JPH11308072A - Surface acoustic wave element - Google Patents

Surface acoustic wave element

Info

Publication number
JPH11308072A
JPH11308072A JP12828098A JP12828098A JPH11308072A JP H11308072 A JPH11308072 A JP H11308072A JP 12828098 A JP12828098 A JP 12828098A JP 12828098 A JP12828098 A JP 12828098A JP H11308072 A JPH11308072 A JP H11308072A
Authority
JP
Japan
Prior art keywords
electrode
comb
acoustic wave
surface acoustic
resonator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12828098A
Other languages
Japanese (ja)
Inventor
Takaki Hanaguruma
隆紀 花車
Masahide Tamura
雅英 田村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hokuriku Electric Industry Co Ltd
Original Assignee
Hokuriku Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hokuriku Electric Industry Co Ltd filed Critical Hokuriku Electric Industry Co Ltd
Priority to JP12828098A priority Critical patent/JPH11308072A/en
Publication of JPH11308072A publication Critical patent/JPH11308072A/en
Pending legal-status Critical Current

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  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide, with a simple structure, a surface acoustic wave element which is miniaturized. SOLUTION: Two sets of resonator patterns 20 and 28 which consists of comb-shaped electrodes 14 and 22 mutually facing opposite to each other and two reflectors 16, 18, 24 and 26 which are provided on both sides of the electrodes 14 and 22 are installed on a piezoelectric substrate 12. An input electrode 48 connected to one of the comb-shaped electrode 14 of each resonator pattern and a output electrode 56 connected to the other comb-shaped electrode 22 of each resonator pattern are arranged between the patterns 20 and 28, each reflector 18 and 24 is respectively connected to a ground electrode 32 in each of the resonator patterns, and the electrode 32 is arranged between the patterns 20 and 28.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】この発明は、特定の周波数帯
域の電磁波を抽出する周波数フィルタであって、弾性表
面波を利用した弾性表面波装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a frequency filter for extracting electromagnetic waves in a specific frequency band, and more particularly to a surface acoustic wave device using a surface acoustic wave.

【0002】[0002]

【従来の技術】従来、弾性表面波素子は、図3に示すよ
うに、水晶などの圧電性の基板1上に縦続接続する接続
部2を介して接続した二対の櫛形電極3が設けられ、こ
の各櫛形電極3の両側方には、等ピッチに格子状のパタ
ーンが形成された反射器4が4ヶ所に各々配置されてい
る。
2. Description of the Related Art Conventionally, as shown in FIG. 3, two pairs of comb-shaped electrodes 3 are provided on a piezoelectric substrate 1 made of quartz or the like via a connecting portion 2 connected in cascade, as shown in FIG. On both sides of each of the comb-shaped electrodes 3, reflectors 4 each having a grid pattern formed at an equal pitch are arranged at four positions.

【0003】基板1の側縁部には、各々櫛形電極3とそ
れぞれ接続する入力電極5と、出力電極6が各々形成さ
れている。また4ケ所にアース電極7が設けられ、さら
に各反射器4間の基板1上にもアース電極8が反射器4
に接続して設けられている。
An input electrode 5 connected to the comb-shaped electrode 3 and an output electrode 6 are formed on the side edges of the substrate 1, respectively. In addition, ground electrodes 7 are provided at four locations, and ground electrodes 8 are also provided on the substrate 1 between the reflectors 4.
It is connected to and provided.

【0004】このように、セラミックパッケージと接続
する電極として入出力電極5,6及び4つのアース電極
7が形成され、さらに反射器4間にもアース電極8がシ
ールド効果を高めるように形成されていた。
As described above, the input / output electrodes 5 and 6 and the four ground electrodes 7 are formed as electrodes connected to the ceramic package, and the ground electrode 8 is formed between the reflectors 4 so as to enhance the shielding effect. Was.

