JPH11320379A - Manufacturing method and device for wire saw and wire saw manufactured thereby - Google Patents

Abstract

PROBLEM TO BE SOLVED: To produce wire saws easily and at a high speed by applying powder adhesive and abrasive grains to a core material of wire made of metal, sintering the adhesive, and fixing the grains to the surface of wire core material. SOLUTION: A metal wire core material 1 grounded through a pulley 2 is driven by the pulley 2 and a pulley 3, then a powder adhesive charged negatively is applied to the core material 1 from an electrostatic powder spraying gan 4, an abrasive grains charged negatively is applied to the surface of the adhesive by an electrostatic powder spraying gan 5. Thereafter, the adhesive is heated with a burning furnace 6 to fuse, harden and sinter it for strongly fixing the abrasive grains, resulting in formation of abrasive grain layer on the surface of the core material 1. A wire saw is produced in this way. For example, the core material 1 is composed of steel wire such as piano wire, aluminium wire while the adhesive is composed of thermosetting resin type powder adhesive such as of polyester, thermoplastic powder adhesive such as of vinyl chrolide resin, and the abrasive grain is composed of diamond, or aluminium oxide. Since the abrasive grains are fixed with the adhesive, long wire saws can be produced easily at a high production speed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for manufacturing a wire saw, and a wire saw manufactured by the method. More specifically, the present invention can perform a cutting process without using oil, can apply a large tension when used for processing a brittle material such as a silicon ingot, has a low disconnection, and has a small cutting margin. The present invention relates to a wire saw manufacturing method, a manufacturing apparatus, and a wire saw manufactured by the method, which can be easily manufactured at a high speed without loss, having a good cut surface finish, and without causing environmental pollution.

[0002]

2. Description of the Related Art A cutting wheel, an ID blade, and the like are used for slicing a brittle material such as a silicon ingot to cut out a silicon wafer for an LSI.
Band saws, wire saws and the like are used. When cutting material using such tools, the loss of material equivalent to the blade thickness of the tool is inevitable, so the thinning of wheels and blades has been promoted, and wire saws with small wire diameters have attracted attention. ing. Conventionally, for cutting semiconductor wafers from ingots and cutting ceramics such as alumina, a wire saw using a core such as a piano wire has been used. , Silicon carbide,
Cutting was performed while applying a lapping agent in which high hardness free abrasive grains such as cerium oxide were dispersed. However, if a lapping agent in which free abrasive grains are dispersed in oil is used, the object to be cut is contaminated by the oil, which requires labor and cost for cleaning the oil after processing, and that the surrounding environment is greatly contaminated by the oil. There was a problem. Therefore, a silicon ingot or the like has been cut without using oil by using a wire saw in which abrasive grains are fixed to the surface of a metal wire such as a piano wire or a tungsten wire by an electrodeposition method. However, since the fixing speed of the abrasive grains by the electrodeposition method is about 100 m per day, it takes a long time to manufacture a wire saw.
In addition, since large-scale equipment is required to electrodeposit a large number of wire cores, it is not easy to manufacture economically, and particularly, it is necessary to manufacture a long wire saw having a length of 2,000 m or more. Was difficult. The electrodeposition method requires a large amount of plating solution, it takes time to process waste liquid, and it is necessary to use expensive superabrasives such as diamond abrasives in a larger amount than the amount actually fixed to the wire core material. was there. Further, when a wire saw to which abrasive grains are fixed by an electrodeposition method is used, there is a tendency that a cut surface is rough and a good finished surface is hardly obtained. Further, there is a problem that the wire saw is likely to be broken in a reel having a small curvature or the like due to metal fatigue of the plated metal used for the electrodeposition. JP-A-8-12
No. 6953 proposes a wire saw in which abrasive grains are dispersed and fixed to a core wire of polyethylene, nylon, polyester or the like via a synthetic resin adhesive. Using this wire saw, it is said that the residual processing distortion after cutting such as silicon ingot is small and high quality products can be obtained stably, but the core wire of polyethylene, nylon, polyester etc. is compared with metal wire. Since both the tensile strength and the elastic modulus were low, the tension applied to the wire saw at the time of cutting was limited, and the wire saw often broke. In addition, it is difficult to uniformly bond the abrasive grains and the synthetic resin to the core material, and further, it is difficult to obtain roundness about the axis of the core wire, and the abrasive grain layer is biased or the thickness is different. There was a problem. For this reason, there has been a demand for a wire saw manufacturing method, a manufacturing apparatus, and a wire saw that can be easily manufactured, can apply a large tension at the time of cutting, have few disconnections, and have a good cut surface finish.

[0003]

When the present invention is used for cutting a brittle material such as a silicon ingot, a large tension can be applied, the disconnection is small, the material loss due to the cutting margin is small, and the cut surface can be cut. An object of the present invention is to provide a wire saw manufacturing method, a manufacturing apparatus, and a wire saw manufactured by the method, which have a good finish and can be easily manufactured at high speed.

