JPH11335693A - Granular fungus-removing agent composition - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain the subject composition hardly causing a choked state by powder when preparing the composition, hardly emitting irritating odor, and suitable for removing fungi themselves by allowing the fungus-removing agent composition comprising a peroxy compound and a surfactant to have a specific bulk density and the content of a fine powder component regulated so as not to be larger than a specified value. SOLUTION: This fungus-removing agent composition comprising (A) a peroxy compound (suitably sodium percarbonate or the like) and (B) a surfactant (e.g. an alkyl sulfate salt) has 0.4-1.0 g/cc, preferably 0.6-0.8 g/cc bulk density and includes <=30 wt.%, preferably <=10 wt.% fine powder component passing through a 250 μm sieve. Preferably, 30-80 wt.% component A and 10-40 wt.% component B are included in the composition. A metal complex and/or a poly acid and an alkaline material are preferably compounded therewith because the removing ability of the fungi is improved thereby. The granulation of each components is preferable because the fine powder component passing through the sieve is further reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION The present invention relates to an oxygen-based mold suitable for mold removal which does not generate flaking when preparing a mold remover, does not generate harmful gas when used, and has no irritating odor. The present invention relates to an absorbent composition.

[0002]

2. Description of the Related Art Bathrooms, bathtubs, toilets around houses,
Stain, such as sinks, especially where water is used frequently, is often due to organic or insoluble inorganic substances caused by mold,
Since ordinary detergents containing surfactants as the main component cannot be easily removed, to remove these stains, use a chlorine- or oxygen-based bleaching agent as the main component, and bleach it. A method has been adopted in which the effect makes the color of the mold inconspicuous.

[0003] However, those containing a chlorine bleach such as sodium hypochlorite as a main component are excellent in the bleaching power of mold dye and the performance of removing mold, but have a great risk of damaging eyes and skin. In addition, when using a chlorine odor strongly, it is necessary to pay attention to sufficient ventilation, and there is a drawback that harmful chlorine gas is generated when used in combination with an acidic cleaning agent by mistake.

[0004] On the other hand, those containing an oxygen-based bleaching agent represented by hydrogen peroxide as a main component do not have a drawback of generating chlorine gas, but can provide a sufficient bleaching effect of a mold dye by themselves. Therefore, various bleach activators had to be used in combination (for example, see JP-A-2-225).
No. 600, JP-A-2-196896, JP-A-62-4
No. 794).

However, even if these organic peracid bleach activators are used in combination, the bleaching effect on mold dyes is only slightly improved, and the removal of mold by itself is still insufficient. There is a drawback that dirt easily adheres.

Further, when an oxygen-based mold removing agent having a strong oxidizing action is stored in a state of being dissolved in an internal solution, there is a disadvantage that the activity is lost with time and the mold removing effect is reduced. The method of dissolving the fungicide powder in water is used each time, but when it is put into a container or the like, there is a problem that if the amount of the fine powder is large, powder dust may be generated or coughing may occur.

[0007]

SUMMARY OF THE INVENTION Accordingly, the present invention has been made in view of the above-mentioned circumstances of the prior art, and does not cause flaking at the time of preparing a fungicide, and has no irritating odor. It is an object of the present invention to provide a powdery and granular fungicide composition suitable for removing odor.

[0008]

DISCLOSURE OF THE INVENTION The present inventors have developed a powdery and granular fungicide composition which exhibits a strong mold removing power, does not cause flaking during preparation of the fungicide, and has no pungent odor. For this reason, as a result of intensive studies, the fungicide composition comprising the peroxy compound and the surfactant has a specific bulk density, and the fine powder passing through a sieve having an opening of 250 μm is a specified amount or less. It has been found that the above object can be achieved by using the powdery and granular mold removing agent composition, and the present invention has been completed based on this finding.

That is, according to the present invention, at least (A)
The mold removing composition comprising a peroxy compound and a surfactant (B) has a bulk density of 0.4 to 1.0 g / cc.
Wherein the fine powder passing through a sieve having an opening of 250 μm is not more than 30% by weight.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail. In the present invention, the peroxy compound used as the component (A) includes a hydrogen peroxide releasing compound, a hydrogen peroxide generation system, a peroxy acid and a salt thereof, a peroxy acid precursor system, and a mixture thereof.

