JPH11340080A - Laminated microchip capacitor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laminated microchip capacitor which is suited to high-frequency application and can obtain a plurality of electrostatic capacitance thereby enables an easy constitution of necessary capacitance. SOLUTION: This laminated microchip capacitor 1 is provided with a plurality of inner electrodes laminated by means of a cermic layer and a plurality of capacitor units D to F formed by laminating a plurality of inner electrodes in a cermic sintered body 2. A plurality of first external electrodes 13 to 15 are formed on the upper surface of the cermic sintered body so that they are connected electrically with the inner electrode connecting with one potential of the capacitor units D to F, and a second external electrode 16 is formed on the entire surface of lower surface 16, thereby forming three laminated capacitor units along the direction of the laminated inner electrodes.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer microchip capacitor formed by using a ceramic sintered body, and more particularly, to a multilayer microchip capacitor suitable for mounting in an IC package or an optical communication device.

[0002]

2. Description of the Related Art In order to obtain a capacitance in a high-frequency device for optical communication or an IC package using a GaAs semiconductor, for example, a very small multilayer microchip capacitor having a maximum dimension of 1 mm or less is used. .

FIGS. 7A and 7B show an example of a conventional multilayer microchip capacitor. The multilayer microchip capacitor 51 is configured using a ceramic sintered body 52 on a rectangular parallelepiped. In this laminated microchip capacitor 51, an external electrode 53 is formed on an upper surface 52a of a ceramic sintered body 52, and an external electrode 54 is formed on the entire lower surface 52b.

On the other hand, as shown in a schematic perspective view in FIG. 8, a ceramic sintered body 52 is obtained by laminating a plurality of ceramic green sheets 55 and integrally firing them. A conductive paste 56 or a conductive paste 57 is printed on the plurality of ceramic green sheets 55 to form internal electrodes. The conductive paste 56 is drawn out to the upper edge of the ceramic green sheet 55 in FIG. 8, and the conductive paste 57 is drawn out to the lower edge of the ceramic green sheet 55.

Accordingly, the ceramic green sheets 55 on which the conductive pastes 56 and 57 are printed are laminated, and an appropriate number of plain ceramic green sheets are laminated and fired to obtain a ceramic sintered sheet shown in FIG. A body 52 has been obtained. In the ceramic sintered body 52, the internal electrode 58 drawn out to the upper surface 52a and the internal electrode (not shown) drawn out to the lower surface 52b of the ceramic sintered body 52 are ceramic sintered along the arrow A direction. It is arranged so that it may overlap via a body layer.

The above laminated microchip capacitor 51
Are mounted on a substrate from the external electrode 54 side in an IC package using a GaAs semiconductor, for example. The external electrode 53 formed on the upper surface 52a of the ceramic sintered body 52 is electrically connected to the outside by a bonding wire (not shown).

[0007]

As described above, very small laminated microchip capacitors 51 are used in electronic devices or components used for high-frequency applications such as optical communication devices and the above-mentioned IC packages.
When mounting the laminated microchip capacitor 51, the laminated microchip capacitor 51 having a capacitance according to a design value is used.

However, in the above-described high-frequency device, the capacitance required as a capacitor differs depending on the mounting form, and the circuit does not operate well only by forming a capacitor having the capacitance as designed. There is. In such a case, the laminated microchip capacitors 51 having different capacitances had to be prepared. Alternatively, a plurality of laminated microchip capacitors 5
1 needed to be implemented. Therefore, the manufacturing process was very complicated.

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned drawbacks of the conventional multilayer microchip capacitor for a high-frequency device, to easily form a plurality of types of capacitances, and to attain the required capacitance. It is an object of the present invention to provide a multilayer microchip capacitor which can be easily configured.

