JPH11326077A - Heat flux measuring gauge - Google Patents

Heat flux measuring gauge

Info

Publication number
JPH11326077A
JPH11326077A JP13180898A JP13180898A JPH11326077A JP H11326077 A JPH11326077 A JP H11326077A JP 13180898 A JP13180898 A JP 13180898A JP 13180898 A JP13180898 A JP 13180898A JP H11326077 A JPH11326077 A JP H11326077A
Authority
JP
Japan
Prior art keywords
heat flux
gauge
measuring
cylindrical
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13180898A
Other languages
Japanese (ja)
Other versions
JP3439120B2 (en
Inventor
Kenichiro Takeishi
賢一郎 武石
Masaaki Matsuura
正昭 松浦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Heavy Industries Ltd
Original Assignee
Mitsubishi Heavy Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Heavy Industries Ltd filed Critical Mitsubishi Heavy Industries Ltd
Priority to JP13180898A priority Critical patent/JP3439120B2/en
Publication of JPH11326077A publication Critical patent/JPH11326077A/en
Application granted granted Critical
Publication of JP3439120B2 publication Critical patent/JP3439120B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Measuring Temperature Or Quantity Of Heat (AREA)

Abstract

PROBLEM TO BE SOLVED: To surely measure the heat flux at a local position, e.g. a surface with a curvature or a narrow section, in a heat flux measuring gauge measuring the heat flux via the principle of the unstationary measuring method. SOLUTION: Heat flux is measured by a resistor circuit 4 formed on the upper surface of a cylindrical gauge main body 3 in this heat flux measuring gauge. The heat flux measuring gauge is provided with a lead circuit 5 formed on the side face of the cylindrical gauge main body 3 to be continued to the lower section of the cylindrical gauge main body 3 from the resistor circuit 4 and an instrument connecting socket 7 fitted to the lower section of the cylindrical gauge main body 3 and electrically connected to the lead circuit 5.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、非定常計測手法の
原理を用いて熱流束を測定する、熱流束測定ゲージに関
する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat flux measuring gauge for measuring a heat flux using the principle of an unsteady measuring method.

【0002】[0002]

【従来の技術】図2は従来の熱流束測定ゲージを示す模
式図であり、(a)はその平面図、(b)はその透視斜
視図、(c)はその取付概念図を示している。この熱流
束測定ゲージは、図2(c)に示すように、衝撃風洞等
のように時間ステップ的に高温高速の流れ〔図2(c)
中、矢印2で示す〕が得られる装置において、その流れ
(気流)の中に設置された供試体表面1の局所熱流束を
計測することができ、供試体表面1に埋設するように設
置される。
2. Description of the Related Art FIGS. 2A and 2B are schematic diagrams showing a conventional heat flux measuring gauge, in which FIG. 2A is a plan view, FIG. 2B is a transparent perspective view, and FIG. . As shown in FIG. 2 (c), this heat flux measurement gauge is a high-temperature, high-speed flow in a time step like a shock wind tunnel etc. [FIG.
(Indicated by arrow 2 in FIG. 2) can measure the local heat flux of the specimen surface 1 installed in the flow (air flow), and is installed so as to be embedded in the specimen surface 1. You.

【0003】そして、本熱流束測定ゲージは、図2
(b)に示すように、セラミックス(アルミナ等)製の
円柱状ゲージ本体(例えば、直径φ1.6mm,高さ2
mm)3を備えるが、この円柱状ゲージ本体3の上部表
面には、図2(a)に示すように、スパッタリング等に
より白金薄膜を形成して、この白金塗膜にレーザートリ
ミングを施すことによって所定の電気抵抗値(例えば5
0Ω)になるようにして抵抗回路4〔図2(a)中にス
クリーントーンで示す〕を形成している。
The heat flux measuring gauge is shown in FIG.
As shown in (b), a cylindrical gauge body made of ceramics (alumina or the like) (for example, having a diameter of 1.6 mm and a height of 2 mm)
2), a platinum thin film is formed on the upper surface of the cylindrical gauge body 3 by sputtering or the like as shown in FIG. 2 (a), and the platinum coating is subjected to laser trimming. A predetermined electric resistance value (for example, 5
0Ω) to form a resistance circuit 4 (shown by a screen tone in FIG. 2A).

