JPH11300481A - Vacuum chamber for semiconductor manufacturing device and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain the vacuum chamber for the semiconductor manufacturing device with a high dimensional precision and its manufacturing method by which a large type equipment is not used and the vacuum chamber can be assembled at a low cast. SOLUTION: Relating to the vacuum chamber made of aluminum, which is used as a vacuum container, on a square tube shaped side wall part 1, a surface lid 2 having a stair shaped butting part 4, is fit, a tool 3 is brought into contact with the front surface of the peripheral part of the surface lid 2 while rotating the tool 3 made of aluminum or a metal harder than an aluminum alloy, and the tool 3 is moved along this peripheral part. Consequently, by using frictional heat generated between the tool 3 and the surface lid 2, the surface lid 2 and the upper end face of the side wall part 1, are subjected to solid phase bonding.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a vacuum chamber used in a semiconductor manufacturing apparatus and a method for manufacturing the same.
In particular, the present invention relates to a vacuum chamber made of aluminum or an aluminum alloy and a method of manufacturing the same.

[0002]

2. Description of the Related Art Recently, in a semiconductor manufacturing apparatus, a vacuum chamber that requires ultra-high vacuum and ultra-clean performance is used. This vacuum chamber is formed by cutting a thick plate or a forged product made of aluminum or an aluminum alloy (hereinafter, aluminum or aluminum alloy is collectively referred to as aluminum), a method of fusion-welding a combination of aluminum plates, and a plate of aluminum (Japanese Patent Laid-Open No. 7-2510)
No. 58) and a method of inserting a brazing filler metal into a joint and using laser or electron beam welding (Japanese Patent Laid-Open No. 9-1942).
No. 4).

[0003]

However, in the method of forming a chamber by shaving a thick plate or a forged product or the like, when a large chamber is manufactured, material costs and cutting costs are increased. There is a problem that a large amount of material waste occurs and the manufacturing cost becomes extremely high.

[0004] Further, by combining aluminum plate materials, M
The method of welding by IG welding or TIG welding, etc., requires high repair costs when conditions are severe and defects occur, and distortion occurs because each part is heated to a high temperature by welding heat during welding work. This leads to a decrease in dimensional accuracy.

[0005] The brazing method using a combination of aluminum plates has a problem that a large heating furnace is required when a large chamber is manufactured.

[0006] The method of welding with a laser and an electron beam also has the problem that the equipment for welding increases in size and the cost required for the welding machine and its system increases.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and can be assembled at low cost without using large-scale equipment and has high dimensional accuracy and a method of manufacturing the same. The purpose is to provide.

[0008]

In a vacuum chamber for a semiconductor manufacturing apparatus according to the present invention, a bottom plate and / or a surface cover and a side wall member are separately made of aluminum or an aluminum alloy. And / or wherein the surface lid is joined by a friction joining method using frictional heat with a metal harder than aluminum or an aluminum alloy.

In a method of manufacturing a vacuum chamber for a semiconductor manufacturing apparatus according to the present invention, a bottom plate and / or a surface lid and a side wall member are manufactured separately from aluminum or an aluminum alloy, and the side wall member and the bottom plate and / or the surface are manufactured separately. The lid and the lid are joined by a friction joining method using friction heat with a metal harder than aluminum or an aluminum alloy.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be specifically described below with reference to the accompanying drawings. FIG. 1 is a perspective view showing a method according to an embodiment of the present invention. The vacuum chamber includes a rectangular cylindrical side wall 1 and a surface cover 2 disposed on the side wall 1.
And each member is manufactured separately. The peripheral edge of the lower surface superimposed on the upper end of the side wall 1 of the front cover 2 is formed in a step shape, and the outer portion of the peripheral edge is thinner and the inner portion is thicker. The upper end surface of the side wall portion 1 is also formed in a stepped shape so as to be aligned with the lower peripheral edge of the front cover 2. That is, the upper end surface of the side wall portion 1 is higher on the outer surface side and lower on the inner surface side. Then, the front cover 2 is fitted to the upper end of the side wall 1. The front cover 2 and the side wall 1 are made of aluminum or an aluminum alloy material, and can be manufactured by a method such as casting, extrusion, rolling, and forging.

The bottom plate of the vacuum chamber is also made of aluminum or an aluminum alloy, and can be formed separately from the side wall portion 1 or can be formed integrally with the side wall portion 1.