[0010]

According to a first aspect of the present invention, there is provided a multilayer microchip capacitor comprising: a ceramic sintered body having an upper surface and a lower surface; and a lower surface of the ceramic sintered body in the ceramic sintered body. And a plurality of internal electrodes arranged so as to overlap with each other via a ceramic layer along a direction parallel to the plurality of internal electrodes. A plurality of first external electrodes exposed on the upper or lower surface of the body and formed on the upper surface of the ceramic sintered body, and at least one second external electrode formed on the lower surface of the ceramic sintered body; And a plurality of types of capacitance can be extracted between the plurality of first external electrodes and the second external electrode.

[0011] As described in claim 2, a plurality of the second external electrodes may be formed on the lower surface of the sintered body. Further, in the invention according to claim 3, at least two or more internal electrodes are divided internal electrodes divided in a direction orthogonal to the internal electrode laminating direction and the upper and lower surface directions of the ceramic sintered body. In a portion where the mold internal electrodes are stacked, a plurality of first external electrodes divided in a direction perpendicular to the internal electrode stacking direction and the upper and lower surfaces of the ceramic sintered body are formed on the upper surface of the sintered body. I have.

According to a third aspect of the present invention, as described in the fourth aspect, in the portion where the split-type internal electrodes are stacked, the internal electrode stacking direction and the sintered body are arranged on the lower surface of the sintered body. A plurality of second external electrodes divided in a direction orthogonal to the upper and lower surface directions are formed.

According to the fifth aspect of the present invention, a bump electrode is formed on each of the plurality of first external electrodes.
In the invention according to claim 6, the lower end is connected to the second external electrode on the lower surface of the ceramic sintered body, and is formed in the ceramic sintered body such that the upper end reaches the upper surface of the ceramic sintered body. And a third external electrode formed on the upper surface of the ceramic sintered body so as to be connected to the upper end of the connection electrode.

In the invention described in claim 6, as in claim 7, a bump electrode may be formed on each of the first external electrode and the third external electrode.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in more detail by describing specific embodiments of the present invention with reference to the drawings.

FIGS. 1A and 1B are views for explaining a multilayer microchip capacitor according to a first embodiment of the present invention. FIG. 1A shows a sintered body excluding external electrodes. (B) is a perspective view showing the appearance of the multilayer microchip capacitor.

The multilayer microchip capacitor 1 is formed using a ceramic sintered body 2 on a rectangular parallelepiped. Examples of the ceramic material constituting the ceramic sintered body 2 include:
For example, an appropriate dielectric ceramic such as a barium titanate-based ceramic can be used.

In the ceramic sintered body 2, a plurality of internal electrodes are arranged so as to overlap with each other via a ceramic layer. The structure of the ceramic sintered body 2 will be clarified by describing a manufacturing method with reference to FIG.

In obtaining the ceramic sintered body 2,
As shown in a schematic exploded perspective view of FIG. 2, a plurality of rectangular ceramic green sheets 3 to 7 are prepared. Each of the ceramic green sheets 4 to 7 has an internal electrode 8 or an internal electrode 9 formed by screen-printing a conductive paste. As the conductive paste,
A conductive paste mainly composed of an appropriate metal such as Ag-pd can be used. The formation of the internal electrodes 8 and 9 is not limited to the conductive paste printing method, and may be performed by other known means. Similarly, in the following examples, the internal electrodes can be formed by any known method.

The internal electrode 8 is formed such that a part of its edge reaches the upper edge of the ceramic green sheets 4 and 6 in FIG. The internal electrode 9 is formed such that a part of its edge reaches the lower edge of the ceramic green sheets 5 and 7.

No conductive paste is printed on the ceramic green sheet 3, so that the ceramic green sheet 3 is a plain ceramic green sheet.

The ceramic green sheet 4 shown in FIG.
In the laminate obtained by laminating Nos. To 7, internal electrodes 8 and 9 are configured to be alternately exposed on the upper surface or the lower surface of the laminate.

In obtaining the ceramic sintered body 2,
An appropriate number of the above-described ceramic green sheets 4 to 7 are laminated, and a laminate obtained by laminating an appropriate number of plain ceramic green sheets such as the ceramic green sheets 3 is fired.

