JPH11307560A - Method and device for resin packaging - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method and device for resin packaging with which the device can be constituted inexpensively by simplifying the device as a whole and the installation space can be reduced, and moreover the inspection and maintenance of the device can be simplified. SOLUTION: In order to package a lead frame mounted with a prescribed electronic element with a resin by using a pressure die, a thermosetting resin 60 is mixed in an oblong runner 5 having a plurality of cavities, which cross each other at about right angles in the length direction and long sideways before the resin 60 is completely polymerized, and in order to perform resin packaging by polymerizing the resin by applying pressure to the resin with the runner 5, the granular thermosetting resin 60 before complete polymerization is weighed and temporarily housed by the amount corresponding to the moving amount of the runner 5, and after the pressure die has been opened, mixed into the runner 5 so that the resin 60 is distributed evenly in the runner 5. After the pressure die is closed, the resin 60 is transferred by a pressure to cavities 15A and 15B by means of a mobile runner 1 in the runner 5 and cured. After the pressure die is reopened, the cured resin 60 integrated with the lead frame is taken out of the die.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin packaging method and an apparatus therefor, and more particularly to a semi-finished product in a state after predetermined electronic and electrical elements such as semiconductor elements and resistors are mounted on a lead frame. The present invention relates to a resin packaging method and apparatus for performing resin packaging using a thermosetting resin material.

[0002]

2. Description of the Related Art Conventionally, a semi-finished product in which a semiconductor element, a resistor, and the like are mounted on a lead frame and which is being manufactured is subjected to resin packaging using a thermosetting resin material represented by an epoxy resin. A device has been proposed. For example, JP-A-7-147294 discloses a configuration example in which a semiconductor element is sealed with a resin.

According to the proposed resin packaging method, a thermosetting resin material before polymerization is prepared so as to have a predetermined volume and a predetermined shape so as to substantially conform to the internal shape of a horizontally long horizontally long runner. I have. For this purpose, a granular material is supplied substantially uniformly to a die set having a space portion substantially matching the internal shape of the horizontally long runner, and the granular resin material supplied into the die set is compression-molded by a punch. Thus, a stick-shaped thermosetting resin material is obtained.

[0004] Thereafter, a stick-shaped thermosetting resin material is charged into a horizontally long runner provided in a pressing device for resin packaging, and the movable runner is driven by closing the mold, thereby forming a thermosetting resin. By heating the resin material to make it in a molten state, the resin material is pressure-fed toward the cavity, and after curing, an integrated body with the lead frame is taken out from the press device.

The above-described resin packaging method requires a dedicated device for preparing the thermosetting resin material so as to substantially conform to the shape of the runner.

[0006]

However, according to the resin packaging apparatus constructed as described above, the molding material for resin packaging is fed sideways in the horizontal runner of the press apparatus. A stick-shaped thermosetting resin molded to have a predetermined volume and a predetermined shape must be prepared from a granular thermosetting resin material using a dedicated device so as to substantially match the internal shape of the long horizontally long runner. . For this purpose, a special die composed of a die set and a punch having a space portion substantially matching the internal shape of the horizontally long runner is separately required, and the granular material is substantially uniform with respect to the die set. A first step of supplying and a second step of compression-molding the material supplied into the die set by a punch to obtain a stick-like thermosetting resin material.
And a third step of taking out the thermosetting resin material after opening the die set and putting it into the horizontally long runner of the press device.

[0007] As a result, the whole apparatus becomes considerably complicated and expensive, and the installation space becomes large. In some cases, a large amount of cost is required for inspection and maintenance.

[0008] Therefore, the present invention has been made in view of the above-mentioned problems, and in order to package a lead frame on which a predetermined electronic element is mounted using a press die, the lead frame is substantially orthogonal to the longitudinal direction. Injecting thermosetting resin before full polymerization into a horizontally long horizontally long runner with multiple cavities, and performing resin packaging by pressurization by the horizontally long runner. It is an object of the present invention to provide a resin packaging method and a device thereof that can be configured, can save installation space, and can be easily inspected and maintained.

