JPH11326566A - Fusion device pyrogenic load structure - Google Patents
Fusion device pyrogenic load structureInfo
- Publication number
- JPH11326566A JPH11326566A JP10137940A JP13794098A JPH11326566A JP H11326566 A JPH11326566 A JP H11326566A JP 10137940 A JP10137940 A JP 10137940A JP 13794098 A JP13794098 A JP 13794098A JP H11326566 A JPH11326566 A JP H11326566A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- cooling substrate
- resistant material
- load structure
- heat load
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E30/00—Energy generation of nuclear origin
- Y02E30/10—Nuclear fusion reactors
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、核融合装置高熱負
荷構造に関する。詳しくは、核融合装置真空容器内の高
熱負荷構造に関する。The present invention relates to a high heat load structure for a fusion device. More specifically, the present invention relates to a high heat load structure in a fusion device vacuum vessel.
【０００２】[0002]
【従来の技術】従来の高熱負荷構造を図３に示す。同図
に示すように、Ｃu合金、ステンレス鋼、モリブデン等
の金属材料からなる冷却基板２内には冷却管３が貫通す
ると共にその上に、Ｗ，Ｍo等の高融点金属、セラミッ
クス、黒鉛材料等よりなる耐熱材料１を冶金的に接合す
る構造となっている。2. Description of the Related Art FIG. 3 shows a conventional high heat load structure. As shown in the figure, a cooling pipe 3 penetrates into a cooling substrate 2 made of a metal material such as a Cu alloy, stainless steel, molybdenum and the like, and further has a high melting point metal such as W and Mo, ceramics and graphite material. The structure is such that the heat-resistant material 1 made of metal or the like is metallurgically joined.
【０００３】この耐熱材料１の寸法は、冷却基板２の幅
と同等であり、２５〜３０ｍｍ程度である。このような
構造は、核融合プラズマからの高熱負荷を直接受けるた
め、高温及び熱応力の繰り返しにより、熱疲労が発生
し、耐熱材料と冷却基板２との接合部の信頼性が問題と
なっていた。The size of the heat-resistant material 1 is equal to the width of the cooling substrate 2 and is about 25 to 30 mm. Since such a structure is directly subjected to a high thermal load from fusion plasma, thermal fatigue occurs due to repetition of high temperature and thermal stress, and the reliability of the joint between the heat-resistant material and the cooling substrate 2 has become a problem. Was.
【０００４】[0004]
【発明が解決しようとする課題】本発明は、上記従来技
術の問題点を解消する核融合装置高熱負荷構造を提供す
ることを目的とする。SUMMARY OF THE INVENTION An object of the present invention is to provide a high heat load structure for a fusion device which solves the above-mentioned problems of the prior art.
【０００５】[0005]
【課題を解決するための手段】上記目的を達成する本発
明の請求項１に係る核融合装置高熱負荷構造は、耐熱材
料を金属製冷却基板上に冶金的に接合してなる高熱負荷
構造において、前記耐熱材料は、接合時及び熱負荷時に
発生する熱応力が問題とならない程度の寸法の丸棒或い
は角棒状としたことを特徴とする。According to a first aspect of the present invention, there is provided a high heat load structure for a fusion device, wherein a heat resistant material is metallurgically bonded on a metal cooling substrate. The heat-resistant material is characterized in that it is formed in a round bar or a square bar having such a size that thermal stress generated at the time of joining and heat load does not matter.
【０００６】上記目的を達成する本発明の請求項２に係
る核融合装置高熱負荷構造は、耐熱材料を金属製冷却基
板上に冶金的に接合してなる高熱負荷構造において、前
記耐熱材料は前記冷却基板上に接合後、熱負荷時に発生
する熱応力が問題とならない程度の寸法に、接合面まで
切断加工されることを特徴とする。According to a second aspect of the present invention, there is provided a high heat load structure for a fusion device, wherein a heat resistant material is metallurgically bonded on a metal cooling substrate. After bonding on the cooling substrate, the substrate is cut to a bonding surface to such a size that thermal stress generated at the time of heat load does not matter.