【0004】また、この抵抗回路4の両極4A,4A
は、図2(b)に示すように、円柱状ゲージ本体3の軸
方向に開けた2個の貫通孔5a,5aのそれぞれに挿通
された白金線(リード線)6a,6aを介して図示しな
い下部取出計測回路に接続されている。なお、図2
(b)では抵抗回路4は簡略化して示している。そし
て、この抵抗回路4に微小電流(例えば5mA)を流
し、その両極4A,4A間の電圧を測定し、これに基づ
いて抵抗値を計測する。
Further, both poles 4A, 4A of this resistance circuit 4
FIG. 2B shows platinum wires (lead wires) 6a, 6a inserted through two through holes 5a, 5a opened in the axial direction of the cylindrical gauge body 3, as shown in FIG. Not connected to the lower extraction measurement circuit. Note that FIG.
2B, the resistance circuit 4 is simplified. Then, a minute current (for example, 5 mA) is applied to the resistance circuit 4 to measure the voltage between the two electrodes 4A, 4A, and the resistance value is measured based on the voltage.

【0005】これにより、ステップ状に流れる高温高圧
の流れからのステップ入熱時の非定常表面温度変化を測
定することにより、その温度変化速度の大小で決まる熱
流束を測定することができるようになっている。
Thus, by measuring the unsteady surface temperature change at the time of step heat input from a high-temperature, high-pressure flow flowing in a step-like manner, the heat flux determined by the magnitude of the temperature change speed can be measured. Has become.

【0006】[0006]

【発明が解決しようとする課題】ところで、図2(a)
に示すように、このような熱流束を計測する抵抗回路4
は両極4A,4Aを除くと約0.5mm角程度に形成さ
れているが、リード線の取出孔としての貫通孔5a,5
aの配置に必要なスペースを確保する必要があるため、
図2(b)に示すように、円柱状ゲージ本体3の直径は
約1.6mmとなっている。なお、円柱状ゲージ本体3
の高さは約2mmである。
FIG. 2 (a)
As shown in the figure, a resistance circuit 4 for measuring such a heat flux
Are formed to have a size of about 0.5 mm square except for the poles 4A, 4A, but the through holes 5a, 5
Since it is necessary to secure the space necessary for the arrangement of a,
As shown in FIG. 2B, the diameter of the cylindrical gauge body 3 is about 1.6 mm. In addition, the cylindrical gauge body 3
Has a height of about 2 mm.

【0007】このため、従来の熱流束測定ゲージでは、
曲率をもった表面や狭隘部の熱流束を測定する場合に、
この円柱状ゲージ本体3の大きさ、即ち円柱状ゲージ本
体3の直径の大きさのために正確な局所熱流束を測定す
ることができないという課題がある。本発明は、このよ
うな課題に鑑み創案されたもので、例えば曲率をもった
表面や狭隘部のように局所の熱流束も確実に測定できる
ようにした、熱流束測定ゲージを提供することを目的と
する。
For this reason, in the conventional heat flux measuring gauge,
When measuring the heat flux of curved surfaces and narrow areas,
Due to the size of the cylindrical gauge body 3, that is, the diameter of the cylindrical gauge body 3, there is a problem that an accurate local heat flux cannot be measured. The present invention has been made in view of such a problem, and provides a heat flux measurement gauge capable of reliably measuring a local heat flux such as a curved surface or a narrow portion. Aim.

【0008】[0008]

【課題を解決するための手段】このため、請求項1記載
の本発明の熱流束測定ゲージは、円柱状ゲージ本体の上
部表面に形成された抵抗回路により熱流束を測定する熱
流束測定ゲージにおいて、該抵抗回路から該円柱状ゲー
ジ本体の下部へ連なるように該円柱状ゲージ本体の側面
に形成されるリード回路と、該円柱状ゲージ本体の下部
に取り付けられ、該リード回路に電気的に接続される計
器接続用ソケットとを備えることを特徴としている。
According to the present invention, there is provided a heat flux measuring gauge for measuring a heat flux by a resistance circuit formed on an upper surface of a cylindrical gauge body. A lead circuit formed on a side surface of the cylindrical gauge body so as to continue from the resistance circuit to a lower portion of the cylindrical gauge body; and a lead circuit attached to a lower portion of the cylindrical gauge body and electrically connected to the lead circuit. And a socket for connecting an instrument.

【0009】[0009]

【発明の実施形態】以下、図面により、本発明の実施の
形態について説明する。本発明の一実施形態にかかる熱
流束測定ゲージは、図1(a), (b)に示すように、衝
撃風洞等のように時間ステップ的に高温高速の流れ〔図
1(b)中、矢印2で示す〕が得られる装置において、
その流れ(気流)中に設置された供試体表面1の局所熱
流束を計測する場合に用いられる。
Embodiments of the present invention will be described below with reference to the drawings. As shown in FIGS. 1A and 1B, the heat flux measuring gauge according to one embodiment of the present invention is a high-speed, high-speed flow such as a shock wind tunnel in FIG. 1B. [Indicated by arrow 2],
It is used when measuring the local heat flux on the specimen surface 1 installed in the flow (air flow).

