JPH11297523A - Plated resin coil - Google Patents
Plated resin coilInfo
- Publication number
- JPH11297523A JPH11297523A JP10111698A JP10111698A JPH11297523A JP H11297523 A JPH11297523 A JP H11297523A JP 10111698 A JP10111698 A JP 10111698A JP 10111698 A JP10111698 A JP 10111698A JP H11297523 A JPH11297523 A JP H11297523A
- Authority
- JP
- Japan
- Prior art keywords
- cylindrical body
- coil
- conductive layer
- plated
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は樹脂メッキコイルに
関する。[0001] The present invention relates to a resin-plated coil.
【0002】[0002]
【従来の技術】従来より、樹脂製円筒体の外周面上に螺
旋状に延びる導電層を形成した樹脂メッキコイルが知ら
れている。2. Description of the Related Art Conventionally, there has been known a resin-plated coil in which a conductive layer extending spirally is formed on the outer peripheral surface of a resin cylinder.
【0003】[0003]
【発明が解決しようとする課題】しかしながら、メッキ
層からなる導電層は極めて薄く、このため導電層の断面
積およびコイル巻数を、芯材に導線を巻き付けてなるコ
イルと同じにしようとすると導電層を大きくせざるを得
なくなり、したがって樹脂メッキコイル全体の寸法が大
きくなるという問題点がある。However, the conductive layer composed of a plated layer is extremely thin. Therefore, if the cross-sectional area of the conductive layer and the number of turns of the coil are made to be the same as those of a coil formed by winding a conductive wire around a core material, the conductive layer is not formed. Therefore, there is a problem that the size of the resin-plated coil becomes large.
【0004】[0004]
【課題を解決するための手段】前記課題を解決するため
に本発明によれば、樹脂製円筒体の外周面上または内周
面上に螺旋溝を形成し、螺旋溝の内壁面上をメッキ層に
より覆うことにより螺旋状に延びる導電層を形成してい
る。すなわち、導電層が円筒体の軸線に対し傾斜して延
びるので樹脂メッキコイル全体の寸法が小さく維持され
る。According to the present invention, a spiral groove is formed on an outer peripheral surface or an inner peripheral surface of a resin cylindrical body, and plating is performed on an inner wall surface of the spiral groove. A spirally extending conductive layer is formed by being covered with the layer. That is, since the conductive layer extends obliquely with respect to the axis of the cylindrical body, the overall size of the resin-plated coil is kept small.
【0005】[0005]
【発明の実施の形態】図1を参照すると、樹脂メッキコ
イル1はメッキ処理が可能な絶縁性樹脂からなる円筒体
2を具備する。円筒体2の外周面上にはネジが形成され
ており、したがって円筒体2は螺旋状に延びるネジ谷3
およびネジ山4を具備する。また、円筒体2の頂端には
フランジ5が円筒体2と一体的に形成されており、この
フランジ5の頂面には円筒体軸線K−K方向に延びる一
対のクリップ6a,6bがフランジ5と一体的に形成さ
れる。樹脂メッキコイル1はこれらクリップ6a,6b
によって基板に取り付けられる。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to FIG. 1, a resin-plated coil 1 has a cylindrical body 2 made of an insulating resin that can be plated. A screw is formed on the outer peripheral surface of the cylindrical body 2, so that the cylindrical body 2 has a spirally extending screw valley 3.
And a screw thread 4. A flange 5 is formed integrally with the cylindrical body 2 at the top end of the cylindrical body 2, and a pair of clips 6 a and 6 b extending in the cylindrical body axis KK direction are provided on the top surface of the flange 5. And formed integrally with it. The resin-plated coil 1 has these clips 6a, 6b
Attached to the substrate.
【0006】図1および図2に示されるように、螺旋溝
を構成するネジ谷3の内壁面は例えば銅メッキ層からな
る導電層7により覆われている。一方、ネジ山4の頂端
には互いに隣接する導電層7を互いに電気的に絶縁する
絶縁部8が形成されている。その結果、円筒体2の外周
面上に螺旋状に延びる導電層、すなわちコイルが形成さ
れる。As shown in FIGS. 1 and 2, the inner wall surface of the thread valley 3 forming the spiral groove is covered with a conductive layer 7 made of, for example, a copper plating layer. On the other hand, an insulating portion 8 for electrically insulating the adjacent conductive layers 7 from each other is formed on the top end of the screw thread 4. As a result, a conductive layer, that is, a coil, extending spirally on the outer peripheral surface of the cylindrical body 2 is formed.
【0007】すなわち、まず円筒体2の外周面全体にメ
ッキ処理が施され、円筒体2の外周面全体がメッキ層に
より覆われる。次いで、ネジ山4の頂端を研磨すること
によりメッキ層を除去すると共に円筒体2を露出させ、
斯くして螺旋状の導電層7が形成される。さらに、クリ
ップ6a,6bの表面上にも導電層が形成される。クリ
ップ6aの導電層はフランジ5に形成された導電層(図
示しない)を介して導電層7の頂端に電気的に接続さ
れ、クリップ6bの導電層は円筒体2の内周面に形成さ
れた導電層(図示しない)を介して導電層7の底端に電
気的に接続される。したがって、樹脂メッキコイル1を
基板に取り付けたときにクリップ6a,6bを介して導
電層5に電流を供給することができる。That is, first, the entire outer peripheral surface of the cylindrical body 2 is plated, and the entire outer peripheral surface of the cylindrical body 2 is covered with the plating layer. Next, the plating layer is removed by polishing the top end of the screw thread 4 and the cylindrical body 2 is exposed,
Thus, the spiral conductive layer 7 is formed. Further, a conductive layer is also formed on the surfaces of the clips 6a and 6b. The conductive layer of the clip 6a is electrically connected to the top end of the conductive layer 7 via a conductive layer (not shown) formed on the flange 5, and the conductive layer of the clip 6b is formed on the inner peripheral surface of the cylindrical body 2. It is electrically connected to the bottom end of conductive layer 7 via a conductive layer (not shown). Therefore, when the resin-plated coil 1 is mounted on the substrate, a current can be supplied to the conductive layer 5 via the clips 6a and 6b.