【0005】[0005]

【発明が解決しようとする課題】上記従来の技術の場
合、近年の電子機器の小型化及び高度化に伴い、高性能
で小型の弾性表面波素子が求められているが、小型化す
るためには、基板1上に設けた櫛形電極3の対数や反射
器4の本数を少なくしたり、あるいは入出力電極5,6
やアース電極7,8の面積を小さくする必要がある。し
かし、これにより弾性表面波フィルタとしての周波数特
性が劣化するという問題を有していた。
In the case of the above conventional technology, a high performance and small surface acoustic wave element is required in accordance with recent miniaturization and sophistication of electronic equipment. Is to reduce the number of comb-shaped electrodes 3 provided on the substrate 1 and the number of reflectors 4
And the area of the ground electrodes 7 and 8 must be reduced. However, this has a problem that the frequency characteristics of the surface acoustic wave filter deteriorate.

【0006】この発明は上記従来の問題点に鑑みてなさ
れたものであり、簡単な構造で小型化を図ることができ
る弾性表面波素子を提供することを目的とする。
SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned conventional problems, and has as its object to provide a surface acoustic wave element which can be reduced in size with a simple structure.

【0007】[0007]

【課題を解決するための手段】この発明の弾性表面波素
子は、圧電性の基板上に、互いに対向した櫛形電極と、
この櫛形電極の両側方に各々設けられた2つの反射器と
からなる共振器パターンが2組並設されている。この各
共振器パターン間には、上記各共振器パターンの一方の
櫛形電極に接続した入力電極と、上記各共振器パターン
の他方の櫛形電極に接続した出力電極とが配置され、上
記各反射器が各々上記共振器パターン毎にアース電極に
接続し、このアース電極が上記各共振器パターン間に配
置されている。
A surface acoustic wave element according to the present invention comprises a piezoelectric substrate, a comb-shaped electrode facing each other,
Two resonator patterns each including two reflectors provided on both sides of the comb-shaped electrode are arranged in parallel. An input electrode connected to one comb-shaped electrode of each resonator pattern and an output electrode connected to the other comb-shaped electrode of each resonator pattern are arranged between the resonator patterns. Are connected to the ground electrode for each of the resonator patterns, and the ground electrode is arranged between the resonator patterns.

【0008】また入力電極と出力電極は、各々ボンディ
ング用電極部と検査用電極部とからなり、同様に、アー
ス電極も、各々ボンディング用電極部と検査用電極部と
からなる。
The input electrode and the output electrode each include a bonding electrode portion and an inspection electrode portion. Similarly, the ground electrode also includes a bonding electrode portion and an inspection electrode portion.

【0009】[0009]

【発明の実施の形態】以下、この発明の実施形態につい
て図面に基づいて説明する。図1はこの発明の一実施形
態の弾性表面波素子10を示し、水晶やリチウムタンタ
レート等の圧電性を有した基板12の表面に、アルミニ
ウムまたはアルミニウム合金等の金属薄膜により二対の
櫛形電極14が各々交互に対向して設けられている。こ
の櫛形電極14の両側方には、等ピッチにアルミニウム
またはアルミニウム合金等の金属薄膜の導電体による格
子状のパターンが形成された反射器16,18が各々設
けられている。そして、櫛形電極14と一対の反射器1
6,18により1組の共振器パターン20を形成してい
る。
Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a surface acoustic wave device 10 according to one embodiment of the present invention, in which two pairs of comb-shaped electrodes are formed on a surface of a substrate 12 having a piezoelectric property such as quartz or lithium tantalate by using a metal thin film such as aluminum or an aluminum alloy. 14 are provided alternately facing each other. On both sides of the comb-shaped electrode 14, reflectors 16 and 18 each having a grid-like pattern formed of a conductor of a metal thin film such as aluminum or an aluminum alloy at an equal pitch are provided. Then, the comb-shaped electrode 14 and the pair of reflectors 1
6, 18 form a set of resonator patterns 20.

