JPH11286067A - Conductive plastic laminate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a release or a craze of a conductive layer and to obtain a light weight and an excellent impact resistance by setting a hardness of the layer to a specific value or more. SOLUTION: The conductive plastic laminate comprises a plastic base material layer, a conductive layer and a curable film layer as indispensable layers, and an arbitrary constitution layer such as a gas barrier layer or the like as needed. Further, as a layer constitution, the film layer is provided between the base material layer and the conductive layer. A hardness of the conductive layer is IGP or more, and its elastic modulus is, for example, 10 GP or more. As a raw material of the base material layer, a noncrystalline polyolefin resin or the like is used. A thickness of the base material layer is suitably selected according to a desired mechanical strength or the like, and is normally about 5 to 500 μm. A silicone resin or the like is used for the curable resin. Its film thickness is normally about 0.1 to 50 μm. An indium oxide or the like is used for the conductive layer. Its thickness is normally about 50 to 200 nm. Further, the barrier layer uses an inorganic oxide film or the like. The film thickness is about 5 to 100 nm.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive plastic laminate suitably used for substrates such as a liquid crystal display, a touch panel, and a solar cell conversion element.

[0002]

2. Description of the Related Art With the rapid progress of electronics technology, the field of optoelectronics, especially liquid crystal display devices, touch panels, and solar cell conversion elements, has been expanding. 2. Description of the Related Art In general, an optoelectronic element is provided for various uses by forming the element on a glass substrate having a transparent conductive layer. However, there is a problem that the weight of the glass is large, and when the glass is incorporated in a portable device, the weight of the equipment increases due to the large specific gravity of the glass. For this reason, weight reduction is strongly desired, and polyarylate, polyether sulfone, polycarbonate, and the like, which are relatively excellent in strength, transparency, heat resistance, and the like, are being used as plastic sheet substrates instead of glass substrates.

In the field of optoelectronic devices,
Particularly, high optical properties, gas barrier properties, electrical conductivity, mechanical strength, and the like are required. Therefore, in practice, a laminate of a plurality of layers or films having each function on a substrate is used. No. 5308 proposes a conductive plastic laminate in which a cured film is provided on both surfaces of a plastic sheet, a conductive layer is provided on one surface, and a gas barrier layer made of a metal oxide is provided on the other surface.

[0004]

However, in the above-described conductive plastic laminate, in addition to the problem due to the properties of the base sheet and the conductive layer, the heating and heating may be caused by the difference in the properties of each layer and the problem of adhesion. There is a problem that cracks easily occur at the time. In addition, although it is a plastic sheet substrate that is useful as a glass substitute substrate, in order to increase its use value,
It is necessary not only to be lightweight, but also to have flexibility. That is, when the substrate is bent (bent) at a certain curvature, it is necessary that the conductive layer is not cracked and that the electrical conductivity is maintained. However, the conventional conductive plastic sheet substrate has a problem that its bending resistance is insufficient.

[0005]

Means for Solving the Problems In order to solve the above-mentioned problems, the present inventors have intensively studied a conductive plastic laminate having sufficient bending resistance as a substrate for a liquid crystal element device, a touch panel, a solar cell and the like. As a result of performing the above, the present invention is completed by noting that the cured film interposed as a layer configuration between the plastic substrate layer and the conductive layer plays a very important role in the bending resistance of the conductive plastic laminate. Reached. That is, the present invention resides in a conductive plastic laminate having a cured coating layer between a plastic substrate layer and a conductive layer, wherein the hardness of the conductive layer is 1 GP or more. .

