JPH11265869A - Substrate surface treating equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To develop substrate surface treating equipment, in which there is no cleaning fluid drip at all on the surface of a substrate, when the substrate is carried in and out of the equipment. SOLUTION: A casing K which constitutes a clean substrate surface treating space S isolated from circumferential environment, is installed for surface treatment of a substrate 11. The casing K is divided into an upper part K1 and a lower part K2, the diameter of the lower part K2 is greater than that of the upper part K1, and the inner peripheral surface 1A of the upper part K1 is positioned inside the inner peripheral surface 6A of the lower part K2. A protrusion 4 which as toward the inner peripheral side is formed on the lower end inner periphery of the upper part K1, and in the lower part K2, an elevating style inner ring 2 is installed which ascends in the surface treating of the substrate 11, abuts against the lower surface Kb of the upper part K1 containing a lower surface 4c of the protruding part 4, and descends to be isolated from the lower surface Kb of the upper part K1, when the substrate 11 is moved.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate surface treatment apparatus for performing a surface treatment such as etching or a surface cleaning (rinsing) after etching or the like on a substrate such as a semiconductor wafer or a wafer for a solar cell. It is.

[0002]

2. Description of the Related Art In general, a semiconductor manufacturing apparatus and a solar cell manufacturing apparatus including the present apparatus are installed and used in an extremely clean room called a clean room. Then, the surface treatment of the substrate in each apparatus creates an extremely clean environment (substrate surface treatment space) inside the apparatus and performs the processing therein.

FIG. 11 is a cross-sectional view of a conventional device. Between the device of the present invention and the conventional device, there is no "projection (4)" described in the device of the present invention in the conventional example. 2)
The main difference is that the contact surface (2c) of the contact portion (2a) is not formed so as to match the lower surface (4c) of the protruding portion (4), and the other portions are almost the same. Therefore, the same members as those of the conventional example and members of the present apparatus are described with the same reference numerals.

(1a) is an upper inner cover, (1c) is a bottom for the upper cover, and a casing (K) constituting a substrate surface treatment space (S).
(6) is a lower cover having an upper surface opening, which constitutes a lower portion of the casing (K). The lower cover (6), which is the lower part, is the upper inner cover
(1a) The upper inner cover (1
The inner peripheral surface of a) is located inside the inner peripheral surface of the lower cover (6).

The substrate surface treatment space (S) constituted by the casing (K) is a space for performing a surface treatment (for example, etching, washing, drying and other various treatments) of the substrate (11), and is extremely clean so that particles and dust do not enter. Area.

A spin chuck (10) to be described later is rotatably arranged at the center of the bottom of the lower cover (6), and a large-diameter outlet (50) is opened at the outer edge of the bottom. The mist-containing airflow and waste liquid in the surface treatment space (S) are discharged. (3) is the opening of the side wall (6a) of the lower cover (6)
This is a door provided for opening and closing (6b).

[0007] (2) is a vertically movable inner ring of a cylindrical shape, which is disposed in the lower cover (6) of the substrate surface treatment space (S), and is used during surface treatment operations such as etching or cleaning. It rises to an upper position and surrounds the periphery of the substrate (11). At that time, the contact surface (2c) of the contact portion (2a) contacts the lower surface of the upper cover bottom (1c). The inner ring
(2) is moved to a lower position by a ring moving part (12) as shown by an imaginary line so as not to obstruct the opening and closing of the substrate (11) by opening the rotary opening and closing type door (3). I am going to put it.

Conventional spin chuck for substrate (11)
The supply to (10) will be described. First, the door (3) is rotated to open the opening (6b) of the side wall (6a). The unprocessed substrate (11) is inserted from the opening (6b) into the substrate surface processing space (S) by a robot arm (not shown), and set on the spin chuck (10). When the set is completed, turn the door (3) in reverse and open
(3b) is closed, and the substrate surface treatment space (S) is defined as a closed space.

Next, the spin chuck (10) is rotated at a low speed and a chemical solution is supplied from a chemical solution nozzle (39). After the supply of the chemical solution, the rotation of the spin chuck (10) and rotation of the chemical solution are performed for several seconds. Is stopped, and the surface treatment is performed so that the chemical solution covers the surface of the substrate (11) in a state of being raised by the surface tension. When the surface treatment with the chemical is completed, the cleaning nozzle
A cleaning agent such as ultrapure water is sprayed from the tip of (35) toward the center of the substrate (11), and the chemical solution on the substrate (11) is washed away by rotating the spin chuck (10) at high speed. The cleaning solution containing the chemical solution is shaken off by the centrifugal force with the rotation of the substrate (11), collides with the inner peripheral surface of the inner ring (2) disposed around the substrate (11), and is dropped and discharged. It is discharged outside the system from 50).