【0010】一方、この共振器パターン20の側方に
は、櫛形電極22と、2つの反射器24,26を有する
共振器パターン28が設けられ、櫛形電極14,22間
には接続部30が形成され、各々接続されている。
On the other hand, a comb-shaped electrode 22 and a resonator pattern 28 having two reflectors 24 and 26 are provided beside the resonator pattern 20, and a connecting portion 30 is provided between the comb-shaped electrodes 14 and 22. Formed and connected to each other.

【0011】各共振器パターン20,28の間であっ
て、接続部30の両側方には、それぞれ反射器18,2
4と接続するアース電極32,34が設けられている。
アース電極32は、矩形状のボンディング用電極部36
と検査用電極部37とからなり、これらの電極部36,
37は、接続部38で接続されている。また、ボンディ
ング用電極部36には、接続部30の方向に向けて細長
い矩形状のシールドパターン40が続いている。アース
電極32は、ボンディング用電極部36の側方で反射器
18と接続している。
Between each of the resonator patterns 20 and 28 and on both sides of the connecting portion 30, reflectors 18 and 2 are provided, respectively.
4 are provided with ground electrodes 32 and 34.
The ground electrode 32 has a rectangular bonding electrode portion 36.
And an inspection electrode section 37, and these electrode sections 36,
37 is connected by a connection part 38. The bonding electrode portion 36 is followed by an elongated rectangular shield pattern 40 toward the connection portion 30. The ground electrode 32 is connected to the reflector 18 on the side of the bonding electrode portion 36.

【0012】同様に、アース電極34も、矩形状のボン
ディング用電極部42と検査用電極部43、及びこれら
の電極部42,43間に設けられた接続部44とからな
る。そして、ボンディング用電極部42から接続部30
の方向に向けてのびるシールドパターン46が設けら
れ、ボンディング用電極部42の側方で反射器24と接
続している。
Similarly, the ground electrode 34 is also composed of a rectangular bonding electrode portion 42 and an inspection electrode portion 43, and a connecting portion 44 provided between these electrode portions 42, 43. Then, from the bonding electrode portion 42 to the connection portion 30
The shield pattern 46 extending in the direction of is provided, and is connected to the reflector 24 on the side of the bonding electrode portion 42.

【0013】さらに各共振器パターン20,28間であ
って、アース電極32の外側方には入力電極48が設け
られている。この入力電極48も、アース電極32,3
4と同様の形状をしたボンディング用電極部50と検査
用電極部51、及びこれらの電極部50,51間に設け
られた接続部52とからなる。そしてボンディング用電
極部50は、反射器18と接続することなく、この反射
器18の外周と平行な配線部54と接続し、配線部54
は、櫛形電極14の外側部と接続している。
An input electrode 48 is provided between the resonator patterns 20 and 28 and outside the ground electrode 32. The input electrode 48 is also connected to the ground electrodes 32, 3
4 includes a bonding electrode part 50 and an inspection electrode part 51 having the same shape as that of No. 4, and a connection part 52 provided between these electrode parts 50 and 51. The bonding electrode portion 50 is connected to a wiring portion 54 parallel to the outer periphery of the reflector 18 without being connected to the reflector 18, and is connected to the wiring portion 54.
Are connected to the outside of the comb-shaped electrode 14.

【0014】また他方のアース電極34の外側方には、
出力電極56が設けられている。この出力電極56も、
入力電極48と同様の形状をしたボンディング用電極部
58と検査用電極部59、及びこれらの電極部58,5
9間に設けられた接続部60とからなる。出力電極56
は、ボンディング用電極部58と櫛形電極22を接続す
る配線部62に接続し、配線部62は、反射器24と接
続することなく、この反射器24の外周と平行に形成さ
れ、櫛形電極22の外側部と接続している。
On the outside of the other ground electrode 34,
An output electrode 56 is provided. This output electrode 56 also
A bonding electrode portion 58 and an inspection electrode portion 59 having the same shape as the input electrode 48, and these electrode portions 58, 5
9 and a connecting portion 60 provided between the connecting portions. Output electrode 56
Are connected to a wiring portion 62 connecting the bonding electrode portion 58 and the comb-shaped electrode 22. The wiring portion 62 is formed parallel to the outer periphery of the reflector 24 without being connected to the reflector 24, and Is connected to the outside.

