JPH11307712A - Method and device for mounting of component on carrier - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method and a device for upright mounting of a component on the surface of a carrier. SOLUTION: The lead wire of a component part is wired on a circuit substrate 7 using lead wires 8 which can be surface-mounted on the component 5, and the component 5 is surface-mounted upright on the circuit substrate 7 in this mounting method. The lower end of the lead wires 8 is bent, and leg parts 10 are provided for having the lead wire 8 come effectively in contact with the circuit substrate 7. Also, when the component has been mounted and connected, it is retained on a correct place, and when it is mounted on the substrate, guiding and supporting pins 6 are used to support the lead wire of the component.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for surface mounting an upright component on a carrier and to an apparatus for surface mounting an upright component on a carrier.

[0002]

BACKGROUND OF THE INVENTION Current components for mounting upright on a circuit board, for example, often include fixing this component to the circuit board,
In addition, in order to make electrical contact between the component parts and the circuit board, it has a straight lead wire inserted into the hole. These leads are in single-in-line form (SIL
Shape). To mount the components on the circuit board, the leads are inserted into metalized holes provided in the circuit board, and the components are firmly supported in the holes by the interaction of the leads, Electrical connections are established within the holes to achieve the necessary electrical contact between the component leads and the circuit board.

[0003]

SUMMARY OF THE INVENTION There is a tendency in the electronics industry to prefer surface mountable components that can be mounted on a carrier such as a circuit board. A component having such a property occupies a small space on the circuit board when viewed as a whole. This is because, for example, it is not necessary to provide a large number of holes. Holes make it difficult to place conductors in the layers below. Furthermore, if only surface-mounted components can be used, the circuit board manufacturing process can be streamlined. Eliminating the hole mounting and wave soldering processes simplifies production and reduces costs.

In connection with "single-in-line" technology, the use of surface mountable leads on components allows the leads to be bent at their lower ends to provide contact with a circuit board. Legs can be provided and guide / support pins are used to mechanically hold the components in place and hold the leads on the finished circuit board during the process of mounting and connecting the components. So
Component leads can be surface mounted on a circuit board and upright components mounted on the board.

[0005] Surface mounted contact leads can be made from existing lead frames or specially modified contact leads. The leads can be bent to the appropriate shape with tools to form the legs on each lead, so the leads are securely connected to the connection surface of the circuit board, and when mounted, the components Is not affected by the position it occupies.

The number of the guide support pins is preferably two or more, and may be straight or slightly curved, but is always connected so that it can be inserted into the guide hole of the circuit board. Must be longer than the lead. The guide support pins allow components to be mounted without the use of a separate fixing device. Depending on the location of use and the dimensions of the associated components, guide support pins with fewer leads may also be used.

[0007]

DETAILED DESCRIPTION OF THE INVENTION Overall, surface mount components occupy less space than hole mount components.
This is because the surface of the lower circuit board layer can be more effectively used for circuit formation. The greater the potential of surface mounted components in the manufacture of circuit boards, the greater the potential for streamlining manufacturing at the same time. Because all components can be surface mounted, the processes associated with hole mounting and wave soldering do not have to be used on the production line.

For example, starting from a rolled strip consisting essentially of several longitudinally joined lead frames (see FIG. 1), after removing all non-functional leads, the contact leads The individual contacts 3 of the wires 2 are first connected to each contact surface 4 of the component 5. Lead
The contacts 3 on the contact leads 2 of the frame can be firmly soldered to the respective contacts 4 of the component. Each component 5 is removed from the components connected to the frame and tested. For example, as shown in FIG. Some of this work can be done immediately before or during the packing process, depending on the packing process applied. By forming at least one lead on the guide support pin 6 adapted to be mounted in a hole in the circuit board 7 with the possibility of electrical connection to the circuit board, the remaining leads are It can be used as an electrical contact lead 8 between a component and a circuit board.

[0009] Thus, existing lead frames can be used for components that can be surface mounted. Alternatively, the contact leads and guide support pins can be mounted directly externally for connection with components. In order to hold the component in place on the carrier, two guide pins 6, which can be formed from a lead which is normally cut off, can be conveniently used. The guide pin may be straight, slightly curved, or have an angle as shown at 6 'in FIG. In this figure, the contact points and the guide holes are aligned, for example, on the carrier. In some cases, it is better to place the component directly upright on the carrier and to use shortened contact leads and guide support pins with this component. See FIG. 4 (B).