[0009]

According to the resin packaging method of the present invention, which solves the above-mentioned problems and achieves the object, a lead frame on which a predetermined electronic element is mounted is mounted on a resin package by using a press die. A resin package in which a thermosetting resin before full polymerization is charged into a horizontally long horizontally long runner having a plurality of cavities substantially orthogonal to a longitudinal direction, and is subjected to polymerization by heating by the horizontally long runner. A first step in which a granular granulated thermosetting resin before complete polymerization is weighed by a predetermined amount substantially corresponding to the movement of the horizontally long runner and temporarily stored therein; and After the mold opening, a second step of introducing the temporarily contained granular thermosetting resin so as to be substantially uniformly distributed in the horizontally long runner, and a mold of the press mold. A third step of heating and melting the granular thermosetting resin by a movable runner driven in the horizontally long runner, pumping the molten thermosetting resin toward the cavity, and curing the resin in the cavity; And a fourth step of taking out the integrated body with the cured lead frame out of the mold after the mold is opened.

Preferably, in the second step, the granular thermosetting resin has a bottom surface substantially corresponding to an opening of the horizontally long runner, and is opened and closed to close and open the bottom surface. The distribution is performed by free fall by using a horizontally long container that is provided with a door means and that is moved between the temporary storage position and the distribution position.

Preferably, the apparatus further comprises a forced supply mechanism having a member passing through the bottom surface, wherein the granular thermosetting resin is positively supplied into the horizontally elongated runner with the movement of the member. Features.

Preferably, the horizontally long container is moved through a window provided in a heat shielding member disposed on the press die and performing heat shielding.

Preferably, in order to resin package the lead frame on which a predetermined electronic element is mounted by using a press die, the lead frame is completely contained in a horizontally long horizontally long runner having a plurality of cavities substantially orthogonal to the longitudinal direction. A resin packaging apparatus for charging a thermosetting resin before polymerization, and performing resin packaging by polymerization by heating with the horizontal runner, wherein the granular granular thermosetting resin before complete polymerization is formed using the horizontal runner. First means for measuring and temporarily storing a predetermined necessary amount substantially corresponding to the movement amount, and after opening the press mold, the temporarily stored granular thermosetting resin is placed in the horizontally long runner. A second means for supplying the granules so as to be distributed substantially uniformly, and a movable runner driven in the horizontally long runner after closing the press die, thereby forming the granules. A thermosetting resin heated and melted is pumped toward the cavity, and a third means for curing in the cavity, after mold opening of the press die,
And a fourth step of taking out the integrated body with the cured lead frame out of the mold.

[0014] Preferably, the second means has a bottom surface substantially corresponding to the opening of the horizontal runner, and the granular thermosetting resin is opened and closed to close and open the bottom surface. The distribution is performed by free fall by using a horizontally long container that is provided with a door means and that is moved between the temporary storage position and the distribution position.

Preferably, the apparatus further comprises a forced supply mechanism having a member passing through the bottom surface, wherein the granular thermosetting resin is positively supplied into the horizontally elongated runner with the movement of the member. Features.

Preferably, the horizontally long container is moved via a door provided on a heat shielding member provided in the press device.

[0017] Preferably, the opening and closing door means includes:
It is characterized in that it opens and closes in a non-contact state with respect to the horizontally long runner.

[0018]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described.
This will be described with reference to the accompanying drawings. FIG. 1 is a cutaway view of a main part of the press device of the resin packaging apparatus, showing a main part thereof broken away.

In this figure, the components related to the upper mold with B added after each reference number, and the components related to the lower mold with A added after each reference number, as shown in FIG. It is installed at a predetermined position, and when the press device P is open, each is vertically separated from a separation surface (parting line PL) formed between the upper and lower cavity blocks 2B and 2A. .