[0004]

Means for Solving the Problems The inventors of the present invention have made intensive studies to solve the above-mentioned problems, and as a result, applied a powder adhesive and abrasive grains to a wire core material, and heated and applied. By sintering the attached powder adhesive and fixing the abrasive grains to the surface of the wire core material, a wire saw can be easily manufactured at high speed, and when this material is used to cut a brittle material, It has been found that the number of disconnections during the operation is small and the finish of the cut surface is good, and the present invention has been completed based on this finding. That is, the present invention provides (1) applying a powder adhesive and abrasive grains to a metal wire core, and sintering the applied powder adhesive to apply the abrasive grains to the surface of the wire core. (2) A method for manufacturing a wire saw, characterized in that the powder adhesive and abrasive grains are simultaneously applied to a wire core material and the applied powder adhesive is sintered. (3) A powder adhesive is applied to the wire core material, the applied powder adhesive is temporarily sintered, and a grinding is performed on the temporarily sintered powder adhesive. The method for producing a wire saw according to (1), wherein the powder adhesive is further heated and sintered after the particles are applied. (4) The powder adhesive and the abrasive grains are charged and directed toward the wire core material. (1) The method for producing a wire saw according to (1), wherein the powder adhesive and the abrasive are fluidized and fluidized at the bottom of the booth. Pull the powder adhesive and the abrasive grains discharged from the top of the booth to the booth, the performing coating with to the introduced wire core within the booth
(1) The method for producing a wire saw according to (1), (6) a coating device for coating a powder adhesive and abrasive grains on a metal wire core,
A wire saw manufacturing apparatus, comprising: a heating device for fixing the abrasive grains to the surface of the wire core material by sintering the applied powder adhesive;
The coating device for simultaneously applying a powder adhesive and abrasive grains to a wire core material, wherein the heating device is a baking furnace that sinters the applied powder adhesive. A wire saw manufacturing apparatus, (8) a first apparatus for applying a powder adhesive by an applying apparatus;
And a second coating device for coating abrasive grains, wherein the heating device temporarily sinters the powder adhesive applied to the wire core material by the first coating device. After the abrasive grains are applied on the powder adhesive in the pre-sintered state by the baking furnace 1 and the second coating device, the powder adhesive is further heated and sintered. (9) The wire saw manufacturing apparatus according to the above (6), comprising a baking furnace, and (9) a coating apparatus having an electrostatic powder coating gun for charging the powder adhesive and the abrasive grains and spraying the charged powder onto the base material. (6) The apparatus for manufacturing a wire saw according to the item (6), (10)
A booth in which the coating device has a wire core material held therein,
A fluidized bed of powder adhesive and abrasive grains formed at the bottom of the booth and open at the top, and a blowing device that pulls out the powder adhesive and abrasive grains from the fluidized bed and blows out the booth from the top of the booth. (6) A wire saw manufacturing apparatus according to (6), and (11) a wire saw manufactured by the manufacturing method according to (1).

[0005]

BEST MODE FOR CARRYING OUT THE INVENTION The method for manufacturing a wire saw according to the present invention comprises applying a powder adhesive and abrasive grains to a wire core material, and sintering the applied powder adhesive to attach the abrasive grains to the wire core. It is fixed on the surface of the material. There is no particular limitation on the metal wire core material used in the method of the present invention, for example, a steel wire such as a piano wire, an aluminum wire, a steel wire, a hard steel wire, a stainless steel wire,
Examples thereof include metal wires such as an iron wire, a nickel wire, a titanium wire, a tungsten wire, and a molybdenum wire. There is no particular limitation on the powder adhesive used in the method of the present invention. For example, thermosetting powder adhesives such as polyester-based adhesives, acrylic-based adhesives, epoxy-based adhesives, phenolic-based adhesives, and polyimide-based adhesives Agent, vinyl chloride resin adhesive,
Examples include thermoplastic powder adhesives such as nylon adhesives, polyethylene resin adhesives, and fluororesin adhesives. Among these, the thermosetting powder adhesive can be suitably used because it has good adhesion to the wire core material and forms an abrasive layer in which the abrasive is firmly fixed.
In the method of the present invention, a filler or a lubricant can be added to the powder adhesive as needed. Examples of the filler to be mixed include carborundum, silica stone powder, antimony trioxide, clay, mica, alumina, silica, and the like, and metal powder such as iron and copper. Examples of the lubricant to be blended include molybdenum disulfide and graphite.

The abrasive used in the method of the present invention is not particularly limited. Examples thereof include superabrasives such as diamond and cBN, powders obtained by grinding basalt, granite, tuff, etc., cerium oxide, sapphire, ruby, garnet, and carbonized. General abrasive grains such as silicon and aluminum oxide can be used. Among them, diamond abrasive grains and cBN abrasive grains can be used particularly preferably because they can cut brittle materials such as silicon ingots efficiently and sharply. In the method of the present invention, after applying a powder adhesive and abrasive grains to the wire core material, by heating, in the case of a thermosetting powder adhesive, the resin is melted and cured, and the thermoplastic powder is cured. In the case of an adhesive, the resin is melted and sintered, and a resin layer is formed on the surface of the wire core material to form an abrasive layer in which abrasive particles are fixed. The heating conditions can be selected according to the properties of the used powder adhesive, but are usually 120 to
The abrasive grains can be fixed by sintering at 200 ° C. for 10 to 30 minutes to form an abrasive layer. In the method of the present invention, a powder adhesive and abrasive grains are applied to a metal wire core, and the abrasive grains are wired by sintering of the applied powder adhesive and fixed to the surface of the core material. Therefore, the production speed of the wire saw is high, and a long wire saw with high efficiency can be manufactured. In addition, the resin layer that fixes the abrasive grains to the surface of the wire core is softer and smoother than the metal layer formed by electrodeposition, so the cut surface is smooth and a good finished surface is obtained. There is no accident such as disconnection of the wire saw due to metal fatigue as in the formed metal layer.