[0006]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the conductive plastic laminate of the present invention will be described in more detail. (Plastic substrate layer) The plastic substrate layer constitutes the substrate layer of the plastic laminate of the present invention. The plastic raw material as the base material layer is not particularly limited as long as it is used as a film or sheet, and ethylene,
Polyolefin (PO) resin such as homopolymer or copolymer such as propylene and butene, amorphous polyolefin resin (APO) such as cyclic polyolefin, polyethylene terephthalate (PET), polyethylene 2,6-naphthalate (PEN) And polyamides such as nylon 6, nylon 12, and copolymerized nylon (P
A) a resin, a polyvinyl alcohol (PVA) resin, a polyvinyl alcohol resin such as an ethylene-vinyl alcohol copolymer (EVOH), a polyimide (PI) resin,
Polyetherimide (PEI) resin, polysulfone (P
S) Resin, polyether sulfone (PES) resin, polyamide imide (PAI) resin, polyether ether ketone (PEEK) resin, polycarbonate (PC) resin, polyvinyl butyral (PVB) resin, polyarylate (PAR) resin, ethylene -Ethylene tetrafluoride copolymer (ETFE), ethylene trifluoride chloride (PCTF)
E), ethylene tetrafluoride-propylene hexafluoride copolymer (FEP), ethylene tetrafluoride-perfluoroalkoxyethylene copolymer (PFA), vinylidene fluoride (P
VDF), fluorocarbon resins such as vinyl fluoride (PVF), perfluoroethylene-perfluoropropylene-perfluorovinylether terpolymer (EPE), (meth)
Acrylate-based resins and the like can be mentioned.

Among the above, from the viewpoints of optical properties such as polarization and transparency, strength, heat resistance and the like, APO, PET, PE
Thermoplastic resins such as S, PAI, PC, PAR, etc .; or sulfur-containing (meth) acrylate resins described in JP-A-62-195357, and JP-A-62-2255.
Photocurable resins represented by the alicyclic skeleton (meth) acrylate resin described in JP-A-08-0808 are particularly preferred.

[0008] The thickness of the above-mentioned base material layer depends on the desired mechanical strength,
It can be appropriately selected according to the flexibility, transparency, use, and the like, but is usually from 5 to 500 μm. Such a base material layer may be a stretched one or a laminate of a plurality of plastic layers. (Curing film layer) As the cured film in the present invention, any organic compound-based cured film can be used without any particular limitation, and it is formed from a hard coating agent, an anchor coating agent (primer coating agent) or the like. It is. As a specific example, as the hard coat agent, an acrylate such as polyurethane acrylate or epoxy acrylate or a polyfunctional acrylate, a photopolymerization initiator, and an organic solvent as main components can be used. Examples of the anchor coating agent include known anchor coating agents such as isocyanate, polyurethane, polyester, polyethyleneimine, polybutadiene, and alkyl titanate. These resins can be used alone or in combination of two or more, and can be three-dimensionally cross-linked using various curing agents, cross-linking agents and the like.

A more preferred example of a cured film is more specifically exemplified by using a silicone resin as the organic polymer when various properties such as surface hardness, heat resistance, chemical resistance, and transparency are taken into consideration. The active energy ray-curable composition containing a silane coupling agent having an acryloyl group or a methacryloyl group is particularly preferable. When an active energy ray-curable composition containing a silane coupling agent having an acryloyl group or a methacryloyl group is used, in particular, the adhesion between a gas barrier film made of a metal oxide or the like and a cured film is improved, and the gas barrier property is improved. Especially improve. Although the reason is not clear, the improvement in adhesion is due to the fact that the silane coupling agent chemically reacts with the metal oxide thin film and reacts with other film formations where acryloyl groups and methacryloyl groups of the silane coupling agent coexist. It is considered that the cured film is firmly bonded to the metal oxide thin film. In addition, improvement of gas barrier property,
It is considered that the gap between the metal oxide particles constituting the metal oxide thin film is filled with a silane coupling agent or a film forming component reacted with the acryloyl group or methacryloyl group.

The silane coupling agent may have at least one of an acryloyl group and a methacryloyl group, but preferably has an acryloyl group having a high reaction rate. For example, if a silane coupling agent having only an isocyanate group or a mercapto group as a reactive group and not having an acryloyl group or a methacryloyl group is used, the adhesion is not improved. This seems to be due to the fact that even though the bond between the silane coupling agent and the metal oxide thin film is formed, the silane coupling agent reacts with other co-existing film formations and is hardly taken into the film. It is.

Examples of the silane coupling agent having an acryloyl group or a methacryloyl group include γ-acryloxypropyltrimethoxysilane, γ-methacryloxypropyltrimethoxysilane, γ-acryloxypropyltriethoxysilane, γ-methacryloxypropyl Triethoxysilane, γ-acryloxypropylmethyldimethoxysilane, γ-acryloxypropylmethyldiethoxysilane, γ-methacryloxypropylmethyldimethoxysilane, γ-methacryloxypropylmethyldiethoxysilane, γ-acryloxypropyl-tris ( β
-Methoxyethoxy) silane, γ-methacryloxypropyl-tris (β-methoxyethoxy) silane, and the like.

