある幅をもった帯だけを残して切り取
る。この絶縁フィルム１２の帯がそのままリード線の役
割をもつ。以上のように、図１６〜図１９に示した製造
工程によって製作した図１５のような超音波探触子は、
リード線を圧電素子１の周辺に接続する必要がないた
め、煩雑なリード線接続作業がなく、超音波探触子の小
型化に有効な手段である。また、圧電素子１上の表面電
極３上に、従来例の図２０で示した電極端子１３やリー
ド線７がないため、超音波探触子の電極およびリード線
が音響特性に影響を与えず、振動有効径を大きくとるこ
とが可能となる。The invention according to claim 1 of the present invention is directed to an ultrasonic probe for transmitting or receiving ultrasonic waves, comprising: a piezoelectric element; and an insulating material surrounding the piezoelectric element in a width direction. A surface electrode formed on both surfaces of the piezoelectric element and the insulating material, and two lead wires connected to the surface electrode, respectively, the lead wire
Each of these ultrasonic probes is characterized by being connected to a surface electrode formed on an insulating material, and the electrodes and leads of the ultrasonic probe do not affect the acoustic characteristics, and have an effective vibration diameter. It has the effect that it can be large.
Then, as in the invention according to claim 2, one surface electrode is formed by partially folding back one surface of the insulating material to the other surface, and the two lead wires are both on the same side of the insulating material, It is more preferable that the ultrasonic probe according to claim 1 is connected to different electrodes. According to a third aspect of the present invention, the insulating material around the piezoelectric element is formed by exposing the piezoelectric element in the insulating material, curing the piezoelectric element, and polishing both sides to expose both sides of the piezoelectric element. 3. The ultrasonic probe according to claim 1, wherein the thickness of the piezoelectric element prepared in advance can be reduced to a desired thickness at the time of polishing even if the piezoelectric element is thicker than the desired thickness. Because the lead wire does not touch the piezoelectric element, the electrode and lead wire of the ultrasonic probe do not affect the acoustic characteristics, making it possible to increase the effective vibration diameter. It has the effect of doing. According to a fourth aspect of the present invention, in the ultrasonic probe that transmits or receives an ultrasonic wave, a piezoelectric element, an insulating material surrounding a periphery of the piezoelectric element in a width direction, and both surfaces of the piezoelectric element and the insulating material A surface electrode formed on each of the surface electrodes, a housing having an electrode on an outer peripheral surface electrically connected to one of the surface electrodes, and two lead wires electrically connected to the surface electrodes, respectively. An ultrasonic probe, wherein one of the lead wires is connected to an electrode formed on the outer peripheral surface of the housing, and the other is connected to a surface electrode formed on an insulating material. The electrode and the lead wire of the ultrasonic probe do not affect the acoustic characteristics, and have an effect of making it possible to increase the effective vibration diameter. According to a fifth aspect of the present invention, there is provided the ultrasonic probe according to any one of the first to fourth aspects, wherein a resin is used as the insulating material. When forming a piezoelectric element, even when it is attached to a fixing jig or the like, the jig does not directly touch the piezoelectric element, so that the piezoelectric element can be handled safely and the effective vibration diameter can be increased.
The invention according to claim 6, wherein in the ultrasonic probe that transmits or receives ultrasonic waves, a piezoelectric element, an insulating film surrounding the piezoelectric element in the width direction, and both surfaces of the piezoelectric element and the insulating film. And a surface electrode respectively formed on the ultrasonic probe, characterized in that the insulating film is formed so as to extend to the outside of the ultrasonic probe, the step of connecting a lead wire Since it can be omitted and has no lead wire,
In addition, the electrode of the ultrasonic probe has an effect that the effective diameter of vibration can be increased without affecting the acoustic characteristics. According to a seventh aspect of the present invention, there is provided the ultrasonic probe according to the sixth aspect, wherein an ultra-heat-resistant polyimide film is used as the film. In addition to the fact that there is no lead wire, the lead wire and the electrode of the ultrasonic probe do not affect the acoustic characteristics, and have an effect that it is possible to increase the effective vibration diameter. Claim 8
The ultrasonic probe according to any one of claims 1 to 7, characterized in that vapor deposition or sputtering is used to form a surface electrode, wherein the periphery of the piezoelectric element is already covered with an insulating material. The masking process is unnecessary or simple, and the electrodes can be thinned.