【0015】この実施形態の弾性表面は素子10は、図
2(a)に示すように、セラミック製等のパッケージ6
4内に収容し接着され、アース電極32,34及び入力
電極48、出力電極50とパッケージ64の側縁部に形
成された各電極66とを、各々金線等のワイヤ68で繋
ぐワイヤボンディングにより接続されている。
As shown in FIG. 2 (a), the elastic surface of the embodiment has a package 6 made of ceramic or the like.
4 and bonded by wire bonding to connect the ground electrodes 32, 34, the input electrode 48, the output electrode 50, and each electrode 66 formed on the side edge of the package 64 with a wire 68 such as a gold wire. It is connected.

【0016】なお、弾性表面波素子10の各電極32,
34,48,50は、図2(b)に示すように、図2
(a)とは逆にパッケージ64の電極66とワイヤ68
で繋いでもよく、パッケージ64に設けた入力電極48
と出力電極50の配置はどちらでもよく、それぞれに対
応可能である。
Each of the electrodes 32,
As shown in FIG. 2B, 34, 48, 50
Contrary to (a), the electrodes 66 and the wires 68 of the package 64
The input electrode 48 provided on the package 64
The arrangement of the output electrode 50 and the output electrode 50 may be either, and can be adapted to each.

【0017】ここでアース電極32,34、入出力電極
48,50に設けられた検出用電極37,43,51,
59は、弾性表面波素子10を検査する際に、プローグ
をあてるため、表面に傷ができ、そのためワイヤ68と
のボンディングがうまくいかない。このためワイヤ56
を接続するボンディング用電極36,42,50,58
が別に設けられている。
Here, detection electrodes 37, 43, 51, provided on the earth electrodes 32, 34 and the input / output electrodes 48, 50,
When the surface acoustic wave element 10 is inspected, the surface 59 is scratched due to a prog, so that the bonding with the wire 68 fails. Therefore, the wire 56
Bonding electrodes 36, 42, 50, 58
Is provided separately.

【0018】この実施形態の弾性表面は素子10のよう
に、基板12の両端に形成された共振器パターン20,
28の間に、入出力48,50及びアース電極32,3
4を設けることにより、全体の形状が小さくなり、また
1ウエハー当たりの素子個数を増やすことが可能となっ
た。
The elastic surface of this embodiment, like the element 10, has the resonator patterns 20 formed on both ends of the substrate 12,
28, the input / output 48, 50 and the ground electrode 32, 3
By providing 4, the overall shape can be reduced and the number of elements per wafer can be increased.

【0019】なおこの発明の弾性表面波素子は、上記実
施形態に限定されるものではなく、検出用電極とボンデ
ィング用電極の大きさをかえてもよく、各電極は導電性
を有する材料であればよく、適宜変更することができ
る。
The surface acoustic wave device according to the present invention is not limited to the above embodiment, and the sizes of the detection electrode and the bonding electrode may be changed, and each electrode may be made of a conductive material. It can be changed as appropriate.

【0020】[0020]

【発明の効果】この発明の弾性表面波素子は、入出力電
極及びアース電極を基板の共振器パターン間の中間に設
けることにより、全体が小型化され、1ウエハー当たり
取ることができる素子個数を増やすことができ、また入
出力電極とワイヤによりワイヤボンディングされるパッ
ケージの電極は、入出力どちらでも対応が可能となる。
The surface acoustic wave device of the present invention has a small size as a whole by providing an input / output electrode and a ground electrode in the middle between the resonator patterns on the substrate, thereby reducing the number of devices that can be taken per wafer. In addition, the input / output electrodes and the electrodes of the package which are wire-bonded with the wires can support both input and output.