Thus, the ceramic sintered body 2 shown in FIG. 1 is obtained. In the ceramic sintered body 2, the above-described internal electrode 8 is drawn out to the upper surface 2 a of the ceramic sintered body 2. The other internal electrode 9 is not shown. Therefore, the plurality of internal electrodes 8 and 9 are stacked in a direction parallel to the lower surface serving as a mounting surface of the ceramic sintered body 2, and each of the internal electrodes 8 and 9 is extended in a direction orthogonal to the mounting surface. Will be.

In the ceramic sintered body 2, the internal electrodes 8 extending to the upper surface 2a of the ceramic sintered body 2 and the internal electrodes 9 extending to the lower surface 2b are alternately laminated. Three capacitor units are formed in the direction of arrow A. The direction of arrow A corresponds to the direction in which the internal electrodes 8 and 9 are stacked.

The first to third multilayer capacitor units BD are configured as described above. Regions E and F where no internal electrodes are laminated are formed between the multilayer capacitor units BD. The regions E and F where the internal electrodes are not formed may be formed by laminating an appropriate number of plain ceramic green sheets 3.

As shown in FIG. 1B, on the upper surface 2a of the ceramic sintered body 2, a plurality of first external electrodes 13 to 1 are provided.
5 are formed. The external electrodes 13 to 15 are respectively connected to the internal electrodes 8 in the multilayer capacitor units BD.
It is connected to the. The lower surface 2 of the ceramic sintered body 2
On the surface b, a second external electrode 16 is formed so as to be connected to the internal electrode 9 over the entire surface. External electrodes 13-16
Is formed, for example, by applying and baking a conductive paste such as an Au paste, but may be formed by another conductive film forming method such as vapor deposition, sputtering, or plating.

In the multilayer microchip capacitor 1, the first to third multilayer capacitor units BD are formed by the first external electrodes 13 to 15 and the second external electrode 16, respectively. . Therefore, since the first to third capacitor units B to D that are electrically independent can be formed, various capacitances can be taken out by making the capacitance of each multilayer capacitor unit appear. . However, the capacitances obtained by the first to third multilayer capacitor units BD may all be the same.

When the multilayer microchip capacitor 1 is used, the first to third multilayer capacitor units B to
D may be used, any two of the multilayer capacitor units may be electrically connected so as to be connected in parallel, or all of the three multilayer capacitor units may be used. . That is, since three multilayer capacitor units are configured, various sizes of capacitance can be obtained by changing the connection method of the first external electrodes 13 to 15.

In the multilayer microchip capacitor 1 of this embodiment, the lower surface, that is, the surface on which the external electrodes 16 are formed is the surface to be mounted on the substrate. Therefore, the second external electrode 16 is electrically connected to the electrode land of the substrate. On the other hand, the first internal electrodes 13 to 15 can be electrically connected to the outside by, for example, bonding wires. Therefore, various capacitances can be obtained by changing the connection mode by the bonding wires.

Although not specifically shown, like the first external electrodes 13 to 15, independent second external electrodes are provided on the lower surface 2 b of the ceramic sintered body 2 in accordance with the capacitor units BD. May be formed. That is, three second external electrodes may be formed on the lower surface 2b of the ceramic sintered body 2.

FIGS. 3A and 3B are perspective views showing a ceramic sintered body used for a multilayer microchip capacitor according to a second embodiment of the present invention and the appearance of the multilayer microchip capacitor.

In the multilayer microchip capacitor 21 of the second embodiment, a rectangular parallelepiped ceramic sintered body 22 is used. In the ceramic sintered body 22, a plurality of internal electrodes are arranged so as to overlap with a ceramic layer interposed therebetween. This structure will be described with reference to FIGS.

In the ceramic sintered body 22, a plurality of multilayer capacitor units G to K are formed. Of these, in the portion where the multilayer capacitor unit G is configured, the internal electrodes are stacked in the same manner as in the first embodiment. In other words, the internal electrodes 8 extending to the upper surface 22a and the internal electrodes (not shown) extending to the lower surface 22b are alternately laminated to form a multilayer capacitor unit G.

