JPH11326447A - Semiconductor inspecting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a lead terminal of a semiconductor device from being deformed in the case of pulling it out at the time of test and after the test. SOLUTION: This semiconductor device is composed of an upper device 21 and a lower device 22 having the same constitution each other. The upper device 21 and the lower device 22 are composed of insulators 21a, 22a formed into U-shaped cross-sections respectively, and terminals 21b, 22b embedded in one-end sides of space part sides of the insulators 21a, 22a. The upper and lower devices 21, 22 are composed to form in their insides a space part for storing a QFP of an inspection object to cover a package main body 11. When the QFP is mounted on the semiconductor device, a lead terminal 12 of the QFP is stored into a cavity 23 formed by the insulators 21a, 22a to contact with the terminals 21b, 22b. The terminals 21b, 22b are projected outside the insulators 21a, 22a to form electrodes contacting with terminals on an inspection board.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor inspection device, and more particularly to a semiconductor inspection device capable of preventing a lead terminal of a semiconductor device from being deformed.

[0002]

2. Description of the Related Art When a lead terminal is bent in a manufacturing process of a QFP (Quarter Flat Package) type semiconductor device (hereinafter, referred to as a QFP), a screening test and a burn-in test are performed for each unit. Such a screening test (a good product by measuring the electrical characteristics between the lead terminals,
This is a test for sorting out defective products. same as below)
In the inspection process such as burn-in test and QFP,
Usually attached to a test socket. At this time, the lead terminals are pressed and fixed in the socket by a spring or the like.

[0003]

However, in such a method, malfunction of a machine for inserting or removing a QFP into or from a socket, carelessness of an operator when inserting or removing a QFP into or from a socket, or deterioration of the socket. For these reasons, the lead terminals of the QFP may be deformed.

In order to solve such a problem, a QFP inspection apparatus (hereinafter referred to as a conventional apparatus) disclosed in Japanese Utility Model Registration No. 3015654 has been proposed. In this QFP inspection apparatus, the inspection connector 32 mounted on the test board 31 has a central space 35 for accommodating the QFP main body 33a, as shown in FIG. Furthermore, the lead terminal 33 of the QFP 33
In order to securely connect b to the contact 37, a compression suppressor 39 is used.

However, in the above-mentioned conventional apparatus, the inspection connector 32 has to pass through the thin metal wire 36 connecting the upper and lower contacts 37 and 38, so that the manufacturing cost is increased. Since the QFP main body 33a is inserted upside down into the space 35 of the inspection connector 32,
In the step of inserting the QFP 33, a step of changing the vertical direction is required. Further, if the compression suppressor 39 is not used, there is a problem that the contact between the lead terminal 33b and the contact 37 is not good. On the other hand, when the compression suppressor 39 is used, the number of components in the entire QFP inspection apparatus increases, and thus there is a problem in that the manufacturing cost of the entire apparatus increases.

Further, in the above-mentioned conventional device, the QFP 33
Is exposed to the outside. For this reason, an unnecessary stress is externally applied to the lead terminal 33b by the carelessness of the operator, and the lead terminal 33b may be deformed. As a result, there is a problem that the yield of the QFP 33 is reduced.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems of the prior art, and has as its object to provide a semiconductor inspection apparatus capable of preventing deformation of lead terminals of a semiconductor device.

Another object of the present invention is to provide a semiconductor inspection apparatus for inspecting a semiconductor device, which can simplify a process for accommodating the semiconductor device.

Another object of the present invention is to provide a semiconductor inspection apparatus which can be manufactured at low cost depending on the shape of a semiconductor to be inspected.

[0010]

To achieve the above object, the present invention provides a semiconductor inspection apparatus for inspecting a semiconductor device having lead terminals protruding from a package body. A space portion for housing is provided in the center, and is configured by an upper device and a lower device each formed of a U-shaped or U-shaped insulator that abuts on each other to form a cavity portion for housing the lead terminal, The lower device includes an insulator that contacts the lead terminal and protrudes further below the insulator of the lower device.

In the above-described semiconductor inspection apparatus, the lead terminals of the semiconductor device are accommodated in the hollow portion without being pressed by an excessively large force. Therefore, a large stress is not applied to the lead terminal when the semiconductor device is inserted or removed, and the lead terminal is not deformed. In addition, the cavity for accommodating the lead terminal has a sealed shape, so that an unnecessary stress is not applied to the lead terminal by an operator's carelessness and the lead terminal is not deformed.
Further, the semiconductor inspection apparatus does not need to insert the semiconductor device upside down, so that the process for housing the semiconductor device can be simplified.

In the above-described semiconductor inspection apparatus, the semiconductor device may have, for example, a symmetric structure. In this case, the upper device can have the same configuration as the upper device.