【図面の簡単な説明】[Brief description of the drawings]

【図1】この発明の一実施形態の弾性表面波素子の平面
図である。
FIG. 1 is a plan view of a surface acoustic wave device according to an embodiment of the present invention.

【図2】この発明の一実施形態の弾性表面波素子を備え
たパッケージの平面図(a)とこの実施形態の他のパッ
ケージの平面図(b)である。
FIGS. 2A and 2B are a plan view of a package including a surface acoustic wave device according to an embodiment of the present invention and a plan view of another package according to the embodiment; FIGS.

【図3】従来の技術の弾性表面波素子の平面図である。FIG. 3 is a plan view of a conventional surface acoustic wave device.

【符号の説明】[Explanation of symbols]

10 弾性表面波素子 12 基板 14,22 櫛形電極 16,18,24,26 反射器 20,28 共振器パターン 30,38,44,52,60 接続部 32,34 アース電極 36,42,50,58 ボンディング用電極部 37,43,51,59 検査用電極部 48 入力電極 54,62 配線部 56 出力電極 DESCRIPTION OF SYMBOLS 10 Surface acoustic wave element 12 Substrate 14,22 Comb-shaped electrode 16,18,24,26 Reflector 20,28 Resonator pattern 30,38,44,52,60 Connection part 32,34 Earth electrode 36,42,50,58 Bonding electrode part 37, 43, 51, 59 Inspection electrode part 48 Input electrode 54, 62 Wiring part 56 Output electrode

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 圧電性の基板上に、互いに対向した櫛
形電極と、この櫛形電極の両側方に各々設けられた2つ
の反射器とからなる共振器パターンが2組並設され、こ
の各共振器パターン間に、上記各共振器パターンの一方
の櫛形電極に接続した入力電極と、上記各共振器パター
ンの他方の櫛形電極に接続した出力電極とを配置し、上
記各反射器が各々上記共振器パターン毎にアース電極に
接続し、このアース電極が上記各共振器パターン間に配
置された弾性表面波素子。
1. On a piezoelectric substrate, two sets of resonator patterns each comprising a comb-shaped electrode facing each other and two reflectors provided on both sides of the comb-shaped electrode are arranged in parallel. An input electrode connected to one comb-shaped electrode of each of the resonator patterns and an output electrode connected to the other comb-shaped electrode of each of the resonator patterns are arranged between the resonator patterns. A surface acoustic wave element connected to a ground electrode for each resonator pattern, and the ground electrode is arranged between the resonator patterns.
【請求項2】 上記入力電極と出力電極は、各々ボン
ディング用電極部と検査用電極部とからなる請求項1記
載の弾性表面波素子。
2. The surface acoustic wave device according to claim 1, wherein each of the input electrode and the output electrode comprises a bonding electrode portion and an inspection electrode portion.
【請求項3】 上記アース電極は、各々ボンディング
用電極部と検査用電極部とからなる請求項1記載の弾性
表面波素子。
3. The surface acoustic wave device according to claim 1, wherein each of said ground electrodes comprises a bonding electrode portion and an inspection electrode portion.
JP12828098A 1998-04-22 1998-04-22 Surface acoustic wave element Pending JPH11308072A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12828098A JPH11308072A (en) 1998-04-22 1998-04-22 Surface acoustic wave element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12828098A JPH11308072A (en) 1998-04-22 1998-04-22 Surface acoustic wave element

Publications (1)

Publication Number Publication Date
JPH11308072A true JPH11308072A (en) 1999-11-05

Family

ID=14980930

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12828098A Pending JPH11308072A (en) 1998-04-22 1998-04-22 Surface acoustic wave element

Country Status (1)

Country Link
JP (1) JPH11308072A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002319841A (en) * 2001-04-20 2002-10-31 Murata Mfg Co Ltd Surface acoustic wave device precursor, manufacturing method for surface acoustic wave device, communication unit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002319841A (en) * 2001-04-20 2002-10-31 Murata Mfg Co Ltd Surface acoustic wave device precursor, manufacturing method for surface acoustic wave device, communication unit

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