On the other hand, the multilayer capacitor units HK are:
It is configured using a split type internal electrode. Here, the split-type internal electrode refers to an internal electrode obtained by dividing the internal electrode corresponding to the internal electrode 8 in the direction of arrow B, that is, in the direction orthogonal to the internal electrode drawing direction.

Accordingly, the multilayer capacitor unit H and the multilayer capacitor unit I are arranged along the arrow B direction. Similarly, both the multilayer capacitor unit J and the multilayer capacitor unit K are arranged along the arrow B direction.

Among them, the multilayer capacitor units H and I
The process of manufacturing the part having the structure will be described with reference to FIG. As shown in FIG. 4, a plurality of ceramic green sheets 23a to 23h are prepared. Among them, the conductive paste is not printed on the ceramic green sheets 23a and 23b, and therefore, the ceramic green sheets 23a and 23b are plain ceramic green sheets.

Ceramic green sheets 23c, 23
e and 23g, the split type internal electrodes 24 and 25, respectively.
Are formed at intervals in the direction of arrow B. In FIG. 4, the split internal electrodes 24 and 25 are extended to the upper edges of the ceramic green sheets 23c, 23e and 23g. On the other hand, ceramic green sheets 23d, 23f,
An internal electrode 26 is formed on one surface of 23h. The internal electrodes 26 are made of ceramic green sheets 23d, 23
f, 23h.

The above ceramic green sheets 23a-2
4 are laminated as shown in FIG. 4, and the obtained laminated body is pressed and then fired, whereby the multilayer capacitor unit portions H and I are formed.

The remaining multilayer capacitor units J and K have the same configuration. The above multilayer capacitor unit G ~
To take out the capacitance from K, first external electrodes 27 to 31 are formed on the upper surface 22a of the ceramic sintered body 22. The lower surface 2 of the ceramic sintered body 22
A second external electrode 32 is formed on the entire surface of 2b. The external electrodes 27 are provided to extract the capacitance of the multilayer capacitor unit G. External electrode 28,
29 are separated in the direction of arrow B. Similarly, the external electrodes 30, 31 are also separated in the direction of arrow B. The external electrodes 28 to 31 are formed to take out the capacitance in the multilayer capacitor units H to K, respectively.

Therefore, in the multilayer microchip capacitor 1 of this embodiment, the plurality of first external electrodes 27 to 31 are provided.
And the second external electrode 32, various capacitances can be obtained.

Also in this embodiment, by changing the number of laminated internal electrodes and the area of the internal electrodes in each of the multilayer capacitor units G to K, each multilayer capacitor unit G
To K can be made different from each other, and all the multilayer capacitor units G to K
May be the same.

In any case, various capacitances can be obtained by changing the connection mode of the first external electrodes 27 to 31. In this embodiment, the second
The external electrodes 22b serve as mounting surfaces when mounted on the substrate. Therefore, when the first external electrodes 27 to 31 are joined by, for example, a bonding wire, various capacitances can be obtained as described above by changing the connection mode by the bonding wire.

In this embodiment, the second external electrode 32
Is formed on the entire lower surface 22b of the ceramic sintered body 22, but a plurality of second external electrodes may be formed on the lower surface. That is, for example, a plurality of second external electrodes may be formed on the lower surface 22b so as to correspond to the first external electrodes 27 to 31 formed on the upper surface 22a,
Alternatively, a plurality of second external electrodes may be formed on the lower surface 22b in a manner different from the upper surface 22a.

FIGS. 5A to 5C are views for explaining a multilayer microchip capacitor according to a third embodiment of the present invention. FIG. 5A is a perspective view showing the appearance of a ceramic sintered body. FIG. 1B is a vertical cross-sectional view of the multilayer microchip capacitor, and FIG.

In the multilayer microchip capacitor 41,
A rectangular parallelepiped ceramic sintered body 42 is used. The ceramic sintered body 42 has substantially the same configuration as the ceramic sintered body 2 used in the first embodiment, except that a connection electrode described later is provided. Therefore, the same parts are given the same reference numbers,
The description is omitted.