The electrode of the ultrasonic probe has an effect that the effective diameter of vibration can be increased without affecting the acoustic characteristics. The invention according to claim 9 is a step of forming an insulating material surrounding the periphery in the width direction of the piezoelectric element, a step of forming surface electrodes on both surfaces of the piezoelectric element and the insulating material, respectively, Connecting a lead wire, wherein each of the lead wires is connected to a surface electrode formed on an insulating material, the method comprising the steps of: The effect is that the electrodes and lead wires of the child do not affect the acoustic characteristics, and the effective vibration diameter can be increased. And claim 10
As described in the invention described in 1 above, one surface electrode is formed by partially folding back from one surface of the insulating material to the other surface, and each lead wire is connected to a different electrode on the same side of the insulating material. It is more preferable to use the method for manufacturing an ultrasonic probe according to the ninth aspect of the present invention. According to an eleventh aspect of the present invention, the insulating material around the piezoelectric element is formed by sticking the piezoelectric element into the insulating material and curing the same, and polishing both sides to expose both sides of the piezoelectric element. The method for manufacturing an ultrasonic probe according to claim 9 or 10, wherein even if the piezoelectric element prepared in advance is thicker than a desired thickness, the piezoelectric element can be formed to a desired thickness at the time of polishing. The ultrasonic probe electrodes and lead wires do not affect the acoustic characteristics and have a large effective vibration diameter because the lead wires do not touch the piezoelectric element because they can be attached to insulating materials with a small thickness. Has the effect of enabling Claim 12
In the invention described in the above, a step of forming an insulating material surrounding the periphery in the width direction of the piezoelectric element, a step of forming surface electrodes on both surfaces of the piezoelectric element and the insulating material, respectively, Forming and electrically connecting one of the surface electrodes, and electrically connecting each of the surface electrodes and two lead wires, wherein the lead wires are:
An ultrasonic probe manufacturing method, comprising connecting one of the electrodes to an electrode formed on the outer peripheral surface of the housing, and connecting the other to a surface electrode formed on an insulating material. The effect is that the electrodes and lead wires of the tentacles do not affect the acoustic characteristics and the effective vibration diameter can be increased. The invention according to claim 13 is the method for manufacturing an ultrasonic probe according to any one of claims 9 to 12, wherein a resin is used as the insulating material. When forming electrodes on both sides, even when attaching to a jig for fixing, the jig does not directly touch the piezoelectric element, the piezoelectric element can be handled safely, and the effective vibration diameter can be increased. Having.
The invention according to claim 14 includes a step of surrounding the periphery of the piezoelectric element in the width direction with an insulating film, and a step of forming surface electrodes on both surfaces of the piezoelectric element and the insulating film, respectively. A method for manufacturing an ultrasonic probe, which is formed so as to extend to the outside of the ultrasonic probe, wherein a step of connecting a lead wire can be omitted, and there is no lead wire. Therefore, the lead wire and the electrode of the ultrasonic probe do not affect the acoustic characteristics, and have an effect of making it possible to increase the effective vibration diameter. The invention according to claim 15 is the method for manufacturing an ultrasonic probe according to claim 14, wherein an ultra-heat-resistant polyimide film is used as the insulating film. In addition to having no lead wire, the effect that the lead wire and the electrode of the ultrasonic probe do not affect the acoustic characteristics and make it possible to increase the effective vibration diameter is obtained. Have. The invention according to claim 16 is characterized in that vapor deposition or sputtering is used for forming the surface electrode.