In the method of the present invention, a powder adhesive and abrasive grains are simultaneously applied to a wire core material, and the applied powder adhesive is sintered, whereby the abrasive grains are coated on the surface of the wire core material. Can be fixed. By simultaneously applying the powder adhesive and the abrasive grains, sintering the applied powder adhesive and fixing the abrasive grains to the surface of the wire core material, a so-called one coat,
It is possible to manufacture wire saws by one bake method,
Wire saws can be manufactured quickly and economically.
In the method of the present invention, a powder adhesive is applied to the wire core material, the applied powder adhesive is temporarily sintered, and abrasive grains are applied on the temporarily sintered powder adhesive. Thereafter, the powder adhesive can be further heated and sintered. After the abrasive particles are applied on the powder adhesive in the pre-sintered state, the powder adhesive is further heated and sintered, so that the application amount and the application state of the powder adhesive and the abrasive particles Can be individually controlled, the management of the manufacturing process becomes easy, and the abrasive grains are uniformly arranged in the outermost layer of the wire saw to contribute to cutting, so that the sharpness of the wire saw is improved. In the method of the present invention, the coating can be performed by charging the powder adhesive and the abrasive grains and spraying the charged particles toward the metal wire core material. There is no particular limitation on the method of charging the powder adhesive and the abrasive grains and spraying the powder onto the wire core material. For example, the method can be performed using an electrostatic powder coating gun, a charging pin, a friction charging device, or the like. There is no particular limitation on the order of applying the powder adhesive and the abrasive grains, for example, the powder adhesive and the abrasive grains are mixed and charged,
At the same time, it can be applied to the wire core material, the powder adhesive is charged and applied to the wire core material, and after pre-sintering, the abrasive particles are charged on the pre-sintered powder adhesive. The powder adhesive can be further heated and sintered by heating, or the powder adhesive is applied and pre-sintered, and the abrasive grains are charged and applied. The powder adhesive may be charged and applied and sintered.

[0008] The charging of the powder adhesive and the abrasive grains can be either positive or negative. However, it is necessary to ground the wire core material and negatively charge the powder adhesive and the abrasive grains. This is preferable because the state of adhesion of the particles to the wire core material is improved.
When the powder adhesive and abrasive grains are charged and applied to the grounded wire core, the powder adhesive and abrasive grains are evenly distributed on the surface of the wire core located on the back side in the spray direction by the wrap-around effect. To form an abrasive layer having a uniform thickness and a distribution of abrasive grains on the surface of the wire core material. In the method of the present invention, when metal particles having electrical conductivity are used as the abrasive grains, the abrasive grains can be charged by forming a coating layer made of an insulator on the surface of the abrasive grains in advance. In the method of the present invention, the powder adhesive and the abrasive grains are fluidized at the bottom of the booth, the fluidized powder adhesive and the abrasive grains are drawn out, blown out from the top of the booth into the booth, and introduced into the booth. Application to the wire core material can be performed. By blowing powder adhesive and abrasive particles fluidized at the booth bottom from the booth into the booth, powder adhesive and abrasive particles not applied to the wire core are automatically collected at the booth bottom. Since it is completely recirculated and reused, it is possible to produce a wire saw economically without troublesome recovery of powder adhesive and abrasive grains, without loss of powder adhesive and abrasive grains. it can. In the wire saw manufactured by the method of the present invention, since abrasive grains are fixed to the surface of the wire core material by a resin layer made of a sintered powder adhesive, there is no need to use oil as a lubricant during cutting. In addition, contamination by oil can be avoided. Further, since the method of the present invention is a dry process, no waste liquid or the like is generated and the load on the environment is small.

FIG. 1 is an explanatory view of one embodiment of a method for manufacturing a wire saw according to the present invention. The wire core 1 runs by being driven by rotating pulleys 2 and 3. In addition, the wire core is grounded. The method of grounding the wire core is not particularly limited, but in this embodiment, the wire core is grounded via the pulley 2 made of a conductor. In this embodiment, two electrostatic powder coating guns 4 and 5 are provided, and a negatively charged powder adhesive is supplied from the electrostatic powder coating gun 4 and applied to the wire core material. Negatively charged abrasive grains are supplied from the electrostatic powder coating gun 5 and applied to the surface of the powder adhesive applied to the wire core material. The wire core material coated with the powdered resin and the abrasive grains is then sent to a baking furnace 6 where the powder adhesive is melted, hardened and sintered by heating, and the abrasive grains are solidified. The wire saw is fixed and an abrasive layer is formed on the surface of the wire core. The wire saw is wound by a winding device via a rotating pulley 3. FIG. 2 is an explanatory view of another embodiment of the method for manufacturing a wire saw according to the present invention. The wire core 1 runs by being driven by rotating pulleys 2 and 3. In addition, the wire core is grounded. The method of grounding the wire core is not particularly limited, but in this embodiment, the wire core is grounded via the pulley 2 made of a conductor. In this embodiment, two electrostatic powder coating guns 4 and 5 are provided, and a negatively charged powder adhesive is supplied from the electrostatic powder coating gun 4 to be applied to the wire core material and baked. By being heated in the furnace 6, the applied powder adhesive is temporarily sintered. Next, negatively charged abrasive grains are supplied from the electrostatic powder coating gun 5, applied to the surface of the powder adhesive in a pre-sintered state, sent to the baking furnace 6, and heated. The powder adhesive is melted, hardened and sintered, the abrasive grains are firmly fixed, and an abrasive layer is formed on the surface of the wire core to form a wire saw. The wire saw is wound by a winding device via a rotating pulley 3.