【０００７】[0007]
【発明の実施の形態】以下、本発明の実施の形態につい
て、図面に示す実施例を参照して詳細に説明する。 〔実施例１〕本発明の第１の実施例に係る核融合装置高
熱負荷構造を図１に示す。同図に示すように、この高熱
負荷構造は、タングステン製の耐熱材料４、Ｃu金属製
の冷却基板２及び純Ｃu製の冷却管３により構成され
る。Embodiments of the present invention will be described below in detail with reference to embodiments shown in the drawings. Embodiment 1 FIG. 1 shows a high heat load structure of a fusion device according to a first embodiment of the present invention. As shown in the figure, this high heat load structure is composed of a heat-resistant material 4 made of tungsten, a cooling substrate 2 made of Cu metal, and a cooling pipe 3 made of pure Cu.
【０００８】ここで、耐熱材料４は、外径４ｍｍ、長さ
１０ｍｍの丸棒状であり、冷却基板２上に一定間隔で規
則正しく多数配列している。耐熱材料４は、Ｗ−３０％
Ｃu製の冷却基板２に対して、Ｃu−Ｍn−Ｎiろうで真空
ろう付により接合している。耐熱材料４の寸法は、接合
時及び熱負荷時に発生する熱応力が問題とならない程度
大きさとする。The heat-resistant material 4 is in the form of a round bar having an outer diameter of 4 mm and a length of 10 mm, and is regularly arranged on the cooling substrate 2 at regular intervals. Heat resistant material 4 is W-30%
Cu-Mn-Ni brazing is applied to the cooling substrate 2 made of Cu by vacuum brazing. The dimensions of the heat-resistant material 4 are set to such a degree that thermal stress generated at the time of joining and thermal load does not matter.
【０００９】耐熱材料４としては、丸棒状に限らず、角
棒状としても良い。また、冷却管３は、冷却基板２に対
して、Ｃu−Ｍn−Ｎiろうで真空ろう付により接合して
いる。The heat-resistant material 4 is not limited to a round bar, but may be a square bar. The cooling pipe 3 is joined to the cooling substrate 2 by a Cu-Mn-Ni solder by vacuum brazing.
【００１０】ここで、比較例として、図３に示すよう
に、Ｗ−３０％Ｃu製の冷却基板２に、２５ｍｍ×２５
ｍｍ、厚さ１０ｍｍの純タングステン製耐熱材料（耐熱
タイル）１をＣu−Ｍn−Ｎiろうで真空ろう付した試験
体を作製し、電子ビームによる熱負荷試験を実施した。Here, as a comparative example, as shown in FIG. 3, a cooling substrate 2 made of W-30% Cu is
A heat-resistant material (heat-resistant tile) 1 made of pure tungsten having a thickness of 10 mm and a thickness of 10 mm was vacuum-brazed with a Cu-Mn-Ni braze, and a heat load test using an electron beam was performed.
【００１１】その結果、２５ｍｍ×２５ｍｍのＷ製耐熱
材料１を接合した場合には、１０ＭＷ／ｍ2×１０ｓｅ
ｃの照射条件で８０回照射した後、耐熱材料１と冷却基
板２との接合部近傍の耐熱材料側にクラックが発生した
が、本実施例に係る外径４ｍｍの丸棒Ｗ製耐熱材料４を
使用した場合には、１０ＭＷ／ｍ2×１０ｓｅｃの照射
条件で１００回照射後も丸棒Ｗ製耐熱材料４と冷却基板
２との接合部に変化は見られなかった。As a result, when the W heat-resistant material 1 of 25 mm × 25 mm is joined, 10 MW / m 2 × 10 sec
After irradiating 80 times under the irradiation condition c, cracks occurred on the heat-resistant material side near the joint between the heat-resistant material 1 and the cooling substrate 2. When no was used, no change was observed in the joint between the heat-resistant material 4 made of round bar W and the cooling substrate 2 even after irradiation 100 times under the irradiation condition of 10 MW / m 2 × 10 sec.
