JPH11345821A - Bonding apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable apparatus error corrections by utilizing a magazine, etc., with known size, etc., even when there is no jig to enable apparatus error corrections by utilizing other magazine, etc., having known size, etc., even when the size, etc., of the magazine mounted on the apparatus is not known, and to calculate corrected data according to the apparatus error correction. SOLUTION: A distance h from an origin position O to the rail surface of a guide rail and a distance x from the locating surface of a first stage lead frame of a magazine M to the bottom surface of the magazine M are set beforehand in a memory, and when an apparatus error occurs in the origin position O, a distance h' from a new origin position O' to the rail surface is calculated and a distance from the upper surface of a magazine receiving part 4 to the origin position O' is obtained for obtaining a displace amount Δ1 between the origin positions O and O', and Δ1 is used as data for apparatus error correction.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding apparatus for performing bonding to a part to be bonded, and more particularly to a bonding apparatus capable of correcting a machine difference of a movable body without using a jig.

[0002]

2. Description of the Related Art FIG.
11 to FIG. FIG. 9 is a perspective view of a conventional wire bonding apparatus, FIG. 10 is a schematic plan view of FIG. 9 viewed from the top, and FIG. 11 is an operation explanatory view of main parts of the wire bonding apparatus shown in FIG.

As shown in FIGS. 9 and 10, a conventional wire bonding apparatus includes a plurality of lead frames L / F.
Magazines M (also referred to as frames) arranged and arranged (arranged in a direction perpendicular to the paper surface) are loaded into a loader 101 as a magazine positioning device mounted on a gantry 109. A plurality of IC chips 102 are attached to each of the lead frames L / F at a constant pitch along the longitudinal direction, and a plurality of leads 108 are arranged around the IC chip 102. I have.

[0004] Each lead frame L /
For example, one of the lowermost sheets of F is pushed out by a pusher 107a of a pusher mechanism 107, and a pair of guide rails 104 as guide means disposed opposite to both sides.
The wafer is guided by a guide rail 105 and transported onto a heater plate 103 as a bonding stage (also referred to as a stage). Guide rails 104 and 1
05 is adjustable in mutual distance, and can correspond to various lead frames L / F having different widths.

When the lead frame L / F arrives on the heater plate 103, the frame transfer means intermittently feeds the lead frame L / F by the arrangement pitch of the IC chips 102 to form each IC chip 102 and the lead frame L / F. Bonding means 106 with lead 108
Bonding connection using a conductive wire.
Then, the lead frame L / F having completed the bonding
Is transferred by the frame transfer means and
01 is stored in an empty magazine M loaded in an unloader 110 having the same configuration as that of the unloader 110.

The bonding means 106 has a bonding head 112 mounted on an XY table 111 which can be moved in a two-dimensional direction. The bonding head 112 swings up and down by a linear motor or a cam drive. A bonding arm 113 having a possible ultrasonic transducer and a capillary 11 as a bonding tool attached to the tip of the bonding arm 113
4 and a wire clamp 115 for clamping a wire inserted into the capillary 114.

When the first lead frame L / F in the magazine M is pushed out by the pusher 107a, the magazine M is lowered by one pitch of the arrangement pitch and the second lead frame L / F from the lowermost stage. Pusher F
07a and transferred by the frame transfer means. Hereinafter, each lead frame L / F in the magazine M
The same operation is repeated for.

The details of the loader 101 will be described with reference to FIG. Note that the unloader 110 has substantially the same configuration as the loader 101 except for the pusher mechanism 107, and thus the description thereof is omitted.

As shown in FIG. 9, the loader 101 has a substantially L-shaped configuration as a whole, and includes a case 116, a stocker 137 serving as a receiving portion of the magazine M when the magazine is discharged, and a regulation for regulating the magazine M. Means 118.

In the case 116, an elevating shaft 119 is provided.
And a pulley 120 fixed to the upper end of the elevating shaft 119, and a belt 12 between the pulley 120 and the pulley 122.
And a pulse motor (not shown) for transmitting a driving force to the elevating shaft 119 by winding the coil 1.

A driving member from the pulse motor is transmitted to the elevating shaft 119 so that the elevating shaft 119 rotates forward or backward (also referred to as forward / reverse rotation) to move up and down (not shown). ) Is provided. This elevating member has a magazine receiving portion 123 that receives a plurality of magazines M placed above. Positioning means for positioning the magazine M by lowering or ascending by the arrangement pitch of the lead frame L / F by the elevating shaft 119 and the elevating member is constituted.

The regulating means 118 has a plurality of regulating members 124 for regulating the magazine M in a horizontal plane (X direction, Y direction) perpendicular to the elevating direction (Z direction).

Next, a description will be given of the machine difference correction of the conventional wire bonding apparatus having the above configuration. The machine difference correction in the conventional wire bonding apparatus is performed by the regulating means 11.
The control member 124 and the guide rails 104 and 105 as guide means in 8 are performed using a jig.