15. The method of manufacturing an ultrasonic probe according to any one of items 1 to 15, wherein the periphery of the piezoelectric element is already covered with an insulating material, so that masking processing is unnecessary or simple processing is required, and the electrodes are thinned. Therefore, there is an effect that the electrode of the ultrasonic probe does not affect the acoustic characteristics and the effective vibration diameter can be increased. Hereinafter, embodiments of the present invention will be described with reference to FIGS. (Embodiment 1) FIG. 1 is a schematic diagram showing a configuration of an ultrasonic probe according to the present embodiment. In FIG. 1, an insulating material 2 is provided around the piezoelectric element 1 in the width direction.
The surface electrodes 3 are formed on the upper and lower surfaces of the insulating material 2, respectively, and are partially folded from the lower surface to the upper surface. Examples of the piezoelectric element include a lead titanate type and a high frequency LiNbO 3 . The insulating material 2 includes a resin such as an epoxy resin. A backing material 6 is adhered to the upper surfaces of the piezoelectric element 1 and the insulating material 2 on which the electrodes are formed, and an acoustic matching layer 4 and an acoustic lens 5 are adhered to the lower surfaces, respectively. One of the lead wires 7 is connected to the surface electrode 3 on the upper surface side, and the other is connected to the surface electrode 3 which is folded from the lower surface side and located on the upper surface, both at positions above the insulating material 2. I have. 2 to 7 show the manufacturing process of the ultrasonic probe according to the embodiment shown in FIG. First, as shown in FIG. 2, the piezoelectric element 1 is arranged near the center surrounded by the flat plate 9 and the ring 8, and the insulating material 2 is poured from above and cured. Note that the plate 9 and the ring 8 are preferably made of Teflon or the like having releasability. The gap between the flat plate 9 and the ring 8 is treated with vacuum grease or the like so that the insulating material 2 does not leak. The inner diameter of the ring 8 is equal to or smaller than the outer diameter of the acoustic lens 5. Next, as shown in FIG. 3, the cured insulating material 2 and the piezoelectric element 1 are taken out from the plate 9 and the ring 8 and polished to a desired frequency thickness to obtain the state shown in FIG. Next, the surface electrode 3 is formed as shown in FIG. Examples of the surface electrode forming method include sputtering and vapor deposition. Next, as shown in FIG. 6, the matching layer 4 is bonded to the acoustic lens 5 in advance.
Then, as shown in FIG. 7, the lead wire 7 is bonded as shown in the figure. Silver paste or solder is used for bonding the lead wires. Next, the ultrasonic probe is completed by bonding the backing material 6. The backing material may not be used depending on the purpose. As described above, in the ultrasonic probe as illustrated in FIG. 1 manufactured by the manufacturing process illustrated in FIGS. 2 to 7, since the lead wire 7 is connected to the surface electrode 3 on the insulating material 2, The electrodes and lead wires of the ultrasonic probe do not affect the acoustic characteristics, and the effective vibration diameter can be increased. (Embodiment 2) FIG. 8 is a schematic diagram showing a configuration of an ultrasonic probe according to the present embodiment. In FIG. 8, an insulating material 2 is provided around the piezoelectric element 1 in the width direction.
A surface electrode 3 is formed on each of the upper and lower surfaces of the insulating material 2. Examples of the piezoelectric element include a lead titanate type and a high frequency LiNbO 3 . Further, as an insulating material, there is an epoxy resin or the like. A backing material 6 is adhered to the upper surfaces of the piezoelectric element 1 and the insulating material 2 on which the electrodes are formed, and an acoustic matching layer 4 and an acoustic lens 5 are adhered to the lower surfaces, respectively. In addition,
The surface electrode 3 is formed on the upper surface of the acoustic matching layer 4 in advance, and the surface electrode 3 formed on the lower surface of the piezoelectric element 1 is electrically connected by ohmic contact by bonding. One lead wire 7 is connected to the surface electrode 3 on the upper surface side at a position above the insulating material 2. The other one is
Once through the hole from the inside of the tube 11 which is the housing, the tube 1
1 is connected to an electrode formed outside the piezoelectric element 1 and connected to the lower surface of the piezoelectric element 1. 9 to 14 show a process of manufacturing the ultrasonic probe according to the present embodiment shown in FIG. First, as shown in FIG. 9, the surface electrode 3 is formed on the acoustic lens 5 and the acoustic matching layer 4 which are bonded in advance, as shown in FIG. Examples of the surface electrode forming method include sputtering and vapor deposition. Next, as shown in FIG. 10, a piezoelectric element 1 having a surface electrode 3 formed on one surface is provided.