【００１２】〔実施例２〕本発明の第２の実施例に係る
核融合装置高熱負荷構造を図２に示す。同図に示すよう
に、この高熱負荷構造は、タングステン製の耐熱材料
５、Ｃu金属製の冷却基板２及び純Ｃu製の冷却管３によ
り構成される。Embodiment 2 FIG. 2 shows a high heat load structure of a nuclear fusion device according to a second embodiment of the present invention. As shown in the figure, this high heat load structure is composed of a heat-resistant material 5 made of tungsten, a cooling substrate 2 made of Cu metal, and a cooling pipe 3 made of pure Cu.
【００１３】タングステン製の耐熱材料５は、２５ｍｍ
×２５ｍｍ、厚さ１０ｍｍのタイル状の純タングステン
を、Ｗ−３０％Ｃu製の冷却基板２にＣu−Ｍn−Ｎiろう
で真空ろう付で接合した後、ワイヤカットにより、約５
ｍｍ×５ｍｍの碁盤目状に、耐熱材料５と冷却基板２の
接合面まで切断加工したものである。The heat-resistant material 5 made of tungsten is 25 mm
× 25 mm, 10 mm thick tile-shaped pure tungsten was bonded to a cooling substrate 2 made of W-30% Cu by vacuum brazing with a Cu-Mn-Ni braze, and then about 5 mm was cut by wire cutting.
This is cut into a grid of mm × 5 mm up to the joint surface between the heat-resistant material 5 and the cooling substrate 2.
【００１４】耐熱材料５の切断加工される寸法は、接合
時及び熱負荷時に発生する熱応力が問題とならない程度
大きさとする。また、冷却管３は、冷却基板２に対し
て、Ｃu−Ｍn−Ｎiろうで真空ろう付により接合してい
る。The size of the heat-resistant material 5 to be cut is set to such a size that thermal stress generated at the time of joining and thermal load does not matter. The cooling pipe 3 is joined to the cooling substrate 2 by a Cu-Mn-Ni solder by vacuum brazing.
【００１５】実施例１と同様に、電子ビームによる熱負
荷試験を実施した。その結果、１０ＭＷ／ｍ2×１０ｓ
ｅｃの照射条件で、１００回照射後も耐熱材料５と冷却
基板２の接合部には変化は見られなかった。In the same manner as in Example 1, a heat load test using an electron beam was performed. As a result, 10 MW / m 2 × 10 s
Under the irradiation condition of ec, no change was observed in the joint between the heat-resistant material 5 and the cooling substrate 2 even after irradiation 100 times.
【００１６】[0016]
【発明の効果】以上、実施例に基づいて具体的に説明し
たように、本発明の請求項１に係る核融合装置高熱負荷
構造は、耐熱材料を金属製冷却基板上に冶金的に接合し
てなる高熱負荷構造において、前記耐熱材料は、接合時
及び熱負荷時に発生する熱応力が問題とならない程度の
寸法の丸棒或いは角棒状としたので、温度変化の繰り返
しを経ても接合部に変化がなく、耐熱負荷性能を向上さ
せることができた。As described above in detail with reference to the embodiments, the fusion device high heat load structure according to the first aspect of the present invention comprises a heat resistant material metallurgically bonded on a metal cooling substrate. In the high heat load structure described above, the heat-resistant material has a round bar or a square bar shape having a size such that thermal stress generated at the time of bonding and heat load does not cause a problem, so that the heat-resistant material changes to the bonded portion even after repeated temperature changes. As a result, the heat load performance was able to be improved.