Setting of the reference position for operation of the regulating member 124

As shown in FIG. 10, a long jig 127 is prepared in a substantially flat plate shape, and holes formed in the jig 127 are inserted into two positioning pins 103 on the heater plate 103.
a and 103b to be positioned with respect to the first reference position 128. The jig 127 includes each regulating member 12.
4 and contact surfaces 127a to 127h for contacting the guide rails 104 and 105 are formed.

As shown in FIG. 11, the width of the jig 127 is g, and the distribution dimensions h and i (h = i) of the jig 127 with respect to the first reference position 128 are also set. Is known. Therefore, the distances p and q between the operation start position (the position indicated by the two-dot chain line) and the first reference position 128 for each regulating member 124 are p = c + h and q = d + i.

Also, an operation start position (a position indicated by a two-dot chain line) in a direction perpendicular to the moving direction of the regulating member 124 and a second reference position 129 orthogonal to the first reference position 128 are described. The distance v can be obtained as v = e + t. t is known.

The distances p, q, and v are calculated and set as operation reference positions.

Guide rail 104 and guide rail 1
Setting of operation reference position of 05

Guide rail 104 and guide rail 10
The setting of the operation reference position 5 is performed using the contact surfaces 127g and 127h at the center of the jig 127.

As shown in FIGS. 10 and 11, sensors 131, 132, 133, 134 and 13 as detecting means are provided along the guide rails 104 and 105.
5 are provided. These detecting means are provided in the frame transfer means.

The sensor 131 includes a push mechanism 107
Is operated to detect that the lead frame L / F is projected from the magazine M on the loader 101, and the sensor 132 confirms that the lead frame L / F is stored in the magazine M of the unloader 110. It is for doing. The sensor 133 and the sensor 134
Is for detecting the width dimension of the lead frame L / F guided by the guide rails 104 and 105. Further, the sensor 135 is the sensor 1
This is for detecting the leading end of the lead frame L / F detected by the sensor 33 and the sensor 134.

Next, detection of the width dimension of the lead frame L # F using the two sensors 133 and 134 will be described.

As shown in FIG. 11, the guide rail 104
The guide rail 105 is located at a preset operation reference position, and the distance T shown in FIG. 11 is known. When, for example, only one of the guide rails 105 is operated and moved toward the other guide rail 104 from the operation reference position, the lead frame L / F receives the guide rail 10.
5 and is sandwiched between the guide rails 104 and 105. Guide rail 105 at this time
When the amount of movement and W _2, the width U of the lead frame L / F is a value obtained by subtracting the W ₂ from the distance T. The guide rail 105 is moved by being provided with a driving force by a pulse motor (not shown), and the movement amount W ₂ of the guide rail 105 is calculated by an encoder that emits a pulse signal according to the rotation amount of the pulse motor.

[0025]

In the conventional wire bonding apparatus, correction data is calculated by using a jig 127 for correcting a machine difference and machine difference is corrected.

However, since the conventional wire bonding apparatus cannot calculate correction data without the jig 127, adjustment and reassembly of a mechanical unit must be performed for each apparatus. After that, it was necessary to calculate the correction data while adjusting each part. Therefore, there is a problem that the number of work steps increases and much time is required. In addition, in the case of an in-line system in which a plurality of units are connected, in many cases, machine difference correction is performed at a place where the apparatus is installed. In such a case, there is a problem that the jig is not provided.

The jig 127 is shown in FIGS.
As shown in FIG. 1, there is a problem that it is difficult to handle because it is thin and long, and that a different type of jig 127 is required for each device.

Therefore, the present invention has been made in view of the above-mentioned drawbacks of the prior art. Even when the jig is not provided, a machine using a magazine or a lead frame whose dimensions and the like are known in advance is used. Difference correction is possible, and even if the dimensions and the like of the magazine and lead frame mounted on the device are not known, machine difference correction using other magazines and lead frames whose dimensions and the like are known in advance It is an object of the present invention to provide a bonding apparatus capable of calculating the correction data by the machine difference correction.

[0029]

SUMMARY OF THE INVENTION The present invention provides a positioning means for moving and positioning a magazine capable of accommodating a plurality of frames in a frame arranging direction, and positioning the magazine in a plane substantially perpendicular to the moving direction. Regulating means for regulating, guiding means for guiding a frame in a magazine regulated by the positioning means and the regulating means, frame transferring means for transferring the frame along a guiding direction of the guiding means, and frame transferring A stage for performing a bonding operation by mounting a frame transferred by the means, the positioning means, the regulating means, the guiding means,
A control unit for controlling the frame transfer unit and the like, and a control unit having a storage unit, wherein the control unit stores in advance known information such as dimensions of the magazine and the frame. If there is a machine difference in the distance from the preset operation start position to the movable body, the machine difference is corrected using known information such as the dimensions of the magazine and the frame.

