JPH1131720A - Bonding sheet with carrier film - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the sticking work of the bonding sheet, by a method wherein an opening larger than the stamping out size are made for stamping out the bonding sheets, thereby eliminating the removing step of the carrier films. SOLUTION: A semiconductor chip is bonded onto a base substrate 40 using a bonding sheet with a carrier film. Next, the carrier films 21, 22 having opening larger than the stamping out size of the bonding sheet 20 are aligned with the alignment holes 23 to be carried to a sticking device. Next, the bonding sheet 20 is stamped out to the bonding size by a press machine and then heated and pressed to be stuck onto a base substance 40 made of polyimide tape, etc. Finally, a semiconductor chip 50 is mounted on the bonding sheet 20 of the base substance 40 to be bonded while being pressed. In such a constitution, the opening parts 10 are made on both surfaces of the carrier films 21, 22 so that the bonding sheet 20 may not adhere during transportation into the press machine.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an adhesive sheet with a carrier film for use in lead frames for semiconductor devices, tape carriers, and the like, and more particularly to an adhesive sheet with a carrier film which is excellent in workability and can reduce costs. It is.

[0002]

2. Description of the Related Art An adhesive sheet is used for bonding a semiconductor chip or the like to a semiconductor package base such as a lead frame, a tape carrier or a printed circuit board. FIG. 4 shows this adhesive sheet. In the figure, (a) is a plan view, and (b) is BB of (a).
It is sectional drawing. The adhesive sheet 20 includes a thermoplastic resin,
A material such as a mixture of a thermoplastic resin and a thermosetting resin or a thermosetting resin is used, and the surface has tackiness (tackiness).

FIG. 5 shows a state in which a semiconductor chip is bonded on a substrate using this adhesive sheet. As shown in the figure, first, the conveyed adhesive sheet 20 is placed on a pressing machine 3.
0 to a predetermined size (FIG. 5 (a)), the punched adhesive sheet 20 is pressurized while being heated and adhered to the substrate 40 (FIG. 5 (b)).
The semiconductor chip 50 is mounted on the substrate 0 and bonded by heating and pressing (FIG. 5C).

However, as described above, since the surface of the adhesive sheet has adhesiveness, when the adhesive sheet is continuously adhered to the substrate while being transported, the adhesive sheet is adhered in the application device and transported. It becomes difficult, the stamping shape becomes abnormal due to the adhesion of the adhesive sheet to the press machine, and if the adhesive sheet has a low tensile strength, the adhesive sheet breaks during transportation and the workability decreases significantly. There is. In addition, since the feed amount of the adhesive sheet to the press machine is manually adjusted, the sticking position may deviate from a predetermined position or may vary.

[0005] For this reason, the inventor has studied to attach a carrier film to the surface of the adhesive sheet when carrying the adhesive sheet. FIG. 6 shows this adhesive sheet with a carrier film. In the drawings, (a) is a plan view, and (b) is a BB cross-sectional view of (a). This adhesive sheet with a carrier film has P
Carrier films 21 and 22 made of ET (polyethylene terephthalate) are adhered. Positioning holes for punching are provided at both ends in the width direction of the carrier films 21 and 22 at predetermined positions from outer edges at predetermined intervals. 23 are provided.

FIG. 7 shows a state in which a semiconductor chip is bonded on a base using the adhesive sheet with a carrier film. As shown in FIG.
The alignment is performed in step 3, and the sheet is transferred to the attaching device (FIG. 7A).
Immediately before punching, the carrier film 22 positioned between the base 40 and the adhesive sheet 20 is peeled off while being wound up, punched out by a press machine 30 (FIG. 7B), and heated while punching out the adhesive sheet 20. Pressurize substrate 4
7 (FIG. 7C), and before the semiconductor chip 50 is bonded, the carrier film 21 located between the bonding sheet 20 and the bonding surface of the semiconductor chip 50 is peeled off (FIG. 7C).
(D)) The semiconductor chip 50 is placed on the adhesive sheet 20 and adhered while applying heat and pressure (FIG. 7 (e)).

According to this adhesive sheet with a carrier film, since the carrier film is attached to both sides of the adhesive sheet, there is no abnormality in the adhesion or punching shape of the adhesive sheet in the attaching device, no breakage, and the like. Since holes for alignment are provided at both ends of the film, the sticking position does not deviate from a predetermined position and does not vary.