In the upper and lower cavity blocks 2B and 2A which are provided so as to be separable with the separation plane PL as a boundary surface, cavities 15B and 15A serving as space mold portions for forming a resin package are formed by processing as described later. ing. The upper and lower cavity blocks 2B, 2A
Are fixed to upper and lower backup plates 9A and 9B for positioning each other, and a guide 13 fixed to the upper backup plate 9B and a lower backup plate 9A are provided between the upper and lower backup plates 9A and 9B. The guide bush 14 is configured so that mutual positioning is performed.

On the other hand, a package formed in the cavity 15B and an ejector pin receiving upper base 12B holding an ejector pin 11B for pushing the runner 5 out of the upper cavity block 2B to the outside provide a pushing force. ing. In addition, the ejector pin 11A for pushing out the package formed in the lower cavity 15A from the lower cavity block 2A to the outside obtains a pushing force by the movement of the ejector pin receiving lower base 12A that holds the ejector pin 11A.

The upper and lower ejector pin receiving bases 1
2B and 12A are configured to operate by the press pressure at the time of the opening operation of the press device P and the upper and lower springs 25B and 25A.

The mold having the above-described structure is composed of the upper and lower bases 10.
It is attached to the press device P via A and B. Next, between the lower cavity 15A of the lower cavity block 2A, a gate 6 is formed so as to communicate with the horizontal runner 5, and the movable runner 1 obtains a driving force from the actuator 8 below the horizontal runner 5. It is provided so as to be movable in the directions of arrows F and J in FIG. The shape of the movable runner 1 is formed into a rectangular shape in consideration of the arrangement state of the cavity.

Next, FIG. 2 is a plan view of the lower cavity block 2A viewed from the separation plane PL of FIG. 1, and shows an example of the arrangement of the lower cavity 15A.

In this figure, N lower cavities 15A are formed along the longitudinal direction of the lower cavity block 2A, and communicate with the horizontally long runner 5 via gates 6 communicating with the lower cavities 15A. It is formed so that. Below the horizontal runner 5 provided in this manner, a resin having a broken shape close to the outer shape of the horizontal runner 5 is directly injected into the movable runner 1 in a granular state as described later. Resin material can be positioned. A positioning pin 20 for positioning a positioning hole 3E formed in the lead frame 3 relative to the cavity block is implanted in the lower cavity block 2A.

Then, in the upper cavity block 2B,
The upper cavity 15 is located at a position facing the lower cavity 15A.
B while each is formed, the lower cavity block 2A
At a position facing the horizontally long runner 5, a shape portion 2C protruding downward is formed as shown in FIG. The ejector pin 11 </ b> B passes through the inside of this shaped portion, so that the portion formed in the horizontally long runner 5 can be pushed out.

Next, FIG. 3 is a cutaway view (a) of a main part of a granular resin supply device provided in addition to the press device P having the structure described above, and a sectional view taken along the line XX of FIG. b).
In this drawing, if the same reference numerals are given to the components already described for the configuration of the press apparatus and the description thereof is omitted, the press apparatus P is opened and becomes the state shown in the figure. At this time, since the movable runner 1 is retracted downward in the runner 5 by the operation of the actuator 8, the granular thermosetting resin 60 can be charged. The greatest feature is that the granular thermosetting resin material 60 can be directly introduced into the horizontally long runner 5 as described above.

In this figure, an arrow F on the base 70
1, a predetermined amount of the granular resin material 60 is measured in a horizontally long supply unit 61 fixed to the tip of a pair of arms 63 extending from a carriage 64 guided along a guide rail 65 in the F2 direction. Is accommodated. This horizontally long supply unit 61 is a horizontally long runner
It has a horizontally long opening / closing portion 62 which is substantially the same as the above, and is configured such that the granular resin material 60 can be accommodated and dropped by opening and closing the opening / closing portion 62.

