JPH1133456A - Adhesive coater - Google Patents

Abstract

PROBLEM TO BE SOLVED: To maintain a good adhesive coating quality by conducting a waste hitting recognizing motion when the number of the produced circuit boards to be coated with an electronic parts fixing adhesive reaches the waste hitting interval number and applying only waste hitting every number of the produced circuit boards when the number is not reached. SOLUTION: An adhesive coating nozzle is relatively moved to coat a circuit board with an adhesive. In this case, when a waste hitting recognizing motion is conducted, the number of the circuit boards to be produced is set in an adhesive coater in #1. The production of circuit boards is started in #2, the waste hitting recognizing motion is started in #3, and the first circuit board is produced in #4. The number of the produced circuit boards is counted in #5 when the set number is reached, the coating nozzle is positioned in a waste hitting station, and waste hitting is conducted. Meanwhile, when the set number is not reached, only waste hitting is conducted in #6. Consequently, the problem that the adhesive is drawn into the coating nozzle due to its surface tension before the number of the produced boards is not reached is solved.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an adhesive applying apparatus for applying an adhesive for fixing an electronic component to a circuit board.

[0002]

2. Description of the Related Art Conventionally, an adhesive coating apparatus has been provided with a step of performing discarding recognition when the number of circuit boards produced reaches a predetermined number. The conventional device will be described below with reference to FIGS. FIG. 2 shows a conventional adhesive application device A.
FIG. In the drawing, reference numeral B denotes an application section provided with an application nozzle 1 for applying the adhesive 3, a syringe 2 for supplying the adhesive 3 to the application nozzle, and a recognition camera 4. Is configured to be positionable. C is a discarding portion provided with a discarding tape 5 for discarding the adhesive 3 and a discarding station 6 provided beside the circuit board transport means 7 and for placing the discarding tape 5 at the time of discarding. The circuit board transporting means 7 and the dumping station 6 are supported on a Y table 8 so as to be positionable in the Y direction with respect to the application nozzle 1.

[0003] Next, a description will be given of a discarding operation by setting the interval between the number of circuit boards to be produced in the conventional adhesive coating apparatus A with reference to FIG. First, in step # 11, when the discarding recognition operation is performed by setting the interval of the number of production sheets in advance, the number of production sheets to be discarded in the adhesive application device A is set in advance. The production of the circuit board is started in # 12, the discarding recognition operation is started in # 13, and the production of the first sheet is performed in # 14. The adhesive coating apparatus A counts the number of circuit boards produced in advance in # 15, and when the number reaches the preset number, positions the application nozzle 1 to the disposal station 6 and performs disposal. Next, the discarded adhesive 3 is recognized by the recognition camera 4 to check whether the applied adhesive has the set adhesive area, and then the adhesive is applied onto the circuit board 9. Then, the discarding recognition operation is started again.

If the number of discarded sheets has not reached,
Production of the circuit board is continued as it is.

[0005]

However, in the above-mentioned conventional adhesive coating apparatus, when it takes a long time to reach the set number of production sheets due to a delay in the supply of the substrate or the like, the adhesive is not used. There is a problem that the coating quality of the adhesive applied to the next substrate deteriorates due to the surface tension being drawn into the application nozzle.

[0006]

SUMMARY OF THE INVENTION The present invention provides an adhesive application nozzle, a lifting drive means for raising and lowering the adhesive application nozzle, a disposal station having a disposal tape on its upper surface, a circuit board supporting means, and XY direction driving means for relatively moving the adhesive coating nozzle to a predetermined position in the horizontal direction of the circuit board and the dumping tape, wherein the production number of circuit boards is If it has reached, perform a discarding recognition operation,
When the number of circuit boards has not been reached, only discarding is performed for each production number of circuit boards.

According to the present invention, there are provided a step of performing a discarding recognition operation when the number of circuit boards produced reaches the number of discarding intervals, and a step of performing only discarding every circuit board production number. Even if it takes a long time to perform the discarding recognition operation, since the method includes a process of performing only the discarding for each production number of circuit boards, the adhesive is drawn into the application nozzle by surface tension. Is gone,
Good quality of the adhesive applied to the circuit board can be maintained.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention comprises an adhesive application nozzle, an elevating drive means for elevating and lowering the adhesive application nozzle, a dumping station provided with a dumping tape on its upper surface, In an adhesive coating apparatus having a circuit board supporting means and XY direction driving means for relatively moving an adhesive coating nozzle to a predetermined position in a horizontal direction of the circuit board and the disposal tape, the production number of circuit boards is An adhesive application device characterized by performing a discarding recognition operation when the number reaches the discarding interval number, and performing only a discarding every circuit board production number when not reaching the circuit board. In addition to the step of performing the discarding recognition operation when the production number of sheets reaches the discarding interval number, a step of performing only the discarding per circuit board production number is provided. Even if it takes a long time to perform the operation, it has a process of only throwing away, so the adhesive will not be drawn into the application nozzle due to surface tension and the adhesive applied to the circuit board It has the effect that the quality of the agent can be kept good.

Hereinafter, an embodiment of the present invention will be described with reference to FIG.
This will be described with reference to FIG. FIG. 1 is a flowchart of a discarding operation according to the embodiment of the present invention. When performing the discarding recognition operation, the number of circuit boards produced for performing the discarding recognition of the adhesive in # 1 is set in the adhesive coating device in advance. In step # 2, the production of the circuit board is started, in step # 3, the discard operation is started, and in step # 4, the first sheet is produced. At # 5, the adhesive coating apparatus A counts the number of circuit boards produced, and when the number reaches the preset number, positions the application nozzle 1 to the disposal station 6 and performs disposal.

Next, the discarded adhesive 3 is recognized by the recognition camera 4 to check whether the applied adhesive 3 has the set adhesive area, and then adheres onto the circuit board 9. Apply the agent. When the production number of circuit boards has not reached the preset number, the production of circuit boards is continued. However, in # 6, the application nozzle 1 performs only the ejection in the ejection station 6, and At 7, the adhesive is applied on the circuit board.

[0011]

As described above, according to the present invention, the process of performing the discarding recognition operation when the number of circuit boards produced reaches the discarding interval number and the process of performing only the discarding per circuit board production number. Therefore, even if it takes a long time to perform the discarding recognition operation, since it has a process of performing only discarding every production number of circuit boards,
The adhesive is not drawn into the application nozzle due to the surface tension, and good adhesive application quality can be maintained.

[Brief description of the drawings]

FIG. 1 is a flowchart showing an adhesive application operation of the present invention.

FIG. 2 is a schematic diagram showing an adhesive application device.

FIG. 3 is a flowchart showing a conventional adhesive application operation.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Application nozzle 2 Syringe 3 Adhesive 4 Recognition camera 5 Discarding tape 6 Discarding station 7 Substrate conveying means 8 Y table 9 Circuit board

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Toshiyuki Kino 1006 Kazuma Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd.

Claims (1)

[Claims] 1. An adhesive application nozzle, an elevation drive means for elevating and lowering the adhesive application nozzle, a disposal station having a disposal tape on its upper surface, a circuit board supporting means, and an adhesive application nozzle connected to the circuit board. And an XY-direction driving means for relatively moving to position the discarded tape at a predetermined position in the horizontal direction.
Adhesive coating characterized in that when the production number of circuit boards reaches the discarding interval number, the discarding recognition operation is performed, and when it does not reach, the discarding operation is performed only for each production number of circuit boards. apparatus.