Further, the positioning means according to the present invention comprises:
It has a microswitch as an origin for detecting the operation start position, and when there is a difference in the mounting position of the microswitch or the like, the amount of deviation from the value set in the control means is calculated and corrected. The value is stored in a storage means or a storage medium.

Further, the regulating means according to the present invention has a plurality of regulating members, and has a microswitch as an origin for detecting each operation start position of the plurality of regulating members. If there is a difference in the mounting position of the device, the amount of deviation from the value set in the control means is calculated and stored as a correction value in the storage means or the storage medium.

Further, the guide means according to the present invention has a pair of guide rails, and has a microswitch as an origin for detecting each operation start position of each guide rail. If there is a difference in position or the like, the amount of deviation from the value set in the control means is calculated and stored as a correction value in the storage means or the storage medium.

Further, the frame transfer means according to the present invention has a detecting means comprising a sensor for detecting the arrival of a frame, and when there is a difference in the mounting position of the sensor or the like, the information of the frame is used. This is to perform machine difference correction.

[0034]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a wire bonding apparatus as an embodiment according to the present invention will be described with reference to the drawings. The description of portions having the same configuration and function as those of the conventional wire bonding apparatus shown in FIGS. 9 to 11 will be omitted, and only the main portions will be described. Note that the same reference numerals are used for components having the same configuration as the conventional device.

FIG. 1 is a side view including a partial cross section of a loader of a wire bonding apparatus according to the present invention. FIG. 2 is a block diagram showing a driving circuit of a positioning means according to the present invention.
FIG. 4 is a view for explaining the operation of correcting the mechanical error of the positioning means according to the present invention, FIG. 4 is a plan view showing a configuration of the restricting means, including a partial cross section, and FIG. FIG. 6 is a diagram for explaining the operation of the device for correcting the machine difference according to the present invention, FIG. 7 is a diagram for explaining the operation of the device for correcting the machine difference according to the present invention, and FIG. FIG. 9 is an operation explanatory diagram for calculating a shift amount by correcting a machine difference between the center of an IC chip and a sensor using the bonding apparatus according to the present invention.

The wire bonding apparatus according to the present invention comprises:
The loader 101 has a loader 101 shown in FIG.
Reference numeral 01 denotes the positioning means 1 shown in FIG.
It comprises a regulating means 31 and a stocker 137 having a magazine discharge mechanism 8 shown in FIG.

First, referring to FIG. 1 and FIG.
01 will be described. In addition,
The unloader 110 that sequentially takes in and arranges the lead frames L / F after bonding in the magazine M after bonding has substantially the same configuration as the loader 101, and a description thereof will be omitted.

As shown in FIG. 1, the positioning means 1 according to the present invention has an encoder 2 as a detecting means for detecting the number of rotations of the elevating shaft 3, and the encoder 2 is used for correcting the machine difference of the positioning means 1. Do it.

As shown in FIG. 1, the positioning means 1 is attached to the base 22 via a base 22 fixed to the apparatus mount 21 and a bearing 23 extending in the vertical direction indicated by the arrow Z. The mounted elevating shaft 3, a pulse motor 24 for rotationally driving the elevating shaft 3, a nut 25 screwed to the elevating shaft 3, and a straight line that is movable in the Z direction together with the nut 25 and forms a linear guide together with the nut 25. It comprises a motion guide unit (not shown) and a magazine receiving portion 4 as a movable body which is connected to the nut 25 and receives the magazine M.

A toothed belt wheel 27 is fitted to the upper shaft end 3a of the elevating shaft 3. The output shaft 26 of the pulse motor 24 attached to the base 22 via a bracket 30 has teeth. An attached belt wheel 28 is fitted. The toothed belt 29 is wound around the both toothed belt wheels 27 and 28, and the driving force of the pulse motor 24 as the driving means is transmitted to the elevating shaft 3. Shaft end 3a at the top of the elevating shaft 3
, An encoder 2 as a detecting means is fixedly mounted on a base 22.

The encoder 2 serving as a detecting means outputs a pulse signal which is a feedback pulse corresponding to the number of rotations of the elevating shaft 3 which is driven to rotate by the rotational force of a pulse motor 24 serving as a driving means.

As shown in FIG. 2, the control circuit 6 as a control means is composed of a microprocessor or the like, and performs various controls of the wire bonding apparatus. The control circuit 6 includes:
The number of pulses generated from a pulse generator 7 as a pulse generator in an internal memory (RAM) as a storage unit (not shown) according to an input setting from an external operation unit such as a keyboard or a storage medium such as an external floppy disk. And a prescribed amount (or prescribed number) that allows a difference between the pulse number and the number of pulses as the feedback signal from the encoder 2 is stored in advance.

FIG. 2 illustrates the range necessary for controlling the drive circuit for driving the pulse motor 24. Also,
In FIG. 2, the control circuit 6 as the control means and the pulse generator 7 as the pulse generation means have different configurations. However, the control circuit 6 may include the pulse generator 7 integrally. 6 and the pulse generator 7 are treated as control means.