The horizontally long supply unit 61 is provided with a carriage motor 66 via an arm 63 and a carriage 64.
, And is configured to be movable in the direction of arrow F1 or F2 on the guide rail 65 by a predetermined drive of a motor 66. The guide rail 65 and the carriage motor 66 are fixed at predetermined positions on the base 70. A base 71 on which a carriage 64 is freely movable in the directions of arrows F1 and F2 is fixed at a predetermined position on the base 70, and a horizontally long measuring container 72 is mounted on the base 71 with a driving mechanism (not shown). Are movably mounted in the directions of arrows S and T.

On the upper surface of the horizontally long measuring container 72, a lower end opening 74 of a horizontally long hopper 73 is formed.
The horizontally long weighing container 72 is movably disposed. The horizontally long hopper 73 is supported and fixed at a predetermined position on a base 70 by a support structure (not shown), and a granular thermosetting resin 60 is provided therein. Is filled.

The upper and lower cavity blocks 2B, 2A
A partition (shielding member) 75 is provided between the horizontal supply unit 61 and the horizontal supply unit 61 to thermally partition them. An opening 75a is formed in the partition 75 at a position corresponding to the horizontal supply unit 61, and a shutter 77 for opening and closing the opening 75a.
Are configured to move upward by a drive mechanism (not shown).

In the above configuration, with further reference to the operation explanation flowchart of FIG. 6, when the apparatus is started in step S1, the lead frame 3 is moved to the positioning pins 20 provided in the lower cavity block 2A. It is set using a chucking hand device (not shown).

Thereafter, as shown in FIG. 3A, the horizontally long measuring container 72 is moved, the required amount is measured from the hopper 73, and supplied to the horizontally long container 61 (step S).
3, 4). Before or after this, the process proceeds to step S5, in which the shutter 77 is opened as shown in FIG. 3 so that the horizontally long supply unit 61 can pass through the opening 75a.

Next, with further reference to FIG.
6, the carriage 64 is driven on the guide rail 65 in the direction of arrow F <b> 1 by a predetermined operation of the carriage motor 66, and stops after reaching the predetermined position on the horizontally long runner 5. Next, in step S7, the horizontally long opening / closing port 6
2 is opened by an opening / closing mechanism (not shown), and the thermosetting granular thermosetting resin 60 housed in the feeding unit 61 is fed into the horizontally long horizontally long runner 5.

Subsequently, in step S8, the granular thermosetting resin 60 has been supplied and charged into the horizontal runner 5 and the horizontal unit 61 is moved by the carriage motor 66 on the guide rail 65 by the carriage 64 in the direction indicated by the arrow F2. Move in the direction and stop at a predetermined position. In addition, the shutter 77 is driven by an opening / closing mechanism (not shown) to close the opening 75a, thereby bringing the state shown in FIG. 5A.

Before and after this, as shown in FIG. 5B, the mold is closed so that the upper cavity block 2B is joined at the separation plane PL (step S9). Thereafter, as shown in FIG. 5C, the granular thermosetting resin 60 in which the movable runner 1 is driven in the direction of arrow F by the operation of the actuator and is in a molten state is moved to the gate 6.
Through the upper and lower cavities 15A and 15B. Thereafter, the filling of the molten resin into the upper and lower cavities 15A and 15B is completed, the movable runner 1 stops at the final position, and the curing reaction is accelerated by heating and pressurizing to perform the polymerization reaction (step S10). ).

Thereafter, the mold is opened and the resin package portion is ejected from the cavities 15B and 15A by the pushing operation of the ejector pins 11B and 11A, and is gripped by the chucking hand (not shown) and removed from the mold.

In the meantime, the popper 73 is
When the supply unit 61 is stopped at a predetermined position in the state shown in FIG. The long measuring container 72 is moved on the gantry 71 in the direction of arrow S by a driving mechanism (not shown) to
1 and stops at a predetermined position (see FIG. 5B), and the granular thermosetting resin 60 is transferred and accommodated in a supply unit 61 that is long horizontally (see FIG. 5C). Next, the horizontally long measuring container 72 is moved in the direction of the arrow S by a driving mechanism (not shown).
It moves upward and moves to the lower opening / closing opening of the popper 73, stops at a predetermined position, and waits for the next operation (see FIG. 5A).

