JPH11298803A - Solid-state image pickup element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To irradiate illuminating light from light emitting elements provided on a substrate effectively and to make the substrate small. SOLUTION: The solid-state image pickup element 1 is made up of a CCD image pickup section 3 that forms an image of an object part on a surface of a solid-state image pickup element substrate 2, stores charges and picks up and image and plural light emitting elements 4 that are placed at both ends of the CCD image pickup section 3 and irradiate the object part in a lumen with illuminating light. The parts of the solid-state image pickup element substrate 2 on which the light emitting elements 4 are placed are tilted toward the CCD image pickup section 3 with respect to the part of the solid-state image pickup element substrate 2 on which the CCD image pickup section 3 is placed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid-state image sensor, and more particularly, to a solid-state image sensor having a light emitting element for emitting illumination light.

[0002]

2. Description of the Related Art In recent years, an optical endoscope that inserts an insertion portion into a lumen and observes a target portion through an eyepiece or a solid-state image pickup device provided with the target portion at the distal end of the insertion portion, such as a CCD, is used. Electronic endoscopes for imaging and observing are widely used. In an endoscope apparatus equipped with such an electronic endoscope, a light source device for supplying illumination light to a target portion is used. In order to inspect the inside of a body cavity or a thin tube of a structure, for example, Japanese Unexamined Patent Application Publication No. 6
As disclosed in JP-A-153097, a light-emitting element such as a light-emitting diode is provided on the surface of a solid-state image sensor substrate, and a subject is illuminated and observed using the light-emitting element.

[0003]

However, in the solid-state imaging device in which a light-emitting element such as a light-emitting diode is provided on the surface of the substrate as proposed in Japanese Patent Application Laid-Open No. Hei 6-153097, the solid-state imaging device substrate If the plane is a plane, there is a possibility that a light emitting element illuminating an area other than the imaging area of the solid-state imaging element may exist depending on a position where the light emitting element is arranged and a light distribution angle thereof. There is a problem that the solid-state imaging device substrate becomes large by an area where the light emitting element exists.

In addition, since the light of all the light emitting elements is not effectively used as illumination light, there is a problem that an image pickup area of the solid state image pickup element is dark and a picked up image is dark.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and provides a solid-state imaging device capable of effectively irradiating illumination light from a light emitting element provided on a substrate and reducing the size of the substrate. It is an object.

[0006]

According to the present invention, there is provided a solid-state image pickup device comprising: a solid-state image pickup device having an image pickup section for picking up an optical image; Are arranged to be inclined toward the imaging unit.

In the solid-state imaging device according to the present invention, the light-emitting device is arranged at an angle to the image-capturing section, so that illumination light from the light-emitting device provided on the substrate is effectively irradiated and the substrate is downsized. To make things possible.

[0008]

Embodiments of the present invention will be described below with reference to the drawings.

First Embodiment FIGS. 1 to 3 relate to a first embodiment of the present invention. FIG. 1 is a cross-sectional view showing the structure of a solid-state image sensor, and FIG. 2 is a solid-state image sensor of FIG. FIG. 3 is a configuration diagram showing a configuration of an endoscope apparatus including an electronic endoscope having the configuration shown in FIG. 3, and FIG. 3 is an explanatory diagram illustrating an operation of the solid-state imaging device in FIG.

(Structure) As shown in FIG. 1, a solid-state image pickup device 1 of, for example, a CCD according to the present embodiment forms an image of a target portion on the surface of a solid-state image pickup device substrate 2 to accumulate electric charges. The CCD imaging unit 3 for performing and capturing images, and a plurality of light emitting elements 4 for irradiating illumination light to a target part in a lumen are provided at both ends of the CCD imaging unit 3.

Here, the portion of the solid-state imaging device substrate 2 where the light emitting element 4 is provided is inclined toward the CCD imaging portion 3 with respect to the portion of the solid-state imaging device substrate 2 where the CCD imaging portion 3 is disposed. ing.

As shown in FIG. 2, the solid-state image pickup device 1 includes, for example, an insertion portion 1 that is inserted into a lumen of an electronic endoscope 11.
The electronic endoscope 11 includes a video processor 13 that processes an image signal from the electronic endoscope 11 and a display monitor 14 that displays an image processed by the video processor 13. Endoscope device 15
Is configured.

The electronic endoscope 11 has the elongated and flexible insertion section 12, and an operation section 16 is provided at a rear end thereof. A universal cord 17 extends from the operation unit 16 side of the electronic endoscope 11, and a connector 18 is provided at an end of the universal cord 17, and the electronic endoscope 11 is connected to the video via the connector 18. Processor 13
Is to be connected to.