FIG. 3 is an explanatory view of another embodiment of the method for manufacturing a wire saw according to the present invention. In the present embodiment, the five wire cores 1 are driven by the rotating multi-groove pulleys 7 and 8 to travel. In addition, the wire core is grounded. Although there is no particular limitation on the method of grounding the wire core, in this embodiment, the wire core is grounded via the multi-groove pulley 7 made of a conductor. In this embodiment, an electrostatic powder coating gun 9 is provided, and a mixture of a negatively charged powder adhesive and abrasive grains is supplied and applied to a wire core material. The wire core material coated with the powder adhesive and the abrasive grains is then sent to a baking furnace 6 where the powder adhesive is melted by heat treatment.
Hardened and sintered, the abrasive grains are firmly fixed, and an abrasive layer is formed on the surface of the wire core material to form a wire saw. The wire saw is wound by a winding device via a rotating multi-groove pulley 8. FIG. 4 is an explanatory view of another embodiment of the method for manufacturing a wire saw according to the present invention. In this embodiment,
Five wire cores 1 are driven and driven by rotating multi-groove pulleys 7 and 8. In addition, the wire core is grounded. Although there is no particular limitation on the method of grounding the wire core, in this embodiment, the wire core is grounded via the multi-groove pulley 7 made of a conductor. In this embodiment, two sets of three electrostatic powder coating guns 10 and 11 are provided to face the plane formed by the five wire cores, and three sets of The charged powder adhesive is supplied and applied to the wire core, and the negatively charged abrasive grains are supplied from the electrostatic powder coating gun 11 to apply the powder adhesive applied to the wire core. Is applied to the surface of The wire core material coated with the powder adhesive and the abrasive grains is then sent to a baking furnace 6 where the powder adhesive is melted, hardened and sintered by a heat treatment, and the abrasive grains are hardened. , And an abrasive layer is formed on the surface of the wire core material to form a wire saw. The wire saw is wound by a winding device via a rotating multi-groove pulley 8.

FIG. 5 is an explanatory view of one embodiment of a wire saw manufactured by the method of the present invention. FIG. 5 (a) is a schematic sectional view of a wire saw having a high abrasive grain density, and FIG.
FIG. 5C is a schematic side view, and FIG. 5C is a schematic sectional view of a wire saw having a small abrasive grain density. In the wire saw of the present embodiment, a single wire 12 is used as a core material, and a resin layer 13 adheres abrasive grains 14 on the surface thereof to form an abrasive layer. FIG. 6 is an explanatory view of another embodiment of the wire saw manufactured by the method of the present invention, FIG. 6 (a) is a schematic cross-sectional view of a wire saw having a large abrasive grain density, and FIG. FIG. 6C is a schematic cross-sectional view of a wire saw having a small abrasive grain density. In the wire saw of this embodiment, a stranded wire 15 is used as a core material, and a resin layer 13 adheres abrasive grains 14 on the surface thereof to form an abrasive layer.
In the method of the present invention, the particle size of the abrasive used is preferably 50 μm or less. When the particle size of the abrasive grains exceeds 50 μm, the diameter of the obtained wire saw becomes large, the cutting margin when cutting the material increases, and the loss of the material may increase. The outermost diameter of the wire saw produced by the method of the present invention is preferably from 120 to 500 μm. If the outermost diameter of the wire saw is less than 120 μm, the strength of the wire saw may be insufficient. If the outermost diameter of the wire saw exceeds 500 μm, the margin for cutting the material may increase, and the loss of the material may increase.

According to the wire saw manufacturing method of the present invention,
Since the abrasive grains are fixed to the surface of the wire core material with a powder adhesive, the production speed is faster than the fixing of the abrasive grains by electrodeposition.
At a speed of ５０50 m / min, a long wire saw having a length of several tens of km or more can be easily manufactured. Also, because the binder of the abrasive grains is a resin, when cutting a brittle material such as a silicon ingot, it is better than when using a wire saw by an electrodeposition method in which the abrasive grains are fixed with a metal such as nickel. A cut surface with a good finish can be obtained. The wire saw by the electrodeposition method is liable to break due to metal fatigue of plated metal when used for a long time, but the wire saw manufactured by the method of the present invention uses a resin as a binder, so the wire saw is disconnected due to fatigue of the binder. Is less likely to occur. In the method of the present invention, since the powder adhesive and abrasive grains are applied to the wire core material, compared with the resin immersion method,
The powder adhesive and the abrasive can be applied to the surface of the wire core material at a uniform thickness and at a high speed. In addition, since a large number of wire cores can be run in parallel, and at the same time, a large number of wire cores can be coated with a powder adhesive and abrasive grains and subjected to heat treatment, the wire saw can be manufactured with high productivity. Can be manufactured. The wire saw of the present invention is manufactured by the above manufacturing method.

An apparatus for manufacturing a wire saw according to the present invention includes a coating device for coating a surface of a metal wire core with a powder adhesive and abrasive grains, and a powder adhesive coated by the coating device. And a heating device for fixing the abrasive grains to the surface of the wire core material by sintering. The device of the present invention uses a coating device for simultaneously applying a powder adhesive and abrasive grains to a wire core material as a coating device, and sinters the coated powder adhesive as a heating device. A furnace can be used. In the apparatus of the present invention, the coating device includes a first coating device that applies a powder adhesive, and a second coating device that applies abrasive particles, and the heating device includes a first coating device. A first baking furnace for temporarily sintering the powder adhesive applied to the wire core material with the device;
After the abrasive grains are applied on the powder adhesive in the pre-sintering state by the second coating device, the powder adhesive is further heated and sintered so as to be composed of a second baking furnace. It can also be configured. In the device of the present invention, the coating device may include an electrostatic powder coating gun that charges the powder adhesive and the abrasive grains and sprays the powder adhesive and the abrasive toward the wire core material. Alternatively, as a coating device, a booth in which a wire core material is held, a fluidized bed of powder adhesive and abrasive grains formed at the bottom of the booth and open at the top, and powder bonding from the fluidized bed. It is also possible to use a device provided with a blowing device that draws out the agent and abrasive grains and blows out the booth from the upper part of the booth.

FIG. 7 is a system diagram of one embodiment of the device of the present invention. The manufacturing apparatus of the present embodiment includes a coating device 16 for applying a powder adhesive and abrasive grains to the surface of the wire core, and a powder adhesive applied to the surface of the wire core by the coating device. And a baking furnace 17 for sintering. FIG. 8 is an explanatory diagram illustrating a configuration of one embodiment of a coating device. At the bottom of booth 18,
A fluidized bed apparatus 19 for fluidizing the powder adhesive and the abrasive grains is detachably attached. The interior of the fluidized bed apparatus is open at the top and communicates with the booth.
0 divides the chamber into an upper chamber and a lower chamber. Pressurized air is supplied to the lower chamber through an air inlet (not shown), and an injector 21 is attached to a side wall of the upper chamber. A wire core material 22 is introduced into the upper part of the booth in a state of being electrically grounded, and can be moved in the length direction. An electrostatic powder coating gun 23 is attached to the side wall surface in the booth toward the wire core material, and an injector of the fluidized bed apparatus is connected to the electrostatic powder coating gun via a hose 24. . A high voltage power supply 25 is electrically connected to the electrostatic powder coating gun.