These silane coupling agents are used in the curable composition in an amount of usually 0.1 to 60% by weight, preferably 0.1 to 60% by weight.
Accounts for 2 to 45% by weight. If the amount of the silane coupling agent is too small, it is difficult for the adhesion between the cured film and the metal oxide thin film to be sufficiently exhibited. This is presumably because the amount of the functional group that reacts with the metal oxide thin film in the composition is not sufficient. Conversely, if the silane coupling agent is present in excess, the alkali resistance of the cured film may decrease. This is probably because a large amount of the silane coupling agent that does not react with the metal oxide thin film remains in the cured film and reacts with the alkali.

The curable composition comprises a conventional monomer, oligomer, polymer, or the like which forms a cured film by being polymerized by irradiation with active energy rays, except for containing a silane coupling agent. For example, monomers or oligomers such as epoxy (meth) acrylate, urethane (meth) acrylate, and polyester (meth) acrylate are used. Examples of some of these include trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, pentaerythritol triacrylate, pentaerythritol trimethacrylate, pentaerythritol tetraacrylate, pentaerythritol tetramethacrylate, dipentaerythritol hexaacrylate, dipentaerythritol hexaacrylate. Methacrylate, isoamyl acrylate, ethoxydiethylene glycol acrylate, methoxydiethylene glycol acrylate, N-vinylpyrrolidone, etc.
Monofunctional and polyfunctional acrylic monomers, methacrylic monomers, and vinyl monomers having one or more carbon-carbon double bonds.

Various curing agents may be used in combination with the coating composition used for forming the cured film for the purpose of accelerating curing and curing at a low temperature. As the curing agent, various epoxy resin curing agents or various organic silicon resin curing agents are used. Specific examples of these curing agents include various organic acids and their acid anhydrides, nitrogen-containing organic compounds, various metal complex compounds, metal alkoxides, various salts such as organic carboxylate and carbonate of alkali metals, and salts of organic acids. Examples thereof include oxides and radical polymerization initiators such as azobisisobutyronitrile. These curing agents can be used as a mixture of two or more kinds.