Then, the solid-state imaging device 1 provided in the distal end of the insertion section 12 of the electronic endoscope 11 irradiates illumination light from the light-emitting element 4 to a target site in the lumen, thereby forming an image of the target site. The CCD imaging unit 3 captures an image.

(Operation) Next, the operation of the solid-state imaging device 1 according to the present embodiment configured as described above will be described.

When the solid-state imaging device 1 of the present embodiment is provided inside the distal end of the insertion portion 6 of the electronic endoscope 11, the insertion portion 6 of the electronic endoscope 2 is inserted into the lumen, and Illumination light is emitted from the light emitting element 4 provided on the substrate 2 to the target part, an image of the target part is formed on the CCD image pickup unit 3 to take an image, and an image signal from the solid state image pickup element 1 is received via the universal code 17. Output to the video processor 13. The video processor 13 performs signal processing on the imaging signal, generates a standard video signal, for example, an NTSC signal, and causes the display monitor 14 to display an endoscope image.

In the solid-state imaging device 1, since the light-emitting device 4 is tilted toward the CCD imaging unit 3 on the solid-state imaging device substrate 2, as shown in FIG. The illumination area 21 moves toward the imaging area 22 indicated by the solid line of the CCD imaging unit 3, and light from all the light emitting elements 4 illuminates the imaging area 22.

At this time, as shown in FIG. 1, the solid-state imaging device 1 has a solid-state imaging device substrate 2 where the light emitting element 4 is provided and a solid-state imaging device where the CCD imaging section 3 is arranged. Since the device substrate 2 is inclined toward the CCD imaging unit 3 with respect to the device substrate 2, the size of the solid-state image sensor substrate 2 is smaller than that of a conventional solid-state image sensor substrate provided with light-emitting elements on a plane indicated by broken lines in FIG. Has become.

(Effect) As shown in FIG. 3C, in the conventional light emitting element provided on the plane of the solid-state image pickup element substrate, the illumination light for illuminating the image pickup area 22 irradiates the area other than the image pickup area 22. On the other hand, in the solid-state imaging device 1 of the present embodiment, the light-emitting device 4 is provided on the solid-state imaging device substrate 2 so as to be inclined toward the CCD imaging unit 3, and thus is shown in FIG. As described above, the illumination area 21 of the optical element 4 moves to the imaging area 22 side of the CCD imaging section 3, and the illumination light of the light emitting element 4 illuminates the imaging area 22. Can be applied to the imaging region 22, and the imaging region 22
Becomes bright, and a bright image can be obtained.

When the solid-state imaging device 1 according to the present embodiment is provided in the distal end of the insertion section 12 of the electronic endoscope 11, the solid-state imaging device substrate 2 where the light emitting element 4 is disposed is C
By tilting the solid-state imaging device substrate 2 by tilting it toward the CD imaging unit 3, the diameter of the distal end of the insertion unit 12 can be made smaller, and the patient who has undergone endoscopy has a smaller diameter. Pleasure can be suppressed.

Further, since the illumination light of the light emitting element 3 can be used efficiently, even if the number of the light emitting elements 4 is reduced, FIG.
As shown in (2), the imaging area 22 can obtain sufficient brightness, and the number of the light emitting elements 4 can be reduced to make the imaging area 22 more inexpensive and smaller.

Second Embodiment FIG. 4 is a sectional view showing the structure of a solid-state imaging device according to a second embodiment of the present invention.

Since the second embodiment is almost the same as the first embodiment, only different points will be described, and the same components will be denoted by the same reference numerals and description thereof will be omitted.

(Structure) As shown in FIG. 4, in the solid-state imaging device 1a of this embodiment, the solid-state imaging device substrate 2a is formed in a katakana "U" shape, and the solid-state imaging device substrate 2a
A CCD imaging unit 3 is provided on the surface of the inner bottom surface, and a plurality of light emitting elements 4 are provided at both ends of the opening of the solid-state imaging device substrate 2a in a state inclined to the CCD imaging unit 3 side. The solid-state imaging device substrate 2a has a CCD
A convex lens 31 and a concave lens 32 are arranged in front of the imaging unit 3.

(Operation) In the present embodiment, the light emitting element 4 arranged on the solid-state imaging device substrate 2a has the above configuration.
Is tilted in the direction of the CCD imaging unit 3, so that the first
Similarly to the embodiment, the illumination light from all the light emitting elements 4 illuminates the imaging area 22 of the CCD imaging section 3 (see FIG. 3).

