JPH11312715A - Semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor device for maintaining simplicity of bending, and improving the strength of wiring. SOLUTION: In a semiconductor 21, a base film 22 is mounted on a semiconductor chip 23. The width dimension of plural wirings 24 at bending parts 21c and 21d is set larger than the width dimension of the other parts, so that a wide part 24a can be formed, and an opening 25 is formed. The plural wirings 24 are arrayed in parallel at the bending parts 21c and 21d, so that the odd- numbered columns and the even-numbered columns are shifted alternately. The openings 25 facing each wide part 24a are alternately shifted in the longitudinal direction of the wiring 24. Thus, the mutual sides of the adjacent wide parts 24a can be prevented from being a butted to each other, and the width dimension of the overall wirings 24 can be prevented from being increased, even when the wide part 24a is formed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device having wiring covered with a base film to which a semiconductor chip is attached.

[0002]

2. Description of the Related Art In general, in various electronic devices, a TAB (Tape Automated Bondin) in which a semiconductor chip and a wiring are integrally mounted on a base film and configured to be bent.
Semiconductor devices referred to as g) are widely used. As shown in FIGS. 4 and 5, for example, such a semiconductor device 11 includes a base film 12 having insulating properties and flexibility.
A semiconductor chip 13 is mounted thereon, and a plurality of wirings 14 connected to the semiconductor chip 13 are integrally covered by the base film 12.

When such a semiconductor device 11 is used for a liquid crystal display device, for example, as shown in FIG.
Liquid crystal cell 16 arranged via plastic frame 15
The printed circuit board 17 is bent at a bent portion 18 and installed. Also, the plurality of wirings 14 are bent portions 18,
As shown in FIG. 5, they have a width dimension a and are arranged in parallel at a pitch p. Further, an opening 19 is formed in a portion corresponding to the bent portion 18 so that the base film 12 can be easily bent, and the wiring 14 in this portion is exposed to the outside.
Note that the semiconductor device 11 has a solder lead portion 20 formed on the printed wiring board 17.

The wiring 14 is covered with a thin resin or a coating material. However, the wiring 14 is not sufficiently covered, and if a stress such as vibration, impact, or torsion is applied to the bent portion 18 from the outside. Wiring 14 in a bent state
And may cause cracks and disconnections.

[0005]

As described above, in the conventional example shown in FIGS. 4 and 5, the opening 19 is formed in the bent portion 18 so that the base film 12 can be easily bent. There is a problem that the wiring of the portion 19 is not sufficiently covered and may be damaged by external stress.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has as its object to provide a semiconductor device having improved wiring strength while maintaining the ease of bending.

[0007]

SUMMARY OF THE INVENTION The present invention provides a base film having a bent portion, a semiconductor chip mounted on the base film, and an opening formed in a portion corresponding to the bent portion of the base film. And a plurality of wirings connected to the semiconductor chip and covered by the base film, and having a wide portion having a wider width than other portions at a position corresponding to the opening of the bent portion of the base film. It was done.

Since the width of the portion corresponding to the bent portion of each wiring is wider than the other portions, the wiring is less likely to be damaged even when external stress is applied.

The plurality of wirings are arranged in parallel,
The wide portions of the wiring and the openings of the base film corresponding to the wide portions are arranged so as to be alternately shifted in odd rows and even rows of the wiring, and correspond to the wide portions of each wiring and the wide portions. Since the openings are alternately shifted, even if a wide portion is provided, the width of the entire wiring is not increased, and the size of the bent portion is reduced while maintaining the strength.

Further, on both sides of each opening of the base film, a slit parallel to this wiring is formed between a corresponding opening edge and an adjacent wiring, and each slit located between adjacent same wirings is formed. The slits in each of the openings are continuously cut and formed. Since the slits are provided near each of the openings, even if the openings are alternately displaced, the openings can be sufficiently bent and the handling can be facilitated.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the semiconductor device of the present invention will be described below with reference to the drawings.

As shown in FIGS. 1 and 2, a semiconductor device 21 applied to, for example, a liquid crystal display device has a base film 22 having insulating properties and flexibility. The semiconductor chip 23 is integrally mounted. The plurality of wirings 24 connected to the semiconductor chip 23 are integrally covered by the base film 22.

In this semiconductor device 21, an upper edge 21a shown in FIG. 2 is used for connection to the liquid crystal cell 16 as shown in FIG. 3, and a lower edge 21b is used for connection to the printed wiring board 17. The solder lead portion is used. A bent portion 21c and a bent portion 21d are provided between the upper edge portion 21a and the lower edge portion 21b and the semiconductor chip 23 located at the center, respectively.