When the cleaning is completed, the supply of the cleaning liquid from the cleaning nozzle (35) is stopped, and then a drying gas such as nitrogen gas is supplied from a drying nozzle (36) arranged next to the cleaning nozzle (35). Is sprayed toward the substrate (11) rotating at high speed, and the surface of the substrate (11) is dried.

When the drying of the substrate (11) is completed, the spin chuck (10) stops and a series of substrate surface treatments is completed. After the processing is completed, the door (3) is opened as described above, and the robot hand takes out the processed substrate (11). Treated substrate
When (11) is taken out, the same operation as described above is repeated to set the unprocessed substrate (11) on the spin chuck (10) with a robot hand and perform surface treatment.

A particular problem here is contamination at the time of removing the substrate (11). That is, the spin chuck in the cleaning process
The chemical-containing cleaning liquid shaken off by the high-speed rotation of (10) scatters in the tangential direction of the substrate (11), collides with the inner ring (2), and most of the liquid drops. However, some of the droplets containing the chemical liquid, i.e., the cleaning liquid is ejected from the cleaning nozzle so strongly that the cleaning liquid hits the substrate (11) and rebounds, or the liquid is splashed off after colliding with the inner ring (2) by centrifugal force. As a result, the liquid also adheres to the inner surface of the upper inner cover (1a) and gradually grows to form droplets (E), and when it reaches a certain size, flows down the inner peripheral surface of the upper inner cover (1a).

The drop of the chemical-containing droplet (E) flows irregularly, and it is completely unknown when and from which position on the inner peripheral corner (1e) of the upper cover bottom (1c). Sometimes Figure 1
As shown in FIG. 2 (B), if there is a drop of the chemical solution-containing droplet (E) on the substrate (11) when the drying completion processing substrate (11) is taken out by the robot hand, a drop mark is formed on the substrate (11). It may be formed on the surface of 11), and that part may be defective in the next step.

[0014]

SUMMARY OF THE INVENTION An object of the present invention is to develop a substrate surface treatment apparatus in which no cleaning liquid drops are dropped on the surface of a substrate when the substrate is taken in and out of the apparatus.

[0015]

According to a first aspect of the present invention, there is provided a substrate surface treatment apparatus comprising: a clean substrate surface treatment space (S) which is isolated from an ambient environment to perform a surface treatment on a substrate (11); )
In the substrate surface treating apparatus having a casing (K), the casing (K) is divided into an upper part (K1) and a lower part (K2), and the diameter of the lower part (K2) is larger than that of the upper part (K1). The upper (K1) inner peripheral surface (1A) is located inside the lower (K2) inner peripheral surface (6A) and the upper (K1) lower inner periphery protrudes inward. A part (4) is provided, which is liftable in the lower part (K2), rises during the surface treatment of the substrate (11), and includes the upper part (K1) including the lower surface (4c) of the protruding part (4). Abuts on the lower surface (Kb) of
An inner ring (2) is provided, which moves down when the substrate (11) moves and separates from the lower surface (Kb) of the upper portion (K).

When the substrate (11) is taken in and out of the substrate surface treatment space (S), the substrate (11) is placed on the upper part (K1) as shown in FIG.
Each time under the lower surface (Kb) of the. On the other hand, the mist containing the chemical adheres to the inner peripheral surface (1A) of the upper part (K1) and grows into a droplet (E), and when it reaches a certain size or more, it flows down to the upper part (K1).
Of the inner peripheral surface (1A) and do not drop immediately as in the conventional example.

Further, an inner ring (2) is provided, and an upper portion (K) including a lower surface (4c) of the protruding portion (4) every time the inner ring (2) rises.
Since the liquid drops (E) that abut on the lower surface (Kb) of (1) and are about to overflow on the protruding part (4) at that time, the liquid droplets (E) travel along the contact part and strike the inner peripheral surface of the inner ring (2). The amount of the droplet (E) flowing down and accumulated on the protrusion (4) is reduced. This drastically reduces the amount of the droplet (E) dripping over the protrusion (4), and the droplet (E) drops on the surface of the substrate (11) when the substrate (11) moves. Is extremely small.

