JPH11345848A - Manufacture of semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To facilitate processing and to achieve the efficiency of control, by controlling the image recording foreign matter by utilizing a work station, and simultaneously controlling the image recorded in the past and the accompanied data. SOLUTION: A worker specifies a wafer 3 by inputting a part or all of a product name, a process name, an installation name, an inspection date, a lot number and a wafer number on a work station(WS). WS searches the index of the image and a characteristic code 4 of a foreign matter which is attached to a wafer 3 agreeing subject to a specified conditions, and the X coordinate and the Y coordinate of the foreign matter on the wafer 3. WS displays the shape of the wafer 3 and the position where the foreign matter is dispersed on the wafer 3 on a cathode-ray tube CRT 1 based on the result of the search as a-c. When the worker specifies the example of the intended foreign matte, WS moves the image index to the image database for every coordinates of the foreign matter on the cathode ray tube CRT 1 and displays the image of the foreign matter on an image display device.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for inspecting a thin film product, for example, a semiconductor device, a thin film circuit board, a magnetic disk, a thin film transistor, etc., for an appearance defect such as a foreign matter, a defect or a film defect, and particularly to the appearance method. The present invention relates to an image filing system for searching for a defective image.

[0002]

2. Description of the Related Art Inspection of foreign matter or defects during the manufacture of semiconductor devices or the like is extremely important for reducing product defects and improving yields. Judgment of the type and the like depended on the visual inspection of the operator. However, as an automatic foreign substance inspection apparatus for easily visually observing the position where the foreign substance is detected on the wafer, Japanese Patent Application Laid-Open Nos. There is one disclosed in Japanese Patent Application Laid-Open No. 62-76732. With these foreign matter inspection devices, the worker can easily observe the detected foreign matter with a visual optical system or a system including a television camera receiver.

[0003] However, these automatic foreign substance inspection devices do not have means for registering, storing, or reproducing images taken using, for example, a television camera. Therefore, an operator has taken a photograph of a foreign substance using a visual optical system or recorded a foreign substance image captured by a television camera on a video tape recorder (hereinafter, referred to as a VTR).

[0004]

The above-mentioned prior art does not have means for collating the image information and the data at the time of recording the image, so that the collation can be performed by the memory or memo of the operator, or the desired VTR can be obtained. Images were searched and played. For this reason, no consideration has been given to facilitation of means for effectively utilizing past images.

SUMMARY OF THE INVENTION An object of the present invention is to manage images recorded with foreign substances using a workstation and simultaneously search for previously recorded images and associated data to facilitate processing and improve management efficiency. It is an object of the present invention to provide an image filing system suitable for performing the above.

[0006]

An object of the present invention is to record an image detected and photographed by a foreign substance inspection device in an image database, to associate one image with one image index, and to store the image on a workstation. A database is constructed, and the image index, the coordinates of the foreign matter on the wafer, the photographing date, and the accompanying data such as the wafer processing process are recorded.
The wafer is determined by specifying the photographing date, etc., and the information accompanying the wafer, the shape of the wafer and the position of the recorded foreign matter are displayed on the CRT of the workstation, and the position of the desired foreign matter is designated with a mouse. By doing
This is accomplished by an image filing system configured to cause a workstation to send an image index of a foreign object to an image database and retrieve and display the image.

With the above arrangement, the work station searches the wafer to which the observed foreign matter has adhered by designating the photographing date and the process name, and further designates the foreign matter desired to be observed at the position on the wafer. The foreign substance image can be easily searched and displayed, and information associated with each wafer is displayed, so that it is possible to determine under what conditions the foreign substance is observed.

[0008]

Embodiments of the present invention will be described with reference to the drawings. <Embodiment 1> This embodiment relates to a method of inspecting foreign substances on a semiconductor wafer and observing the foreign substances in parallel with the inspection. FIG. 1 is a CRT screen showing the distribution of foreign substances on a wafer 3. Reference numeral 2 denotes a monitor television screen showing an image of a foreign substance.
The operator first specifies the wafer 3 by inputting part or all of the product name, process name, equipment name, inspection date, lot number, and wafer number into the workstation 7. The workstation 7 searches for an image index of the foreign matter adhered to the wafer 3 that matches the designated condition, the feature code 4, and the X and Y coordinates on the wafer 3. The coordinate system need not be limited to the XY coordinate system if a fixed system is used continuously.