The hydrogen peroxide sources include peroxides of alkali metals, organic peroxides such as urea peroxide, and inorganic peroxides such as alkali metal perborates, percarbonates, perphosphates and the like. Persulfates. Two or more of these compounds may be mixed. Of these, particularly preferred are sodium percarbonate, sodium perborate and potassium persulfate.

These compounds may be used alone or in combination with a peroxyacid precursor. These peroxyacid precursors include those that are used with hydrogen peroxide releasing compounds and generate organic peracids in the bath. Specifically, esters such as acyl phenol sulfonate, acyl alkyl phenol sulfonate, acyl phenol carboxylate, acylated citrate, acyl alkyl phenol carboxylate, ester of aromatic divalent carboxylic acid and alcohol having quaternized amine, etc. , Sodium-4-benzoyloxybenzenesulfonate, sodium-1-methyl-2
-Benzoyloxybenzene-4-sulfonate, sodium nonanoyloxybenzenecarboxylate, sodium decanoyloxybenzenecarboxylate,
Acetyltriethyl citrate, 2- (4-methoxycarbonylbenzoyloxy) -N, N, N-trimethylethanaminium methosulfate and the like can be mentioned.

The acylamides include N, N,
N ′, N′-tetraacetylethylenediamine, and quaternary ammonium-substituted peroxyacid precursors include:
N, N, N, -trimethylammonium toluyloxybenzenesulfonate, 2- (N, N, N-trimethylammonium) ethyl-4-sulfophenyl carbonate and the like can be mentioned.

The content of these peroxy compounds is not particularly limited, but is preferably 20 to 9% in the powdery and mildew removing composition.
0% by weight, preferably 30 to 80% by weight. If the amount is less than 20% by weight, a sufficient mold removing effect cannot be obtained, while if it exceeds 90% by weight, no improvement in the effect can be expected.

In the present invention, as the surfactant used as the component (B), a commonly used surfactant can be used. Such surfactants include, for example, alkyl sulfates, alkyl benzene sulfonates,
Anionic surfactants such as polyoxyethylene alkyl ether sulfate, polyoxyethylene alkyl phenyl ether sulfate, α-sulfo fatty acid alcohol ester salt and sulfosuccinic acid monoester salt, polyoxyethylene alkyl ether, sorbitan fatty acid ester, alkyl Glycosides, alkyl glycoside fatty acid esters,
And other cationic surfactants such as long-chain mono-, dialkyl-quaternary ammonium salts and amine oxides, and amphoteric surfactants such as carboxybetaine and sulfobetaine.

These surfactants may be used alone or in combination of two or more. Although the content of these surfactants is not particularly limited, they are blended so as to contain 5 to 50% by weight, preferably 10 to 40% by weight in the powdery and granular fungicide composition. If the amount is less than 5% by weight, a sufficient effect of removing mold due to the adhesion retention property cannot be obtained, while if it exceeds 50% by weight, no improvement in the effect can be expected.

In the present invention, the above-mentioned peroxy compound and surfactant are essential components, but when a metal complex and / or a polyacid and an alkaline substance are further blended,
It is preferable because the ability to remove mold is improved. Examples of the metal complex used in this case include a complex in which a ligand is bound around a central metal. Specifically, pyridine, bidentate ligands such as ethylenediamine, terpyridine,
Examples thereof include those in which a ligand such as a tridentate or higher planar ligand such as porphyrin, a tridentate or higher stereoligand such as a cyclic amine, or a binuclear defined ligand is bonded to a metal.

Here, the center metal includes transition metals, and among them, V, Cr, Mn, Fe, C
o, Ni, Cu, Zn, Mo, Tc, Ru, Rh, P
II to VI selected from d, W, Re, Ir, Pt, and Au
Transition metals in the I-valent oxidation state are preferred.