FIG. 7 is an external perspective view of a semi-finished product obtained through the above-described steps. In FIG. 7, a part indicated by a two-dot chain line shows a pressure in the direction of arrow F by the movable runner 1 described above. The granular thermosetting resin material to be moved. This granular thermosetting resin material can be moved through the gate 6 toward the cavity in the horizontally elongated runner 5 substantially uniformly as the movable runner 1 rises in the heated and molten state. The resin package portion 15E is formed on the upper and lower surfaces of the lead frame 3 as shown in the figure, but only in the resin package portion 15E formed on the lower surface of the lead frame 3, the gate forming portion 6E communicates with the runner forming portion 5E. It is formed and a one-piece semi-finished product is obtained.

Thereafter, the semi-finished product is inserted into the positioning holes 3E.
Is set as a positive value in a pressing device (not shown), the bridging portion 3B is cut and eliminated so as to leave the lead portion 3A of the lead frame 3, and the lead portion 3A is bent by a predetermined amount to obtain a finished product.

As described above, according to the present embodiment, the thermosetting resin material can be directly supplied into the horizontally long runner by the horizontally long supply unit into the press apparatus having the horizontally long runner. A device for supplying the thermoset resin in a substantially uniform manner to the die set having a space that approximately matches the internal shape of the horizontally long runner, or the material supplied in the die set is compression-molded with a punch and heated. No need for a device to obtain the curable resin material or a device to open the die set and then remove the stick-shaped thermosetting resin material and put it into the horizontal runner, which can reduce large-scale mechanical parts. In addition, the manufacturing cost can be reduced. In addition, maintenance is easy, and significant improvements can be made.

Incidentally, the granular thermosetting resin 60 is positively supplied into the horizontally long runner 5 with the movement of the members by further providing a forced supply / injection mechanism having a member passing through the bottom surface of the supply unit 61. Therefore, the supply can be performed reliably and at high speed, and the cycle time can be reduced.

FIG. 8 is a schematic diagram of a door opening / closing device provided on the bottom surface of the horizontally long supply unit. Components already described are given the same reference numerals and will not be described.
A cylinder 82 for driving a rod 83 in a vertical direction is provided on a side surface of the horizontally long supply unit 61. Further, on the bottom surface of the horizontally long supply unit 61, doors 62a and 62b which open and close in the directions indicated by arrows in solid and two-dot chain lines around the pivot points 80 and 81 and have a link 84 at one end are provided as shown. Is provided. The other end of each link 84 is connected to the rod 83 described above, and is configured to open and close the door when the cylinder 82 is turned on and off. The doors 62a and 62b that are opened and closed in this manner are sufficiently separated from the horizontally long runner 5 so as to prevent the influence of heat.

[0044]

As described above, according to the present invention,
In order to resin package the lead frame on which a predetermined electronic element is mounted using a press die, a thermosetting resin before full polymerization is placed in a horizontally long elongated runner having a plurality of cavities substantially orthogonal to the longitudinal direction. When resin packaging is performed by pressurization and polymerization by a horizontal runner, the entire device can be simplified and configured inexpensively, installation space can be reduced, and inspection and maintenance can be performed. And a resin packaging method and a device therefor, which can be simplified.

[0045]

[Brief description of the drawings]

FIG. 1 is a cutaway view of a main part of a resin packaging press device.

FIG. 2 is a plan view of a mold.

FIG. 3A is a cutaway view of a main part of the entire apparatus. (B)
FIG. 3A is a sectional view taken along line XX of FIG.

FIG. 4A is a fragmentary cutaway view of the entire apparatus. (B)
FIG. 3A is a sectional view taken along line XX of FIG.

FIG. 5 is an explanatory diagram of the operation of the entire apparatus.

FIG. 6 is a flowchart illustrating the operation of the entire apparatus.

FIG. 7 is an external perspective view of the integrated body after resin packaging.