As shown in FIG. 2, the control circuit 6 issues a drive command to the pusher mechanism 107 (shown in FIG. 9 and FIG. 10) in response to the operation of an operating means such as a keyboard (not shown) to operate the pusher 107a. Activate to push out the lead frame L / F in the magazine M. Then, the control circuit 6 issues a command signal to the pulse generator 7 to generate a pulse signal synchronized with the clock signal in the control circuit 6. The pulse signal from the pulse generator 7 causes the drive circuit 8 to drive the pulse motor 24 to rotate the elevating shaft 3 forward (or reverse) as shown in FIG.
Lower by F arrangement pitch. When the push-out of all the lead frames L / F in the magazine M is completed, the magazine receiving portion 4 on which the magazine M is placed is lowered at a high speed to the position of the stocker recess 137a (shown in FIG. 9) of the stocker 137. Let me enter. And Magazine M is
The magazine M is placed on the loading surface 137b of the magazine M of the stocker 137, and the magazine discharge mechanism 8 (shown in FIG. 1)
To discharge the paper to the front surface of the stocker 137 (Y direction in FIGS. 1 and 9).

Next, with reference to FIG. 1 and FIG. 3, the machine difference correction of the positioning means 1 according to the present invention will be described.

First, as shown in FIG.
4 is rotated forward (or reversely), and the magazine receiver 4 is lowered in the Z direction until the origin position O is detected. When the magazine receiver 4 as a movable body reaches the origin position, the pulse motor 2 is rotated.
4 is stopped. The detection of the origin position is performed by a microswitch (not shown) provided in the stocker recess 137a (shown in FIG. 9) of the stocker 137.

Then, the guide rail 10 is moved from the origin position O.
4 and the distance h to the rail surface of the guide rail 105 (shown in FIGS. 9 to 11), that is, the transfer surface of the lead frame L / F, are previously stored in a memory as a storage unit in a control unit of the wire bonding apparatus. The data is set by a keyboard or the like as an external operation means, converted into digital data corresponding to the distance h, and stored. Therefore, after detecting the origin position O, the pulse motor 24 is rotated reversely (or forwardly) to raise the magazine receiver 4 to a distance h stored in the memory in advance. As shown in FIG. 2, a feedback signal from the encoder 2 is obtained by the pulse motor 24, so that the movement distance can be calculated by counting the feedback signal by a counter in the control circuit 2. .

However, as described above, since the origin position O is configured to be detected by the microswitch, an error (machine difference for each device) occurs in the origin position due to a mounting error of the microswitch or the like, so that the origin position O is set in advance. Distance h
May not coincide with the rail surfaces of the guide rail 104 and the guide rail 105.

Therefore, the machine difference correction shown in FIG. 3 is performed as follows.

First, let h be the distance from the origin position O to the rail surface (h is a preset value.
Let x be the distance from the mounting surface of the first-stage lead frame L / F of the magazine M whose dimensions are known to the bottom surface of the magazine M (h and x are preset in the memory).
Therefore, the distance a from the upper surface of the magazine receiving portion 4 to the origin position O is as follows: a = h−x (1)

Next, if a machine error occurs at the origin position O and the distance from the origin position O 'to the rail surface is h', the distance b from the upper surface of the magazine receiving portion 4 to the origin position O ' Is b = h'-x (2).

Therefore, from the equations (1) and (2), ba = Δl (3)

Machine difference correction is performed using the Δl as correction data. The operator easily sets and inputs the correction data Δl into the memory as the storage means of the wire bonding apparatus from a keyboard or the like as the operation means, or stores the correction data in an external storage medium such as a floppy disk. It is possible to perform machine difference correction.

Next, the regulating means 31 of the loader 101 will be described with reference to FIG.

The regulating means 31 regulates in a plane perpendicular to the moving direction in which the positioning means 1 moves the magazine M (horizontal direction shown in FIG. 4, in the plane of arrows XX, YY). Hereinafter, the regulating means 31 will be described. In addition,
The regulating means 31 is also provided with the positioning means 1 and the base 2.
2 and is fixed to the device mount 21.

As shown in FIG. 4, the regulating means 31 includes a fixed frame 32 fixed on the base 22 and a pair of reciprocatingly movable members in the direction indicated by arrows YY on the fixed frame 32. Movable frames 33 and 34 and a driving means 35 for moving each movable frame 33 and 34 respectively.
And 36.

A linear motion guide unit comprising track rails 37a, 38a and sliders 37b, 38b is interposed between the movable frames 33 and 34 and the fixed frame 32. The structure is movable in the Y direction.

Next, the driving means 35 of the regulating means 31
And the driving means 36 will be described.