In order to apply the powder adhesive and the abrasive grains to the wire core using the applying apparatus of the present embodiment, the fluidized bed apparatus 19 is used.
The powder adhesive and the abrasive grains are accommodated in, for example, a volume ratio of 1: 1 in the upper chamber, and pressurized air is supplied to the lower chamber. Thereby, the mixture of the powder adhesive and the abrasive grains is fluidized. Here, when pressurized air is supplied to the injector 21, the mixture of the powder adhesive and the abrasive particles fluidized in the upper chamber of the fluidized bed apparatus is drawn out to the hose 24, and the electrostatic powder coating gun 2
3 is supplied. At this time, a corona discharge is generated from the discharge pin of the electrostatic powder coating gun toward the wire core material 22 that is electrically grounded, and the powder adhesive and the abrasive grains are charged by ions generated by the corona discharge. It is blown out into the booth 18 and receives electric force from an electrostatic field formed between the discharge pin and the wire core, and adheres to the surface of the wire core. The powder adhesive and abrasive particles that have not fallen on the surface of the wire core material and fall by their own weight return to the upper chamber of the fluidized bed apparatus and are reused, so it takes time to collect the powder adhesive and abrasive particles. No powder adhesive and abrasive grains are wasted. FIG. 9 is a partial cross-sectional view of a wire core material surface portion,
FIG. 9A shows a state where the powder adhesive and the abrasive grains are applied, and FIG. 9B shows a state where the powder adhesive is sintered. Powder adhesive 26 and abrasive grains 27 attached to the surface of wire core material 22
The powder adhesive is sintered to form the resin layer 28, the abrasive grains are fixed, and an abrasive layer is formed on the surface of the wire core material.

FIG. 10 is a system diagram of another embodiment of the device of the present invention. The manufacturing apparatus of this embodiment includes a first coating device 29 for coating a powder adhesive on the surface of a wire core material, a second coating device 30 for coating abrasive grains, and a wire coating device. Baking furnace 1 for sintering powder adhesive applied to the surface of core material
7 is provided. The first coating device and the second coating device may be configured as shown in FIG. FIG.
FIG. 3 is a partial cross-sectional view of a surface portion of a wire core material. When the apparatus of the embodiment shown in FIG. 10 is used, the state shown in FIG. 11A in which the powder adhesive 26 adheres to the surface of the wire core material by the first coating device is obtained. Further abrasive grains 27
When the powder adhesive is sintered, the state shown in FIG. 11B is obtained in which the abrasive grains 27 are fixed by the resin layer 28. FIG. 12 is a system diagram of another embodiment of the device of the present invention. The manufacturing apparatus of the present embodiment includes a first coating device 29 for coating a powder adhesive on the surface of a wire core material.
A first baking furnace 31 for temporarily sintering the powder adhesive applied by the first applying device, a second applying device 30 for applying abrasive grains, and a second applying device A second baking furnace 32 is provided for further heating and sintering the adhesive in a pre-sintered state after applying the abrasive grains with the apparatus. First coating device and second coating device
Can be an apparatus having a configuration shown in FIG. FIG. 13 is a partial cross-sectional view of the surface portion of the wire core material.
When the apparatus of the embodiment shown in FIG. 12 is used, the state is shown in FIG. 13A in which the powder adhesive 26 is adhered to the surface of the wire core material by the first coating apparatus. The state shown in FIG. 13B in which the adhesive layer 33 in the temporarily sintered state is formed by sintering, and the state shown in FIG. 13C in which the abrasive particles 27 are further adhered by the second coating device When the powder adhesive is sintered, a state shown in FIG. 13D in which the abrasive grains 27 are fixed by the resin layer 28 is obtained.

FIG. 14 is an explanatory view showing the configuration of another embodiment of the coating apparatus. The coating device of this embodiment can be used as the coating device of the manufacturing device of the embodiment shown in FIG. 7 and the first and second coating devices of the manufacturing device of the embodiments shown in FIGS. 10 and 12. In the coating device of this embodiment, the booth 34 has a perforated plate 3
The upper chamber and the lower chamber are divided into two sections by the pressurized air 5, and the lower chamber is supplied with pressurized air through an air inlet 36. Further, a plurality of discharge pins 37 project from the lower chamber through the perforated plate and project into the upper chamber, and a high-voltage power supply 38 is electrically connected to these discharge pins. On the other hand, the wire core 22 is introduced into the upper chamber so as to be able to move in the length direction. Powder adhesive, abrasive grains or a mixture of powder adhesive and abrasive grains are accommodated in the upper chamber, and pressurized air is supplied from the air inlet to the lower chamber. It gushes, which causes the powder to fluidize and soar into the booth. At this time, a corona discharge is generated from a discharge pin to which a high potential is applied from a high-voltage power supply toward an electrically grounded wire core material, and the powder is charged by ions generated by the corona discharge, and the discharge is performed. Receiving an electric force from an electrostatic field formed between the pin and the wire core, it adheres to the surface of the wire core. FIG. 15 is an explanatory diagram illustrating the configuration of another embodiment of the coating apparatus. The coating device of this embodiment can be used as the coating device of the manufacturing device of the embodiment shown in FIG. 7 and the first and second coating devices of the manufacturing device of the embodiments shown in FIGS. 10 and 12. The coating device of this embodiment is the same as the coating device of the embodiment shown in FIG.
3 is attached to the ceiling of the booth 18 downward, and a pair of electrode plates 39 is suspended in the booth so as to sandwich the wire core material 22 from both sides thereof, and a high-voltage power supply 40 is electrically connected to these electrode plates. It is the one that was connected in a way. By applying a potential to the electrode plate by a high voltage power supply and forming an electrostatic field between the electrode plate and the wire core material at the ground level, the powder that is ejected from the electrostatic powder coating gun and floats in the booth Powder composed of an adhesive, abrasive grains, or a mixture of powder adhesive and abrasive grains receives electric force from an electrostatic field and efficiently adheres to the surface of the wire core material.