Is adhered on the acoustic matching layer 4. The electrode formed on one side of the piezoelectric element 1 and the surface electrode 3 formed on the acoustic lens 5 and the acoustic matching layer 4 bonded to each other are electrically connected by ohmic contact. Next, as shown in FIG. 11, the ring 8 is attached, and the insulating material 2 is poured between the piezoelectric element 1 and the ring 8 to be cured. The ring 8 is preferably one having a releasable property such as Teflon (registered trademark). Next, as shown in FIG.
When the insulating material 2 has hardened, the ring 8 is removed, and the surface electrode 3 is formed on the upper surface to constitute a main part of the probe. Also,
A tube 11 to be used as a housing is prepared in advance, and a hole is formed in the side surface of the tube 11 as shown in FIG. 13, and a band-like electrode is formed from the hole downward. The tube 11 uses an insulating material. Next, as shown in FIG. 14, the tube 11 is adhered to the main part of the probe in the state shown in FIG. 12, and the electrode on the side surface of the acoustic lens 5 and the band-shaped electrode on the tube 13 Is conducted. As the conductive material 12, solder, silver paste, or the like is used. Then, as shown in FIG.
One is connected to the surface electrode 3 located on the insulating material 2 such as an epoxy resin from the inside of the tube 11, and the other is removed from the inside of the tube 11 to the outside to form a band-shaped electrode on the tube 11. Glue. The backing material 6 is bonded if necessary. As described above, in the ultrasonic probe shown in FIG. 8 manufactured by the manufacturing process shown in FIGS. 9 to 14, since the lead wire 7 is connected to the surface electrode 3 on the insulating material 2, The electrodes and leads of the ultrasonic probe do not affect the acoustic characteristics,
It is possible to increase the effective vibration diameter. (Embodiment 3) FIG. 15 is a schematic diagram showing a configuration of an ultrasonic probe according to the present embodiment. In FIG. 15, there is an insulating film 10 around the piezoelectric element 1 in the width direction,
Surface electrodes 3 are formed on both upper and lower surfaces of the piezoelectric element 1 and the insulating film 10, respectively. Examples of the piezoelectric element include a lead titanate type and a high frequency LiNbO 3 . Further, as the insulating film, there is a polyimide film or the like. A backing material 6 is provided on the upper surfaces of the piezoelectric element 1 on which the electrodes are formed and the insulating film 10, and an acoustic matching layer 4 and an acoustic lens 5 are provided on the lower surfaces.
Are bonded to each other. FIG. 16 to FIG.
4 shows a manufacturing process of the ultrasonic probe according to the present embodiment shown in FIG. First, as shown in FIG. 16, a hole having a size to accommodate the piezoelectric element 1 is formed in the insulating film 10 having the same thickness as or thinner than the piezoelectric element 1, and the piezoelectric element 1 is fitted into the hole of the insulating film 10. Next, as shown in FIG. 17, surface electrodes 3 are formed on both surfaces. Examples of the surface electrode forming method include sputtering and vapor deposition. Next, as shown in FIG.
The acoustic matching layer 4 and the acoustic lens 5 are bonded to the other surface. Next, as shown in FIG. 19, the insulating film 12 protruding from the backing material 6 is cut out leaving only a band having a certain width. The band of the insulating film 12 has a role of a lead wire as it is. As described above, the ultrasonic probe as illustrated in FIG. 15 manufactured by the manufacturing process illustrated in FIGS.
Since there is no need to connect a lead wire to the periphery of the piezoelectric element 1, there is no need for complicated lead wire connection work, and this is an effective means for reducing the size of the ultrasonic probe. Further, since the electrode terminal 13 and the lead wire 7 shown in FIG. 20 of the conventional example are not provided on the surface electrode 3 on the piezoelectric element 1, the electrode and the lead wire of the ultrasonic probe do not affect the acoustic characteristics. Thus, it is possible to increase the effective vibration diameter.