The second aspect of the present invention relates to the position of the projection (4), "the contact surface (2) of the inner ring (2) lowered to the lower position.
c) and the substrate (11) passing between the lower surface (Kb) of the upper portion (K1) of the casing (K) and the opening (6b) into and out of which the casing (K)
At least the protrusion (4) is provided in accordance with the opening (6b). "

The substrate (11) can be taken in and out of the substrate surface treatment space (S) by the opening provided in the side wall (6a) of the casing (K).
Through (6b). Therefore, the upper part of the casing (K)
The effect of the drop of the droplet (E) from (K1) is that the passage of the substrate (11) coincides with the opening (6b). Of course, the protruding portion (4) may be provided on the entire inner periphery of the lower end of the upper portion (K1), but if it is provided only at a portion corresponding to the passage of the substrate (11), the droplet
Dropping of (E) on the substrate (11) can be prevented.

A third aspect of the present invention relates to a means for discharging the liquid accumulated in the protrusion (4), wherein the suction passage (42) for sucking and discharging the liquid accumulated in the protrusion (4) has a casing (K). )). The chemical-containing droplet (E) that has flowed down along the inner peripheral surface (1A) of the upper part (K1) is blocked by the protruding part (4) and does not drip to the lower part (K2) side as described above. If left unchecked, the amount will gradually increase and eventually overflow and drip. Therefore, if the suction path (42) is provided in the casing (K), the liquid accumulated in the projection (4) is discharged through the suction path (42) and does not accumulate as it overflows, but drops from the projection (4). Is prevented.

The fourth aspect is an upper portion (K1) including a projecting portion (4).
Regarding the improvement of the lower surface (Kb) of the upper part (K1) including the protrusion (4)
The lower surface (Kb) of the lower surface (Kb) is formed to be inclined upward toward the inner peripheral side, and the outer peripheral end (4b) of the lower surface (Kb) is formed at an acute angle (θ). Inner ring to touch (2)
The contact surface (2c) of the upper surface (K1) including the protrusion (4) is the lower surface (Kb)
The inner ring (2) is raised and the contact surface (2c) is raised as described above. When contacting the lower surface (Kb), a minute gap is generated therebetween, and when the liquid accumulated on the upper surface of the projection (4) comes into contact with this minute gap, it enters into the minute gap by surface tension.

Then, a part of the liquid flows down along the sunner ring (2), but the liquid that has entered the fine gap remains as it is. When the inner ring (2) moves down and separates from the lower surface (Kb), most of the inner ring adheres to the contact surface (2c) of the inner ring (2) and moves together with the inner ring (2). The portion adheres to and remains on the lower surface (Kb), which accumulates at the lowest position on the lower surface (Kb), gradually forms a droplet (E), grows, and eventually drops. This also causes the droplet (E) to fall on the substrate (11) and become soiled.

Therefore, the lower surface (Kb) is positively formed so as to be inclined upward toward the inner peripheral side, and the outer peripheral end of the lower surface (Kb) is formed.
By forming (4b) at an acute angle (θ), the liquid adhering to the lower surface (Kb) tends to collect at the outer peripheral end (4b), and the inner ring (2) falls and separates from the lower surface (Kb) Sometimes, the liquid collected at the outer peripheral end (4b) is transferred to the contact surface (2) of the inner ring (2).
c) to make it easier to flow down, and to the outer peripheral end (4
In b), the liquid is prevented from growing into a large droplet (E).

[0024]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described based on preferred embodiments. FIGS. 1 to 3 are diagrams showing an outline of a main part of the surface treatment apparatus of the present embodiment, and FIGS. 4 to 10 show respective embodiments of a projection (4) used in the present invention.

(1a) is an upper inner cover, (1b) is an upper outer cover located outside thereof, (1c) is a bottom for the upper cover, (1d) is a ceiling for the upper cover, and the upper cover (1) is Constitute. An exhaust hole (V) is formed in the ceiling (1d) for the upper cover, and gas in the upper cover (1) is exhausted to the external space of the present device. Further, the bottom portion (1c) for the upper cover is a ring-shaped one formed in accordance with the inner peripheral surface (1A) of the upper inner cover (1a), and has a through-hole formed in the center thereof, so that the substrate surface treatment space can be formed.
Form a part of (S). In the embodiment of FIGS. 1 and 2, a ring-shaped projection (4) projecting inside the inner peripheral surface (1A) of the upper inner cover (1a) over the entire periphery of the through hole of the bottom portion (1c) for the upper cover is provided on the lower surface. Installed. Although not shown, a projection (4) is provided in accordance with a passage portion of the substrate (11) corresponding to the opening (6b) used for taking the substrate (11) into and out of the substrate surface treatment space (S). You may do so.

