JPH11313849A - Cooling-heating device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the flow of a heat medium to each cooling-heating body so as to cool-heat sufficiently while reducing cost and miniaturizing a device by forming two or more heat medium circulating paths at one heat exchanger, and connecting the cooling-heating body to each circulating path. SOLUTION: A cooling-heating device is provided with a cooling-heating plate 1 made of material with high heat conductivity such as aluminum; at least two sets of corrosion resistant pipes formed of copper or the like and embedded in the cooling-heating plate 1; one or more electronic heat exchanging elements such as Peltier elements fixed to the surface of the cooling-heating plate 1; and cooling-heating bodies 7, 8 connected to the respective sets of pipes through pumps 9, 10.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a water pillow made of rubber or a plastic sheet for a heat medium (for example, water) flowing through a heat exchanger cooled or heated by an electronic heat exchange element such as a Peltier element. The present invention relates to a cooling / heating device for passing through at least two or more cooling / heating bodies such as ice sacs to simultaneously cool and heat the occipital region and forehead.

[0002]

2. Description of the Related Art The present applicant uses a heat medium such as water that passes through a heat exchanger cooled by an electronic heat exchange element such as a Peltier element to form a bag such as a water pillow or an ice bag made of rubber or a synthetic resin sheet. A cooling / heating device for cooling a certain cooling / heating body was filed (Japanese Patent Application Laid-Open No. Hei 8-84744). This cooling / heating apparatus has the advantage that the exchange of water is not required and the temperature of the cooling / heating body can be freely set.

[0003]

By the way, when a person becomes ill, it is necessary to cool two places at the same time, such as using an ice sac at the same time as using a water pillow, or
It may be necessary to heat two places at the same time.

However, the above-described conventional cooling and heating device is configured such that one cooling and heating device is connected to one cooling and heating device, and therefore, two cooling and heating units are simultaneously cooled. When heating or heating, two cooling / heating devices are required. When two cooling / heating devices are used in this way, the cost is increased and the device is bulky, which causes a problem of an installation place.

Therefore, it is conceivable to connect two cooling and heating elements to one cooling and heating device. In this case, the difference between the external pressure applied to the cooling and heating element, that is, the external pressure applied to the ice sac and the water pressure applied to the water pillow. As for the external pressure, since the external pressure applied to the water pillow is higher, there arises a problem that the amount of the heat medium flowing into the water pillow decreases, or the heat pill is stored and the water pillow cannot be cooled sufficiently.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and has as its object to provide two heat exchangers in one heat exchanger.
By forming one or more heat medium circulation paths, and connecting the cooling and heating elements to each of the circulation paths, the flow of the heat medium to each of the cooling and heating elements can be improved and sufficient cooling and heating can be performed, and
It is an object of the present invention to provide a cooling and heating device that can reduce the cost and reduce the size.

[0007]

SUMMARY OF THE INVENTION A cooling and heating apparatus according to the present invention achieves the above-mentioned object, and includes a single cooling and heating plate made of a material having high thermal conductivity such as aluminum. At least two sets of corrosion-resistant pipes such as copper buried in the cooling and heating plate, at least one or more electronic heat exchange elements such as Peltier elements fixed to the surface of the cooling and heating plate; And a cooling / heating body connected to a pipe and connected via a pump.

It is desirable that a fan be mounted on the heat radiation side of the electronic heat exchange element via a radiator. further,
It is desirable that a pipe buried in the cooling and heating plate be bent into the cooling and heating plate to lengthen the flow path.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the cooling and heating device according to the present invention will be described below with reference to the drawings. First, the heat exchanger A will be described with reference to FIGS. 1 to 5. 1 is a cooling / heating plate made of a material having good heat conductivity such as aluminum, and is internally bent into a mountain shape as shown in FIG. In addition, two copper pipes arranged in the upper and lower two stages are buried by casting, or as shown in FIG.
3 is buried by casting.

Further, two trapezoidal ridges 1a are integrally formed on one surface of the cooling / heating plate 1, or FIG.
As shown in (1), one raised portion 1a is integrally formed on each of the two surfaces.

In FIGS. 3 and 4, reference numeral 4 denotes each of the raised portions 1;
An electronic heat exchange element such as a Peltier element fixed to a is a radiator formed by a number of fins screwed and fixed to the heat exchanger 1 on the upper surface of the electronic heat exchange element 4, and 6 is a heat radiator. The fan is rotated by a motor mounted on the surface of the container 5.

In the heat exchanger A thus configured, when the electronic heat exchange element 4 is energized so that the cooling and heating plate 1 side is cooled, the cooling and heating plate 1 is cooled, while the electronic heat exchange element 4 is cooled. Since the heat is dissipated on the side opposite to, the cooling through the radiator 5 by the fan 6 prevents the cooling efficiency of the electronic heat exchange element 4 from lowering.

Further, when electricity is supplied to the electronic heat exchange element 4 so that the side of the cooling and heating plate 1 is heated, the cooling and heating plate 1 is heated, while the opposite side of the electronic heat exchange element 4 is cooled and frozen. Therefore, the outside air is sent through the radiator 5 by the fan 6, so that the heating efficiency of the electronic heat exchange element 4 can be prevented from lowering.