After the front cover 2 is fitted on the side wall 1, the peripheral edge of the upper surface of the front cover 2 is friction-welded with a tool 3.
That is, while rotating a columnar tool 3 made of a metal harder than aluminum or an aluminum alloy, the tool 3 is brought into contact with the peripheral edge of the front cover 2 so that the tool 3 and the front cover 2 are rotated.
And slide. The sliding generates frictional heat, and the frictional heat heats the abutting portion 4 between the surface cover 2 and the side wall portion 1 and locally joins the surface cover 2 and the side wall portion 1 by stirring. . Then, the tool 3 is attached to the surface lid 2
Is moved along the peripheral edge of the front cover 2 to join the entire peripheral edge of the front cover 2 to the side wall 1. As a result, FIG.
As shown in (a), a joint 5 where the material is melted and solidified is formed along the peripheral edge of the front cover 2, and the vacuum chamber is completed.

In the joining method according to the present embodiment, the tool 3 is brought into contact with the upper surface of the front cover 2 fitted and placed on the side wall member 1, and the frictional heat between the tool 3 and the front cover 2 is used. This is a method in which the surface lid 2 and the side wall member 1 are solid-phase bonded to each other, and since the side wall member 1 and the surface lid 2 do not reach the melting temperature, the influence of distortion due to welding heat can be reduced and, at the same time, butt joints Part 4
There is an advantage that the decrease in strength of the steel sheet can be small. Therefore,
In the case of a structure such as a vacuum chamber, it is manufactured as an aluminum member divided at least into a surface cover and / or a bottom plate and a side wall member, and is joined by friction welding to thereby obtain a thick plate or a forged product. It is not necessary to cut out the parts, etc., and the number of parts can be reduced, so that the number of manufacturing steps and cost can be reduced.

The use of an extruded aluminum member or a casting for the member 1 can further reduce the manufacturing cost.

The shape of the butting portion 4 is not limited to the step-like shape as in the embodiment shown in FIG.
As shown in (b), the side wall member 1 may have a protrusion 6 at the center in the thickness direction of the upper end surface, and the shape of the abutting portion can be variously selected.

[0016]

As described above, according to the present invention,
An aluminum vacuum chamber for semiconductor manufacturing equipment can be assembled at low cost by solid-state bonding without using large-scale equipment.

[Brief description of the drawings]

FIG. 1 is a schematic perspective view showing a method according to an embodiment of the present invention.

2 (a) is a partially enlarged sectional view of FIG. 1 showing the butted shape, and FIG. 2 (b) is a partially enlarged sectional view showing a modified example of the butted shape.

[Explanation of symbols]

 1: Side wall member 2: Surface cover 3: Tool 4: Butt joint 5: Joint 6: Projection

Claims (8)

[Claims] 1. A method according to claim 1, wherein the bottom plate and / or the surface lid and the side wall member are made of aluminum or an aluminum alloy separately, and the side wall member and the bottom plate and / or the surface lid are made of a metal harder than aluminum or an aluminum alloy. A vacuum chamber for a semiconductor manufacturing apparatus, which is formed by joining by a friction joining method using frictional heat. 2. The semiconductor manufacturing apparatus according to claim 1, wherein a tool made of a metal harder than aluminum and an aluminum alloy is rotated relative to the member while rotating, thereby generating frictional heat. Vacuum chamber. 3. The vacuum chamber for a semiconductor manufacturing apparatus according to claim 1, wherein a groove portion at which the members abut against each other is bent in a step-like manner. 4. The bent portion has a thickness of 10 to 5 from the inner surface.
4. The vacuum chamber for a semiconductor manufacturing apparatus according to claim 3, wherein the position is 0%. 5. A bottom plate and / or a surface lid and a side wall member are manufactured separately from aluminum or an aluminum alloy, and the side wall member and the bottom plate and / or the surface lid are frictionally bonded to a metal harder than aluminum or an aluminum alloy. A method of manufacturing a vacuum chamber for a semiconductor manufacturing apparatus, wherein the bonding is performed by a friction bonding method using heat. 6. The semiconductor manufacturing apparatus according to claim 5, wherein the tool made of a metal harder than aluminum or an aluminum alloy is rotated relative to the member while rotating, thereby generating frictional heat. Manufacturing method for vacuum chambers. 7. The method for manufacturing a vacuum chamber for a semiconductor manufacturing apparatus according to claim 5, wherein a groove which is bent in a stepwise manner is formed at a butt portion of said member. 8. The bent portion has a thickness of 10 to 5 from the inner surface.
8. The method according to claim 7, wherein the position is 0%.