JPH11307157A - Electrical connection device for electronic component and electrical connection method for electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To perform electrical connection of an electronic component with high reliability regardless of use temperature. SOLUTION: In an electrical connection device 3 of an electronic component 1 that is used to connect the electronic component 1 to an object 2 electrically by the use of a nonconductive resin containing conductive particles 14, coil-like carbon fiber structural bodies 20 are incorporated into the nonconductive resin. Then, the coil-like carbon fiber structural bodies 20 are connected to electrical connection parts 4 of the electronic component 1 and electrical connection parts 5 of the object 2 through the conductive particles 14 included in the nonconductive resin so that the electrical connection of the electrical connection parts 4 of the electronic component 1 to the electrical connection parts 5 of the object 2 is performed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for electrically connecting an electronic component to an object and a method for electrically connecting the electronic component.

[0002]

2. Description of the Related Art Normally used electronic components such as semiconductor packages and IC (integrated circuit) packages, etc.
For example, it is necessary to electrically connect the object to a circuit board. FIG. 7 shows a conventional electronic component 10.
2 shows an example of an electrical connection between 0 and the circuit board 101.
As shown in FIG. 7A, the terminal 102 of the electronic component 100
Are electrically connected to a wiring pattern 103 of a circuit board 101 via an anisotropic conductive film 104. This anisotropic conductive film 104 has a non-conductive resin 105 and conductive particles 106, and a large number of conductive particles 106.
Are contained in the non-conductive resin 105. The anisotropic conductive film 104 is disposed between the electronic component 100 and the circuit board 101, and when the electronic component 100 is pressed from above, the terminals 102 of the electronic component 100 are connected to the circuit board 101.
Can be electrically connected to the wiring pattern 103 using conductive particles 106.

[0003]

However, such a conventional electrical connection method has the following problems. When the circuit board 101 is operated, the non-conductive resin 105 fixing the conductive particles 106 expands due to an increase in the use temperature, and a force for pushing the electronic component 100 in the direction of the arrow 107 acts. As a result, the terminal 102 of the electronic component 100 and the conductive pattern 1 of the circuit board 101 which were formed by the ball-shaped conductive particles 106 as shown in FIG.
The electrical connection of 03 is disconnected, resulting in a disconnection state.
That is, the conductive particles 1 which are the metal particles used for the electric passages
In No. 06, since the shape is not changed, the contact portion at the grain boundary is separated and the wire breaks. And the circuit board 10 again
When the temperature is lowered after the operation 1, the electronic component 100 and the circuit board 101 are brought into a conductive state again as shown in FIG.

As described above, the electronic component 1 shown in FIG.
There is a problem in the temperature dependency of the circuit system of the circuit board 101 and the circuit board 101, and the operating temperature range of such a circuit system is very narrow. Accordingly, the present invention has been made to solve the above-described problems, and provides an electronic component electrical connection device and an electrical component electrical connection method that can perform electrical connection of electronic components with high reliability regardless of a use temperature. It is intended to be.

[0005]

According to the present invention, there is provided an electronic component for electrically connecting an electronic component to an object using a non-conductive material containing conductive particles. In the electrical connection device, the non-conductive material includes a plurality of coil-shaped carbon fiber structures, and the coil-shaped carbon fiber structures are electrically connected to the electronic component via the conductive particles in the non-conductive material. The electrical connection of the electronic component is characterized in that the electrical connection of the electronic component and the electrical connection of the object are performed by connecting the electrical connection of the object and the electrical connection of the object. You.

According to the present invention, there is provided a device for electrically connecting an electronic component to an object by using a non-conductive resin containing conductive particles. A coil-shaped carbon fiber structure is included, and the coil-shaped carbon fiber structure is connected to the electrical connection portion of the electronic component and the electrical connection portion of the object via conductive particles in the non-conductive material, and The electrical connection between the electrical connection of the object and the electrical connection of the object is made. Thus, the electrical connection between the electrical connection portion of the electronic component and the electrical connection portion of the target object can be reliably performed by using the coiled carbon fiber structure and the conductive particles.

In the present invention, preferably, one end side of the coiled carbon fiber structure is electrically connected to the electrical connection portion of the electronic component via conductive particles in a non-conductive material, and When the other end is electrically connected to the electrical connection portion of the object, the electronic component is pressurized. Thus, when the one end side and the other end side of the coiled carbon fiber structure are used to securely fix the electrical connection portion of the electronic component and the electrical connection portion of the object, the electronic component may be pressurized. .