The thickness of the above-mentioned cured film is usually from 0.1 to 50 μm, preferably from 0.3 to 10 μm from the viewpoint of maintaining the adhesive strength and hardness. In applying the coating, the coating composition is used after being diluted with various solvents for the purpose of controlling the workability and the thickness of the coating. As the diluting solvent, for example, water, alcohols, esters, ethers, halogenated hydrocarbons, dimethylformamide, dimethylsulfoxide and the like can be variously used depending on the purpose, and a mixed solvent can be used if necessary. is there. Water, alcohol, dimethylformamide, ethylene glycol, diethylene glycol, triethylene glycol,
Polar solvents such as benzyl alcohol, phenethyl alcohol and phenyl cellosolve are preferably used. To form a cured film with the curable composition, the active energy ray-curable composition is subjected to a gravure coating method, a reverse coating method,
It may be applied by various coating methods such as a die coating method, and cured by irradiating active energy rays. At this time, preheating may be performed before the coating is cured. When the active energy ray-curable composition is diluted with a solvent, the solvent must be removed in this preheating step. (Conductive layer) Examples of the conductive material constituting the conductive layer include indium oxide, tin oxide, gold, silver, copper, nickel and the like, and these can be used alone or in combination of two or more. Of these, usually indium oxide 99 to 90
%, And indium tin oxide (hereinafter referred to as “ITO”) comprising a mixture of 1% to 10% of tin oxide are particularly preferable in terms of balance between transparency and conductivity. The method of forming the conductive layer is a conventionally known vacuum evaporation method, sputtering method,
It can be performed using an ion plating method, a chemical vapor deposition method, or the like. Of these, the sputtering method is preferred from the viewpoint of adhesion. The thickness of the above conductive layer is usually 50 to 20.
The range of 0 nm is preferable from the viewpoint of balance between transparency and conductivity. (Gas Barrier Layer) In the conductive plastic laminate of the present invention, a high gas barrier property is often required depending on its use. Therefore, it is an optional layer, but it is preferable to provide a gas barrier layer separately. Examples of the gas barrier layer include an inorganic oxide film and a gas barrier resin layer such as an ethylene-vinyl alcohol copolymer and vinylidene chloride, and an inorganic oxide film is preferable. Inorganic oxides are oxides of metals, nonmetals, and submetals, and specific examples thereof include aluminum oxide, zinc oxide,
Antimony oxide, indium oxide, calcium oxide, cadmium oxide, silver oxide, gold oxide, chromium oxide, silicon oxide, cobalt oxide, zirconium oxide, tin oxide, titanium oxide, iron oxide, copper oxide, nickel oxide, platinum oxide, palladium oxide , Bismuth oxide, magnesium oxide, manganese oxide, molybdenum oxide, vanadium oxide, barium oxide and the like, with silicon oxide being particularly preferred. Examples of a method of forming the gas barrier layer include a method of coating a resin or the like and a method of forming a vapor deposition film made of an inorganic oxide. As a method of forming a deposited film, a vacuum deposition method,
Conventionally known methods such as a vacuum sputtering method, an ion plating method and a CVD method can be used. The thickness of the gas barrier film described above is not particularly limited, and varies depending on the type of the constituent components of the gas barrier film.
00 nm is preferred. (Conductive Plastic Laminate) The conductive plastic laminate of the present invention comprises a plastic substrate layer, a conductive layer, and a cured film layer as essential constituent layers as described above, and optionally has a gas barrier layer and other optional constituent layers. Add layers. The layer configuration of the conductive plastic laminate is arbitrary except that it is essential that a cured coating layer is provided between the plastic substrate layer and the conductive layer. Conductive layer, plastic substrate layer / gas barrier layer / cured film layer / conductive layer, plastic substrate layer / cured film layer /
Gas barrier layer / conductive layer, gas barrier layer / plastic substrate layer / cured coating layer / conductive layer, cured coating layer / plastic substrate layer / cured coating layer / conductive layer, cured coating layer / gas barrier layer / plastic substrate layer / cured A layer configuration such as a coating layer / conductive layer is exemplified. By employing such a configuration in which the cured coating layer is interposed between the plastic base material layer and the conductive layer film, the adhesion of the conductive layer is improved.

The conductive plastic laminate of the present invention is characterized in that, in addition to the above-mentioned layer constitution, physical properties of the conductive layer are important, and the hardness of the conductive layer is 1 GP or more, preferably 2 GP. . Further, similarly to the hardness of the conductive layer, the elastic modulus of the conductive layer is also important in defining the properties of the conductive plastic laminate, and is preferably 10 GP or more, particularly preferably 15 GP or more. When the hardness or the elastic modulus of the conductive layer is also in this range, even if the conductive plastic laminate is bent, cracks do not occur in the conductive layer and the electric resistance value does not deteriorate. It can be suitably used as a conductive plastic laminate having a high level for substrates in the field of optoelectronics such as liquid crystal displays and touch panels.

The hardness and the elastic modulus of the conductive layer can be measured by an indentation test (indentation test). In general, the indentation depth of the indenter needs to be about one tenth of the film thickness in the thin film hardness measurement, and it can be measured using, for example, PicoIndenter manufactured by Hysitron. In the indentation test, a load is applied to the indenter and the indenter is pressed into the test object to obtain an indentation curve (load-indentation depth curve). The hardness H is represented by the ratio between the maximum load P at that time and the contact projected area A between the indenter and the test object (the following (1)
See formula).

[0018]

H = P / A (1) From the following equation (2), the composite elastic modulus Er can be obtained from the initial gradient S of the unloading curve of the indentation curve.

[0019]

S = (2 / ππ) · Er · β · √A (2) Further, according to the following equation (3), Young's modulus Ei of the indenter, Poisson's ratio vi of the indenter, Poisson's ratio of the DUT From Vs, the Young's modulus Es of the specific test piece is obtained.

[0020]

[Equation 3] Er = 1 / {(1-vs2) / Es + (1-vi2) / Ei} (3) However, since the Poisson's ratio vs of the conductive layer which is the test object is unknown, a composite It was expressed as "elastic modulus" using the elastic modulus Er. The indenter is diamond, and its Young's modulus Ei is 1140 GPa and Poisson's ratio is 0.0.
See WCOliver and GM for more information
Pharr, J. Mater. Res., Vol. 7, No. 6, Jun 1992 and Handboo
See k of Micro / Nanotribology.