As shown in FIG. 4, the driving means 35 is disposed so as to extend in the moving direction of the movable frame 33, that is, in the YY direction, and is attached and fixed to the fixed frame 32 via a bearing. It has a screw shaft 39, a pulse motor 40 for driving the screw shaft 39 to rotate, and a nut 45 screwed to the screw shaft 39 and fixed to the movable frame 33.

The one end of the screw shaft 39 and the output shaft 40a of the pulse motor 40 are provided with toothed belt wheels 46 and 4 respectively.
The toothed belt 48 is wound around both toothed belt wheels 46 and 47, and the driving force is transmitted from the pulse motor 40 to the screw shaft 39. An encoder 49 as a position detecting means is connected to one end of the screw shaft 39 via a coupling. The encoder 49 emits a pulse signal according to the rotation amount of the pulse motor 40.

On the other hand, the driving means 36 for driving the movable frame 34 has the same configuration as the driving means 35.

As shown in FIG. 4, the driving means 36 is provided so as to extend in the moving direction of the movable frame 34, and a screw shaft 51 fixed to the fixed frame 32 via a bearing, and A pulse motor 52 that rotationally drives the screw shaft 51;
4 and a nut 53 fixed to the nut 4.

Further, one end of the screw shaft 51 and the output shaft 52a of the pulse motor 52 are provided with toothed belt wheels 54 and 5 respectively.
The toothed belt 56 is wound around both toothed belt wheels 54 and 55, and the driving force from the pulse motor 52 is transmitted to the screw shaft 51. An encoder 57 as a position detecting means is connected to one end of the screw shaft 51 via a coupling.

A movable bracket 58 is provided on the movable frame 34 so as to be reciprocally movable in the directions of arrows XX. A linear guide unit including a track rail 59a and a slider 59b is interposed between the movable bracket 58 and the movable frame 34 to move the movable bracket 58. The movable bracket 58 includes:
The driving unit 60 is driven by applying a driving force.

As shown in FIG. 4, the driving means 60 is provided so as to extend in the direction of the arrow XX in which the movable bracket 58 is movable, and is attached and fixed to the movable frame 34 via a bearing 61. A screw shaft 62, a pulse motor 63 that rotationally drives the screw shaft 62, and a nut 64 screwed to the screw shaft 62 and fixed to the movable bracket 58.

One end of the screw shaft 62 and the pulse motor 63
The toothed belt wheels 65 and 66 are fitted on the output shaft 63a of each of the gear wheels.
And the driving force from the pulse motor 63 is
2 An encoder 68 as a position detecting means is connected to one end of the screw shaft 62 via a coupling.

As shown in FIG.
And 34 and the movable bracket 58 have long regulating members 71, 7 as a movable body for regulating the magazine M.
2 and 73 are mounted extending in the vertical direction (ZZ direction shown in FIG. 1). The restricting members 71 to 73 as these movable bodies are the movable frame 3 on which they are mounted, respectively.
3, 34 and the movable bracket 58 actuate to move closer to and away from each other.

As shown in FIG. 4, the pair of regulating members 71 as movable bodies are formed in a rectangular plate shape as a whole.
As shown in FIG. 1, the regulating member 71 has rollers 74 as a plurality of rotating members along the longitudinal direction.
Among these rollers 74, one corresponding to the lead frame transport level 75 is for urging the magazine M toward the other regulating members 72 and 73.

The other regulating members 72 and 73 are provided one by one, and each has an L-shaped cross section.

The magazine M is regulated in the width direction (Y-Y direction) by regulating surfaces 72a and 73a formed on each side of the regulating members 72 and 73 and the rectangular plate-shaped regulating member 71. .

The length of the magazine M is regulated by regulating surfaces 72b and 73b formed on the other sides of the regulating members 72 and 73.

Next, an adjusting operation when the magazine M is changed by changing the type of the lead frame L / F by the restricting means 31 will be described.

First, when a command signal is issued by the operation of the operation means (not shown), each pulse motor 40 shown in FIG.
The respective screw shafts 39, 51 and 62 are rotationally driven by reversely rotating the respective 52 and 63 to move the respective movable frames 33, 34 and the movable bracket 58, and separate the respective regulating members 71, 72 and 73 from each other. In the direction of the arrow to position each reference position. Each regulating member 71, 72 and 7
The reference position in the direction away from No. 3 is the first reference position.

The reference position of each of the regulating members 71, 72 and 73 in the mutually approaching direction is defined as a second reference position. In this second reference position, the distance between the respective regulating members 71, 72 and 73 is smaller than the outer diameter of the magazine M. Therefore, the control means controls each of the regulating members 71, 72 and 7
In a case where the magazine 3 starts moving in the direction approaching each other and reaches the second reference position, it is determined that the magazine M is not loaded.

When the pulse signals from the encoders 49, 57 and 68 are not obtained while the regulating members 71, 72 and 73 move from the first reference position to the second reference position, the magazine M It is determined that the regulation has been completed. That is, when there is no difference between the drive command signal from the control means and the feedback pulse from each of the encoders 49, 57 and 68, the regulation of the magazine M has not been completed. Therefore, it is determined that the regulation of the magazine M has been completed at that time.

