JPH11274277A - Ultraviolet irradiator and method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an ultraviolet irradiator and method therefor which can be provided compactly at an installation position, without giving adverse influence on a work. SOLUTION: It is constituted as an ultraviolet irradiator 1 composed of a mount 20a for mounting a work W, a plane reflection mirror 7 disposed apart below the mount 20a at a fixed inclination angle, a moving mechanism for moving the plain reflection mirror 7 from one end of the work W to the other end, and an optical source adjacent to the moving mechanism for irradiating a light beam on the work through the plane reflection mirror 7.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ultraviolet irradiation apparatus for performing an ultraviolet irradiation treatment of a work, and more particularly to an ultraviolet irradiation apparatus which is excellent in use at a position where low temperature processing and space saving are required.

[0002]

2. Description of the Related Art Conventionally, when light-treating a work,
For example, there is a work of separating an adhesive tape attached to a semiconductor wafer. In this work, since the semiconductor wafer needs to be cut after the circuit is formed, a sheet-like adhesive tape is stuck on the back surface side of the semiconductor wafer, and cut into the size of each chip by a cutting device. In addition, by irradiating ultraviolet rays from an ultraviolet irradiating device, the adhesive force of the adhesive tape is reduced, and the semiconductor wafer is easily peeled off from the adhesive tape.

In the ultraviolet irradiation apparatus used in the above operation, a light source section is disposed below the semiconductor wafer, and the light source section is provided on a discharge lamp for irradiating ultraviolet rays and on a rear side of the discharge lamp. It is known that the light source is provided with a light-shielding shutter that can be freely opened and closed by a reflecting mirror or the like.

[0004] In addition, depending on the working means, the ultraviolet irradiating device may move the installed work horizontally from the installation position or the discharge lamp of the light source may move horizontally.
The work was configured to be irradiated with ultraviolet rays. In any case, the light source unit is arranged below the work.

[0005]

However, the configuration of the conventional ultraviolet irradiation apparatus has the following problems.

[0006] Since the position of the light source unit is disposed below the work, the ultraviolet irradiation device is susceptible to the influence of heat from the light beam emitted from the discharge lamp by performing the light irradiation operation. Since the pressure-sensitive adhesive tape is affected by the heat generated by the discharge lamp itself, the work for light treatment of the work is hindered.

[0007] Since the ultraviolet irradiation device is disposed below the work, the device at the light processing work position is disadvantageously increased in size in the vertical direction.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and has an ultraviolet irradiation apparatus and a method thereof which can be provided compactly at a position where the work is installed without adversely affecting the work. The purpose is to provide.

[0009]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention relates to a mounting portion on which a work is mounted, and a flat-plate reflecting plate provided at a distance below the mounting portion and inclined at a constant angle. A mirror, a moving mechanism for moving the flat reflecting mirror from one end position to the other end position of the work, and a light source unit provided adjacent to the moving mechanism and irradiating the work with light rays via the flat reflecting mirror. The ultraviolet irradiation device comprised from this.

The moving mechanism may vary a moving speed of the flat reflecting mirror, and may include at least one filter for blocking unnecessary light beams in a light irradiation path from the light source to the work. This is convenient.

Further, as an ultraviolet irradiation method, a first step of mounting a work on a mounting section and irradiating a light beam containing ultraviolet light of a predetermined wavelength from a light source section in a direction parallel to the mounted work. A second step of irradiating the work through a flat reflecting mirror inclined at a fixed angle, a third step of moving the flat reflecting mirror from one end side of the work to the other end thereof, and irradiating the entire work with light; Move the light-treated work,
A fourth step of reducing the input power to the light source unit while the new work is being placed on the placement unit, and blocking light irradiation from the light source unit by a blocking mechanism.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view showing the entirety of an ultraviolet irradiation apparatus, FIG. 2 is a plan view showing a state where a flat reflecting mirror of the ultraviolet irradiation apparatus is moved, and FIG. 3 is a cross-sectional view showing a main part of the ultraviolet irradiation apparatus. FIG. 4 is a cross-sectional view of a state where a flat reflecting mirror showing a main part of the ultraviolet irradiation device is moved, and FIG. 5 is a cross-sectional view of a main part showing an operation state of the ultraviolet irradiation device.

As shown in FIGS. 1 to 4, the ultraviolet irradiation apparatus 1 includes a mounting portion 20a for mounting a work W and a storage portion 20 for storing a moving mechanism 6 provided below the mounting portion 20a. And an installation section 22 of the light source section 2 provided adjacent to the storage section 20. And the installation section 2
2, a heat exhaust hole 23 for exhausting heat is formed.

The light source 2 is located at the position of the mounting portion 20a.
A transmission member that transmits light from the light source is used, and the transmission member has a configuration in which a filter 21 that reflects heat rays (infrared rays and a predetermined band of visible light) that are unnecessary light rays is disposed. Further, a filter 10 is installed in the light irradiation path from the light source unit 2 to the work W (between the storage unit 20 and the installation unit 22 in the drawing) so that unnecessary heat rays do not adversely affect the work W. It is configured.