The object of the present invention is to provide a method for electrically connecting an electronic component to an object using a non-conductive material containing conductive particles. By mixing the coiled carbon fiber structure into the non-conductive material and curing the non-conductive material, the electrical connection portion of the electronic component and the electrical connection portion of the object can be connected to the coiled carbon fiber structure and the non-conductive material. This is achieved by a method for electrically connecting electronic components, which is electrically connected via conductive particles.

When an electronic component is electrically connected to an object by using a non-conductive material containing conductive particles, a coiled carbon fiber structure is mixed into a non-conductive resin, and the non-conductive material is removed. By curing, the electrical connection portion of the electronic component and the electrical connection portion of the object are electrically connected to the coiled carbon fiber structure via conductive particles in a non-conductive material. Thus, the electrical connection portion of the electronic component and the electrical connection portion of the object can be reliably electrically connected using the coiled carbon fiber structure and the conductive particles.

[0010]

Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. Note that the embodiments described below are preferred specific examples of the present invention,
Although various technically preferable limits are given, the scope of the present invention is not limited to these modes unless otherwise specified in the following description.

FIG. 1 shows an electronic component (also called an electrical component) 1.
And a preferred embodiment of an electrical connection device 3 that can reliably and electrically connect the circuit board (object) 2. FIG. 2 is a cross-sectional view illustrating a structural example of the electronic component 1, the circuit board 2, and the electrical connection device 3 of FIG. FIG.
In FIG. 2 and FIG. 2, the electronic component 1 has a plurality of terminals 4 as electric connection portions at a lower portion. On the other hand, on the upper surface of the circuit board 2, a wiring pattern 5, which is an electrical connection portion, is formed.

The electrical connection device 3 can reliably and electrically connect the terminals 4 of the electronic component 1 and the wiring patterns 5 of the circuit board 2. The electrical connection device 3 is, for example, a device in which conductive particles 14 as metal balls and a coiled carbon fiber structure 20 are mixed or contained in a non-conductive resin (non-conductive material) 10. Anisotropic conductive adhesive resin film (ACF: Anisotropic Conductivity)
ve Film). Examples of the non-conductive resin 10 include a thermosetting resin such as an epoxy resin, a UV resin (a resin which is cured by irradiation with ultraviolet rays), and a thermoplastic resin such as a styrene resin. The non-conductive resin 10 contains ball-shaped conductive particles (metal particles). The non-conductive resin 10 including a large number of such coiled carbon fiber structures 20 is applied on the circuit board 2 by, for example, a screen printing method or a supply method using a dispenser or the like.

Next, the coiled carbon fiber structure 20
And an example of a manufacturing method thereof will be described. The coiled carbon fiber structure 20 illustrated in FIG. 5 has conductivity, and the fiber diameter (thickness) L1 is, for example, 1 μm to 5 μm. The outer diameter L2 of the coil of the coiled carbon fiber structure 20 is, for example, about 2 to 5 times the fiber diameter L1, that is, 2 μm to 2 μm.
5 μm. The axial length of the coiled carbon fiber structure 20 is, for example, 3 μm to 30 μm. The coiled carbon fiber structure 20 has, for example, about 1 to 30 turns.

The coiled carbon fiber structure 20 consisting essentially of carbon having a fiber diameter of 1 μm to 5 μm has a coil outer diameter of 2 to 5 times the fiber diameter and a hydrocarbon in a system in which a transition metal exists. System gas, especially gas containing acetylene gas
It can be obtained by performing a gas phase thermal decomposition at 0 to 800 ° C.

As hydrocarbons, acetylene, ethylene,
Examples thereof include unsaturated hydrocarbons such as propylene, and saturated hydrocarbons such as ethane, propane, and butane. Acetylene is most preferable from the viewpoint of the catalytic action of transition metals. Hydrogen can be mixed with these hydrocarbon gases and used, and in addition, diluting gases such as argon, nitrogen, and helium can be used, which is useful for controlling the shape of the coil.

[0016] The reaction temperature is in the range of 300 to 1000 ° C, more preferably 700 to 800 ° C. If the temperature is lower than this, thermal decomposition does not occur depending on the type of raw material gas and other reaction conditions. On the other hand, when the temperature exceeds this temperature, the obtained fiber becomes linear, and a coiled fiber cannot be obtained. The reaction pressure is preferably in the range of 200 mmHg to atmospheric pressure, and if it is out of this range, it becomes difficult to control the reaction.