When the respective regulating members 71, 72 and 73 are separated from each other and reach the first reference position, in this state, an empty space for accommodating a lead frame to be newly handled is interposed between the respective regulating members 71, 72 and 73. Are inserted from above in the state of being stacked vertically, for example, and are placed on the magazine receiving portion 4 provided in the positioning means 1.

Next, a control circuit 6 (FIG.
, The pulse motor 40 for driving the regulating member 71 located on one side in the width direction of the magazine M is rotated forward and the regulating member 71 is rotated.
Move toward the regulating members 72 and 73 on the other side. The magazine M is pressed by the regulating members 71 and both regulating members 72,
73, and are held in the width direction by the respective regulating members 71, 72 and 73. However, the regulating member 71 itself does not contact the magazine M, but the roller 74 shown in FIG. 1 is contacted, and the pulse motor 40 is stopped in a state where the pulse signal from the encoder 49 cannot be obtained. Thereby, the regulation in the YY direction shown in FIG. 4 is completed.

Next, by rotating the pulse motor 63 in the forward direction, the regulating member 73 located on one side in the longitudinal direction of the magazine M, that is, the XX direction is moved to the regulating member 72 located on the other side.
Move towards. The magazine M is pressed by the regulating member 73 and pressed against the regulating member 72, and
The pulse motor 63 is stopped in a state where it is held in the length direction by 2 and 73 and the pulse signal from the encoder 68 cannot be obtained. Thereby, the regulation in the XX direction shown in FIG. 4 is completed.

Next, by rotating the pulse motor 40 in the reverse direction and rotating the pulse motor 52 in the forward direction,
72 and 73 are synchronously moved in the width direction of the magazine M at the same resolution and the same speed, and the guide rails 104 and 105 shown in FIG.
The control is performed such that the center of the magazine M in the width direction coincides with the center of the route to which the / F is guided. When such adjustment is completed, the magazine M is moved to the respective regulating members 7.
In the state surrounded by 1, 72, and 73, it is movable in the up-down direction, and the positioning device 1 can move the magazine M up and down.

Next, regarding the machine difference correction of the regulating means 31 according to the present invention, first, as shown in FIG.
This is performed after performing the mechanical error correction of 05. That is, the bonding stage (heater plate) and the IC chip 102 mounted on the lead frame L / F guided by the guide rail 104 and the guide rail 105 as the movable body.
Positioning with respect to the center of 103 is performed, and then the machine difference correction of the regulating means 31 is performed.

As shown in FIG. 5, the guide rail 104 is moved in a direction away from the lead frame L / F by rotating the pulse motor 77 and the pulse motor 78 forward (or reverse).
Then, the guide rail 105 is moved to the operation start position as the origin, and is brought into contact with the microswitch 139 and the microswitch 140 to stop in a state where the switch is turned on. This position is the origin, that is, the operation start position, and is a value set in advance in a memory as storage means in the control circuit 6.

The center of the IC chip 102 mounted on the lead frame L / F is the center of the lead frame L / F as shown in FIG.
8 (see FIG. 10) is the distance x. Therefore, the distance h between the guide rail 104 and the guide rail 105 is h = 2 (x + a) as shown in FIG. This distance h and the length of the lead frame L / F,
The value such as the width is stored in a memory as a storage unit in the control circuit 6 in advance.

However, as shown in FIG. 5, when the operation start positions of the guide rails 104 and 105 completely coincide with the preset values, the guide rails 104 and 105 are actuated at the preset values. The center of the lead frame L / F can be positioned at the center of the bonding stage (heater plate) 103.

However, as shown in FIG. 5, when the microswitch 140 for detecting the operation start position of the guide rail 105 is displaced by the distance α as shown by a broken line due to an installation error or the like. The center of the IC chip 102 of the lead frame L / F is at the first reference position 1
Positioning is performed in a non-aligned state without matching with the reference numeral 28 (the lead frame L / F is shown by a broken line in FIG. 5).

Then, as shown in FIG. 5, for example, one guide rail 104 is operated from the operation start position so that the center of the IC chip 102 of the lead frame L / F coincides with the center of the bonding stage (heater plate) 103. And position it. The movement amount of the guide rail 104 can be measured by a drive signal of the pulse motor 77 and a feedback pulse from an encoder (not shown), similarly to the circuit shown in FIG. Therefore,
If the value is different from the value preset in the control circuit 6,
This shift amount is set in the control circuit 6.

Next, the other guide rail 105 is operated and moved until it comes into contact with the lead frame L / F.
The amount of movement of the guide rail 105 is the same as that of the guide rail 1.
It is configured to be able to measure similarly to 04. Therefore, as shown in FIG. 5, the guide rail 105 moves a distance of (a + α). Since the distance h between the guide rail 104 and the guide rail 105 and the width 2x of the lead frame L / F are preset values, the newly detected deviation amount α is determined by h′−h. Therefore, the deviation amount α is used as the data for correcting the machine difference, and the control circuit 6
As an internal storage means, it is stored in a storage medium such as a memory or an external floppy disk.