The substrate (11) is moved into and out of the substrate surface treatment space (S) through an opening (6b) provided in the casing (K). Therefore, the effect of the drop of the droplet (E) from the upper portion (K1) of the casing (K) is the same as the opening (6b) of the substrate (11).
It will be called a passage. Of course, the protruding portion (4) may be provided on the entire circumference of the bottom portion of the upper portion (K1), but if it is provided only at least in a portion corresponding to the passage of the substrate (11), the substrate (1) of the droplet (E) may be provided.
Dropping on 1) can be prevented. The manner and shape of the projection (4) is not limited to one, and will be described later in detail with reference to FIGS.

The ceiling part (1d) for the upper cover has a through hole corresponding to the inner peripheral surface (1A) of the upper inner cover (1a) in the same manner as the bottom part (1c). Top cover (4
1) is provided. A large number of cover holes (40) are formed in the top cover (41), and a clean gas containing no particles or dust at all through the cover holes (40) into a substrate surface treatment space (S) described later. Is flowing downflow.

(6) is a lower cover having an upper opening, and a side wall thereof.
The upper end of (6a) is attached to the outer periphery of the lower surface of the bottom portion (1c) for the upper cover, and a spin chuck (10) to be described later is rotatably arranged at the center of the bottom portion. An outlet (50) having a diameter is provided to discharge a mist-containing air stream and waste liquid in the substrate surface treatment space (S).

(3) is an opening (6) in the side wall (6a) of the lower cover (6).
b) A door provided to open and close the opening of the side wall (6a)
(6b) is rotatably connected to a rotating shaft (3a) provided to protrude from an opening edge of the opening. A door operating body (3b) (in this embodiment, an actuator such as a motor or a rotary cylinder) is attached to the rotating shaft (3a), and opens and closes as shown by a virtual line in FIG.

Here, a casing (K), an upper cover (1), and a lower cover constituting a clean substrate surface treatment space (S) isolated from the surrounding environment for performing the surface treatment of the substrate (11).
The relationship with (6) will be described. First, regarding the substrate surface treatment space (S), the substrate surface treatment space (S)
(1a), a space surrounded by an upper cover bottom (1c), an upper cover (41), and a lower cover (6). In this embodiment, the substrate surface treatment space (S) is constituted by the above-mentioned members, but is not limited to this, and may be constituted integrally except for the top cover (41).

The casing (K) constituting the substrate surface treatment space (S) is divided into an upper part (K1) and a lower part (K2). In this case, the upper part (K1) of the casing (K) is Inner cover (1
a), bottom for top cover (1c), top cover (41) and protrusion
(4), and the lower part (K2) of the casing (K) is formed by the lower cover (6). And in this structure, the upper inner cover which forms a part of the upper part (K1) of the casing (K)
The inner diameter of (1a) is smaller than the inner diameter of the lower cover (6), which is the lower part (K2) of the casing (K), and is located inside the lower cover (6). K2) is enlarged, and the inner peripheral surface (1A) of the upper portion (K1) is located inside the inner peripheral surface (6A) of the lower portion (K2). " In the following description of the embodiments, the description will be made using the reference numerals related to the upper cover (1) and the lower cover (6).

Next, on the inner periphery of the lower end of the upper portion (K1), a protruding portion (4) protruding inward is provided.
When projecting integrally from the lower inner periphery of the upper inner cover (1a), or integrally projecting from the inner periphery of the upper inner cover bottom (1c), the upper inner cover bottom (1c) It is conceivable that another member (hereinafter referred to as a drip-proof member (7)) is attached to the lower surface and this is used as a protrusion (4), but this embodiment is the case of Will be described. In addition, protrusion (4)
Refers to a portion protruding inward from the inner peripheral surface (1A) of the upper inner cover (1a), and when integrated with the upper inner cover (1a), as in ), Or as a separate member << drip-proof member (7) >>. In addition, although the shape is various, the description will be made focusing on the basic form of FIG. 4 and the modified example will be described later in detail. The inner peripheral side of the lower surface of the drip-proof member (7) becomes gradually thinner toward the inner peripheral side and is formed with an upward slope, and the angle of the inner front end (4a) is an acute angle (α), The outer peripheral side of the lower surface was horizontal, and the protrusion amount of the protrusion (4) was about 2 mm.