[0008]

However, according to the studied adhesive sheet with a carrier film, there are the following problems. (1) When bonding the adhesive sheet to the substrate, the carrier film located between the substrate and the bonding surface of the adhesive sheet is peeled off immediately before punching out the adhesive sheet, and the semiconductor chip is bonded to the adhesive sheet. In this case, it is necessary to remove the carrier film located between the semiconductor chip and the adhesive surface of the adhesive sheet before mounting the semiconductor chip, which is complicated. (2) In addition to this, the material cost of the carrier film is increased, and the adhesive sheet other than the punched portion cannot be used, so that the yield is poor and the cost is increased.

[0009]

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an adhesive sheet with a carrier film which is excellent in workability and can reduce costs.

[0010]

In order to achieve the above object, the present invention has a carrier film on one or both sides of an adhesive sheet, and the adhesive sheet conveyed by the carrier film is cut into a predetermined size. Punching,
In the adhesive sheet with a carrier film so that the adhesive sheet is attached to a substrate, the carrier film has an opening portion larger than the punching dimension of the adhesive sheet on at least one surface, and the adhesive sheet is An object of the present invention is to provide an adhesive sheet with a carrier film, wherein the adhesive sheet is configured to be punched at an opening.

In the above structure, the carrier film preferably has a positioning hole outside the opening, and the adhesive sheet has a width smaller than the carrier film and larger than the opening. Is desirable.

[0012]

BRIEF DESCRIPTION OF THE DRAWINGS FIG.
An embodiment of the present invention will be described in detail.

FIG. 1 shows an adhesive sheet with a carrier film according to an embodiment of the present invention. In the drawings, (a) is a plan view, and (b) is a BB cross-sectional view of (a).
Here, the same parts as those in FIGS. 4 to 7 are denoted by the same reference numerals and symbols, and thus redundant description will be omitted. However, a configuration in which an opening larger than the punching size of the adhesive sheet is provided in the carrier film. Is different from the conventional adhesive sheet with a carrier film.

That is, the adhesive sheet with a carrier film is adhered to both sides of the adhesive sheet 20 having a thickness of 50 μm and a width of 15 mm made of a mixture of a thermoplastic polyimide resin and a thermosetting epoxy resin.
Carrier films 21 and 22 made of PET (polyethylene terephthalate) having a thickness of 50 μm and a width of 29 mm in which a hole 10 (length 12 mm × width 12 mm) larger than an adhesion dimension (length 10 mm × width 10 mm) is opened at the center. It is composed of In the above configuration, positioning holes 23 (3 mm in diameter) are provided at both ends in the width direction of the carrier films 21 and 22 at an interval of 15 mm at a position 4 mm from the outer edge.
(Circle) is provided.

FIG. 2 shows a state in which a semiconductor chip 50 is bonded on a substrate 40 using an adhesive sheet with a carrier film according to an embodiment of the present invention. As shown in the figure, first, the carrier films 21 and 22 are positioned in the positioning holes 23 and conveyed to an attaching device, and the adhesive sheet 20 is punched out on a substrate 40 made of a polyimide tape or the like to an adhesive size (FIG. 2 (a)) and affix by heating and pressing (FIG. 2 (b)). Next, the semiconductor chip 50 is placed on the adhesive sheet 20 attached to the base 40, and is adhered to the adhesive sheet 20 while applying heat and pressure (FIG. 2).
(C)).

According to this embodiment, since the carrier films 21 and 22 having openings on both sides are used, the adhesive sheet 20 does not stick during transportation in the press device. Since there is no carrier film 21 on the adhesive sheet 20 that is adhered even at the time of adhesion, the semiconductor chip 50 can be mounted as it is and the attaching operation can be performed extremely efficiently. Further, since the carrier films 21 and 22 have the holes 23 for positioning, the carrier films 21 and 22 can be easily and continuously attached to the prescribed positions on the base 40.

FIG. 3 shows an adhesive sheet with a carrier film according to another embodiment of the present invention. This adhesive sheet with a carrier film is a carrier film 22 ′ having a thickness of 25 μm, an adhesive sheet 20 obtained by applying an adhesive varnish made of a thermosetting epoxy resin on the carrier film 22 ′, and then drying the adhesive sheet 20. Apertures 10 that are larger than the attached dimensions (length 10 mm x width 10 mm)
(Length 12mm x width 12mm) thickness 5
And a carrier film 21 having a width of 0 μm and a width of 29 mm. In the above configuration, the carrier film 22 ′
And the adhesive sheet 20 are slit to a width of 20 mm,
At both ends in the width direction of the carrier film 21, holes 2 for alignment are provided at a position 4 mm from the outer edge at an interval of 15 mm.
3 (diameter 3 mm circular) is provided.