Further, as shown in FIG.
2 is located at the center of the lead frame L / F. For example, when the IC chip 102 is placed off the center of the lead frame L / F, the lead frame L / F
The shift amount from the center of F may be stored in advance in the memory in the control circuit 6 as information (data).

Next, referring to FIG. 6 and FIG.
The first machine difference correction will be described.

The machine difference correction of the regulating means 31 is performed using a magazine M whose dimensions of width d, length 1 and height are known.

As shown in FIG. 6, the distance L between one of the regulating members 72 (regulating surface 72a), which is a movable body, and the regulating member 73 (regulating surface 73a), and the other regulating member 71, which is a movable body, is , The width d of the magazine M is known, is set in advance so that L = d + 2a, and is stored in the memory in the control circuit 6. Therefore, since the distance L and the width d of the magazine M are known, Ld = 2a is also known.

Thus, the one regulating member 72 (regulating surface 7)
2a) When there is an error (machine difference) between the mounting position of the micro switch 79 for detecting the operation start position of the regulating member 73 (regulation surface 73a) and the micro switch 80 for detecting the operation start position of the other regulating member 71. Needs to correct the distance L to obtain L ′.

Therefore, the guide rail 104 shown in FIG.
Similarly, in the same way as the machine difference correction of the guide rail 105, the shift amount between one of the regulating members 72 and 73 and the other regulating member 71 is obtained.

However, even if the deviation amount β of the distance a from the operation start position as the origin to the width of the magazine M is obtained for the regulating means 31 as described above, the lead of the regulating means 31 in the magazine M is obtained. I of frame L / F
The center of the C chip 102 may not coincide with the center of the bonding stage (heater plate 103) (the IC chip 102 may be shifted (shifted) from the center of the lead frame L / F and mounted). Including). Therefore, it is necessary to match the center of the IC chip 102 with the center of the bonding stage (heater plate 103).

As shown in FIG. 7, the lead frame L / F accommodated in the magazine M is pushed into the pusher 107a (FIG. 9, FIG. 9).
In the state of being slightly pushed out to the guide rail 104 and the guide rail 105 side by using FIG. 10), the one regulating member 72 and the regulating member 73 and the other regulating member 71 are moved in the same direction, for example, the Y direction (or the Y direction) (In the opposite direction) in synchronization with the IC chip 10 of the lead frame L / F.
2 and bonding stage (heater plate 10
Perform alignment to match the center of 3).

After the above operation is completed, information (data) such as the deviation amount β after machine difference correction, the distance L ′ and the distance to the center of the bonding stage is stored in the control circuit 6 in the memory in the control circuit 6 or in an external device. It is stored in a storage medium such as a floppy disk.

Further, the machine difference correction of the side guide performed by using the regulating surface 73b of the regulating member 73 shown in FIG. 6 is similarly performed using the length l of the magazine M.

As shown in FIGS. 6 and 7, the drive control of the pulse motors 40, 52 and 63 for driving one of the regulating members 72 and 73 and the other regulating member 71 is as follows.
This is the same as the circuit shown in FIG.

Next, as shown in FIG. 10, the wire bonding apparatus according to the present invention comprises a plurality of sensors 131, 1
32, 135 are used. Note that the sensors 133 and 134 shown in FIG. 10 do not include the bonding apparatus according to the present invention. Then, the lead frame guided by the guide rails 104 and 105 is transferred (or intermittently fed) by a frame transfer means (not shown) and transferred to the center 117 of the bonding stage to perform a bonding operation. However,
A deviation may occur in the feed amount of the lead frame L / F set in advance due to an attachment error (machine difference) of the sensors 131 and 135 as detection means of the frame transfer means. Therefore, it is necessary to correct such a shift amount in this case as well.

As shown in FIG. 8, the lead frame L / F
Is known, and the distance S from the tip of the lead frame L / F to the center of the IC chip 102 is known, so that it is stored in advance in the memory in the control circuit 6 as information (data). .

Then, as shown in FIG.
First, the lead frame L / F sent out from the frame 7a is supplied to a sensor 131 as a detecting means of the frame transferring means.
Is detected by Then, it is transferred by a frame transfer means (not shown) (the configuration by the pulse motor and the encoder is the same as the circuit shown in FIG. 2) and detected by a sensor 135 as a detection means. When the sensor 135 detects the lead frame L / F, the lead frame L / F
And the center of the IC chip 102 is positioned at the center 117 of the bonding stage (heater plate) 103 to determine the distance Y from the sensor 135 to the lead frame L / F. The distance S from the tip of the lead frame L / F to the center of the IC chip 102
Since is known in advance, the amount of deviation of the preset value l can be calculated. This deviation amount is stored in a memory in the control circuit 6 or an external storage medium.