(2) is a vertically movable inner ring, which is disposed in the lower cover (6) of the substrate surface treatment space (S) and is used during surface treatment such as etching or cleaning. It rises to an upper position and surrounds the periphery of the substrate (11). At that time, the contact surface (2c) is the substrate surface treatment space (S)
It comes into contact with the lower surface (Kb) of the drip-proof member (7) including the lower surface (4c) of the ring-shaped protrusion (4) protruding inward. The contact surface (2c) of the inner ring (2) is formed so as to correspond to the lower surface (Kb) of the drip-proof member (7), and the inner peripheral side of the upper surface of the contact surface (2c) is inclined upward inward. The outer peripheral side is formed horizontally,
The whole is in contact with the contact surface (2c). Abutment surface
The lower part following the contact part (2a) in which (2c) is formed is formed in a cylindrical shape whose diameter increases downward, and forms a skirt part (2b).

The inner ring (2) is a rotating door.
When opening (3) and moving the substrate (11) in and out, the substrate is moved to a lower position so as not to be in the way, and the operation for that is performed by the ring moving part (12). The ring moving section (12) includes an elevating mechanism section (12a) and two guide sections (12b).

First, the lifting mechanism (12a) will be briefly described. The guide cylinder (17) is provided so as to penetrate over the bottom part (1c) for the upper cover, and has a rod-shaped gear (1
6) is inserted slidably up and down. The rod gear (1
The lower end of (6) is attached to an attaching member (18) attached to the outer surface of the skirt (2b) of the inner ring (2). The rod-shaped gear (16) allows the face to be seen through the window (17a) of the guide cylinder (17), and the gear (16) is attached to the rod-shaped gear (16) at the window (17a).
(15) is engaged. The gear (15) is connected to the drive motor (13), and transmits the torque of the drive motor (13) to the gear (15).

Next, the guide portion (12b) of the ring moving portion (12)
Will be described. The guide part (12b) is provided at two places, and the inner ring (2) is moved up and down by one elevating mechanism part (12a) and two guide parts (12b). The guide cylinder (21) is erected on the bottom part (1c) for the upper cover similarly to the guide cylinder (17), and a guide rod (20) is inserted through its inner periphery so as to be slidable up and down. 16) Similar guide rod
The lower end of (20) is attached to an attaching member (18) attached to the outer surface of the skirt (2b) of the inner ring (2).

Next, the chemical solution supply section (19) will be described.
As can be seen from FIG. 2, the substantially L-shaped arm (38) protruding from the rotation shaft (52) is provided with a nozzle hole (51) formed in the upper inner cover (1a) through the substrate surface treatment space (S). A chemical solution nozzle (39) is provided along the arm (38). The tip of the chemical liquid nozzle (39) is disposed downward toward the center of the substrate (11).

The rotating shaft (52) is a ceiling part (1d) for an upper cover.
It is connected to the rotary actuator (55) arranged above, and by operating the rotary actuator (55), the chemical liquid nozzle (39) is displaced from the center of the substrate (11) as shown in FIG. It can be swung to the position where it was.

Next, the surface cleaning section (23) will be described.
As can be seen from FIG. 3, the rotating shaft (28) is
It is disposed facing a position shifted by about 120 ° from the rotation shaft (52) of 9). A substantially F-shaped nozzle outer cylinder (34) protrudes from a nozzle hole (61) drilled in the upper inner cover (1a), and the tip of the nozzle outer cylinder (34) is disposed to be inclined downward substantially toward the center of the substrate (11). Have been. A cleaning nozzle (35) for injecting a cleaning agent such as ultrapure water and a drying nozzle (36) for injecting nitrogen gas are inserted into the nozzle outer cylinder (34).

The rotating shaft (52) is connected to a rotating actuator (24) disposed on the ceiling (1d) for the upper cover,
By operating the rotary actuator (24), the nozzle outer cylinder (34) can be swung from the center of the substrate (11) to a position deviated from the peripheral edge as shown in FIG.

Next, the spin chuck (10) and its rotating mechanism will be described. The spin chuck (10) is a block having an approximately X-shaped cross section with a reduced body, and has many ring grooves engraved on its upper surface in a concentric manner. Rotating spindle (5) in the center
A suction hole (5a) drilled at the center of the rotating spindle (5) communicates with the ring groove to form a spin chuck (10).
The upper substrate (11) is adsorbed.