As shown in FIG. 1 to FIG.
Is a discharge lamp 3 for irradiating a light beam containing ultraviolet light having a predetermined wavelength.
And a curved reflecting mirror 4 for reflecting a light beam emitted from the discharge lamp 3 in a horizontal direction. The curved reflecting mirror 4 uses a so-called cold mirror that transmits unnecessary heat rays (a predetermined band of infrared rays and visible rays) and reflects ultraviolet rays. Only the light is reflected in a predetermined direction.

As shown in FIG. 1 to FIG. 4, a blocking mechanism 5 for blocking light from the discharge lamp 3 is a member for blocking irradiation light and having a size substantially equal to the length of the discharge lamp 3. 5a, a link arm 5b formed at both ends of the blocking plate 5a, and a blocking drive motor 5c for driving the link arm 5b.

Therefore, when the light emitted from the discharge lamp 4 is cut off as required, the cut-off mechanism 5 operates the cut-off drive motor 5c by a half turn, and the link arm 5
By driving b and 5b, the blocking plate 5a is moved from the position indicated by the solid line to the position indicated by the imaginary line in FIG. 1, and the irradiation light is blocked so as not to reach the flat mirror 7 side.

The work W has a sheet-like adhesive tape T adhered to a semiconductor wafer S, and the adhesive tape T is stretched over an annular frame F. Adhesive tape T of this work W
Is configured such that, by irradiating ultraviolet light of a predetermined wavelength, its adhesive strength is reduced and it is easy to peel off from the semiconductor wafer S.

As shown in FIGS. 1 to 4, the moving mechanism 6
Is a drive motor 6a, a drive pulley 6b and a driven pulley 6c for transmitting the rotational force of the drive motor 6a, a drive belt 6d stretched over the pulleys 6b and 6c, and a juxtaposition along the drive belt 6d. Guide guide 6e.

The plane reflecting mirror 7, which is moved from one end of the work W to the other end by the moving mechanism 6, has a rectangular reflecting surface having a length larger than the width of the work W. A supporting portion 8 for supporting the reflecting surface at an angle of 45 degrees, a sliding base 9 for holding the supporting portion 8 and sliding on the guide 6e, A connection portion 8a for connecting a predetermined position of the drive belt 6d.

Accordingly, when the driving mechanism 6 is operated, the driving belt 6d is operated via the pulleys 6b and 6c by the rotation of the driving motor 6a, and the connecting portion 8a connected to the driving belt 6d is connected from one end to the other. Since it is moved to the end side, the plate reflecting mirror 7 connected to the connection portion 8a via the sliding base moves from one end of the work W to the other end position. When the flat reflecting mirror 7 moves to the other end position (moving end), the drive motor 6a reverses the rotation direction by a signal from an installed sensor (not shown), and moves the flat reflecting mirror 7 again. It is configured to move to one end position via the drive belt 6d.

Next, the operation of the entire ultraviolet irradiation apparatus 1 will be described. As shown in FIG. 5A, the workpiece W is placed on the placement unit 20 a of the ultraviolet irradiation device 1 at the position of the handler 40.
When the work W is placed by (see (c)) or the like, the blocking mechanism 5 of the light source unit 2 is operated to move the blocking plate 5a from the position of the virtual line to the position of the solid line.

As shown in FIGS. 5A and 5B, when a light beam is emitted from the light source unit 2, the moving mechanism 6 operates to move the flat reflecting mirror 7 from the base end of the work W to the other end. Move to the side. Therefore, the light beam emitted from the discharge lamp 3 is
The work W is precisely irradiated from the base end side to the other end side of the adhesive sheet T of the work W via the flat reflecting mirror 7. Light emitted from the discharge lamp 3 is transmitted to the filter 10 and the filter 21 of the mounting portion 20a.
Accordingly, the work W is irradiated in a state where the influence of heat is suppressed to a minimum.

When irradiating the workpiece W with a light beam through the flat mirror 7, the moving speed of the moving mechanism 6 may be reduced as the distance from the light source unit 2 increases. By changing the moving speed of the moving mechanism 6 in this way, it is convenient to equalize the integrated light amount applied to the work W and promote the appropriateness of the light processing work of the work W.

The irradiation time of the light from the light source unit 2 to the work W is performed while the flat reflecting mirror 7 moves from one end to the other end, or while the flat reflecting mirror 7 makes one round trip. It is set to be performed during the further movement distance of the flat plate reflecting mirror 7, and is determined according to the type of the work W to be optically processed.