Referring to FIG. 2, a state in which a semiconductor chip is bonded to a substrate using an adhesive sheet with a carrier film according to this embodiment will be described. First, a carrier film 22 'having a thickness of 25 μm is turned downward. To the sticking device and the carrier film 2 just before punching.
The adhesive sheet 20 is peeled off while being wound up, and the adhesive sheet 20 is punched into an adhesive size on the substrate 40, and is adhered by applying heat and pressure. Next, the semiconductor chip 50 is placed on the adhesive sheet 20 and bonded while heating and pressing.

According to this embodiment, the use of the carrier film 21 having an opening on one side only requires the carrier film 22 'to be peeled off immediately before punching, but does not cause sticking during transportation, and Semiconductor chip 5
Since the carrier film 21 does not remain on the adhesive sheet 20 on the base 40 at the time of bonding 0, the semiconductor chip 50 can be directly mounted and bonded. In addition, since the positioning holes 23 are provided, the positioning can be performed very easily.

As described above, according to the adhesive sheet with a carrier film of the present invention, at least one surface of the adhesive sheet has a carrier film that can be peeled off from the adhesive sheet, and the carrier film has an opening larger than an adhesive dimension. Thereby, there is no sticking in the apparatus at the time of transportation, and the step of peeling the carrier film at the time of bonding the base and the semiconductor chip can be omitted. Furthermore, since the carrier film can be reused, it contributes to cost reduction.

In addition, since there is a positioning hole outside the opening of the carrier film, it can be used for positioning and can be continuously conveyed and bonded.

Further, since the width of the adhesive sheet is smaller than the width of the carrier film, the loss of the adhesive sheet (the portion other than the punched portion) is smaller than that in the case where the positioning hole is formed on the adhesive sheet without using the carrier film. It has the advantage of being small.

If the size of the opening is smaller than the punched size of the adhesive sheet, the carrier film remains on the bonding surface after punching, resulting in a decrease in adhesive strength and a change in thickness. Therefore, it is necessary to make the size of the opening larger than the punched size of the adhesive sheet. Further, the structure of the opening can be freely designed as long as it is larger than the punching size of the adhesive sheet, and the shape of the punching hole can be set as needed.

[0024]

As described above, according to the adhesive sheet with a carrier film of the present invention, at least one surface of the carrier film is provided with an opening that is larger than the punched dimension of the adhesive sheet, and the adhesive sheet is removed from the opening. Since it is configured to be punched out, it is easy to carry it into the apparatus, and the step of removing the carrier film is not required, so that the operation of attaching the adhesive sheet can be performed extremely efficiently.
Further, by providing the positioning holes on the carrier film, the positioning of the attachment to the desired position can be easily performed. Further, since the width of the adhesive sheet is made smaller than the width of the carrier film, it is possible to reduce a loss other than the punched portion of the adhesive sheet, which can contribute to cost reduction.

[Brief description of the drawings]

FIG. 1 is a diagram showing an adhesive sheet with a carrier film according to an embodiment of the present invention, wherein (a) is a plan view and (b) is a cross-sectional view taken along line BB of (a).

FIG. 2 is a diagram showing a state in which a semiconductor chip is bonded to a base using an adhesive sheet with a carrier film according to an embodiment of the present invention.

FIG. 3 is a diagram showing an adhesive sheet with a carrier film according to another embodiment of the present invention.

4A and 4B are views showing a conventional adhesive sheet, wherein FIG. 4A is a plan view, and FIG. 4B is a cross-sectional view taken along line BB of FIG.

5 is a diagram showing a state in which a semiconductor chip is bonded on a base using the adhesive sheet of FIG. 4;

6A and 6B are views showing a conventional adhesive sheet with a carrier film, wherein FIG. 6A is a plan view and FIG. 6B is a cross-sectional view taken along line BB of FIG.

FIG. 7 is a view showing a state in which a semiconductor chip is bonded to a base using the adhesive sheet with a carrier film of FIG. 7;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Opening part 20 Adhesive sheet 21 Carrier film 22 Carrier film 22 'Carrier film 23 Alignment hole 30 Press machine 40 Substrate 50 Semiconductor chip

Claims (3)

[Claims] 1. A carrier film having a carrier film on one or both sides of an adhesive sheet, punching the adhesive sheet conveyed by the carrier film at a predetermined punching size, and affixing the adhesive sheet on a substrate. In the attached adhesive sheet, the carrier film has an opening that is larger than the punching dimension of the adhesive sheet on at least one surface, and the adhesive sheet is configured to be punched at the opening. Adhesive sheet with a carrier film. 2. The adhesive sheet with a carrier film according to claim 1, wherein the carrier film has a positioning hole outside the opening. 3. The adhesive sheet with a carrier film according to claim 1, wherein the adhesive sheet has a width smaller than the carrier film and larger than the opening.