In this case, the upper device and the lower device can be constituted by the same parts. Therefore, the manufacturing cost of the entire semiconductor inspection apparatus can be kept low.

In the above semiconductor device, the insulator is
It is preferable that it is made of a heat-resistant material.

In the above semiconductor device, it is preferable that the terminal includes an elastic body.

[0016]

Embodiments of the present invention will be described below with reference to the accompanying drawings.

FIG. 1 shows a QF applied to this embodiment.
FIG. 2 is a plan view of a P-type semiconductor device (hereinafter, referred to as QFP). FIG. 2 is a front view of the QFP of FIG. As shown in these figures, the QFP 1 includes a package body 11 in which a semiconductor chip is molded, and a plurality of lead terminals 12 connected to the semiconductor chip in the package body 11 by bonding wires and protruding from the package body 11. And

The package body 11 has a square shape with four sides equal in length. The lead terminal 12 has a gull wing shape that is projected obliquely downward from the package body 11 and then bent obliquely downward and further outwardly in the horizontal direction. The lead terminals 12 are arranged at substantially the same positions on the four sides of the package body 11 by the same number, and the QFP 1 has a symmetric structure.

The QFP 1 is placed on a circuit board (not shown) after an inspection step using a semiconductor inspection apparatus described later, and the final bent portion of the lead terminal 12 (the bent portion corresponding to the lowermost portion in FIG. 2). ) Is soldered.

Next, a semiconductor inspection apparatus for testing the QFP 1 of FIGS. 1 and 2 will be described. FIG. 3 is a plan view showing the semiconductor inspection device 2 in a state where the QFP 1 according to the present embodiment is mounted, and FIG. 4 is a front view.
5 is a sectional view taken along line AA of FIG. 3 (only a part is shown), and FIG. 6 is a sectional view taken along line BB of FIG. 3 (only a part is shown).

As shown in these figures, the semiconductor inspection apparatus 2 comprises an upper device 21 and a lower device 22 having the same configuration. The semiconductor inspection device 2 including the upper device 21 and the lower device 22 has a Q
A rectangular space 20 that covers and accommodates the package body 11 of the FP1 is provided at the center. The upper device 21 and the lower device 22 are provided on the peripheral portion, and are insulators 21a and 22a each having a U-shaped cross section.
And terminals 21b and 22b embedded at one end of the insulators 21a and 22a on the space portion 20 side.

The insulators 21a and 22a are made of a heat-resistant material such as a heat-resistant resin or a heat-resistant glass that can withstand high temperatures during a burn-in test. Terminals 21b, 22
b denotes a pogo pin (having a spring inside and giving elasticity to the movement of the terminal by a spring pressure; the same shall apply hereinafter) or an elastic body such as a conductive rubber or a spring. The electrodes serve as electrodes for connection to the electrodes of an inspection substrate (not shown) on which the semiconductor inspection device 2 is mounted during a test.

The depth of the insulators 21a and 21b is greater than the bending height of the lead terminal 12, and the width is greater than the length of the bent portion. When the QFP 1 is mounted on this semiconductor inspection device, as shown in FIG. 5, the lead terminals 12 of the QFP type semiconductor device are accommodated in a cavity 23 made of insulators 21a and 22a. The terminals 21a and 21b each have a thickness of 2 mm of the lead terminal 12 of the QFP 1.
It is shorter than the insulators 22a and 22b by a factor of one, and the cavity 23 in which the lead terminal 12 is accommodated is completely closed.

Hereinafter, a method of inspecting QFP 1 in this embodiment will be described. In the manufacturing process of the QFP1, after the bending process of the lead terminal 12 is completed, the QFP1 sequentially flowing into the manufacturing line is lifted by using, for example, an insertion machine using a suction method or the like. Then, the QFP 1 is inserted into the lower device 22 flowing from another line by performing predetermined positioning. This allows
The package body 11 is accommodated in the space 20 and the lead terminal 12 is accommodated in a portion of the insulator 22a forming the cavity 23.

Further, the upper device 21 flowing from another line in an upside-down direction with respect to the lower device 22 is lifted up by using a dedicated machine, and, after predetermined positioning, is brought into contact with the lower device 21 into which the QFP 1 is inserted. Contact This gives Q
The lead terminal 12 of the FP1 is housed in the cavity 23, is sealed by the insulators 21a, 22a of the upper device 21 and the lower device 22, and is not exposed to the outside. Further, the terminals 21 b and 22 b of the upper device 21 and the lower device 22 come into contact with the lead terminals 12.

Next, the semiconductor test apparatus 2 containing the QFP 1 as described above is placed on a test board for a screening test, and a screening test is performed. Further, a burn-in test is performed by placing the test board on a test board for a burn-in test. At the time of these tests, the protruding portions of the lower device 22 protruding below the terminals 22b come into contact with the electrodes of the inspection substrate.