The feature code is a code that encodes features such as the shape, color, and material of the foreign matter. For example, a white spherical foreign matter is designated as a, a silicon piece is designated as b, and a black powdery foreign matter is designated as c. Classify. Workstation 7 has
As shown in FIG. 1, the shape of the wafer 3 and the position where the foreign matter is distributed on the wafer 3 are displayed on the CRT 1 based on the search result as foreign matter characteristic codes a, b, and c. When the worker designates a desired foreign substance, for example, c as shown by an arrow 4 using the mouse 15, the workstation 7 transfers an image index to the image database for each coordinate of the foreign substance on the CRT 1, and as shown in FIG. The foreign object image 5 is reproduced on an image display device (hereinafter referred to as a monitor television) 2. As a result, the operator can search for a foreign object image without being conscious of the image index.

<Embodiment 2> A method of realizing the present invention shown in FIGS. 1 and 2 will be described with reference to FIG. FIG. 3 is a block diagram showing a basic hardware configuration. It is preferable that the foreign substance inspection device 6 be capable of measuring the coordinates of the foreign substance detected on the wafer 3 and capable of recording the process name, date, and type of the wafer 3 inspected by the operator. As such a foreign substance inspection device 6, I manufactured by Hitachi Electronics Engineering, Ltd.
S-1010.

The workstation 7 has a function of instructing data processing contents by an operator and displaying data processing, storage, processing results, and the like. Image database 8 is one by one
It suffices to have a function of assigning an index to two images, a function of storing an image and an index of the image in association with each other, and a function of searching for and displaying an image corresponding to the index when the index is input. A communication line 9 connects the foreign matter inspection device 6 and the workstation 7 to each other.
A signal line 10 connects between the workstation 7 and the image database 8, and a communication line 1 connects between the workstation 7 and the image database 8.
1, respectively.

FIG. 4 shows the configuration of the workstation 7 in which a data processing unit (hereinafter referred to as a CPU) 12 and a CR
T1 and a data input unit (hereinafter referred to as K / B) 13, a data storage unit (hereinafter referred to as HD) 14 and a mouse 15 may be used. For example, 2050/32 manufactured by Hitachi, Ltd.
Is appropriate. Here, the CPU 12 not only processes data but also has a temporary storage of data accompanying the processing, that is, a memory function.

FIG. 5 is a block diagram showing the structure of the image database 8. The image database 8 is composed of the monitor television 2 and an image recording unit 16 and a control unit 17 such as, for example, OVDR manufactured by Hitachi, but is externally housed in the same housing. Is also good. The image recording medium of the present invention does not need to be limited to a special type, but it is preferable to use an optical disk in terms of search speed. For example, in the case of using OVDR manufactured by Hitachi, the average search time per search is This is advantageous in that a high-speed search of about 20 times or more that of a general video tape recorder can be performed within 0.5 seconds or outside.

The image recording section 16 receives the image signal from the foreign matter inspection device 6 and outputs the image signal to the monitor television 2 as it is. The control unit 17 sends the index of the recorded image to the workstation 7, receives the index of the image to be searched from the workstation 7, calls up the index from the image recording unit 16, and displays the index on the monitor television 2.

Next, the flow of operations from inspection of the wafer 3 to recording of a foreign substance image will be described with reference to the flowchart of FIG. In step 1001, an inspection lot is set in the foreign substance inspection device 6, and the product name, process name, date, operator name, lot number, and wafer number are input.

In step 1002, the foreign matter inspection device 6 loads one wafer 3 and automatically detects foreign matter on the wafer 3. When the detection of the foreign object is completed, the foreign object inspection device 6 transmits the inspection data to the workstation 7 in step 1003, and the C of the workstation 7 is transmitted in step 1004.
The data list 100 is displayed on RT1.