Next, as shown in FIG. 5 (c), when the light processing of the work W is completed and the work W is moved by the moving means such as the handler 40, the light from the light source unit 2 is not irradiated. Then, the blocking mechanism 5 is operated to move the blocking plate 5a so as to cover the light source unit 2. At this time, the discharge lamp 3
The power source 30 that supplies power to the power supply is configured to reduce the amount of power from that during the light irradiation operation (see FIG. 5A).
Therefore, heat generated from the discharge lamp 3 can be minimized. Then, as shown in FIG. 5D, the control of the power supply 30 and the cutoff by the cutoff plate 5a are performed until the next work W is conveyed to the mounting portion 20a (see FIG. 5D).
(Until the state of (a) is reached).

While the discharge lamp 3 is on, the heat exhaust holes 23
, The exhaust operation is always performed, and the heated gas is always exhausted to the outside of the ultraviolet irradiation device 1. In order to further suppress the influence of the heat of the discharge lamp 3, a configuration may be adopted in which a cooling gas (including cooled air) is supplied into the divided installation sections 22.

In the above description, the operation of peeling the adhesive tape from the semiconductor wafer has been described as an example. However, the work requiring a low-temperature light processing operation or the work requiring a space-saving and low-temperature light processing operation is described. Of course, it can be used.

[0029]

Since the present invention is configured as described above, it has the following excellent effects. In the ultraviolet irradiation device, since the light source unit is located at a position separated from below the work, even if the discharge lamp is turned on or the heat generated from the discharge lamp rises upward, the work is located at that position. Therefore, it is possible to minimize the influence of heat on the work at the position of the mounting portion. Therefore, the work is hardly affected by unnecessary heat, and it is possible to perform an appropriate light processing operation.

In the ultraviolet irradiation device, since the light source unit is not arranged below the work, and irradiates the work with light through a flat reflecting mirror that is moved by a moving mechanism, the overall configuration of the device can be made thin and compact. In addition, since the configuration of the ultraviolet irradiation device can be formed thin, operations inside the device such as maintenance can be facilitated.

The ultraviolet irradiation device can stabilize the light irradiation amount by using the speed of the plane reflecting mirror that is moved by the moving mechanism, and appropriately perform the light processing on the work. Becomes possible.

When light processing is performed by an ultraviolet irradiation device, the light source unit is not disposed below the work, the work is irradiated by the moving flat reflecting mirror, and when the work is not at the mounting position, the light source is controlled by the light blocking mechanism. In addition to blocking the light from the power supply and reducing the power of the power supply unit, it is possible to minimize the effect of heat on the work side, making it suitable for work requiring low-temperature processing and space saving. It can be used effectively.

[Brief description of the drawings]

FIG. 1 is a plan view showing an entire ultraviolet irradiation apparatus of the present invention.

FIG. 2 is a plan view showing a state where a flat reflecting mirror of the ultraviolet irradiation apparatus of the present invention is moved.

FIG. 3 is a sectional view showing a main part of the ultraviolet irradiation device of the present invention.

FIG. 4 is a cross-sectional view showing a main part of the ultraviolet irradiation apparatus according to the present invention, in which a flat reflecting mirror is moved.

FIG. 5 is a sectional view of a main part showing an operation state of the ultraviolet irradiation device of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Ultraviolet irradiation apparatus 2 Light source part 3 Discharge lamp 4 Curved surface reflection mirror 5 Blocking mechanism 5a Blocking plate 5b Link arm 5c Blocking drive motor 6 Moving mechanism 6a Drive motor 6b Drive pulley 6c Driven pulley 6d Drive belt 6e Guide guide 7 Flat mirror Reference Signs List 8 support part 8a connection part 9 sliding base circuit 10 filter 20 storage part 20a mounting part 21 filter 22 installation part 23 heat exhaust hole 30 power supply 40 handler F frame S semiconductor wafer T adhesive tape W work

Claims (4)

[Claims] 1. A mounting portion on which a work is mounted, a flat reflecting mirror provided at a distance below the mounting portion and inclined at a constant angle, and the flat reflecting mirror is moved from one end position of the work to the other end. An ultraviolet irradiation apparatus, comprising: a moving mechanism for moving the work to a position; and a light source unit provided adjacent to the moving mechanism and irradiating the work with light rays via the flat plate reflecting mirror. 2. The ultraviolet irradiation apparatus according to claim 1, wherein the moving mechanism changes a speed at which the flat reflecting mirror is moved. 3. The ultraviolet irradiation apparatus according to claim 1, wherein one or more blocking filters for blocking unnecessary light rays are arranged in a light irradiation path from the light source section to the workpiece. 4. A first step of placing a work on a placement section, and a step of irradiating a light beam containing ultraviolet light having a predetermined wavelength from a light source section to the placed work in a direction parallel to the work and tilting the work at a predetermined angle. A second step of irradiating the work through a flat reflecting mirror,
A third step of moving the flat reflecting mirror from one end to the other end of the work and irradiating the entire work with light; and moving the light-treated work, and placing a new work on the mounting section. An ultraviolet irradiation method comprising a fourth step of reducing input power to the light source unit and blocking light irradiation from the light source unit by a blocking mechanism.