FIG. 16 is an explanatory view showing the configuration of another embodiment of the coating apparatus. The coating device of this embodiment can be used as the coating device of the manufacturing device of the embodiment shown in FIG. 7 and the first and second coating devices of the manufacturing device of the embodiments shown in FIGS. 10 and 12. The application device of this embodiment is different from the application device of the embodiment shown in FIG. 8 in that, instead of the electrostatic powder coating gun 23, the spray nozzle 41 is attached downward to the ceiling of the booth 18 and the spray nozzle is attached to the spray nozzle. The friction charging device 42, the fixed amount supply device 43, and the powder tank 44 are sequentially connected, and the injector 2 of the fluidized bed device 19 is connected to the powder tank via the hose 24.
1 are connected. The frictional charging device arranges a charged body in a conveying pipe for conveying powder, and applies vibration to the powder conveyed in the conveying pipe by vibrating means to promote contact between the powder and the charged body, and disperses the powder. To charge. When pressurized air is supplied to the lower chamber of the fluidized bed apparatus, the pressurized air is ejected through the perforated plate 20 into the upper chamber containing the powder,
Thereby, the powder is fluidized. Here, when pressurized air is supplied to the injector, the powder fluidized in the upper chamber of the fluidized bed device is drawn out by a hose and supplied to the powder tank. The powder in the powder tank is quantitatively supplied to the friction charging device by the quantitative supply device, charged by the friction charging device, then blown out from the spray nozzle into the booth, and adheres to the surface of the wire core material.

[0019]

EXAMPLES The present invention will be described in more detail with reference to the following Examples, which should not be construed as limiting the present invention. Example 1 A wire saw was manufactured using a piano wire having a diameter of 0.2 mm as a core material. Diamond abrasive grains having a particle size of 30 to 40 μm were used as the abrasive grains, and an acrylic resin [hagawa Seisakusho, particle size 20 μm] was used as the powder resin. The electrostatic powder coating was performed using a quantitative supply device [Nihon Parkerizing Co., Ltd., Unifeed] and a corona charged type hand gun [Nihon Parkerizing Co., Ltd., GX106N]. The powder resin and the abrasive grains were mixed in a weight ratio of 80:20, put into a paint tank, and subjected to electrostatic powder coating under the conditions of a paint supply pressure of 2.0 kg / cm ² and an applied voltage of −60 kV. The powder resin and the abrasive grains were uniformly attached to the surface of the piano wire. Piano wire with powder resin and abrasive particles attached was sent to an infrared drying oven,
The powder resin was melt-hardened by heating for 0 minutes. A wire saw having an average outermost diameter of 286 μm in which a uniform abrasive layer having an average thickness of 43 μm was formed on the surface of the piano wire was obtained. Using this wire saw, peripheral speed 120m / min
A wire saw having a total length of 20 m was reciprocated to cut a 6-inch silicon ingot with a pressing load of 400 g, a wire tension of 3.5 kgf, and a cutting fluid using water. The time required for cutting was 4.8 hours for the first sheet, 6.0 hours for the second sheet, 6.4 hours for the third sheet, and 6.6 hours for the fourth sheet. Example 2 A wire saw was produced in the same manner as in Example 1 except that a piano wire having a diameter of 0.18 mm was used as a core material and diamond abrasive grains having a particle diameter of 20 to 30 μm were used as abrasive grains. A wire saw having an average outermost diameter of 246 μm, in which a uniform abrasive layer having an average thickness of 33 μm was formed on the surface of the piano wire, was obtained. Using this wire saw, a 6-inch silicon ingot was cut in the same manner as in Example 1. The time required for cutting was
The first sheet was 6.0 hours, the second sheet was 6.5 hours, the third sheet was 7.5 hours, and the fourth sheet was 6.0 hours.

Example 3 A wire saw was produced in the same manner as in Example 1 except that a phenol resin [hagawa Seisakusho, particle size: 20 μm] was used as the powder resin. The powder resin and the abrasive grains were mixed in a weight ratio of 80:20, put in a paint tank, and electrostatic powder coating was performed under the conditions of a paint supply pressure of 2.0 kg / cm ² and an applied voltage of −80 kV. The powder resin and the abrasive grains were uniformly attached to the surface of the piano wire.
The piano wire to which the powder resin and the abrasive grains adhered was sent to an infrared drying oven, and heated at 180 ° C. for 30 minutes to melt and cure the powder resin. On the surface of piano wire, thickness average 41μ
Thus, a wire saw having an average outermost diameter of 282 μm on which a uniform abrasive layer of m was formed was obtained. Using this wire saw, a 6-inch silicon ingot was cut in the same manner as in Example 1. The time required for cutting was 5.0 hours for the first sheet, 6.0 hours for the second sheet, 7.0 hours for the third sheet, 6.6 hours for the fourth sheet, and 7.9 hours for the fifth sheet. Example 4 A wire saw was produced in the same manner as in Example 3, except that a piano wire having a diameter of 0.25 mm was used as a core material and diamond abrasive grains having a particle diameter of 10 to 20 μm were used as abrasive grains. A wire saw having an average outermost diameter of 296 μm in which a uniform abrasive layer having an average thickness of 23 μm was formed on the surface of the piano wire was obtained. Using this wire saw, a 6-inch silicon ingot was cut in the same manner as in Example 1. The time required for cutting was
The first sheet was 7.5 hours, the second sheet was 8.7 hours, the third sheet was 8.0 hours, and the fourth sheet was 5.8 hours.