Generally, it is said that a film formed has an internal stress due to a difference in thermal expansion coefficient between the substrate (base) and the film, and that a large amount of the film tends to cause cracks in the film. Various methods are known for measuring the internal stress of a film, but these methods cannot be applied to a film (conductive layer) of a conductive plastic laminate for the following reasons. (A) Measurement of the amount of deflection of a substrate after film formation is uncertain in the case of a plastic substrate because of the influence of heat and the like. (B) The method of obtaining from the lattice constant and the plane spacing of the crystal peak of thin film X-ray diffraction cannot be measured when the film is amorphous. (C) Measurement by Raman scattering is difficult because the base material is plastic.

Although the internal stress of the film is related to the occurrence of cracks when the film is at rest, such as after film formation,
Cracking when the conductive plastic laminate is bent includes other factors. One of them is the quality of the film following the base sheet when the plastic laminate is bent. Cracks are likely to occur if the film does not follow the substrate sheet poorly. Hardness and Young's modulus can be considered as indices for evaluating them as physical properties, and can be directly characterized as influential factors of the presence or absence of cracking of the film due to bending.

In order to increase the hardness of the conductive layer to a specific value or more, the properties of the conductive layer may be controlled, but the layer structure and the properties of the layers other than the conductive film in the laminate also have a great effect. Since the substrate is made of plastic, the upper limit of the laminating temperature is low, and the physical properties of the conductive layer are limited no matter how other laminating conditions are changed. On the other hand, it can be said that it is relatively easy to change the physical properties of the cured coating layer in a wide range, such as by changing the prescription and curing conditions.

[0024]

EXAMPLES Hereinafter, the contents and effects of the present invention will be described in more detail with reference to examples, but the present invention is not limited to the following examples unless it exceeds the gist of the present invention. The plastic laminates obtained in Examples and Comparative Examples were evaluated by the following methods. <Layer Thickness> Regarding the gas barrier layer and the conductive layer of the laminate obtained in the examples and comparative examples, the cross section of the laminate was observed with a transmission electron microscope (H-600, manufactured by Hitachi, Ltd.). Was measured. <Surface Resistance of Conductive Layer> The surface resistance was measured using a four-terminal method resistance meter (Lorester MP) manufactured by Mitsubishi Chemical Corporation. <Bending resistance test of conductive layer> A plastic laminate having a size of 5 × 10 cm was placed along a long side with a conductive film on the inner side of φ2.
After winding the plastic laminate around a 5 mm stainless steel tube, the conductive film was wound outside, and then the presence or absence of cracks in the conductive film was examined with an optical microscope, and the surface resistance was measured by the above method. <Indentation test of conductive layer> Hysitron
Using a PicoIndenter manufactured by Co., Ltd., a single indentation (indenter indentation) is performed for 10 seconds under a load (μN) at which the indenter indentation depth is about 1/10 of the film thickness.
The measurement was performed five times for each sample, and the average value was determined. In each measurement, the distance between the measurement points was sufficiently large so that the influence of the indentation did not occur. Further, the sample was sufficiently fixed on the sample stage. Example 1 bisoxymethyltricyclo [5.2.1.02,6]
100 parts by weight of decane dimethacrylate, 2,4,6-trimethylbenzoyldiphenylphosphine oxide ("Lucillin TPO" manufactured by BASF) as a photoinitiator.
After uniformly mixing and stirring 05 parts by weight and 0.05 parts by weight of benzophenone, the composition was defoamed to obtain a composition. This composition was poured into an optically polished glass mold using a 0.4 mm thick silicon plate as a spacer, and an output of 80% on the glass surface was obtained.
40 / cm on the glass mold surface with a metal halide lamp of W / cm
After irradiation so as to have an energy of J / cm ² , the glass mold was released, and a photocurable resin sheet having a thickness of about 0.4 mm was obtained.