A gas ejection groove (10a) is provided in the vicinity of the outer periphery of the upper surface of the spin chuck (10).
An inert gas such as a nitrogen gas or an argon gas blows out from the gas ejection groove (10a) through the gas supply hole (5b) formed in the (5).

Further, a back rinse nozzle (9) is provided on the side of the spin chuck (10) from the bottom of the lower cover (6). It is open toward the periphery of the back surface of (11).

Reference numeral 11 denotes a substrate to be cleaned, for example, a semiconductor wafer or a solar cell wafer, which has a circular or rectangular shape (a square or a square having an arc-shaped corner portion). (10) It is held by suction.

Next, the operation of the present apparatus will be described. As described above, the clean gas containing no particles or dust flows into the substrate surface treatment space (S) through the large number of cover holes (40) of the top cover (41) by downflow, and the discharge holes (50)
Is discharged together with the processing waste liquid. The supply of the substrate (11) to the spin chuck (10) will be described.
b) to rotate the door (3) to open the side wall (6a) opening (6
Open b). The unprocessed substrate (11) is inserted from the opening (6b) into the substrate surface processing space (S) by a robot arm (not shown), and set on the spin chuck (10). When the setting is completed, the door (3) is reversed to close the opening (3b), and the substrate surface treatment space (S) is closed.

Next, the spin chuck (10) is rotated at a low speed, and the rotation actuator (55) of the chemical solution supply section (19) is rotated.
To move the chemical liquid nozzle (39) to the substrate (11) as shown in FIG.
Is swung from a position deviated from the peripheral edge of the substrate to the center of the substrate (11), and stopped when it reaches the center to supply an appropriate amount of the chemical solution onto the substrate (11). When the supply of the chemical is completed, the rotary actuator (55) is operated in reverse to move the chemical nozzle (39) from the center position of the substrate (11) to the outside of the peripheral portion.

The supplied chemical solution has a low speed (for example, 50 rpm).
p) It flows on the rotating substrate (11) toward the periphery, and covers the entire surface of the substrate (11). The rotation of the spin chuck (10) and the supply of the chemical solution are stopped at the position where the rotation is performed for several seconds, and the chemical solution covers the surface of the substrate (11) in a state of being raised by the surface tension, and the optimal time length (for example, 1 to 1) 2 minutes), and the surface treatment of the substrate (11) with a chemical solution is performed.

When the surface treatment with the chemical solution is completed, the rotation actuator (24) of the chemical solution supply unit (19) of the surface cleaning unit (23) is operated to move the substrate (11) from the stop position outside the periphery of the substrate (11). Swing the nozzle sleeve (34) to the center of 11),
A cleaning agent such as ultrapure water is sprayed from the tip of the cleaning nozzle (35) inserted into the nozzle outer cylinder (34) toward the center of the substrate (11), and the spin chuck (10) is rotated at a high speed. To wash off the chemical solution on the substrate (11). Cleaning solution containing chemicals
It is shaken off by centrifugal force with the rotation of the substrate (11), collides with the inner peripheral surface of the inner ring (2) disposed around the substrate (11), and drip-drops. Is discharged out of the system together with the airflow.

When the cleaning is completed, the supply of the cleaning liquid from the cleaning nozzle (35) is stopped, and then a drying gas such as nitrogen gas is supplied from a drying nozzle (36) arranged next to the cleaning nozzle (35). Is sprayed toward the substrate (11) rotating at high speed, and the surface of the substrate (11) is dried.

The backside rinsing nozzle (9) disposed on the backside of the substrate (11) is provided on the backside of the substrate (11) when necessary so that the chemical does not flow to the backside of the substrate (11). The cleaning liquid is discharged toward.

When the drying of the substrate (11) is completed, the nozzle
(34) deviates from the center of the substrate (11) to the outer periphery of the substrate (11) and returns to the standby position, during which the rotation of the spin chuck (10) becomes slow and finally stops. A series of substrate surface treatments is completed in this manner. After the treatments are completed, the door (3) is opened as described above, and the robot hand takes out the processed substrates (11). When the processed substrate (11) is taken out, the same operation as described above is repeated to process the unprocessed substrate (11).
Is set on the spin chuck (10) with a robot hand to perform surface treatment.