【発明の効果】以上のように本発明によれば、超音波を
送信あるいは受信する超音波探触子において、超音波探
触子に用いられる圧電素子の幅方向の周囲を絶縁材料で
囲み、圧電素子と絶縁材料の両面に表面電極を形成し
て、絶縁材料側にリード線を接続することにより、ある
いは、その絶縁材料として絶縁フィルムを用いて絶縁フ
ィルムの両面の電極にそれぞれリード線の役目をもたせ
ることにより、超音波探触子の電極およびリード線が音
響特性に影響を与えず、振動有効径を大きくとることを
実現でき、高感度な小型超音波探触子を提供できるとい
う有利な効果を有するものである。As described above, according to the present invention, in the ultrasonic probe for transmitting or receiving ultrasonic waves, the periphery of the piezoelectric element used in the ultrasonic probe in the width direction is surrounded by an insulating material. A surface electrode is formed on both sides of the piezoelectric element and the insulating material, and a lead wire is connected to the insulating material side, or an insulating film is used as the insulating material to serve as a lead wire for the electrodes on both sides of the insulating film. The advantage is that the electrode and the lead wire of the ultrasonic probe do not affect the acoustic characteristics and the effective diameter of the vibration can be increased, thereby providing a small-sized ultrasonic probe with high sensitivity. It has an effect.
【図１】本発明の実施の形態１による超音波探触子の構
成を示す概略断面図FIG. 1 is a schematic cross-sectional view showing a configuration of an ultrasonic probe according to a first embodiment of the present invention.
【図２】本発明の実施の形態１による超音波探触子製造
の一工程を示す概略断面図FIG. 2 is a schematic sectional view showing one process of manufacturing the ultrasonic probe according to the first embodiment of the present invention.
【図３】本発明の実施の形態１による超音波探触子製造
の一工程を示す概略断面図FIG. 3 is a schematic cross-sectional view showing one step of manufacturing the ultrasonic probe according to the first embodiment of the present invention.
【図４】本発明の実施の形態１による超音波探触子製造
の一工程を示す概略断面図FIG. 4 is a schematic sectional view showing one process of manufacturing the ultrasonic probe according to the first embodiment of the present invention.
【図５】本発明の実施の形態１による超音波探触子製造
の一工程を示す概略断面図FIG. 5 is a schematic sectional view showing one process of manufacturing the ultrasonic probe according to the first embodiment of the present invention.
【図６】本発明の実施の形態１による超音波探触子製造
の一工程を示す概略断面図FIG. 6 is a schematic sectional view showing one process of manufacturing the ultrasonic probe according to the first embodiment of the present invention.
【図７】本発明の実施の形態１による超音波探触子製造
の一工程を示す概略断面図FIG. 7 is a schematic sectional view showing one process of manufacturing the ultrasonic probe according to the first embodiment of the present invention.
【図８】本発明の実施の形態２による超音波探触子の構
成を示す概略断面図FIG. 8 is a schematic cross-sectional view showing a configuration of an ultrasonic probe according to Embodiment 2 of the present invention.
【図９】本発明の実施の形態２による超音波探触子製造
の一工程を示す概略断面図FIG. 9 is a schematic cross-sectional view showing one process of manufacturing an ultrasonic probe according to the second embodiment of the present invention.
【図１０】本発明の実施の形態２による超音波探触子製
造の一工程を示す概略断面図FIG. 10 is a schematic cross-sectional view showing one process of manufacturing an ultrasonic probe according to Embodiment 2 of the present invention.
【図１１】本発明の実施の形態２による超音波探触子製
造の一工程を示す概略断面図FIG. 11 is a schematic cross-sectional view showing one process of manufacturing an ultrasonic probe according to the second embodiment of the present invention.
【図１２】本発明の実施の形態２による超音波探触子製
造の一工程を示す概略断面図FIG. 12 is a schematic cross-sectional view showing one process of manufacturing an ultrasonic probe according to the second embodiment of the present invention.