Next, in step 1005, the foreign substance inspection device 6 displays the foreign substances on the monitor television 2 one screen at a time in the order of inspection. In the data list 100 displayed on the workstation 7, a foreign substance mark 101 is displayed at the position of the data on the displayed foreign substance. Next, in step 1006, the worker observes the foreign matter displayed on the monitor television 2.

In step 1007, as a result of the observation, when it is determined that the foreign matter needs to be recorded, an input is made to the workstation 7 as to whether or not to record the image.

In step 1008, the features of the foreign matter are coded and input to the workstation 7. Next, in step 1009, the foreign substance inspection device 6 determines whether or not the foreign substance to be observed still exists. If a foreign object exists, the process returns to step 1005;
At 010, the wafer 3 is released from the load state. When there is no foreign substance to be observed next, the foreign substance inspection device 6 sets the next wafer 3
It is determined whether or not there is, and if there is a wafer 3, the process returns to step 1002, and if there is no wafer 3, the operation ends. Here, steps 1001, 1002, 1003,
1009, 1010, and 1011 are operations performed by the foreign substance inspection device 6, steps 1004 and 1005 are operations performed by the image database 8, and steps 1006, 1007, and 10
08 is an operation performed by the operator.

FIG. 7 shows the structure of the inspection data transferred in step 1003. At the head of the data, a header, for example, S10 indicating the head is displayed, and then the product name, process name, lot number, date, number of wafers, and operator name are displayed. Next, a header of data for each wafer, for example, S20 is displayed,
Subsequently, the wafer number and the number of detected foreign substances are displayed. Next, a header of data for each foreign substance, for example, S30 is displayed.
Next, the X coordinate, Y coordinate, and size of the foreign matter are displayed, and data for each foreign matter is repeatedly displayed for the number of detected foreign matters. Header indicating the end of the last data to be transferred, for example, S40
Is written. The end of each data is indicated by “:”.

Next, FIG.
4 shows a data list 100 displayed at T1. In the data list 100, columns indicating a lot number, a wafer number, a process name, and a date are provided at an upper portion, and below the columns, there are columns such as an X coordinate, a Y coordinate, a size, a feature code, a display mark, and an image index of a foreign substance. When it is determined in step 1007 in FIG. 6 that an image needs to be recorded, an image index is calculated by the following procedure and displayed in the image index column. In step 1008, when a characteristic code of a foreign substance is input, it is displayed in a characteristic code column. If the number of foreign substances is too large to be displayed on one screen, the user scrolls through the X coordinate, Y coordinate, size, feature code, display mark, and image index fields. The operator can scroll the screen up and down by specifying the upper scroll icon 103 or the lower scroll icon 104.

Next, FIG. 9 is a flowchart showing a flow from recording an image to managing an image index in a database. In the workstation 7, a counter is provided in step 1012, and an initial setting value of the counter is set to zero.
In step 1006 shown in FIG. 6, the operator determines whether or not the observed image needs to be stored, and inputs the result of the determination to the workstation 7. In response to the operator's input, the workstation 7 executes step 1006
If the image is stored in response to the input result in step (1), 1 is added to the counter value in step 1013. Next, in step 1014, the value of the counter is registered in the database as an image index.

If the counter exceeds the upper limit of the capacity of the recording medium in step 1015, the value of the counter is reset to zero in step 1016. If the counter does not exceed the upper limit of the capacity of the storage medium, it is determined at 1017 whether or not the work has been completed. If completed, the work is stopped. If not, the process returns to step 1006.

When an optical disc is used as a recording medium such as the above-described OVDR, the upper limit of the recording medium is 24,000.
It is. In the image database 8, the index of the first image to be recorded on one recording medium is 1. For the index of the image to be recorded next, 1 is added to the index of the image recorded before that. By this method, the image index issued in the image database 8 matches the image index issued in the workstation 7.