【0008】ところで、冒頭で述べたような従来の樹脂
メッキコイルでは円筒体の外周面は円筒体軸線に対し平
行に延びており、したがって導電層も円筒体軸線に対し
平行に延びている。このため、導電層7の断面積および
コイル巻数を確保するためには樹脂メッキコイル全体の
寸法を大きくせざるを得ない。これに対して本発明によ
る実施態様では、特に図2からわかるように、導電層7
が円筒体軸線K−Kに対し傾斜しており、したがって樹
脂メッキコイル1の寸法を小さく維持しつつ導電層7の
断面積およびコイル巻数を確保することができる。In the conventional resin-plated coil described above, the outer peripheral surface of the cylindrical body extends parallel to the axis of the cylindrical body, and therefore, the conductive layer also extends parallel to the axis of the cylindrical body. For this reason, in order to secure the cross-sectional area of the conductive layer 7 and the number of coil turns, the dimensions of the entire resin-plated coil must be increased. In contrast, in the embodiment according to the invention, as can be seen in particular from FIG.
Are inclined with respect to the cylinder axis KK, so that the cross-sectional area of the conductive layer 7 and the number of coil turns can be ensured while keeping the dimensions of the resin-plated coil 1 small.
【0009】なお、円筒体2の内周面上にネジ谷および
ネジ山を形成し、このネジ谷の内壁面を導電層により覆
うことにより円筒体2の内周面にコイルを形成するよう
にしてもよい。この場合、円筒体2の内周面上および外
周面上の両方にコイルを形成してもよく、或いは円筒体
2の内周面上または外周面上のいずれか一方にコイルを
形成してもよい。A thread is formed on the inner peripheral surface of the cylindrical body 2 by forming a thread valley and a thread on the inner peripheral surface of the cylindrical body 2 and covering the inner wall surface of the thread valley with a conductive layer. You may. In this case, a coil may be formed on both the inner peripheral surface and the outer peripheral surface of the cylindrical body 2, or a coil may be formed on either the inner peripheral surface or the outer peripheral surface of the cylindrical body 2. Good.
【0010】また、絶縁部8を形成するために、まずネ
ジ山4の頂端をレジストにより覆い、次いで円筒体全体
にメッキ処理を施した後にレジストを除去するようにし
てもよい。In order to form the insulating portion 8, the top end of the screw thread 4 may be first covered with a resist, and then the entire cylindrical body may be plated and then the resist may be removed.
【0011】[0011]
【発明の効果】導電層が円筒体の軸線に対し傾斜して延
びるので樹脂メッキコイル全体の寸法を小さく維持する
ことができる。As described above, since the conductive layer extends obliquely with respect to the axis of the cylindrical body, the size of the entire resin-plated coil can be kept small.
【図1】樹脂メッキコイルの全体図である。FIG. 1 is an overall view of a resin-plated coil.
【図2】樹脂メッキコイルの部分拡大断面図である。FIG. 2 is a partially enlarged sectional view of a resin-plated coil.
1…樹脂メッキコイル 2…円筒体 3…ネジ谷 4…ネジ山 7…導電層 8…絶縁部 K…円筒体軸線 DESCRIPTION OF SYMBOLS 1 ... Resin plating coil 2 ... Cylindrical body 3 ... Screw thread 4 ... Screw thread 7 ... Conductive layer 8 ... Insulating part K ... Cylindrical body axis line
Claims (1)
に螺旋溝を形成し、該螺旋溝の内壁面上をメッキ層によ
り覆うことにより螺旋状に延びる導電層を形成した樹脂
メッキコイル。1. A resin plating in which a spiral groove is formed on an outer peripheral surface or an inner peripheral surface of a resin cylindrical body, and a spirally extending conductive layer is formed by covering an inner wall surface of the spiral groove with a plating layer. coil.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10111698A JPH11297523A (en) | 1998-04-13 | 1998-04-13 | Plated resin coil |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10111698A JPH11297523A (en) | 1998-04-13 | 1998-04-13 | Plated resin coil |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH11297523A true JPH11297523A (en) | 1999-10-29 |
Family
ID=14292114
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10111698A Pending JPH11297523A (en) | 1998-04-13 | 1998-04-13 | Plated resin coil |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH11297523A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014220466A (en) * | 2013-05-10 | 2014-11-20 | 株式会社豊田自動織機 | Coil |
WO2024024121A1 (en) * | 2022-07-28 | 2024-02-01 | タツタ電線株式会社 | Coil |
-
1998
- 1998-04-13 JP JP10111698A patent/JPH11297523A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014220466A (en) * | 2013-05-10 | 2014-11-20 | 株式会社豊田自動織機 | Coil |
WO2024024121A1 (en) * | 2022-07-28 | 2024-02-01 | タツタ電線株式会社 | Coil |
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