FIG. 8 is a schematic diagram of a door opening / closing device provided on the bottom surface of the horizontally long supply unit.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Movable runner 3 Lead frame 5 Horizontal runner 6 Gate 15A Lower cavity 15B Upper cavity 60 Granular thermosetting resin 61 Horizontal supply unit 62 Opening / closing part 63 Arm 64 Carriage 65 Guide rail 70 Base 72 Metering container 75 Partition (heat shielding member) ) 77 Shutter

Continued on the front page (51) Int.Cl. ⁶ Identification code FI B29L 31:34

Claims (9)

[Claims] In order to package a lead frame on which a predetermined electronic element is mounted using a press die, a pre-polymerization process is performed in a horizontally long horizontally long runner having a plurality of cavities substantially perpendicular to a longitudinal direction. A resin packaging method of charging a thermosetting resin and performing resin packaging by polymerization by heating and pressurization by the horizontal runner, wherein the granular thermosetting resin before complete polymerization is transferred to the horizontal runner moving part. A first step of measuring and temporarily storing an approximately corresponding predetermined required amount, and after opening the press die, distributing the temporarily stored granular thermosetting resin substantially uniformly in the horizontally long runner. A second step of charging the granular thermosetting resin by a movable runner driven in the horizontal runner after closing the press die. Hot melted and pumped towards the cavity,
A resin comprising: a third step of curing in the cavity; and a fourth step of taking out the integrated body with the cured lead frame out of the mold after opening the press mold. Packaging method. 2. In the second step, there is provided an opening / closing door means which has a bottom surface substantially corresponding to an opening of the horizontally long runner, and closes and opens the bottom surface. By using a horizontally long container that is further moved between the temporary storage position and the distribution position,
The resin packaging method according to claim 1, wherein the distribution is performed by free fall. 3. A forcible supply and supply mechanism having a member passing through the bottom surface, wherein the granular thermosetting resin is positively supplied into the horizontally long runner with the movement of the member. The resin packaging method according to claim 2. 4. The container according to claim 1, wherein the horizontally long container is moved through a window provided on a heat shielding member disposed on the press die and performing heat shielding. The resin packaging method according to 1. 5. A pre-polymerization process in which a lead frame on which a predetermined electronic element is mounted is resin-packaged using a press die in a horizontally long horizontally long runner having a plurality of cavities substantially orthogonal to a longitudinal direction. A resin packaging device for charging a thermosetting resin and performing resin packaging by polymerization by heating and pressurization by the horizontal runner, wherein the granular thermosetting resin before complete polymerization is formed by the horizontal runner. First means for measuring and temporarily storing a predetermined required amount substantially corresponding to the movement amount, and after the mold of the press die is opened, the temporarily stored granular thermosetting resin is placed in the horizontally long runner. A second means for supplying the particles so as to be distributed substantially uniformly; and a movable runner driven in the horizontally long runner after closing the press die, whereby the granular thermosetting is performed. A third means for heating and melting the conductive resin, forcing the resin into the cavity, and curing the resin in the cavity; and, after opening the mold of the press mold, removing the integrated body with the cured lead frame. And a fourth step of extracting the resin from the resin packaging apparatus. 6. The second means further comprises an opening / closing door means having a bottom surface substantially corresponding to the opening of the horizontally elongated runner, wherein the granular thermosetting resin is closed and opened. The resin packaging apparatus according to claim 5, wherein the distribution is performed by free fall by using a horizontally long container that is provided and that is moved between the temporary storage position and the distribution position. . 7. A forcible supply and supply mechanism having a member passing through the bottom surface, wherein the granular thermosetting resin is positively supplied into the horizontally long runner with the movement of the member. The resin packaging device according to claim 6. 8. The resin according to claim 5, wherein the horizontally long container is moved via a door provided on a heat shielding member provided in the press device. Packaging equipment. 9. The door according to claim 6, wherein the door is opened and closed in a non-contact state with the horizontal runner.
The resin packaging apparatus according to item 1.