【図１３】本発明の実施の形態２による超音波探触子製
造の一工程を示す概略斜視図FIG. 13 is a schematic perspective view showing one process of manufacturing an ultrasonic probe according to the second embodiment of the present invention.
【図１４】本発明の実施の形態２による超音波探触子製
造の一工程を示す概略断面図FIG. 14 is a schematic cross-sectional view showing one process of manufacturing an ultrasonic probe according to the second embodiment of the present invention.
【図１５】本発明の実施の形態３による超音波探触子の
構成を示す概略断面図FIG. 15 is a schematic sectional view showing a configuration of an ultrasonic probe according to a third embodiment of the present invention.
【図１６】本発明の実施の形態３による超音波探触子製
造の一工程を示す概略斜視図FIG. 16 is a schematic perspective view showing one process of manufacturing an ultrasonic probe according to Embodiment 3 of the present invention.
【図１７】本発明の実施の形態３による超音波探触子製
造の一工程を示す概略断面図FIG. 17 is a schematic sectional view showing one process of manufacturing an ultrasonic probe according to the third embodiment of the present invention.
【図１８】本発明の実施の形態３による超音波探触子製
造の一工程を示す概略断面図FIG. 18 is a schematic sectional view showing one process of manufacturing an ultrasonic probe according to the third embodiment of the present invention.
【図１９】本発明の実施の形態３による超音波探触子製
造の一工程を示す概略斜視図FIG. 19 is a schematic perspective view showing one process of manufacturing an ultrasonic probe according to the third embodiment of the present invention.
【図２０】従来の超音波探触子の構成を示す概略断面図FIG. 20 is a schematic sectional view showing the configuration of a conventional ultrasonic probe.
１ 圧電素子 ２ 絶縁材料 ３ 表面電極 ４ 音響整合層 ５ 音響レンズ ６ バッキング材 ７ リード線 ８ リング ９ 平板 １０ 絶縁フィルム １１ 筒 １２ 導電性材料 １３ 電極端子 DESCRIPTION OF SYMBOLS 1 Piezoelectric element 2 Insulating material 3 Surface electrode 4 Acoustic matching layer 5 Acoustic lens 6 Backing material 7 Lead wire 8 Ring 9 Flat plate 10 Insulating film 11 Tube 12 Conductive material 13 Electrode terminal
───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 2G047 EA05 EA15 GB21 GB32 4C301 EE06 EE16 GB18 GB33 5D019 AA21 AA25 BB02 BB28 FF03 GG03 GG06 HH01 HH02 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2G047 EA05 EA15 GB21 GB32 4C301 EE06 EE16 GB18 GB33 5D019 AA21 AA25 BB02 BB28 FF03 GG03 GG06 HH01 HH02
Claims (16)
触子において、圧電素子と、前記圧電素子の幅方向の周
囲を取り囲む絶縁材料と、前記圧電素子と前記絶縁材料
の両面にそれぞれ形成された表面電極と、前記表面電極
それぞれに接続された２つのリード線とを有し、前記リ
ード線は、いずれも絶縁材料上に形成された表面電極に
接続することを特徴とする超音波探触子。1. An ultrasonic probe for transmitting or receiving an ultrasonic wave, wherein a piezoelectric element, an insulating material surrounding a widthwise periphery of the piezoelectric element, and both surfaces of the piezoelectric element and the insulating material are formed. An ultrasonic probe, comprising: a front surface electrode formed by the above-mentioned method, and two lead wires connected to each of the front surface electrodes, wherein each of the lead wires is connected to a front surface electrode formed on an insulating material. Child.
面から他面へ折り返して形成され、２つのリード線は、
両方とも前記絶縁材料の同じ側で、異なる電極にそれぞ
れ接続することを特徴とする請求項１記載の超音波探触
子。2. One of the surface electrodes is formed by folding a part of the insulating material from one surface to the other surface, and the two lead wires are
The ultrasonic probe according to claim 1, wherein both are connected to different electrodes on the same side of the insulating material.