The problem here is the drop (E) of the droplet (E) from the upper inner cover (1a) as described in the conventional example. However, in the device of the present invention, since the projection (4) projecting inward is provided at the lower end of the inner peripheral surface (1A) of the upper inner cover (1a), the inner peripheral surface (1A) and the projection (4) are provided. ) And a drop in the corner (1e)
Since (E) accumulates, it does not drop immediately as in the conventional example. (FIGS. 5 and 6) FIG. 7 shows a modification of the embodiment, in which a corner (1
The gap (4d) opening to e) is formed, and the liquid accumulated in the entry corner (1e) enters the gap (4d), so that the dropping of the droplet is further alleviated. The gap (4d) is sufficient if it is opened at the corner (1e), so that not only the drip-proof member (7) but also the upper inner cover (1a),
It can also be provided on the bottom (1c) for the upper cover.

Further, an inner ring (2) which can be brought into contact with and separated from the lower surface (Kb) is provided, and the projecting portion (4)
Abuts on the lower surface (Kb) of the drip-proof member (7) including the lower surface (4c) of the liquid droplet, so that the droplet (E) that has accumulated on the protruding portion (4) and is likely to overflow at that time travels along the contact portion. As a result, the amount of the droplet (E) that has flowed down to the inner peripheral surface side of the inner ring (2) and accumulated on the protrusion (4) is reduced. This drastically reduces the amount of the droplet (E) dripping over the protrusion (4), and the droplet (E) drops on the surface of the substrate (11) when the substrate (11) moves. Is extremely small.

Further, in FIGS. 8 and 10, the suction passage (42) for sucking and discharging the liquid accumulated in the protruding portion (4) has an upper inner cover (1a) which is a part of the casing (K). ) To the bottom (1c) for the upper cover. Then, the liquid droplet containing the chemical liquid flowing down along the inner peripheral surface of the upper inner cover (1a).
(E) does not drop because it is blocked by the protruding portion (4) as described above, but the amount gradually increases when left to stand, and eventually overflows and drops. In this case, since the suction path (42) is provided in the casing (K), the liquid collected in the protrusion (4) is removed by the suction path (42).
It does not accumulate to the extent that it is discharged through and overflows, and dripping from the protrusion (4) is prevented.

FIG. 9 shows the lower surface of the upper portion (K1) including the protruding portion (4).
(Kb) Regarding the further improvement of << In this case, the lower surface of the drip-proof member (7) >>, the lower surface (Kb) of the upper portion (K1) including the protruding portion (4) is formed to be inclined upward toward the inner peripheral side. The outer peripheral end (θ) of the lower surface (Kb) is formed at an acute angle. On the other hand, the contact surface (2c) of the inner ring (2) contacting the lower surface (Kb) when ascending is also
The inner peripheral side is formed to be inclined upward toward the inner peripheral side so as to correspond to the lower surface (Kb), and the outer peripheral side is formed in parallel. This portion is referred to as a parallel portion (2d).

In this case, when the inner ring (2) rises and its contact surface (2c) comes into contact with the lower surface (Kb), a minute gap is generated therebetween, and the inner ring (2) accumulates on the upper surface of the protrusion (4). When the liquid in contact with the fine gap, it enters into the fine gap by surface tension. Then, the inner ring (2) goes down and
When separated from (Kb), a part of the liquid adheres to the lower surface (Kb) due to the surface tension of the liquid and remains, and flows down along the lower surface (Kb) and accumulates at the lowest position of the lower surface (Kb).

On the other hand, since the contact surface (2c) of the inner ring (2) is formed in accordance with the lower surface (Kb), the liquid collected at the outer peripheral end (4b) of the lower surface (Kb) is The contact surface (2c) from the outer edge (4b) by gravity with the separation due to the lowering of the inner ring (2)
Side to make it easier to flow down, the droplet (E) at the outer peripheral end (4b)
Is trying not to grow. In this way, the droplet (E) at the outer peripheral end (4b) shifts to the inner ring (2) side at every rise, so that the droplet (E) at the outer peripheral end (4b) is It does not grow enough to drop.

If a suction path (43) that opens at the entry corner (1e) is provided as shown in FIG. 10, the droplets (E) collected on the protruding portion (4) will always be drawn by the suction path (43). Therefore, the amount of the droplets (E) accumulated on the protrusions (4) is drastically reduced, and the occurrence of the trouble can be effectively suppressed.