In the present invention, it is necessary that a transition metal catalyst be present in the reaction system. Fe, C as transition metals
o, Ni, Cr and the like, and alloys thereof may be used. In the absence of these transition metal catalysts, fiberization is difficult.

Next, a method for manufacturing the electrical connection device 3 shown in FIG. 2 will be described with reference to FIG. The metal balls (conductive particles) 14 described above include, for example, solder balls, copper,
Silver, nickel, an alloy thereof, or the like can be used. Alternatively, as the metal ball, a ball obtained by plating metal on plastic can be used. The axial length of the metal ball 14 or the coiled carbon fiber structure 20 is, for example, about 3 μm to 30 μm. FIG.
In step SP1, a large number of coil-shaped carbon fiber structures 20 are mixed into the non-conductive resin 10 containing the metal balls 14 as conductive particles. Alternatively, the metal ball 14 and the coiled carbon fiber structure 20 can be mixed into the non-conductive resin 10 at the same time.

Next, a tape-shaped member having a thickness of 25 μm and a width corresponding to the size of the component is temporarily bonded to the substrate 2 in advance (step SP2). In step SP3 in FIG.
A mounting device (not shown) mounts the electronic component 1 on the electrical connection device 3 on the circuit board 2, and the electronic component 1 is pressed from above. The non-conductive resin 10 is cured by being heated together with the pressing operation. If the non-conductive resin 10 is a UV resin, the non-conductive resin 10 is cured by irradiating ultraviolet rays. In step SP4 in FIG. 6, the anisotropic conductive resin is cured as described above, and the electrical connection device 3 as shown in FIG. 2 is completed.

By the way, under normal temperature conditions, the electronic component 1 is reliably electrically connected to the circuit board 2 by using the coiled carbon fiber structure 20 as described above. If the circuit board 2 operates and the temperature including the electronic component 1 and the circuit board 2 rises, the non-conductive resin 10 expands as shown in FIG. That is, the thickness D1 of the non-conductive resin 10
However, the thickness becomes larger than the thickness D of the non-conductive resin 10 in FIG. However, the coiled carbon fiber structure 20 has elasticity, and the coiled carbon fiber structure 20
Can follow the expansion of the non-conductive resin 10 by the elastic force of the coil-shaped carbon fiber structure 20.
Since it can be pressed against the terminal 4 of the electronic component 1 and the wiring pattern 5 of the circuit board 2, electrical connection can be reliably maintained, and high reliability can be obtained without breaking the circuit. .

When the temperature of the circuit board 2 is reduced after the operation of the circuit board 2 is completed, the thickness D2 of the non-conductive resin 10 returns to the thickness D of FIG. 2 as shown in FIG. Even in this case, the terminal 4 of the electronic component 1 and the wiring pattern 5 of the circuit board 2 can be electrically reliably connected by the spring force of the coiled carbon fiber structure 20. Furthermore, if the ambient temperature is lower than normal and the non-conductive resin 10 shrinks compared to the normal state in FIG. 2 and the thickness D2 shown in FIG. And coiled carbon fiber structure 2
0 is the terminal 4 of the electronic component 1 according to the shrinkage of the non-conductive resin 10.
And the wiring pattern 5 of the circuit board 2 can be reliably electrically connected. As described above, by using the electrical connection device 3 according to the embodiment of the present invention instead of the conventional connection using an anisotropic conductive resin, the electrical connection region at normal temperature or the low temperature region can be obtained. Electrical connection can be ensured in all of the electrical connection region and the high-temperature region.

The electrical connection device and the electrical connection method for electronic components of the present invention can be used for electrical connection of the following components. (1) When a semiconductor bare chip is mounted on a circuit board or the like. (2) A case where surface-mounted electronic devices such as molded semiconductor devices, resistors, and capacitors, and electrical components such as switches and sockets are connected to a circuit board or the like. (3) In the case of application to equipment in a high temperature region or a high temperature environment (outdoor use equipment), which was difficult with the conventional technology. As described above, the electronic component 1 according to the embodiment of the present invention includes:
In addition to semiconductor devices, semiconductor bare chips, and the like, it also includes ordinary electrical components such as switches and sockets.