In the ceramic sintered body 42, a plurality of internal electrodes are stacked so as to overlap with each other via a ceramic layer along the direction of arrow A, thereby forming three multilayer capacitor unit portions BD. ing. In each of the multilayer capacitor units B to D, an internal electrode 8 led to the upper surface 42a of the ceramic sintered body 42;
The internal electrodes 9 extending to the lower surface 42b are alternately stacked.

Further, in the sintered body 42, an upper surface 42a and a lower surface 42b are provided near one end surface 42c of the sintered body 42.
And the connection electrode 43 is formed. FIG. 6 shows a ceramic green sheet and an internal electrode shape for obtaining a portion where the connection electrode 43 and the first capacitor unit B are formed.

As shown in FIG. 6, a plurality of ceramic green sheets 44a to 44i are used. The ceramic green sheets 44a, 44b, 44d, 44e are plain ceramic green sheets. The connection electrode 43 is formed on one surface of the ceramic green sheet 44c by subjecting the same conductive paste as the internal electrode to compound printing. In this case, the connection electrode 43 is formed so as to extend from the upper edge to the lower edge of the ceramic green sheet 44c.

On the other hand, the ceramic green sheets 44f-
At 44i, the internal electrodes 8 and the internal electrodes 9 are printed alternately as in the case of the first embodiment. The above-mentioned ceramic green sheets 44a to 44i are laminated, and further, the ceramic green sheets and internal electrodes for constituting the second and third multilayer capacitor units are laminated, and a laminate is obtained by pressing in the laminating direction. By firing the thus obtained laminate, a ceramic sintered body 42 can be obtained.

Returning to FIG. 5C, the ceramic sintered body 42
The plurality of first external electrodes 45 to 47
And a third external electrode 48. The first external electrodes 45 to 47 are provided to extract the capacitance of the multilayer capacitor units B to D, respectively. That is, the first external electrodes 45 to 47
Correspond to the first external electrodes 13 to 15 in the embodiment.

In this embodiment, a third external electrode 48 is formed so as to be electrically connected to the upper end of the connection electrode 43. On the other hand, the lower surface 42b of the ceramic sintered body 42
On the entire surface, a second external electrode 49 is formed.
Therefore, the second external electrode 49 is connected to the third electrode by the connection electrode 43.
Are externally connected to the external electrodes 48.

Therefore, in the multilayer capacitor 41 of the present embodiment, when the second external electrode 49 is mounted on the substrate, the first external electrodes 45 to 47 and the third external electrode 48 are used to form, for example, a bonding wire. Can be connected to the outside. That is, since the second external electrode 49 is electrically connected to the third external electrode 48, all the electrical connections can be made on the upper surface 42 a side of the ceramic sintered body 42.

More preferably, as shown in FIG. 5C, the first external electrodes 45 to 47 and the third external electrodes 48
An appropriate metal spherical bump electrode 50 is formed thereon. If the bump electrode 50 is formed, the multilayer microchip capacitor 41 can be easily mounted on a substrate by a face-down bonding method with the upper surface side as a mounting surface. Conversely, other components, substrates, and the like can be placed on the upper surface side of the multilayer microchip capacitor 41.

That is, when the multilayer microchip capacitor 41 is mounted on the substrate, the bump electrodes 50 are arranged so as to be in contact with the electrode lands on the substrate. And can be easily surface mounted.

[0056]

According to the multilayer microchip capacitor according to the first aspect of the present invention, a plurality of internal electrodes are laminated via a ceramic layer along a direction parallel to the lower surface of the ceramic sintered body. An internal electrode is extended to the upper or lower surface of the ceramic sintered body, and a plurality of first external electrodes formed on the upper surface of the ceramic sintered body and a second external electrode formed on the lower surface are interposed. Thus, a plurality of independent multilayer capacitor units are configured. Therefore, when the first external electrode is connected to the outside, various capacitances can be obtained by changing the connection mode.