FIGS. 10, 11, and 12 are diagrams showing data formats inside the HD, and FIG. 10 shows a lot holding format of data. This is a lot data in a table format and is called a lot data table. This lot data table includes lot ID, lot number, process name, equipment name, product name, date, and operator name. The lot ID includes a lot number and a process or date. Therefore, even if the lot number is the same, if the inspection process or date is different, the lot ID is different.

FIG. 11 shows a format for holding data in units of three wafers. This is data in a table format, and is called a wafer 3 data table. This wafer 3 data table includes a wafer ID, a lot ID, a wafer number, and the number of foreign substances. The wafer number is the number assigned in the same lot.
The same wafer number exists between different lots. Wafer ID
Assigns a serial number to a wafer 3 having a different one of the lot ID and the wafer number.

FIG. 12 shows a data holding format for each foreign object. This is data in a table format, and is referred to as a foreign substance data table. This foreign matter data table contains the foreign matter I
D, wafer ID, X coordinate, Y coordinate, size, feature code, and image index. Foreign matter ID is wafer I
A serial number is assigned to a foreign substance that differs in any one of the D, X coordinates, and Y coordinates. In the above-described embodiment, an example is shown in which the mouse 15 is used as a means for specifying a foreign substance. However, the present invention is not limited to the mouse 15, and a light pen may be used as long as the position can be specified on the CRT 1.

FIG. 13 is a flow chart from the time when a foreign substance is designated on the CRT 1 by the mouse 15 to the time when the foreign substance image 5 is displayed on the monitor television 2.

At step 1018, the operator moves the mouse 15
Is used to specify the feature code 4 for the foreign matter whose image is desired. At step 1019, the workstation 7
Reads the position on the screen designated by the mouse, and recognizes the ID of the foreign substance at this position.

Since step 1019 can be realized by a general method of using the mouse 15, detailed description will be omitted. In step 1020, the workstation 7 reads the image index of the foreign substance from the foreign substance ID using the foreign substance data table shown in FIG.

In step 1021, the image index is sent to the image database controller 17. Step 10
At 22, the image database control unit 17 calls the recorded image from the image recording unit 16 based on the image index and causes the monitor television 2 to display the image.

[0032]

According to the present invention, it is possible to simultaneously view information for searching for a wafer and an image of a foreign substance, and to perform inspection while comparing the state of the foreign substance and the shape of the foreign substance with each other. Since it is not necessary to specify an image index or the like of a foreign substance when searching for an image of a foreign substance, the time and effort required for the search can be simplified, and therefore, it is easy to know what kind of foreign substance is occurring on the production line. This makes it easy to take effective measures to reduce foreign matter, and has a remarkable effect on improving the product yield.

[Brief description of the drawings]

FIG. 1 is a diagram showing a CRT screen of a foreign substance distribution on a wafer.

FIG. 2 is a diagram showing a monitor television screen of an image of a foreign substance.

FIG. 3 is a block diagram showing a basic hardware configuration of the present invention.

FIG. 4 is a diagram showing a configuration of a workstation.

FIG. 5 is a block diagram showing an internal configuration of an image database.

FIG. 6 is a flowchart showing a work flow up to recording of a foreign object image.

FIG. 7 is a diagram showing a configuration of inspection data transferred from the foreign substance inspection device.

FIG. 8 is a diagram showing a data list displayed on a CRT of a workstation.

FIG. 9 is a flowchart showing a flow from recording an image to managing an image index in a database.

FIG. 10 is a diagram illustrating a format for holding data in lot units.

FIG. 11 is a diagram showing a format for holding data in wafer units.

FIG. 12 is a diagram showing a format for holding data in a foreign substance unit.