(Effects) As described above, in the solid-state imaging device 1a of the present embodiment, in addition to the effects of the first embodiment, the CCD imaging unit 3a is provided via the convex lens 31 and the concave lens 32.
And the light emitting element 4 are spaced apart from each other.
Illuminating light from the light source 4 does not directly enter the CCD imaging unit 3, and the influence of the direct illuminating light from the light emitting element 4 on the imaging of the target part by the CCD imaging unit 3 can be eliminated, so that a clear endoscope can be obtained. A mirror image can be obtained.

Since the solid-state image sensor substrate 2a is formed in a U-shape, the solid-state image sensor substrate 2a has a smaller size than that of the first embodiment.
When the electronic endoscope 11 is incorporated in the distal end, the distal end of the electronic endoscope 11 can be made thinner, and the discomfort of the patient during the endoscopic examination can be further suppressed.

By the way, when the light emitting element 4 emits light, heat is generated. The heat causes thermal noise to the solid-state imaging device 1 and causes a problem of deteriorating the characteristics of the solid-state imaging device 1. Therefore, in the following embodiment, a solid-state imaging device capable of preventing a characteristic deterioration due to heat generated by light emission of a light-emitting element will be described.

Third Embodiment FIG. 5 is a sectional view showing the structure of a solid-state imaging device according to a third embodiment of the present invention.

(Construction) As shown in FIG. 5, the solid-state imaging device 41 of, for example, a CCD according to the present embodiment forms an image of a target portion on the surface of a solid-state imaging device substrate 42 to accumulate charges. The CCD image pickup unit 43 for performing and taking an image, and a plurality of light emitting elements 44 for irradiating a target portion in the lumen with illumination light are provided at both ends of the CCD image pickup unit 43.

In the solid-state imaging device 41, a CCD imaging unit 43
Solid-state light-emitting element substrate 4 provided with light-emitting element 44
2 is entirely covered with a transparent cover 45.
The space between 5 and the solid-state imaging device substrate 42 forms a vacuum space 46 in which a vacuum is provided.

(Operation) When the light emitting element 44 emits light, heat is generated from the light emitting element 44 and the heat is conducted to the space around the CCD image pickup section 43 and the solid state image pickup element substrate 42. In the embodiment, since the vacuum space 46 is vacuum, heat generated from the light emitting element 44 is
2 and it is difficult to conduct to the space around and the CCD imaging unit 43.

(Effect) As described above, in the solid-state imaging device 41 of the present embodiment, the heat generated from the light emitting device 44 is generated by the vacuum space 4.
6 makes it difficult for the CCD imaging unit 43 to conduct the electric current, so that the deterioration of the characteristics of the solid-state imaging device 41 due to heat can be effectively prevented.

When the solid-state imaging device substrate 41 is provided at the tip of the electronic endoscope 11 (see FIG. 2), heat generation at the tip of the electronic endoscope 11 is suppressed, so that safety for the patient is improved. It has the effect of increasing and suppressing discomfort.

Fourth Embodiment FIG. 6 is a sectional view showing the structure of a solid-state imaging device according to a fourth embodiment of the present invention.

Since the fourth embodiment is almost the same as the third embodiment, only different points will be described, and the same components will be denoted by the same reference numerals and description thereof will be omitted.

(Construction) As shown in FIG. 6, in the solid-state imaging device 51 of the present embodiment, a light-shielding and heat-insulating member is provided between a CCD imaging unit 43 and a light-emitting device 44 provided on a solid-state imaging device substrate 42. 52 are provided. Further, the light emitting element 4
4, a transparent cover 53 is provided, and a space existing between the transparent cover 53 and the light emitting element 44 is a vacuum space 4.
6 are formed. The transparent cover 53 has light directivity.

(Operation) In the present embodiment, the heat generated by the light emitting element 44 is prevented from being transmitted to the CCD image pickup unit 53 by the vacuum space 46 and the light shielding and heat insulating member 52 in the present embodiment.

(Effect) As described above, in the solid-state imaging device 51 of the present embodiment, similarly to the third embodiment, the vacuum space 46 and the light-shielding and heat-insulating member 52 allow the CCD of heat generated by the light-emitting device 44 to emit light. Because it hinders conduction to the imaging unit 43,
It is possible to prevent deterioration of the characteristics of the solid-state imaging device 51 due to heat.

Further, similarly to the third embodiment, when the solid-state imaging device substrate 51 is provided at the tip of the electronic endoscope 11 (see FIG. 2), heat is generated at the tip of the electronic endoscope 11. Since it can be suppressed, it has the effect of increasing the safety to the patient and suppressing discomfort.