As described above, the semiconductor inspection apparatus 2 of this embodiment can accommodate the lead terminal 12 in the hollow portion 23 without pressing the lead terminal 12 with an unnecessarily large force. It does not deform due to large stress. Also, the lead terminals 12
Is completely closed, and the lead terminals 12 are not exposed. For this reason, an unnecessary stress is not applied to the lead terminal 12 by the carelessness of the worker and the lead terminal 12 is not deformed.

Further, the semiconductor inspection apparatus 2 of this embodiment
Does not need to be turned upside down when inserting the QFP1. Therefore, unlike the conventional apparatus, the insertion process is not complicated, and the inspection cost is not increased.

Further, the lead terminals 12 of the QFP 1 are sandwiched between the upper device 21 and the lower device 22, so that poor contact between the terminals 21b, 22b and the lead terminals 12 does not occur. Moreover, since the same components can be used for the upper device 21 and the lower device 22, the manufacturing cost of the entire semiconductor inspection device 2 can be reduced.

Furthermore, by using a heat-resistant material such as heat-resistant resin or heat-resistant glass for the insulators 21a and 21b,
It can withstand the high temperature during the burn-in test.
Further, since the terminals 21b and 22b are configured to include an elastic body such as a pogo pin or conductive rubber or a spring, the inspection substrate only needs to have the electrodes and the positioning pins.

Further, since the QFP 1 is housed in the semiconductor inspection apparatus 2 immediately after the step of bending the lead terminal 12 of the QFP 1, the lead terminal 12 is not deformed by applying an external stress in the subsequent manufacturing process. .

The present invention is not limited to the above embodiment,
Various modifications are possible. Hereinafter, modifications of the above embodiment will be described.

In the above embodiment, the semiconductor inspection device 2
The semiconductor device to be inspected by the package main body 1
1 is a QFP 1 having a square shape and a lead terminal 12 formed in a gull wing shape. However, the shape of the package body in the semiconductor device to be inspected in the present invention, and the shape thereof are arbitrary as long as the lead terminals are attached so as to protrude outward from the package body. In this case, the shape of the semiconductor inspection device may be determined according to the shape of the semiconductor device to be inspected.

In the above embodiment, the QFP 1 has a symmetrical structure, and the upper device 21 and the lower device 22 of the semiconductor inspection device 2 have the same shape. However, the present invention is not limited to this. For example, if the depth of the lower device is sufficient to accommodate the lead terminals, the depth of the upper device may be less. Further, if the lower device has a terminal, the upper device does not have to have a terminal that contacts a lead terminal of the semiconductor device. Further, the shape of the upper device and the lower device may be U-shaped instead of U-shaped.

[0035]

As described above, according to the semiconductor inspection apparatus of the present invention, deformation of the lead terminals of the semiconductor device to be inspected can be prevented. Further, a process for accommodating the semiconductor device can be simplified.

Further, the semiconductor inspection apparatus of the present invention can be manufactured at low cost depending on the shape of the semiconductor to be inspected.

[Brief description of the drawings]

FIG. 1 is a plan view of a QFP applied to an embodiment of the present invention.

FIG. 2 is a front view of the QFP of FIG. 1;

FIG. 3 is a diagram illustrating Q in FIGS. 1 and 2 according to the embodiment of the present invention;
It is a top view of the semiconductor inspection device which mounts FP.

FIG. 4 is a front view of the semiconductor inspection device of FIG. 3;

FIG. 5 is a sectional view taken along line AA of FIG. 3;

FIG. 6 is a sectional view taken along line BB of FIG. 3;

FIG. 7 is a diagram showing a conventional QFP inspection apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 QFP type semiconductor integrated circuit 11 Package main body 12 Lead terminal 2 Semiconductor inspection device 20 Space part 21 Upper device 21a Insulator 21b Terminal 22 Lower device 22a Insulator 22b Terminal 23 Cavity

Claims (4)

[Claims] 1. A semiconductor inspection apparatus for inspecting a semiconductor device having lead terminals protruding from a package body, wherein a space for accommodating the package body is provided at a center.
An upper device and a lower device each formed of a U-shaped or U-shaped insulator that abuts each other to form a cavity for accommodating the lead terminal, wherein the lower device is in contact with the lead terminal. A semiconductor inspection device comprising an insulator protruding further below the insulator of the lower device. 2. The semiconductor inspection apparatus according to claim 1, wherein the semiconductor device has a symmetric structure, and the upper device has the same configuration as the upper device. 3. The semiconductor inspection apparatus according to claim 1, wherein said insulator is made of a heat-resistant material. 4. The semiconductor inspection apparatus according to claim 1, wherein the terminal includes an elastic body.