内に前記圧電素子をつけこんで硬化させ、両面を研磨す
ることにより前記圧電素子の両面をむき出すことで形成
することを特徴とする請求項１または２記載の超音波探
触子。3. The insulating material around the piezoelectric element is formed by placing the piezoelectric element in an insulating material, curing the piezoelectric element, and polishing both sides to expose both sides of the piezoelectric element. The ultrasonic probe according to claim 1.
触子において、圧電素子と、前記圧電素子の幅方向の周
囲を取り囲む絶縁材料と、前記圧電素子と前記絶縁材料
の両面にそれぞれ形成された表面電極と、前記表面電極
の一方に電気的に接続される電極を外周面に有する筐体
と、前記表面電極それぞれに電気的に接続される２つの
リード線とを有し、前記リード線は、一方を前記筐体の
外周面に形成された電極に接続し、他方を絶縁材料上に
形成された表面電極に接続することを特徴とする超音波
探触子。4. An ultrasonic probe for transmitting or receiving ultrasonic waves, wherein a piezoelectric element, an insulating material surrounding a widthwise periphery of the piezoelectric element, and both surfaces of the piezoelectric element and the insulating material are formed. A surface electrode, a housing having an outer peripheral surface of an electrode electrically connected to one of the surface electrodes, and two lead wires electrically connected to the surface electrode, respectively. An ultrasonic probe characterized in that one end is connected to an electrode formed on the outer peripheral surface of the housing, and the other end is connected to a surface electrode formed on an insulating material.
る請求項１から４のいずれかに記載の超音波探触子。5. The ultrasonic probe according to claim 1, wherein a resin is used as the insulating material.
触子において、圧電素子と、前記圧電素子の幅方向の周
囲を取り囲む絶縁フィルムと、前記圧電素子と前記絶縁
フィルムの両面にそれぞれ形成された表面電極とを有
し、前記絶縁フィルムを前記超音波探触子の外部まで延
びるように形成することを特徴とする超音波探触子。6. An ultrasonic probe for transmitting or receiving ultrasonic waves, wherein a piezoelectric element, an insulating film surrounding the widthwise periphery of the piezoelectric element, and both surfaces of the piezoelectric element and the insulating film are formed. An ultrasonic probe, comprising: a front surface electrode; and the insulating film extending to the outside of the ultrasonic probe.
を用いることを特徴とする請求項６記載の超音波探触
子。7. The ultrasonic probe according to claim 6, wherein a super heat-resistant polyimide film is used as the film.
いることを特徴とする請求項１から７のいずれかに記載
の超音波探触子。8. The ultrasonic probe according to claim 1, wherein vapor deposition or sputtering is used to form the surface electrode.
材料を形成する工程と、前記圧電素子と前記絶縁材料の
両面にそれぞれ表面電極を形成する工程と、前記表面電
極それぞれにリード線を接続する工程とを有し、前記リ
ード線は、いずれも絶縁材料上に形成された表面電極に
接続することを特徴とする超音波探触子の製造方法。9. A step of forming an insulating material surrounding a periphery of the piezoelectric element in a width direction, a step of forming surface electrodes on both surfaces of the piezoelectric element and the insulating material, and connecting a lead wire to each of the surface electrodes. And connecting each of the lead wires to a surface electrode formed on an insulating material.
一面から他面へ折り返して形成され、それぞれのリード
線は、両方とも前記絶縁材料の同じ側で、異なる電極に
それぞれ接続することを特徴とする請求項９記載の超音
波探触子の製造方法。10. One surface electrode is formed by folding a part from one surface of an insulating material to another surface, and each lead wire is connected to a different electrode on the same side of the insulating material. The method for manufacturing an ultrasonic probe according to claim 9, wherein:
料内に前記圧電素子をつけこんで硬化させ、両面を研磨
することにより前記圧電素子の両面をむき出すことで形
成することを特徴とする請求項９または１０記載の超音
波探触子の製造方法。11. An insulating material around a piezoelectric element is formed by placing the piezoelectric element in an insulating material, curing the piezoelectric element, and polishing both sides to expose both sides of the piezoelectric element. A method for manufacturing an ultrasonic probe according to claim 9.