The metal complex having these ligands may be formed in advance or may be formed in a mold remover composition bath. The metal complex having these ligands may be mononuclear or polynuclear. Depending on the type of ligand and the oxidation state of the metal, a binuclear or polynuclear metal complex can be formed. In the complex, the coordinating species and / or the bridging species form a bridge between the metal centers.

The content of these metal complexes is not particularly limited, but is preferably 0.03% in the bath of the powdery mold remover composition.
It is from 0.01 to 1% by weight, preferably from 0.01 to 0.5% by weight.

The polyacid used in the present invention includes a polynuclear complex in which two or more inorganic oxyacids are condensed, and a salt thereof. As the central element of the polyacid, group III to group VI elements in the periodic table, especially B, Si, P, S,
V, Nb, Ta, Cr, Mo, W. Examples of the polyacid include an isopolyacid containing one of these metals and a heteropolyacid containing two or more of these metals, and a heteropolyacid is preferred from the viewpoint of performance.

Specific examples of these compounds include molybdic acid, tungstic acid, phosphomolybdic acid, phosphotungstic acid, silicomolybdic acid, silicotungstic acid,
Examples thereof include phosphorus tungstomolybdic acid, phosphorus vanadomolybdic acid, phosphorus vanadotungstic acid, and a sodium salt or an ammonium salt thereof.

Although the content of these polyacids is not particularly limited, the content of the polyacid in the bath of the powdery mold remover composition is 0.00
It is 1 to 1% by weight, preferably 0.01 to 0.5% by weight.

The alkaline substance may be any substance which exhibits alkalinity when dissolved in water, such as an alkali metal or ammonium hydroxide, carbonate, bicarbonate, etc., and is easy to handle and adjust pH. In that respect, sodium carbonate or potassium carbonate is preferred. Particularly preferred is potassium carbonate.

The content of these alkaline substances is not particularly limited, but they are blended so as to be contained in the powdery and granular fungicide composition in an amount of 5 to 30% by weight, preferably 5 to 15% by weight.

The fungicide composition of the present invention may optionally contain a builder, a radical scavenger, an alcohol, a thickener, a fragrance, a dye, an enzyme and the like for the purpose of improving storage stability, usability, and the like. Can be blended.

In the present invention, the composition comprising these components has a bulk density of 0.4 to 1.0 g / cc, and the amount of fine powder passing through a sieve having an opening of 250 μm is 30% by weight.
Must be: Preferred bulk density is 0.5-1.
0 g / cc, more preferably 0.6 to 0.8 g / cc.
cc. If the bulk density is less than 0.4 g / cc, the amount of fine powder described later increases, and if the bulk density is more than 1.0 g / cc, the solubility in water becomes poor, which is not preferable.

The preferred amount of fine powder is 20% by weight or less, more preferably 10% by weight or less. Aperture 2
If the amount of fine powder passing through a 50 μm sieve is more than 30% by weight, it is not preferable because powder dust and coughing become severe when put into a container or the like.

The powdery and granular fungicide composition of the present invention may be used by mixing each component such as a hydrogen peroxide releasing compound, a peroxyacid precursor and a surfactant. When the ingredients such as the agent are granulated, the opening 250
This is preferable because the fine powder content passing through a μm sieve is further reduced.

The granulation method is not particularly limited, and may be performed by a usual method, and the use of a binder for granulation is optional. As an example of granulation, a mixture of a peroxyacid precursor, a surfactant, a water-soluble binder, and the like is heated to a temperature equal to or higher than the melting point of the water-soluble binder, preferably 40 to 80.
After consolidation treatment at a temperature of not more than ° C., a method of obtaining granules by applying impact and shear force to the obtained condensed product by a high-speed rotating knife cutter to obtain a granulated product may be mentioned.

[0031]

Next, the present invention will be described in more detail by way of examples, which should not be construed as limiting the present invention.