The axial length of the coiled carbon fiber structure 20 as shown in FIG. 2 is preferably, for example, at most 30 μm or less. The reason for this is that when the wiring interval becomes narrower, it is necessary to prevent a short circuit between the electrodes, and it is important that the length be not longer than necessary. The embodiment of the electrical connection device for electronic parts of the present invention is based on characteristics of a conventional anisotropic conductive resin having conductive particles such as Ag balls used for connection for forming an electric circuit of electronic parts. Can be compensated for, and high reliability regarding electrical connection can be ensured.

As the coiled carbon fiber structure, for example, a coiled hollow carbon fiber structure whose surface is metal-treated can be used. As this metal plating, for example, nickel or nickel and gold can be adopted.

In the embodiment of the present invention, the coiled carbon fiber structure is also referred to as a carbon coil, and has the same size distribution as that of a conventional metal ball. Expansion due to temperature change after connection,
During compression, there is no change in contact resistance, and high electrical connection reliability is obtained. By using such a coiled carbon fiber structure, electrical connection of electronic components can be performed at room temperature, low temperature, or high temperature, and the applications are expanded.

In the illustrated example, the arrangement example of the coiled carbon fiber structure is vertically oriented in the drawing, that is, one end and the other end are connected to the terminal of the electronic component and the wiring pattern of the circuit board, respectively. 2 shows a configuration example. However, the coiled carbon fiber structure is not limited to this, and the coiled carbon fiber structure is a completely elastic body, regardless of whether the coiled carbon fiber structure is arranged substantially parallel to the electronic component and the circuit board or is arranged diagonally. The same effect as in the case of the vertical arrangement can be obtained. The non-conductive material is not limited to the non-conductive resin, but may be rubber or the like.

[0027]

As described above, according to the present invention,
The electronic components can be electrically connected with high reliability regardless of the operating temperature.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a preferred embodiment of an electrical connection device for electronic components of the present invention.

FIG. 2 is a sectional view showing the structure of the electrical connection device of FIG. 1;

FIG. 3 is a diagram showing a state in which a non-conductive resin expands when the temperature rises.

FIG. 4 is a diagram showing a state in which a non-conductive resin has contracted when the temperature has dropped.

FIG. 5 is a diagram showing an example of a coiled carbon fiber structure.

FIG. 6 is a diagram showing an example of the method for electrically connecting electronic components according to the present invention.

FIG. 7 is a diagram showing an example of a conventional electrical connection device.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Electronic component, 2 ... Circuit board (target object), 3
..Electrical connection devices, 4 ... terminals of electronic components (electric connection portions), 5 ... wiring patterns (electric connection portions), 1
4 Metal balls (conductive particles), 20 Coiled carbon fiber structure

Claims (6)

[Claims] An electronic component electrical connection device used to electrically connect an electronic component to an object using a non-conductive material containing conductive particles, wherein the non-conductive material includes a plurality of coils. -Shaped carbon fiber structure, and the coil-shaped carbon fiber structure connects the electrical connection portion of the electronic component and the electrical connection portion of the object through the conductive particles in the non-conductive material to form the electronic component. An electrical connection device for an electronic component, wherein an electrical connection is made between an electrical connection portion and an electrical connection portion of an object. 2. One end of a coiled carbon fiber structure is electrically connected to an electrical connection portion of an electronic component via conductive particles in a non-conductive material, and the other end of the coiled carbon fiber structure is an object. 2. An electrical connection to an electrical connection portion of an object.
An electrical connection device for an electronic component according to claim 1. 3. The electrical connection device for an electronic component according to claim 2, wherein the non-conductive material is a non-conductive resin, and the object is a circuit board. 4. A method for electrically connecting an electronic component to an object using a non-conductive material containing conductive particles, wherein the coil-shaped carbon fiber structure is formed in the non-conductive material. By mixing and curing the non-conductive material, the electrical connection portion of the electronic component and the electrical connection portion of the object are electrically connected to the coiled carbon fiber structure via the conductive particles in the non-conductive material. A method for electrically connecting electronic components. 5. Applying pressure to the electronic component, one end of the coiled carbon fiber structure is electrically connected to an electrical connection portion of the electronic component via conductive particles in a non-conductive material, and The method according to claim 4, wherein the other end of the carbon fiber structure is electrically connected to an electrical connection portion of the object. 6. The method according to claim 4, wherein the non-conductive material is a non-conductive resin, and the object is a circuit board.