[0059]

According to the present invention, since the projecting portion is provided at the lower end of the inner peripheral surface of the upper portion, it adheres and grows on the inner peripheral portion of the upper portion, grows into a droplet, and becomes larger than a certain size. Even if it flows down, it is blocked by the protruding portion and accumulates in the corner, and does not drop immediately as in the conventional example. In addition, the amount of liquid droplets that have accumulated on the protruding portion every time the inner ring rises and that are likely to overflow will flow down the inner peripheral surface of the inner ring through the contact portion, and the amount of liquid droplets accumulated on the protruding portion Is reduced each time, and the possibility of dropping over the protrusion is extremely reduced. Further, by providing the suction path, the liquid accumulated in the protruding portion is discharged by suction, so that dripping from the protruding portion is more effectively prevented. Furthermore, by forming the lower surface of the upper portion including the protruding portion and the contact surface of the inner ring ascending upward toward the inner peripheral side, and forming the outer peripheral end of the upper lower surface at an acute angle, When the inner ring is separated, the transition of the liquid to the inner ring can be made smooth, and the liquid can be prevented from growing into a large droplet at the outer peripheral end of the lower surface,
Drops of droplets can be prevented more effectively.

[Brief description of the drawings]

FIG. 1 is a sectional view taken along line XX of an embodiment of the present invention.

FIG. 2 is an enlarged Y-Y sectional view of one embodiment of the apparatus of the present invention shown in FIG.

FIG. 3 is a sectional view taken along the line ZZ of one embodiment of the apparatus of the present invention shown in FIG.

FIG. 4 is a partially enlarged sectional view of a first embodiment of a protrusion of the device of the present invention.

FIG. 5 is an enlarged sectional view of a first modified example of the protruding portion shown in FIG.

FIG. 6 is an enlarged cross-sectional view of a second modification of the protruding portion shown in FIG.

FIG. 7 is an enlarged sectional view of a third modified example of the protruding portion shown in FIG.

FIG. 8 is an enlarged cross-sectional view when a droplet suction path is provided in a fourth modification of the protruding portion shown in FIG.

9A is an enlarged sectional view of a fifth modified example of the protruding portion shown in FIG. 4 when the inner ring is in contact with the inner ring, and FIG. 9B is an enlarged sectional view of the state where the inner ring is separated from the projection; FIG.

FIG. 10 is an enlarged cross-sectional view of a sixth modified example of the protruding portion shown in FIG. 4, in a case where a droplet suction path is provided, and the inner rings are separated from each other.

FIG. 11 is a sectional view of a conventional device.

FIG. 12 is a partially enlarged cross-sectional view showing an inner ring operation and a dropping state of a droplet of the conventional device.

[Explanation of symbols]

 (S): Substrate surface treatment space (K): Casing (K1): Upper casing (K2): Lower casing (Kb): Lower casing (1): Upper cover (2): Inner ring (3): Door ( 4) Projection (4a) ... Lower surface of projection (5) ... Rotating spindle (6) ... Lower cover (8) ... Isolation space (9) ... Rinsing nozzle on back side (10) ... Spin chuck (11) ... Substrate

Claims (4)

[Claims] 1. A substrate surface treatment apparatus having a casing constituting a clean substrate surface treatment space isolated from an ambient environment for performing substrate surface treatment, wherein the casing is divided into an upper part and a lower part, The lower part is larger in diameter than the upper part, the inner peripheral surface of the upper part is located inside the inner peripheral surface of the lower part, and the lower inner part of the upper part is provided with a protruding part protruding toward the inner peripheral side. An inner ring, which is an elevating type, which rises during surface treatment of the substrate, abuts on the lower surface of the upper portion including the lower surface of the protruding portion, and which lowers when moving the substrate and is separated from the lower surface of the upper portion, is provided. A substrate surface treatment apparatus characterized in that: 2. A casing is provided with an opening for entering and exiting a substrate passing between an upper surface of the inner ring lowered to a lower position and a lower surface of an upper portion of the casing, and at least a projecting portion is formed in the opening. The substrate surface treatment apparatus according to claim 1, wherein the apparatus is provided in accordance with the following. 3. The substrate surface treatment apparatus according to claim 1, wherein a suction path for sucking and discharging the liquid accumulated in the projecting portion is provided in the casing. 4. An upper surface of the inner ring including the protruding portion is formed so as to be inclined upward toward the inner peripheral side, and an outer peripheral end of the lower surface is formed at an acute angle. The substrate surface treatment apparatus according to claim 1, wherein the upper surface is formed so as to correspond to the lower surface of the upper portion including the protruding portion, and is formed to be inclined upward toward the inner peripheral side.