Therefore, for example, when used as a high-frequency laminated microchip capacitor mounted in an optical communication device or an IC package, the capacitance of the first external electrode is changed by changing the connection mode of the first external electrode. It can be easily adjusted. In other words, when the design value is different from the actually required capacitance, the capacitance of the multilayer microchip capacitor can be easily brought close to the required capacitance.

Therefore, a multilayer microchip capacitor suitable for high frequency applications can be provided, and the manufacturing process of high frequency devices can be simplified. In the multilayer microchip capacitor according to the first aspect of the present invention, a plurality of independent multilayer capacitor units are configured between the plurality of first external electrodes and the second external electrodes. Therefore, a portion requiring a plurality of multilayer capacitors in the past can be configured by using a smaller number of multilayer microchip capacitors, thereby increasing the mounting density and simplifying the electrical connection work. Can be.

In the multilayer microchip capacitor according to the second aspect of the present invention, since a plurality of second external electrodes are formed on the lower surface of the sintered body, more various capacitances can be taken out.

According to the third aspect of the present invention, since the split type internal electrode is divided in the direction perpendicular to the lamination direction of the internal electrodes and the upper and lower surfaces of the ceramic sintered body, the internal electrode laminating direction and the ceramic A plurality of multilayer capacitor units can be formed along the above-mentioned direction orthogonal to the upper and lower surfaces of the body. Therefore, since a larger number of multilayer capacitor units can be configured, a wide variety of capacitances can be obtained.

According to the fourth aspect of the present invention, in the multilayer microchip capacitor having the split-type internal electrodes, a plurality of second external electrodes are formed on the lower surface of the ceramic sintered body. Capacitance can be taken out.

According to the fifth aspect of the present invention, since the plurality of first external electrode bump electrodes are formed, the multilayer microchip capacitor is mounted on the substrate by face-down bonding from the side where the bump electrodes are formed. Can be easily implemented. In addition, since the bump connection is used, the electrical characteristics hardly deteriorate due to the length of the electrical connection portion, so that a multilayer microchip capacitor suitable for high frequency applications can be provided.

In the invention according to claim 6, the lower surface of the ceramic sintered body is connected to the second external electrode,
Since the connection electrode connected to the third external electrode is provided on the upper surface of the ceramic sintered body, the plurality of first external electrodes and the third external electrode arranged on the upper surface of the ceramic sintered body are provided. Are electrical connection parts with the outside. That is, it is not necessary to electrically connect the second external electrode formed on the lower surface of the ceramic sintered body to the outside.

Therefore, for example, when the lower surface of the ceramic sintered body is used as a mounting surface for mounting on a ceramic substrate,
After the mounting, electrical connection can be made by appropriately connecting bonding wires to the plurality of first external electrodes and the third external electrodes on the upper surface of the ceramic sintered body. That is, all electrical connection operations can be performed using a single electrical connection means such as a bonding wire and only on the upper surface of the ceramic sintered body. Therefore, the manufacturing process can be simplified.

In the invention according to claim 7, since the bump electrodes are formed on the plurality of first external electrodes and the third external electrodes, the face-down bonding method is used from the side where the bump electrodes are formed. Thus, the multilayer microchip capacitor can be easily mounted on the substrate. Moreover, since the bump connection is used, the electrical characteristics hardly deteriorate due to the length of the electrical connection portion, so that a multilayer microchip capacitor suitable for high frequency applications can be provided.

[Brief description of the drawings]

FIG. 1A is a perspective view showing a ceramic sintered body used in a first embodiment of the present invention, and FIG. 1B is a perspective view showing a multilayer microchip capacitor according to the first embodiment.

FIG. 2 is an exploded perspective view for explaining a ceramic green sheet used for manufacturing a ceramic sintered body and a shape of an internal electrode formed on a surface of the ceramic green sheet in the first embodiment.

FIG. 3A is a perspective view showing a ceramic sintered body used in a first embodiment of the present invention, and FIG. 3B is a perspective view showing a multilayer microchip capacitor according to the first embodiment.