【００１７】また、本発明の請求項２に係る核融合装置
高熱負荷構造は、耐熱材料を金属製冷却基板上に冶金的
に接合してなる高熱負荷構造において、前記耐熱材料は
前記冷却基板上に接合後、熱負荷時に発生する熱応力が
問題とならない程度の寸法に、接合面まで切断加工され
たので、温度変化の繰り返しを経ても接合部に変化がな
く、耐熱負荷性能を向上させることができた。In the high heat load structure of a nuclear fusion device according to claim 2 of the present invention, in the high heat load structure in which a heat resistant material is metallurgically bonded on a metal cooling substrate, the heat resistant material is provided on the cooling substrate. After joining, the joint surface was cut to a size that does not cause thermal stress generated during thermal load, so the joint does not change even after repeated temperature changes, improving heat load performance Was completed.
【図１】本発明の第１の実施例に係る核融合装置高熱負
荷構造を示す説明図である。FIG. 1 is an explanatory view showing a high heat load structure of a nuclear fusion device according to a first embodiment of the present invention.
【図２】本発明の第２の実施例に係る核融合装置高熱負
荷構造を示す説明図である。FIG. 2 is an explanatory view showing a high heat load structure of a fusion device according to a second embodiment of the present invention.
【図３】従来の核融合装置高熱負荷構造を示す説明図で
ある。FIG. 3 is an explanatory view showing a conventional fusion device high heat load structure.
１，４，５ 耐熱材料 ２ 冷却基板 ３ 冷却管 1,4,5 heat-resistant material 2 cooling board 3 cooling pipe
Claims (2)
接合してなる高熱負荷構造において、前記耐熱材料は、
接合時及び熱負荷時に発生する熱応力が問題とならない
程度の寸法の丸棒或いは角棒状としたことを特徴とする
核融合装置高熱負荷構造。1. A high heat load structure in which a heat-resistant material is metallurgically bonded on a metal cooling substrate, wherein the heat-resistant material comprises:
A high heat load structure for a fusion device, characterized in that it is shaped like a round bar or a square bar so that thermal stress generated at the time of joining and heat load does not matter.
接合してなる高熱負荷構造において、前記耐熱材料は前
記冷却基板上に接合後、熱負荷時に発生する熱応力が問
題とならない程度の寸法に、接合面まで切断加工される
ことを特徴とする核融合装置高熱負荷構造。2. A high heat load structure in which a heat-resistant material is metallurgically bonded on a metal cooling substrate, wherein the heat-resistant material is bonded to the cooling substrate after the thermal stress generated at the time of heat load does not matter. A high heat load structure for a nuclear fusion device, characterized in that it is cut to the size of the joint surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10137940A JPH11326566A (en) | 1998-05-20 | 1998-05-20 | Fusion device pyrogenic load structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10137940A JPH11326566A (en) | 1998-05-20 | 1998-05-20 | Fusion device pyrogenic load structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11326566A true JPH11326566A (en) | 1999-11-26 |
Family
ID=15210266
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10137940A Withdrawn JPH11326566A (en) | 1998-05-20 | 1998-05-20 | Fusion device pyrogenic load structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11326566A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006324023A (en) * | 2005-05-17 | 2006-11-30 | Tokyo Electron Ltd | Plasma treatment device |
| CN105067449A (en) * | 2015-08-01 | 2015-11-18 | 中国人民解放军国防科学技术大学 | Heat insulation apparatus capable of transmitting tension and pressure |
-
1998
- 1998-05-20 JP JP10137940A patent/JPH11326566A/en not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006324023A (en) * | 2005-05-17 | 2006-11-30 | Tokyo Electron Ltd | Plasma treatment device |
| JP4664119B2 (en) * | 2005-05-17 | 2011-04-06 | 東京エレクトロン株式会社 | Plasma processing equipment |
| CN105067449A (en) * | 2015-08-01 | 2015-11-18 | 中国人民解放军国防科学技术大学 | Heat insulation apparatus capable of transmitting tension and pressure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20050802 |