On the obtained cured resin sheet layer, the following components A, B, F, and G were mixed at a ratio of 62, 38, 5, and 0.3%, respectively, diluted with propylene glycol monomethyl ether, and spun. Apply with a coat, output 80W / c
Irradiation was carried out with a metal halide lamp having a capacity of 5 J / cm ² to form a cured film. Furthermore,
A 10 nm thick silicon oxide thin film was formed on the cured coating with a target material SIO using a total pressure of 6.7 × 10 ^-1 Pa argon gas using an RF sputtering machine manufactured by ULVAC, Inc.
Subsequently, oxygen partial pressure 1 × 10 ^-2 Pa and total pressure 6.7 × 1
An ITO film having a thickness of 120 nm was formed using a target material of ITO (indium oxide: tin oxide = 95: 5 (weight ratio)) at 0 ^-1 Pa to obtain a plastic laminate. Table 1 shows the evaluation results of the laminate. Example 2 Same as Example 1 except that the components of the cured film were changed to a mixture of the following components A, B, C, F, and G, each of which was 40, 35, 25, 5, and 0.3%. To obtain a plastic laminate. Table 1 shows the evaluation results of the laminate. Example 3 The formulation components of the cured film were the following components A, B, C, E, F,
A plastic laminate was obtained in the same manner as in Example 1 except that G was mixed with 20, 25, 35, 20, 5, and 0.3%, respectively. Table 1 shows the evaluation results of the laminate. Example 4 A plastic laminate was obtained in the same manner as in Example 1, except that the order of lamination was changed to the order of a photocurable resin sheet, a silicon oxide thin film, a cured film, and an ITO film. Table 1 shows the evaluation results of the laminate. Example 5 A plastic laminate was obtained in the same manner as in Example 1 except that a silicon oxide thin film and an ITO film were formed by a DC sputtering machine manufactured by ULVAC. Table 1 shows the evaluation results of the laminate.
Shown in Comparative Example 1 Same as Example 1 except that the prescription components of the cured film were changed to the following components A, B, D, F, and G mixed at 20, 15, 65, 5, and 0.3%, respectively. To obtain a plastic laminate. Table 1 shows the evaluation results of the laminate. Comparative Example 2 Same as Example 1 except that the components of the cured film were changed to the following components A, B, E, F, and G, each of which was mixed with 20, 15, 65, 5, and 0.3%. To obtain a plastic laminate. Table 1 shows the evaluation results of the laminate. (Curing film component) Component A; dicyclopentanyl diacrylate, Nippon Kayaku Co., Ltd., Kayarad R684 Component B; mixture of trimethylolpropane triacrylate and epoxy acrylate, etc., Nippon Kayaku Co., Ltd., Kayarad R130 Component C; Pentaerythritol triacrylate, Nippon Kayaku Co., Ltd. Kayarad PET30 Component D; Trimethylolpropane triacrylate, Nippon Kayaku Co., Ltd. Kayarad TMPTA Component E; Ditrimethylolpropane tetraacrylate, NK ester manufactured by Shin-Nakamura Chemical Co., Ltd. AD-TMP Component F; 1-hydroxycyclohexylphenyl ketone and bis (2,6-dimethoxybenzoyl) -2,4,4
-A mixture of trimethylpentylphosphine oxide, Irgacure 1800, manufactured by Nippon Ciba Geigy Co., Ltd. Component G; polyether-modified silicon, Kyoeisha Chemical Co., Ltd.
Granol 450

[0026]

[Table 1]

[0027]

According to the present invention, the conductive plastic laminate is
It is possible to use a conventional glass substrate process without causing peeling of the conductive layer and cracking.
It has a particularly advantageous effect that it is lighter than a glass substrate and has excellent impact resistance, and its industrial utility value is extremely large.

More specifically, the conductive plastic laminate of the present invention is preferably used as a substrate for a liquid crystal display device, and includes a TN (Twisted Nematic type) and an STN (Super Twis
ted Nematic type, ferroelectric liquid crystal) FLC (Ferroelectric
Simple matrix type such as Liquid Cystal type, MIM
(Metal-Insulator-Metal) type, TFT (Thin-FilmTra)
The present invention can be applied to a liquid crystal display device of an active matrix type such as an nsistor type.

Claims (3)

[Claims] 1. A conductive plastic laminate having a cured coating layer between a plastic substrate layer and a conductive layer, wherein the hardness of the conductive layer is 1 GP or more. 2. The conductive plastic laminate according to claim 1, wherein the elastic modulus of the conductive layer is 10 GP or more. 3. The conductive plastic laminate according to claim 1, further comprising a gas barrier layer.