Here, the plurality of wirings 24 are connected to the bent portions 21c,
At the position corresponding to 21d, as shown in FIG. 1, the width b of this portion is made larger than the width a of the other portion to form a wide portion 24a, and the wide portion 24a of the base film 22 is formed. Openings 25 are formed in the corresponding portions, respectively. The opening 25 is provided to make the base film 22 bend easily, and is formed slightly wider than the wide portion 24a of the wiring 24. By providing this opening 25, the wide portion 24a of each wiring 24 is exposed to the outside, but these wirings 24 are covered with a resin or a coating material having a lower hardness than the base film 22, There is no particular problem.

A plurality of wirings 24 are arranged in parallel at bent portions 21c and 21d, and each wide portion 24a alternates in an odd-numbered row α and an even-numbered row β in the length direction of each wiring 24. It is arranged to shift. In addition, with such an arrangement, the opening 25 formed so as to face each wide portion 24a also has the wiring 24.
Alternately with respect to the length direction. Thus, each wiring
24 wide portion 24a and opening facing the wide portion 24a
Since the 25 portions are alternately shifted, the side portions of the adjacent wide portions 24a do not abut each other, and the formation of the wide portions 24a does not increase the width dimension of the entire wiring 24.

Further, slits 26 are formed on both sides of each opening 25 formed in the base film 22. As shown in FIG. 1, these slits 26 are formed, for example, on the edge 25a of the opening 25 corresponding to a certain wiring 24A and the adjacent wiring
24B, the wirings 24A and 24B are formed in parallel. Of these slits 26, those provided in adjacent openings 25, 25 shifted in the length direction of the wiring 24, that is, slits 26A located between the same adjacent wirings 24A, 24B.
, 26B are cut continuously.

As described above, since the slits 26 are provided near each of the openings 25, even if the openings 25 are alternately shifted in the length direction of the wiring 24, sufficient bendability can be obtained. Easy handling can be maintained.

As shown in FIG. 3, the semiconductor device 21 having such a configuration is used, for example, in a drive circuit of a liquid crystal display device, and the upper edge 21a is mounted on the liquid crystal cell 16 and the lower edge 21b is mounted on the printed wiring board 17. When connecting, the semiconductor chip located in the center
It becomes the solder lead part used for 23. The bent portions 21c and 21d between the upper edge portion 21a and the lower edge portion 21b and the semiconductor chip 23 are bent as shown in the drawing to enable connection with the liquid crystal cell 16 and the printed wiring board 17. I have.

Here, a portion corresponding to the bent portions 21c and 21d of each wiring 24 has a wide portion 24a whose width b is wider than the width a of the other portions, so that sufficient strength can be obtained. That is, by providing the wide portion 24a, even if deformation due to bending occurs or external stress is applied, these effects can be dispersed. Therefore, unlike the related art, there is no occurrence of damage such as a crack or disconnection in the bent portion of the wiring, and stable quality can be maintained.

A plurality of wires 24 are arranged in parallel at the bent portions 21c and 21d, but the wide portions 24a are arranged so as to be alternately shifted in the odd rows α and the even rows β. Therefore, despite the provision of the wide portion 24a, the wiring pitch P
Can be made the same pitch as the conventional one, and the width dimension of the entire wiring 24 does not increase.

Further, since the slits 26 are provided near each of the openings 25, sufficient bendability can be obtained even if the openings 25 are alternately shifted in the length direction of the wiring 24.
Easy handling can be maintained. That is, the bending positions are different between the odd-numbered row α and the even-numbered row β of the wiring 24, but the bending is surely performed at the wide portion 24a.
It can be easily folded without causing any damage during the folding operation.

[0022]

According to the present invention, vibration, impact,
Even if stress such as torsion is applied, damage such as cracks or disconnection is unlikely to occur at the bent portion, and excellent durability can be obtained.

[Brief description of the drawings]

FIG. 1 is a partially enlarged view showing a part of an embodiment of a semiconductor device of the present invention.

FIG. 2 is a plan view showing the whole of the same.

FIG. 3 is a side view showing an internal configuration of a general liquid crystal display device.

FIG. 4 is a plan view showing a conventional example.

FIG. 5 is a partially enlarged view of the same.

[Explanation of symbols]

 21 Semiconductor device 21c, 21d Bent portion 22 Base film 23 Semiconductor chip 24 Wiring 24a Wide portion 25 Opening 26 Slit

Claims (3)

[Claims] A base film having a bent portion; a semiconductor chip mounted on the base film; an opening formed in a portion corresponding to the bent portion of the base film; and a semiconductor chip connected to the semiconductor chip. A semiconductor device, comprising: a plurality of wirings which are covered by the base film and have a wide portion having a wider width than another portion at a position corresponding to an opening of a bent portion of the base film. 2. A plurality of wires are arranged in parallel, and the wide portions of the wires and the openings of the base film corresponding to the wide portions are alternately shifted in odd rows and even rows of the wires. The semiconductor device according to claim 1, wherein 3. On both sides of each opening of the base film, a slit parallel to the corresponding wiring is formed between a corresponding opening edge and an adjacent wiring, and each slit located between adjacent same wirings is formed. 3. The semiconductor device according to claim 2, wherein the slit for each opening is cut continuously.