縁材料を形成する工程と、前記圧電素子と前記絶縁材料
の両面にそれぞれ表面電極を形成する工程と、電極を筐
体の外周面に形成して前記表面電極の一方と電気的に接
続する工程と、前記表面電極それぞれと２つのリード線
とを電気的に接続する工程とを有し、前記リード線は、
一方を前記筐体の外周面に形成された電極に接続し、他
方を絶縁材料上に形成された表面電極に接続することを
特徴とする超音波探触子の製造方法。12. A step of forming an insulating material surrounding the periphery in the width direction of the piezoelectric element, a step of forming surface electrodes on both surfaces of the piezoelectric element and the insulating material, and forming the electrodes on the outer peripheral surface of the housing. Electrically connecting to one of the surface electrodes, and a step of electrically connecting each of the surface electrodes and two lead wires, the lead wire,
A method for manufacturing an ultrasonic probe, wherein one is connected to an electrode formed on an outer peripheral surface of the housing, and the other is connected to a surface electrode formed on an insulating material.
する請求項９から１２のいずれかに記載の超音波探触子
の製造方法。13. The method for manufacturing an ultrasonic probe according to claim 9, wherein a resin is used as the insulating material.
ムで取り囲む工程と、前記圧電素子と前記絶縁フィルム
の両面にそれぞれ表面電極を形成する工程とを有し、前
記絶縁フィルムを前記超音波探触子の外部まで延びるよ
うに形成することを特徴とする超音波探触子の製造方
法。14. A method comprising: surrounding a piezoelectric element in a width direction with an insulating film; and forming surface electrodes on both surfaces of the piezoelectric element and the insulating film, respectively. A method for manufacturing an ultrasonic probe, wherein the ultrasonic probe is formed so as to extend to the outside of the probe.
ィルムを用いることを特徴とする請求項１４記載の超音
波探触子の製造方法。15. The method according to claim 14, wherein a super heat-resistant polyimide film is used as the insulating film.
用いることを特徴とする請求項９から１５のいずれかに
記載の超音波探触子の製造方法。16. The method for manufacturing an ultrasonic probe according to claim 9, wherein vapor deposition or sputtering is used to form the surface electrode.
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|---|---|---|---|
| JP2000103054A JP3608471B2 (en) | 2000-04-05 | 2000-04-05 | Ultrasonic probe and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000103054A JP3608471B2 (en) | 2000-04-05 | 2000-04-05 | Ultrasonic probe and manufacturing method thereof |
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| Publication Number | Publication Date |
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| JP3608471B2 JP3608471B2 (en) | 2005-01-12 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2072150A2 (en) | 2007-12-19 | 2009-06-24 | Ueda Japan Radio Co., Ltd. | Ultrasonic transducer |
| JP2009153603A (en) * | 2007-12-25 | 2009-07-16 | Ueda Japan Radio Co Ltd | Ultrasonic probe and method of manufacturing the same |
| JP2010258911A (en) * | 2009-04-27 | 2010-11-11 | Honda Electronic Co Ltd | Ultrasonic sensor |
| JP2017044601A (en) * | 2015-08-27 | 2017-03-02 | 三菱重工業株式会社 | Ultrasonic sensor and method of manufacturing the same |
-
2000
- 2000-04-05 JP JP2000103054A patent/JP3608471B2/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2072150A2 (en) | 2007-12-19 | 2009-06-24 | Ueda Japan Radio Co., Ltd. | Ultrasonic transducer |
| JP2009153603A (en) * | 2007-12-25 | 2009-07-16 | Ueda Japan Radio Co Ltd | Ultrasonic probe and method of manufacturing the same |
| JP2010258911A (en) * | 2009-04-27 | 2010-11-11 | Honda Electronic Co Ltd | Ultrasonic sensor |
| JP2017044601A (en) * | 2015-08-27 | 2017-03-02 | 三菱重工業株式会社 | Ultrasonic sensor and method of manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3608471B2 (en) | 2005-01-12 |
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