FIG. 4 is an exploded perspective view for explaining a ceramic green sheet used for manufacturing a ceramic sintered body and a shape of an internal electrode formed on a surface of the ceramic green sheet in the second embodiment.

5A is a perspective view showing a ceramic sintered body used in a third embodiment, FIG. 5B is a longitudinal sectional view of the ceramic sintered body, and FIG. FIG. 2 is a perspective view showing the appearance of the multilayer microchip capacitor.

FIG. 6 is an exploded perspective view for explaining a ceramic green sheet used for manufacturing a ceramic sintered body and a shape of an internal electrode formed on a surface of the ceramic green sheet in the third embodiment.

FIG. 7A is a perspective view showing a ceramic sintered body used for a conventional multilayer microchip capacitor;
(B) is a perspective view showing the appearance of a conventional multilayer microchip capacitor.

FIG. 8 is a schematic exploded perspective view illustrating a ceramic green sheet used to obtain a conventional multilayer microchip capacitor and the shape of an internal electrode formed on one surface thereof.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Multilayer microchip capacitor 2 ... Ceramic sintered body 2a ... Upper surface 2b ... Lower surface 12 ... Internal electrode 13-15 ... 1st external electrode 16 ... 2nd external electrode BD ... Multilayer capacitor unit 8-11 ... Conduction Paste 21 ... Laminated microchip capacitor 22 ... Sintered body 22a ... Top surface 22b ... Bottom surface 24,25 ... Split type internal electrode 26 ... Internal electrode 27-31 ... First external electrode 32 ... Second external electrode 41 ... Laminated micro Chip capacitor 42 Ceramic sintered body 42a Upper surface 42b Lower surface 43 Connection electrodes 46 to 48 First external electrode 45 Second external electrode 49 Third external electrode 50 Bump electrode

Claims (7)

[Claims] 1. A ceramic sintered body having an upper surface and a lower surface, and a plurality of ceramic sintered bodies arranged in the ceramic sintered body so as to overlap with each other via a ceramic layer along a direction parallel to the lower surface of the ceramic sintered body. In order to take out the capacitance, a part of the edge of the plurality of internal electrodes is exposed on the upper surface or the lower surface of the ceramic sintered body, and on the upper surface of the ceramic sintered body. A plurality of first external electrodes formed, and at least one second external electrode formed on a lower surface of the ceramic sintered body; a plurality of first external electrodes; a second external electrode; A multilayer microchip capacitor characterized in that it is possible to take out a plurality of types of capacitance between the capacitors. 2. The multilayer microchip capacitor according to claim 1, wherein a plurality of the second external electrodes are formed. 3. At least two or more internal electrodes are divided internal electrodes divided in a direction perpendicular to the internal electrode laminating direction and the upper and lower surfaces of the ceramic sintered body. A plurality of first external electrodes divided in a direction orthogonal to the internal electrode laminating direction and the upper and lower surface directions of the ceramic sintered body are formed on the upper surface of the sintered body in the portion where 3. The multilayer microchip capacitor according to item 2. 4. In a portion where the split-type internal electrodes are formed, a plurality of second portions divided on a lower surface of the sintered body in a direction orthogonal to an internal electrode laminating direction and upper and lower surfaces of the sintered body. The multilayer microchip capacitor according to claim 3, wherein an external electrode is formed. 5. The multilayer microchip capacitor according to claim 1, further comprising a bump electrode formed on the plurality of first external electrodes. 6. A connection electrode formed in a ceramic sintered body such that a lower end is connected to a second external electrode on a lower surface of the ceramic sintered body and an upper end reaches an upper surface of the ceramic sintered body. The multilayer microchip capacitor according to claim 1, further comprising a third external electrode formed on an upper surface of the ceramic sintered body so as to be connected to an upper end of the connection electrode. 7. A bump electrode is formed on each of the first external electrode and the third external electrode.
3. The multilayer microchip capacitor according to item 1.