Example 5 A wire saw was manufactured by a method in which a powder resin and abrasive grains were sequentially adhered to a piano wire using two electrostatic powder coating apparatuses. A piano wire having a diameter of 0.2 mm was used as a core material, diamond abrasive grains having a particle diameter of 30 to 40 μm were used as abrasive grains, and an acrylic resin (hamogawa Seisakusho, particle size 20 μm) was used as a powder resin. In addition, the electrostatic powder coating is performed by a quantitative supply device [Nihon Parkerizing Co., Ltd., Unifeed] and a corona charged type handgun [Nihon Parkerizing Co., Ltd., GX106]
N] were used. The powder resin was put in the paint tank of the first powder coating apparatus, and the abrasive grains were put in the paint tank of the second powder coating apparatus. The first powder coating apparatus was operated under the conditions of a paint supply pressure of 2.0 kg / cm ² and an applied voltage of −60 kV to cause powder resin to adhere to the piano wire. By operating at a supply pressure of 3.0 kg / cm ² and an applied voltage of −80 kV, abrasive grains were adhered to the surface of the powder resin adhered to the piano wire. The piano wire was covered with a powder resin, and the abrasive grains were uniformly attached to the surface. Piano wire with powder resin and abrasive particles attached is sent to an infrared drying oven,
The powder resin was melt-hardened by heating at 180 ° C. for 20 minutes. A wire saw having an average outermost diameter of 288 μm in which a uniform abrasive layer having an average thickness of 44 μm was formed on the surface of the piano wire was obtained. Example 1 using this wire saw
6 inch silicon ingot was cut in the same manner as described above. The time required for cutting was 4.2 hours for the first sheet and 5.
3 hours, the third sheet was 7.0 hours, and the fourth sheet was 4.3 hours.

Example 6 Using three electrostatic powder coating apparatuses, powder resin was applied to a piano wire.
A wire saw was prepared by a method in which abrasive grains and powder resin were adhered in this order. A piano wire having a diameter of 0.2 mm was used as a core material, diamond abrasive grains having a particle diameter of 30 to 40 μm were used as abrasive grains, and an acrylic resin (hamogawa Seisakusho, particle size 20 μm) was used as a powder resin. In addition, electrostatic powder coating uses a quantitative supply device [Nihon Parkerizing Co., Ltd., Unifeed] and a corona charged handgun [Nihon Parkerizing
Co., Ltd., GX106N]. The powder resin was put into the paint tanks of the first and third powder coating apparatuses, and the abrasive grains were put into the paint tanks of the second powder coating apparatus. The first powder coating apparatus was operated under the conditions of a paint supply pressure of 2.0 kg / cm ² and an applied voltage of −60 kV to cause the powder resin to adhere to the piano wire.
Operating under the conditions of a paint supply pressure of 3.0 kg / cm ² and an applied voltage of -80 kV, abrasive grains are adhered to the surface of the powder resin adhered to the piano wire. The operation was performed under the conditions of a pressure of 2.0 kg / cm ² and an applied voltage of −60 kV, so that the powder resin was adhered on the abrasive grains. The piano wire was covered with the powder resin, and the appearance of abrasive grains on the surface was partially observed. The piano wire to which the powder resin and the abrasive grains adhered was sent to an infrared drying oven, and heated at 180 ° C. for 20 minutes to melt and cure the powder resin. A wire saw having an average outermost diameter of 282 μm in which a uniform abrasive layer having an average thickness of 41 μm was formed on the surface of the piano wire was obtained. Using this wire saw, a 6-inch silicon ingot was cut in the same manner as in Example 1. The time required for cutting was 7.0 for the first sheet.
Time, second picture 8.2 hours, third picture 7.2 hours, fourth picture 4.
It was 4 hours, and the fifth sheet was 6.0 hours.

Example 7 Using a device similar to the device shown in FIG.
0 were produced simultaneously. Brass-plated piano wire with a diameter of 0.2 mm as core material, grain size 30 to 4 as abrasive grains
Acrylic resin [Hawakawa Seisakusho Co., Ltd., particle size: 20 μm] was used as a 0 μm diamond abrasive particle and powder resin. Also,
Electrostatic powder coating is a quantitative feeder [Nippon Parkerizing
And Unifeed] and a corona-charged handgun [Nippon Parkerizing Co., Ltd., GX106N]. 400 g powder resin and 100 g abrasive
Was uniformly mixed and placed in a paint tank. Further, 10 piano wires each weighing 1 kg were run in parallel with a pitch of 5 mm using a multi-groove pulley, under the conditions of a supply pressure of a mixture of powder paint and abrasive grains of 2.5 kg / cm ² and an applied voltage of −60 kV. Then, electrostatic powder coating was performed. The powder resin and the abrasive grains were uniformly attached to the surface of the piano wire. The piano wire to which the powder resin and the abrasive grains were adhered was sent to an infrared drying oven and heated at 180 ° C. for 10 minutes to melt and harden the powder resin, and then cooled and wound on a reel. Average thickness of 41μm on the surface of piano wire
A wire saw having an average outermost diameter of 282 μm on which a uniform abrasive layer was formed was obtained. Using this wire saw, a 6-inch silicon ingot was cut in the same manner as in Example 1. The time required for cutting was 5.2 hours for the first sheet and 6.
It was 4 hours, the third sheet was 7.6 hours, and the fourth sheet was 7.2 hours.
Table 1 shows the results of Examples 1 to 7.