FIG. 13 is a flowchart showing a flow from designation of a foreign substance to image display.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... CRT 2 ... Monitor television 3 ... Wafer 4 ... Feature code 5 ... Foreign matter image 6 ... Foreign matter inspection device 7 ... Workstation 8 ... Image database 9,11 ... Communication line 10 ... Signal line 12 ... Data processing unit 13 ... Data input Unit 14 Data input unit 15 Mouse 16 Image recording unit 17 Control unit 100 Data list 101 Foreign matter mark

────────────────────────────────────────────────── ───

[Procedure amendment]

[Submission date] June 3, 1999

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Claims

[Correction method] Change

[Correction contents]

[Claims]

[Procedure amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0001

[Correction method] Change

[Correction contents]

[0001]

TECHNICAL FIELD The present invention relates to a thin film circuit board, a magnetic disk, such as a thin film transistor, the foreign matter at the time of manufacturing the semiconductor device, it relates to an inspection method for bad appearance such as defect or film defects, especially the poor appearance of the image Search for semi
The present invention relates to a method for manufacturing a conductor device .

[Procedure amendment 3]

[Document name to be amended] Statement

[Correction target item name] 0005

[Correction method] Change

[Correction contents]

SUMMARY OF THE INVENTION An object of the present invention is to manage images recorded with foreign substances using a workstation and simultaneously search for previously recorded images and associated data to facilitate processing and improve management efficiency. Semiconductors suitable for
An object of the present invention is to provide a method for manufacturing a device .

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0006

[Correction method] Change

[Correction contents]

[0006]

SUMMARY OF THE INVENTION The above object is attained by a predetermined process.
Defects are detected by imaging the wafer that has passed the process, and the detected defects are detected.
Storing an image of the defect together with information identifying the wafer;
The information that identifies the stored wafer is displayed on the screen, and the
From the information that identifies the wafer displayed on the surface,
And selecting the detected defect of the selected desired wafer.
The information about the fault was displayed on the screen and displayed on the screen.
Specify the defect to be observed from the information on the desired wafer defect.
And displays the image of the specified defect on the screen.
Information on the desired wafer defect and the defect
Monitors the status of defect occurrence based on images and semi-conductors
Method of manufacturing semiconductor device, characterized by manufacturing semiconductor device
Method or image of a wafer that has undergone a predetermined process to detect defects.
To detect and to retrieve the image of the detected defect for the defect
For retrieving the stored defect.
Display the information on the screen and display the image of the stored defect.
Information for searching for the defect and the
While monitoring the status of defect occurrence based on the defect image
Manufacturing a semiconductor device from the semiconductor device.
This is achieved by a manufacturing method . Also displayed on the screen
Specify the defect image to be stored from among the defective images
And stores it together with information specifying the image of the designated defect.
And furthermore, an image of the defect is provided on the wafer.
Display on the screen together with an image showing the state of the attachment of the defect
It is configured as follows.

[Procedure amendment 5]

[Document name to be amended] Statement

[Correction target item name] 0007

[Correction method] Deleted

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Yuzo Taniguchi 5-2-1, Josuihonmachi, Kodaira-shi, Tokyo Inside the Musashi Plant of Hitachi, Ltd. Address: Inside the Takasaki Plant of Hitachi, Ltd.

Claims (2)

[Claims] 1. A method for manufacturing a semiconductor device, comprising: picking up an image of a wafer having undergone a predetermined process to detect a defect; storing an image of the detected defect together with information for specifying the wafer; Is displayed on the screen, a desired wafer is selected from the information specifying the wafer displayed on the screen, and information on the detected defect of the selected desired wafer is displayed on the screen. Specifying a defect to be observed from the information on the desired wafer defect displayed on the screen, displaying an image of the specified defect on the screen, and displaying the displayed information on the desired wafer defect and the defect A method of manufacturing a semiconductor device, comprising: manufacturing a semiconductor device while monitoring a state of occurrence of a defect based on an image. 2. A method of manufacturing a semiconductor device, comprising: picking up an image of a wafer having undergone a predetermined process to detect a defect; storing an image of the detected defect together with information for searching for the defect; Displaying information for searching for the detected defect on a screen, displaying the image of the stored defect on a screen, and simultaneously displaying the information for searching for the defect and the image of the defect to generate a defect. Manufacturing a semiconductor device while monitoring a state of the semiconductor device.