The hole 9 for inserting the guide support pin is provided so that the component 5 can be easily mounted on the circuit board.
The circuit board 7 is provided by a drill. These pins and holes serve to guide and support the component in the correct position on the circuit board. The holes 9 in the circuit board are preferably not metallized to maintain the correct size of the holes. The size of the guide holes depends on the lead frame and on the tolerance requirements of the assembly machine used by the circuit board manufacturer.

Although it is necessary to open the guide hole in the circuit board, it is not necessary to provide a large number of holes required for the hole mounting component, which is a relief for the circuit board maker. Providing the guide holes in the circuit board would not have any disadvantage. This is because the circuit board always needs to perform a drilling operation in order to connect the various layers of the board by holes.

In addition to the above procedure for making a component having contact leads 8 and guide support pins 6, equipment for bending the ends 10 of the leads and packaging techniques are required. The ends of the contact leads are J-shaped as shown in FIGS. 3 (B), 4 (A) and 5 (A) for direct connection to the circuit board, and as shown in FIG. 5 (B). Preferably, it has a gull-wing shape, and as shown in FIG. 5C, a cut-out shape having a straight lead wire. Once the component has been mounted on the circuit board, the free ends of the pins protruding outward can be removed, or, if necessary, the firm connection of the component on the circuit board Can be bent or angled to ensure

If the end of the contact lead is in the shape of a letter J, it always makes good contact with the connection surface on the circuit board, thereby making electrical contact. Furthermore, even if the component parts are tilted to one or the other, it is possible to obtain the joint portion 11 in which the surrounding connecting members have exactly the same amount. The guide pin can be kept completely straight or
It can be slightly bent so as to be aligned with the center of the curved portion. In the modified example of the J-shape, as shown in FIG. 5A, the curved portions of the J-shape are mirror images of each other. This shape also helps to provide a more stable placement of the components on the circuit board. Similar mirror image configurations can be used that serve to improve component stability, such as, for example, a mirror image gull wing shape or other similarly shaped lead ends.

When packaging a finished component with connecting leads and guide support pins, pins longer than the contact leads can be used as contact surfaces for the adhesive transport tape,
The completed component can be wound on a transport reel and sent to the user.

[Brief description of the drawings]

FIGS. 1A and 1B are separate views of components mounted on a lead frame.

FIGS. 2A and 2B show the components of FIG. 1 with the leads removed from the lead frame and formed as contact leads and guide support pins in accordance with the present invention. is there.

FIGS. 3A and 3B are views of the components of FIG. 2 mounted and connected to a circuit board.

FIGS. 4A and 4B are diagrams showing another embodiment of the guide support pin.

FIGS. 5A, 5B and 5C are diagrams showing another embodiment of the contact lead wire.

[Explanation of Symbols] 2 Contact lead wire 3 Contact 4 Contact 5 Component 6 Guide support pin 7 Circuit board 8 Contact lead 9 Hole 10 Lead wire end 11 Joint

Claims (12)

[Claims] 1. A method for mounting a component upright on a carrier, wherein the component guides the component when at least one of the plurality of leads is mounted on the carrier. Formed on a guide support pin for supporting and connecting the remaining leads. 2. The method of claim 1, wherein prior to making the connection, the ends of the leads are bent to make contact with the carrier. 3. The method according to claim 1, wherein prior to making the connection, the contact leads are cut off to bring the straight leads into direct contact with the carrier. 4. Apparatus for surface mounting components upright on a carrier, wherein a plurality of leads (2) are connected to the component (5) and at least one of the leads is a guide support pin. (6), the remaining leads function as contact leads for connection to the electrical contacts of the component (4), and are used when mounting the component on the carrier (7). A device in which guide support pins are inserted into holes (9) of the carrier and electrical leads are connected to respective contacts on the carrier. 5. The device according to claim 4, wherein the guide support pins (6) are bent when the contacts and guide holes are arranged in a row on a support, that is, a circuit board (7). An apparatus characterized in that: 6. The device according to claim 4, wherein the guide support pin (6) is connectable to a band. 7. Device according to claim 4, characterized in that the ends of the contact leads (8) are bent in order to improve the connection with the circuit board (7). 8. Apparatus according to claim 7, wherein the ends (10) of the contact leads are J-shaped. 9. Apparatus according to claim 7, wherein the ends (10) of the contact leads are gull-wing shaped. 10. The apparatus according to claim 7, wherein the ends of the contact leads are oriented in different directions. 11. The apparatus of claim 4, wherein the contact leads are cut so as to be straight for making a direct connection. 12. The device according to claim 4, wherein before mounting, the contact leads (8) and the guide support pins (6) are connected to the lead frame (1). An apparatus comprising the upper lead (2).