[Supplementary Note] (Supplementary Note 1) In a solid-state imaging device having a light-emitting element that emits illumination light provided on a solid-state imaging device substrate having an imaging unit that captures an optical image, the light-emitting device is disposed on the imaging unit side. A solid-state imaging device characterized by being arranged at an angle.

(Additional Item 2) The solid-state imaging device according to Additional Item 1, wherein the solid-state imaging device substrate is formed in a U-shape.

(Supplementary Note 3) A solid-state imaging device in which a light-emitting element that emits illumination light is provided on a solid-state imaging element substrate having an imaging unit that captures an optical image, the solid-state imaging device further includes a cover that covers at least the light-emitting element. A solid-state imaging device, wherein a space between the imaging device substrate and the cover is a vacuum space.

(Additional Item 4) The solid-state imaging device according to Additional Item 3, wherein the cover has light directivity.

(Additional Item 5) The solid-state imaging device according to additional item 3, wherein the cover covers the light emitting element and the imaging unit.

(Additional Item 6) The solid-state imaging device according to additional item 3 or 4, wherein a light-shielding and heat-insulating member is provided between the imaging section and the light-emitting element.

(Supplementary Note 7) In an electronic endoscope having a solid-state imaging device for imaging a target site in the lumen at a distal end of an insertion portion to be inserted into the lumen, the solid-state imaging device includes:
A solid-state imaging device having a light-emitting element that emits illumination light provided on a solid-state imaging element substrate having an imaging unit that captures an optical image, wherein the light-emitting element is arranged to be inclined toward the imaging unit. Electronic endoscope.

(Supplementary Item 8) In an electronic endoscope having a solid-state imaging device for imaging a target site in the lumen at a distal end of an insertion portion to be inserted into the lumen, the solid-state imaging device may include:
A solid-state imaging device provided with a light-emitting element that emits illumination light on a solid-state imaging element substrate having an imaging unit that captures an optical image, the solid-state imaging element including a cover that covers at least the light-emitting element, the solid-state imaging element substrate and the cover An electronic endoscope, characterized in that the space with is a vacuum space.

[0049]

As described above, according to the solid-state imaging device of the present invention, since the light-emitting device is disposed inclined to the image-capturing unit side, illumination light from the light-emitting device provided on the substrate is effectively irradiated. In addition, there is an effect that the size of the substrate can be reduced.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating a configuration of a solid-state imaging device according to a first embodiment of the present invention.

FIG. 2 is a configuration diagram showing a configuration of an endoscope apparatus including an electronic endoscope having the solid-state imaging device of FIG. 1;

FIG. 3 is an explanatory diagram illustrating an operation of the solid-state imaging device in FIG. 1;

FIG. 4 is a cross-sectional view illustrating a configuration of a solid-state imaging device according to a second embodiment of the present invention.

FIG. 5 is a cross-sectional view illustrating a configuration of a solid-state imaging device according to a third embodiment of the present invention.

FIG. 6 is a sectional view showing a configuration of a solid-state imaging device according to a fourth embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Solid-state image sensor 2 ... Solid-state image sensor board 3 ... CCD imaging part 4 ... Light emitting element 11 ... Electronic endoscope 12 ... Insertion part 13 ... Video processor 14 ... Display monitor 15 ... Endoscope apparatus 16 ... Operation part 17 ... Universal code 18 Connector 21 Illumination area 22 Imaging area

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Keiichi Arai 2-43-2 Hatagaya, Shibuya-ku, Tokyo Inside Olympus Optical Industrial Co., Ltd. (72) Koichi Yoshimitsu 2-43-2 Hatagaya, Shibuya-ku, Tokyo Inside Olympus Optical Co., Ltd. (72) Inventor Akihiro Miyashita 2-43-2 Hatagaya, Shibuya-ku, Tokyo Inside Olympus Optical Co., Ltd. (72) Takashi Mibori 2-43-2, Hatagaya, Shibuya-ku, Tokyo Within Olympus Optical Co., Ltd. (72) Inventor Makoto Tsunakawa 2-43-2 Hatagaya, Shibuya-ku, Tokyo Olympus Optical Co., Ltd.

Claims (1)

[Claims] 1. A solid-state imaging device having a light-emitting element that emits illumination light provided on a solid-state imaging device substrate having an imaging unit that captures an optical image, wherein the light-emitting device is arranged to be inclined toward the imaging unit. Characteristic solid-state imaging device.