【0010】本熱流束測定ゲージは、セラミックス(ア
ルミナやジルコニア等)製の円柱状ゲージ本体3(例え
ばφ0.8mm,高さ2mm)の上部表面にスパッタリ
ング等によって白金薄膜を形成した上で、この白金塗膜
にレーザートリミングを施すことで所定の電気抵抗値
(例えば50Ω)となるようにして抵抗回路4を形成し
ている。本実施形態の円柱状ゲージ本体3には、従来の
2つのリード線取出孔に変えて、円柱状ゲージ本体3に
上述の抵抗回路4と同様にスパッタリング等によって帯
状の白金膜等のリード回路5,5が形成されており、抵
抗回路4の両極4A,4Aとそれぞれ接続されている。
This heat flux measurement gauge is formed by forming a platinum thin film on the upper surface of a cylindrical gauge body 3 (for example, φ0.8 mm, height 2 mm) made of ceramics (alumina, zirconia, etc.) by sputtering or the like. The resistance circuit 4 is formed so as to have a predetermined electric resistance value (for example, 50Ω) by performing laser trimming on the platinum coating film. In the cylindrical gauge body 3 of the present embodiment, a lead circuit 5 such as a band-shaped platinum film or the like is formed on the cylindrical gauge body 3 by sputtering or the like in the same manner as the above-described resistance circuit 4 instead of the conventional two lead wire extraction holes. , 5 are formed, and are connected to both poles 4A, 4A of the resistance circuit 4, respectively.

【0011】また、この円柱状ゲージ本体3の下部に
は、抵抗回路4の両極4A,4Aからリード回路5,5
を通じて導かれる信号を取り出すためのリード線6,6
を備えるソケット構造の取付具7が取り付けられてお
り、これらのリード線6,6が図示しない外部計測機器
(計器)に接続され、これにより、リード回路5,5と
計器とが電気的に接続されている。そして、円柱状ゲー
ジ本体3の下部まで導かれたリード回路5,5からの信
号が、ソケット7のリード線6,6に導かれ、図示しな
い外部計測機器へ送られるようになっている。
A lower part of the columnar gauge body 3 is connected to the lead circuits 4, 4 A of the resistance circuit 4 and the lead circuits 5, 5.
Leads 6, 6 for extracting signals guided through
A mounting fixture 7 having a socket structure is provided, and these lead wires 6, 6 are connected to an external measuring device (instrument) (not shown), whereby the lead circuits 5, 5 are electrically connected to the instrument. Have been. Then, signals from the lead circuits 5 and 5 guided to the lower portion of the cylindrical gauge body 3 are guided to lead wires 6 and 6 of the socket 7 and sent to an external measuring device (not shown).

【0012】本実施形態にかかる熱流束測定ゲージは、
上述のように構成されているため、以下のような作用,
効果がある。表面の抵抗回路4に微小電流(例えば5m
A)を流し、その両極4A,4A間の抵抗値を測定する
ことによって、図1(b)中、矢印2で示す高温高圧の
流れからのステップ入熱時の非定常表面温度変化を測定
し、これに基づいて、表面に入る熱流束を測定する。
The heat flux measuring gauge according to the present embodiment comprises:
With the above configuration, the following operations,
effective. A very small current (for example, 5 m
A), and the resistance between the two electrodes 4A, 4A is measured to measure the unsteady surface temperature change during the step heat input from the high-temperature and high-pressure flow indicated by arrow 2 in FIG. 1 (b). Based on this, the heat flux entering the surface is measured.

【0013】このように、図示しない下部取出回路への
リード取り出しを円柱状ゲージ本体3の内側面に形成し
たリード回路5を介して行なうようにしているため、円
柱状ゲージ本体3の直径を、熱流束を測定するための抵
抗回路4が形成される範囲である0.5mm角に若干の
周辺が加わった約0.8mm程度に収めることができ、
従来よりも小型化を達成することができる。
As described above, since the lead is taken out to the lower take-out circuit (not shown) through the lead circuit 5 formed on the inner surface of the cylindrical gauge body 3, the diameter of the cylindrical gauge body 3 is reduced. 0.5 mm square, which is a range in which the resistance circuit 4 for measuring the heat flux is formed, and a small margin can be added to about 0.8 mm,
The miniaturization can be achieved as compared with the related art.

【0014】また、ソケットを円柱状ゲージ本体に取り
付けることによって、リード回路と計器との電気的接続
を行なえるため、熱流束測定ゲージの着脱を容易に行な
うことができる。これにより、本実施形態にかかる熱流
束測定ゲージによれば、従来の熱流束測定ゲージの課題
であった曲率をもった表面や狭隘部における熱流束の測
定も確実に行なえるという利点がある。
Further, since the electrical connection between the lead circuit and the instrument can be made by attaching the socket to the cylindrical gauge main body, the heat flux measuring gauge can be easily attached and detached. Thus, according to the heat flux measurement gauge according to the present embodiment, there is an advantage that the measurement of the heat flux in a curved surface or a narrow portion, which has been a problem of the conventional heat flux measurement gauge, can be reliably performed.