The components and symbols in each table have the following meanings, and TPDC and the metal complex are synthetic products. PC: sodium percarbonate TAED: manufactured by Mitsubishi Gas Chemical Company; N, N, N ', N'-tetraacetylethylenediamine; TPDC manufactured by Hoechst: 2,2'-terephthaloyldioxybis [(N, N, N-trimethyl) ) Ethyl ammonium methyl sulfate] Metal complex: Tris-μ-oxo-bis-[(1,4,7
-Trimethyl-1,4,7-triazacyclononane) manganese (IV)] hexafluorophosphate polyacid: sodium phosphomolybdate; Nippon Shinkin Co., Ltd. AOS: sodium α-olefin sulfonate; in-house potassium carbonate Made by Asahi Glass

The amount of fine powder, the absence of flour, the effect of removing mold, and the absence of irritating odor in each example were measured as follows.

(A) Fine powder amount: Using a standard sieve having a mesh size of 250 μm (60 #) in accordance with JIS Z 8801, 300 g of the powdery and granular mold remover composition of the present invention was charged, and the lid was covered with the sieve. The weight that passed when it was shaken was measured, and the amount of fine powder (%) was determined by calculation.

(B) No powder dust; 20 g of the powdery and granular mold remover composition of the present invention was placed in a polypropylene bag (30 × 1).
70 mm), and the amount of muzzle when charged into a container having a diameter of 20 mm from the tip was determined according to the following evaluation criteria. still,
The test was performed by 10 people.

[0036]

(C) Mold removing effect; black mold (Clad)
osporium cladosporioides)
Of the unglazed tile surface prepared by culturing, applying and adjusting (2.
An equivalent amount (0.5 ml) of each sample was dropped on 5 × 2.5 cm), left for 15 minutes, washed with water, and dried at 30 ° C. for 2 hours. On this tile, a food stamp (for fungus:
(Sabouraud agar) was adhered for 1 hour, the change with time (2 days) at 30 ° C. was observed, and the evaluation was made according to the following evaluation criteria.

[0038]

(D) No irritating odor; the degree of irritating odor when 200 ml of each sample was evenly sprayed from a spray container onto the entire side surface of a 5.5 m ³ sealed bathroom and kept as it was for 3 minutes. Was determined based on the following evaluation criteria. The test was performed by five people.

[0040]

Examples 1 to 6 and Comparative Example 1 A powdery and granular mold remover composition of the present invention was prepared by the following method. 10 parts by weight of a peroxyacid precursor, a surfactant, a metal complex and / or a polyacid, an alkaline substance, and an average molecular weight of 6000 polyethylene glycol having an average molecular weight of 6000 shown in Table 1 were added to Extruded Omics EM-6 manufactured by Hosokawa Micron Corporation. Then, by kneading and extruding, an extruded product on a noodle having a diameter of 0.8 mmφ was obtained. The extruded product (60 ° C.) was introduced from the same direction as the extruded and kneaded granulated product was introduced with a Fitzmill DKA-3 manufactured by Hosokawa Micron Corporation, and pulverized to obtain a granulated product. The final composition was prepared by mixing the granules and PC. The surfactant used was a spray-dried product, and mirabilite was used as a grinding aid.

Next, after measuring the amount of fine powder and the absence of fine powder using the obtained powdery and granular mold remover composition, this was mixed with water (at a concentration of 20%) to remove the mold. And a test for absence of pungent odor. In addition, as a comparative example, each test was performed using a powdery and granular mold remover composition containing each component without performing granulation. Table 1 shows the results.

[0043]

[Table 1]

From the results shown in Table 1, it can be seen that the fungicide composition of the present invention has a strong mold-removing power, does not cause flaking during preparation of the fungicide, and has no irritating odor. I understand.

[0045]

Industrial Applicability The powdery and granular fungicide composition of the present invention is a powdery and granular material having a specific range of physical properties, so that it does not muffle or cough when preparing a fungicide. No harmful gas is generated at the time of use, and there is no irritating odor.
It is suitable as a mold remover.

 ────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Hiroshi Miyake 1-3-7 Honjo, Sumida-ku, Tokyo Inside Lion Corporation

Claims (1)

[Claims] 1. At least (A) a peroxy compound,
(B) In a mold remover composition comprising a surfactant,
Bulk density is 0.4 to 1.0 g / cc and opening 2
A powdery and granular fungicide composition, wherein a fine powder content passing through a 50 μm sieve is 30% by weight or less.