[0024]

[Table 1]

[0025]

According to the method and apparatus for manufacturing a wire saw of the present invention, the production speed is faster than the fixing of abrasive grains by the electrodeposition method, and a long wire saw of several tens km or more can be easily manufactured in a short time. Can be manufactured. Further, since the binder of the abrasive grains is a resin layer, a cut surface with a good finish can be obtained when a brittle material such as a silicon ingot is cut.
Further, since the binder of the abrasive grains is a resin layer, there is little possibility of disconnection due to fatigue of the binder.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram of one embodiment of a method for manufacturing a wire saw according to the present invention.

FIG. 2 is an explanatory view of another embodiment of the method for producing a wire saw of the present invention.

FIG. 3 is an explanatory view of another embodiment of the method for manufacturing a wire saw according to the present invention.

FIG. 4 is an explanatory view of another embodiment of the method for manufacturing a wire saw according to the present invention.

FIG. 5 is an explanatory diagram of one embodiment of a wire saw manufactured by the method of the present invention.

FIG. 6 is an explanatory view of another embodiment of the wire saw manufactured by the method of the present invention.

FIG. 7 is a system diagram of one embodiment of the device of the present invention.

FIG. 8 is an explanatory diagram showing a configuration of one embodiment of a coating device.

FIG. 9 is a partial cross-sectional view of a surface portion of a wire core material.

FIG. 10 is a system diagram of another embodiment of the device of the present invention.

FIG. 11 is a partial cross-sectional view of a surface portion of a wire core material.

FIG. 12 is a system diagram of another embodiment of the device of the present invention.

FIG. 13 is a partial cross-sectional view of a surface portion of a wire core material.

FIG. 14 is an explanatory diagram showing the configuration of another embodiment of the coating apparatus.

FIG. 15 is an explanatory diagram showing the configuration of another embodiment of the coating device.

FIG. 16 is an explanatory view showing the configuration of another embodiment of the coating apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Wire core material 2 Pulley 3 Pulley 4 Electrostatic powder coating gun 5 Electrostatic powder coating gun 6 Baking furnace 7 Multi groove pulley 8 Multi groove pulley 9 Electrostatic powder coating gun 10 Electrostatic powder coating gun 11 Electrostatic Powder coating gun 12 Solid wire 13 Resin layer 14 Abrasive particles 15 Twisted wire 16 Coating device 17 Baking furnace 18 Booth 19 Fluidized bed device 20 Perforated plate 21 Injector 22 Wire core material 23 Electrostatic powder coating gun 24 Hose 25 High Voltage power supply 26 Powder adhesive 27 Abrasive grains 28 Resin layer 29 First coating device 30 Second coating device 31 First baking furnace 32 Second baking furnace 33 Adhesive layer in pre-sintered state 34 Booth 35 Perforated plate 36 Air inlet 37 Discharge pin 38 High voltage power supply 39 Electrode plate 40 High voltage power supply 41 Spray nozzle 42 Friction charging device 43 Quantitative supply device 44 Powder tank

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Tomoyoshi Hara 787 Tao, Ichihara-shi, Chiba Asahi Diamond Engineering Co., Ltd. Do Kogyo Co., Ltd.

Claims (11)

[Claims] 1. A method of applying a powder adhesive and abrasive grains to a metal wire core material and fixing the abrasive grains to the surface of the wire core material by sintering the applied powder adhesive. Characteristic method of manufacturing a wire saw. 2. The method for producing a wire saw according to claim 1, wherein a powder adhesive and abrasive grains are simultaneously applied to the wire core material, and the applied powder adhesive is sintered. 3. A powder adhesive is applied to the wire core material, the applied powder adhesive is temporarily sintered, and abrasive grains are applied on the temporarily sintered powder adhesive. 2. The method according to claim 1, wherein the powder adhesive is further heated and sintered. 4. The method for producing a wire saw according to claim 1, wherein the powder adhesive and the abrasive grains are charged and sprayed toward the wire core material to perform coating. 5. The powder adhesive and abrasive grains are fluidized at the bottom of the booth, and the fluidized powder adhesive and abrasive grains are drawn out and blown into the booth from the top of the booth, and the wire introduced into the booth The method for manufacturing a wire saw according to claim 1, wherein the core material is applied. 6. An applicator for applying a powder adhesive and abrasive grains to a metal wire core, and sintering the applied powder adhesive to convert the abrasive grains of the wire core. An apparatus for manufacturing a wire saw, comprising a heating device fixed to a surface. 7. A coating device for simultaneously applying a powder adhesive and abrasive grains to a wire core, and a heating device for sintering the coated powder adhesive. 7. The wire saw manufacturing apparatus according to claim 6, wherein the apparatus is a furnace. 8. A coating device comprises a first coating device for applying a powder adhesive, and a second coating device for applying abrasive grains.
A first baking furnace for temporarily sintering the powder adhesive applied to the wire core material by the first coating device; and a powder bonding in a temporarily sintered state by the second coating device. 7. The wire saw manufacturing apparatus according to claim 6, further comprising a second baking furnace that further heats and sinters the powder adhesive after the abrasive particles are coated on the agent. 9. The wire saw manufacturing apparatus according to claim 6, wherein the coating apparatus has an electrostatic powder coating gun for charging the powder adhesive and the abrasive grains and spraying the charged powder and the abrasive toward the base material. 10. A coating apparatus comprising: a booth in which a wire core material is held; a fluidized bed of powder adhesive and abrasive grains formed on the bottom of the booth and opened upward; 7. The wire saw manufacturing apparatus according to claim 6, further comprising a blowing device that draws out the powder adhesive and the abrasive grains and blows the powder adhesive into the booth from above the booth. 11. A wire saw manufactured by the manufacturing method according to claim 1.