As described above, in the bonding apparatus according to the present invention, it is possible to easily calculate the amount of deviation of a preset value without using a jig.

The setting (input) of information (data) of the bonding apparatus according to the present invention is performed through external operation means or an external storage medium.

In this embodiment, the wire bonding apparatus has been described, but the present invention can be applied to other bonding apparatuses. Further, it may be appropriately changed and used within the scope of the present invention.

[0104]

As described above, the bonding apparatus according to the present invention can perform machine difference correction using a magazine or a frame whose dimensions and the like are known in advance even without a jig. In addition, even when the dimensions and the like of a magazine and a frame mounted on the apparatus are not known, the machine difference can be corrected using another magazine or a frame or the like whose dimensions and the like are known in advance, and the machine difference correction can be performed. Correction data can be calculated.

Further, the bonding apparatus according to the present invention
Since the correction data by the machine difference correction can be stored in a storage medium or the like, for example, when adjusting a plurality of bonding apparatuses such as in-line, it is possible to set using the correction data. Data can be shared, and machine difference correction can be easily performed. Therefore, it is possible to shorten the time when exchanging the product type and improve the production efficiency.

[Brief description of the drawings]

FIG. 1 is a side view including a partial cross section of a loader of a wire bonding apparatus according to the present invention.

FIG. 2 is a block diagram showing a driving circuit of a positioning unit according to the present invention.

FIG. 3 is a diagram illustrating an operation of correcting a machine difference of a positioning unit according to the present invention.

FIG. 4 is a plan view showing a configuration of a regulating means according to the present invention, including a partial cross section.

FIG. 5 is a diagram illustrating an operation of correcting a machine difference between guide rails according to the present invention.

FIG. 6 is a diagram illustrating an operation of correcting a machine difference of a regulating unit according to the present invention.

FIG. 7 is a diagram for explaining the operation of the restriction means according to the present invention for correcting a machine difference.

FIG. 8 is an explanatory diagram of an operation for calculating a shift amount by correcting a difference between a center of an IC chip and a sensor by using the bonding apparatus according to the present invention.

FIG. 9 is a perspective view of a conventional wire bonding apparatus.

FIG. 10 is a schematic plan view of FIG. 9 viewed from a plane.

11 is an operation explanatory view of a main part of the wire bonding apparatus shown in FIG. 10;

[Explanation of symbols]

 M Magazine L＼F Lead frame 1 Positioning means 2 Encoder 3 Elevating shaft 4 Magazine receiving unit 6 Control circuit 7 Pulse generator 8 Drive circuit 21 Device mount 22 Base 23 Bearing 24 Pulse motor 25 Nut 26 Output shaft 27, 28 Toothed belt Wheel 29 toothed belt 30 bracket 31 regulating means 32 fixed frame 33,34 movable frame 35,36,60 driving means 49,57,68 encoder 77,78 pulse motor 79,80 micro switch

Claims (5)

[Claims] 1. A positioning means for moving and positioning a magazine capable of accommodating a plurality of frames in a frame arrangement direction, a restricting means for restricting the magazine in a plane substantially perpendicular to the moving direction, and the positioning. Means for guiding the frame in the magazine regulated by the means and the regulating means, frame transporting means for transporting the frame along the guiding direction of the guiding means, and loading the frame transported by the frame transporting means. A bonding stage comprising: a stage for performing a bonding operation by placing the positioning unit, the regulating unit, the guide unit, the frame transfer unit, and the like, and a control unit having a storage unit. The control means previously stores known information such as dimensions of the magazine and the frame in a storage means. If there is a difference in the distance from the preset operation start position to the movable body, the difference is corrected using known information such as the dimensions of the magazine and the frame. Bonding equipment. 2. The positioning means has a microswitch as an origin for detecting an operation start position, and when there is a difference in a mounting position of the microswitch or the like, the positioning means is set in the control means. 2. The bonding apparatus according to claim 1, wherein a deviation from the value is calculated and stored in a storage unit or a storage medium as a correction value. 3. The regulating means has a plurality of regulating members, and has a microswitch as an origin for detecting each operation start position of the plurality of regulating members, and a mounting position of the microswitch. If there is a machine difference, etc.,
2. The bonding apparatus according to claim 1, wherein a shift amount from a value set in the control unit is calculated and stored as a correction value in the storage unit or a storage medium. 4. The guide means has a pair of guide rails, and has a micro switch as an origin for detecting each operation start position of each guide rail. 2. The bonding apparatus according to claim 1, wherein when there is a machine difference, the amount of deviation from a value set in the control means is calculated and stored as a correction value in a storage means or a storage medium. 5. The apparatus according to claim 1, wherein said frame transfer means includes a detection means comprising a sensor for detecting the arrival of the frame. 2. The method according to claim 1, wherein the correction is performed.
The bonding apparatus as described in the above.