Next, the two cooling and heating members 7, 8 (for example, a water pillow and an ice sac) are simultaneously passed through the heat medium using the heat exchanger A using the cooling and heating plate 1 shown in FIG. This will be described below with reference to this drawing.

In FIG. 6, pumps 9 and 10 are
The cooling and heating members 7, 8 and the pumps 9, 10 and the heat exchanger A
Are connected annularly by the connection pipes 11 and 12, and each is filled with a heat medium such as water.

Next, the operation will be described. When power is supplied to the two electronic heat exchange elements 4 and 4 of the heat exchanger A, the cold / hot plate 1 is cooled by the electronic heat exchange elements 4 and 4.
When the pumps 9 and 10 are driven in this state, the heat medium circulates. The heat medium is pipes 2 in the cooling and heating plate 1,
The cooling medium is cooled when passing through the cooling medium 3, and the cooled heat medium passes through the cooling and heating bodies 7, 8, so that the cooling and heating bodies 7, 8 are cooled, and therefore, the back of the head and the forehead are cooled.

FIG. 7 shows a case in which the two cooling and heating members 7, 8 are cooled by simultaneously flowing a heating medium using the heat exchanger A using the cooling and heating plate 1 shown in FIG. Hereinafter, description will be made with reference to this drawing.

In the case of this embodiment, the cooling / heating members 7, 8 and the pumps 9, 10 are connected to the connecting pipes 11, 10 with the heat exchanger A interposed therebetween.
It differs from the previous embodiment in that it is connected in a ring by 12.

Then, as in the previous embodiment, when the two electronic heat exchange elements 4 and 4 of the heat exchanger A are energized and the pumps 9 and 10 are driven, the heat medium circulates, The enclosed heating medium is cooled when passing through the pipes 2 and 3 in the cooling and heating plate 1, and the cooled heating medium passes through the cooling and heating elements 7 and 8, so that the cooling and heating elements 7 and 8 are cooled. It is what cools the back of the head and forehead.

In the above-described embodiment, the case where the cooling and heating members 7 and 8 are cooled has been described. However, if the power supply to the electron heat exchange elements 4 and 4 is performed with the polarity reversed, the cooling is performed. Since the heating plate 1 is heated, the heating medium flowing through the pipes 2 and 3 in the cooling and heating plate 1 is heated, and accordingly, the cooling and heating bodies 7, 8 into which the heating medium flows are heated.

In the above-described embodiment,
Although two pipes 2 and 3 are molded on one cooling / heating plate 1, the number of pipes is not limited to two. In this case, it is possible to connect as many pumps as the number of pipes and to cool or heat the cooling / heating body as many as the number of pipes. Further, the number of the electronic heat exchange elements 4 is not limited to two, and one or two or more may be attached to one cooling / heating plate 1. become.

[0022]

As described above, according to the present invention, two or more sets of pipes made of copper or the like are buried in one piece of a cooling plate of aluminum or the like having a high thermal conductivity, and at least one pipe is An electronic heat exchange element such as a Peltier element is fixed.By connecting a cooling / heating body to each pipe via a pump, the heat medium to each cooling / heating body can be evenly flown. All the cooling and heating members can be cooled or heated at a preset temperature regardless of the external pressure applied to the heating member.

Further, a fan is mounted on the heat radiation side of the electronic heat exchange element via a radiator, and the fan is driven to cool the heat radiation side of the electronic heat exchange element.
Therefore, the cooling efficiency of the electronic heat exchange element can be improved.

Further, the pipe buried in the cooling / heating plate is bent inside the cooling / heating plate to extend the flow path, so that the heat medium flowing through the pipe can be efficiently cooled or heated. It has the effect of.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a cooling / heating plate of a heat exchanger in a cooling / heating device according to the present invention.

FIG. 2 is a perspective view showing another embodiment of the cooling / heating plate.

FIG. 3 is a side view showing still another embodiment of the cooling / heating plate.

FIG. 4 is a side view of a heat exchanger including an electronic heat exchange element and cooling means.

FIG. 5 is a side view of a heat exchanger showing another embodiment.

FIG. 6 is a block diagram for cooling and heating two cooling / heating bodies.

FIG. 7 is a block diagram for cooling and heating two cooling / heating bodies according to another embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Cooling / heating board 2, 3 Pipe 4 Electronic heat exchange element 5 Radiator 6 Fan 7, 8 Cooling / heating body 9, 10 Pump 11, 12 Connecting pipe

Claims (3)

[Claims] 1. A material made of a material having a high thermal conductivity such as aluminum.
A plurality of cooling / heating plates, at least two sets of corrosion-resistant pipes made of copper or the like embedded in the cooling / heating plates, and at least one or more Peltier elements or the like fixed to the surface of the cooling / heating plates. A cooling / heating apparatus comprising: a heat exchange element; and a cooling / heating body connected to each set of pipes and connected via a pump. 2. The cooling and heating device according to claim 1, wherein a fan is mounted on a heat radiation side of the electronic heat exchange element via a radiator. 3. A pipe embedded in the cooling / heating plate,
2. The cooling / heating apparatus according to claim 1, wherein the flow path is lengthened by being bent in the cooling / heating plate.