【0015】[0015]

【発明の効果】以上詳述したように、請求項1記載の本
発明の熱流束測定ゲージによれば、リード回路が円柱状
ゲージ本体の側面に形成されるため、熱流束測定ゲージ
の小型化を図ることができる。これにより、曲率をもっ
た表面や狭隘部における熱流束の測定も確実に行なえる
という利点がある。
As described in detail above, according to the heat flux measuring gauge of the present invention, since the lead circuit is formed on the side surface of the cylindrical gauge main body, the heat flux measuring gauge can be downsized. Can be achieved. Thereby, there is an advantage that the measurement of the heat flux on the surface having the curvature or the narrow portion can be surely performed.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施形態にかかる熱流束測定ゲージ
を示す模式図であり、(a)はその平面図、(b)はそ
の側面図である。
FIG. 1 is a schematic diagram showing a heat flux measurement gauge according to an embodiment of the present invention, where (a) is a plan view and (b) is a side view.

【図2】従来の熱流束測定ゲージを示す模式図であり、
(a)はその平面図、(b)はその透視斜視図、(c)
はその取付概念図を示している。
FIG. 2 is a schematic diagram showing a conventional heat flux measurement gauge;
(A) is its plan view, (b) is its perspective perspective view, (c)
Shows a conceptual diagram of the mounting.

【符号の説明】[Explanation of symbols]

1 供試体表面 2 高温高速の流れ 3 円柱状ゲージ本体 4 抵抗回路 4A 抵抗回路の極 5 リード回路 6 リード線 7 ソケット(計器接続用ソケット) DESCRIPTION OF SYMBOLS 1 Specimen surface 2 High-temperature high-speed flow 3 Cylindrical gauge body 4 Resistance circuit 4A Resistance circuit pole 5 Lead circuit 6 Lead wire 7 Socket (socket for instrument connection)

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 円柱状ゲージ本体の上部表面に形成され
た抵抗回路により熱流束を測定する熱流束測定ゲージに
おいて、 該抵抗回路から該円柱状ゲージ本体の下部へ連なるよう
に該円柱状ゲージ本体の側面に形成されるリード回路
と、 該円柱状ゲージ本体の下部に取り付けられ、該リード回
路に電気的に接続される計器接続用ソケットとを備える
ことを特徴とする、熱流束測定ゲージ。
1. A heat flux measuring gauge for measuring a heat flux by a resistance circuit formed on an upper surface of a cylindrical gauge body, wherein the cylindrical gauge body is connected to the lower part of the cylindrical gauge body from the resistance circuit. A heat flux measurement gauge, comprising: a lead circuit formed on a side surface of the gauge; and a meter connection socket attached to a lower portion of the cylindrical gauge body and electrically connected to the lead circuit.
JP13180898A 1998-05-14 1998-05-14 Heat flux measurement gauge Expired - Fee Related JP3439120B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13180898A JP3439120B2 (en) 1998-05-14 1998-05-14 Heat flux measurement gauge

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13180898A JP3439120B2 (en) 1998-05-14 1998-05-14 Heat flux measurement gauge

Publications (2)

Publication Number Publication Date
JPH11326077A true JPH11326077A (en) 1999-11-26
JP3439120B2 JP3439120B2 (en) 2003-08-25

Family

ID=15066602

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13180898A Expired - Fee Related JP3439120B2 (en) 1998-05-14 1998-05-14 Heat flux measurement gauge

Country Status (1)

Country Link
JP (1) JP3439120B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100791094B1 (en) 2006-03-16 2008-01-03 국방과학연구소 Heat­Flux Sensor and the method thereof
CN104458191A (en) * 2014-12-10 2015-03-25 中国航天空气动力技术研究院 Miniature thin film platinum resistor heat flux transducer and manufacturing method thereof
CN104931229A (en) * 2015-06-12 2015-09-23 中国航天空气动力技术研究院 Integrated thin film sensor for measuring surface heat flow rate in hypersonic flow

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100791094B1 (en) 2006-03-16 2008-01-03 국방과학연구소 Heat­Flux Sensor and the method thereof
CN104458191A (en) * 2014-12-10 2015-03-25 中国航天空气动力技术研究院 Miniature thin film platinum resistor heat flux transducer and manufacturing method thereof
CN104931229A (en) * 2015-06-12 2015-09-23 中国航天空气动力技术研究院 Integrated thin film sensor for measuring surface heat flow rate in hypersonic flow

Also Published As

Publication number Publication date
JP3439120B2 (en) 2003-08-25

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