JPH11251621A - Photocoupler and its manufacture - Google Patents

Photocoupler and its manufacture

Info

Publication number
JPH11251621A
JPH11251621A JP4720698A JP4720698A JPH11251621A JP H11251621 A JPH11251621 A JP H11251621A JP 4720698 A JP4720698 A JP 4720698A JP 4720698 A JP4720698 A JP 4720698A JP H11251621 A JPH11251621 A JP H11251621A
Authority
JP
Japan
Prior art keywords
substrate
emitting element
coupling device
light emitting
receiving element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4720698A
Other languages
Japanese (ja)
Inventor
Naoki Sada
尚記 佐田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP4720698A priority Critical patent/JPH11251621A/en
Publication of JPH11251621A publication Critical patent/JPH11251621A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144Gold (Au) as principal constituent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/13Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301Thyristor
    • H01L2924/13033TRIAC - Triode for Alternating Current - A bidirectional switching device containing two thyristor structures with common gate contact
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303Surface mounted components, e.g. affixing before soldering, aligning means, spacing means

Abstract

PROBLEM TO BE SOLVED: To provide a photocoupler capable of facilitating alignment in the case of packaging a substrate, by a method wherein the dispersion of the packaging positions on a substrate, the slippage in the turning direction on the packaging surface as well as the inverse insertion inverting the positions of a light emitting element and a photo-detecting element are avoided. SOLUTION: In a photocoupler packaged to be composed on a substrate wherein a light emitting element converting electric signal into photosignals as well as a photo-detecting element converting the photosignals into the electric signals oppositely arranged in different lead frames to be molded, multiple projections 9a, 9b are provided on the surface of a substrate 10, while multiple recessions 10a, 10b corresponding to the projections 9a, 9b are provided on the substrate 10.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、フォトカプラ、フ
ォトトライアックカプラ等の光結合装置に関し、特に、
基板上に実装される面実装タイプの光結合装置及びその
製造方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical coupling device such as a photocoupler, a phototriac coupler, etc.
The present invention relates to a surface mounting type optical coupling device mounted on a substrate and a method of manufacturing the same.

【0002】[0002]

【従来の技術】従来の面実装タイプの光結合装置につい
て、図5を用いて説明する。図5に示すように、この光
結合装置は、リードフレーム3,4に、発光素子1,受
光素子2が対向して配置され、発光素子1と受光素子2
とが透光性樹脂8によりモールドされ、さらにその周囲
が遮光性樹脂9によりモールドされ、これが基板10上
に実装されて構成されるものである。
2. Description of the Related Art A conventional surface mounting type optical coupling device will be described with reference to FIG. As shown in FIG. 5, in this optical coupling device, a light emitting element 1 and a light receiving element 2 are arranged on lead frames 3 and 4 so as to face each other.
Are molded with a light-transmitting resin 8, and the periphery thereof is molded with a light-shielding resin 9, which is mounted on a substrate 10.

【0003】この光結合装置の作製は、まず、発光素子
1と受光素子2とを、各々個別のリードフレーム3,4
に銀ペースト等の導電性ペースト5でダイボンドし、そ
れぞれに金線等の導電性ワイヤ6でワイヤボンドを施し
た後、発光素子1にシリコン樹脂7でプリコートする。
そして、これらをスポット溶接やローディングフレーム
にセットするなどして、発光素子1及び受光素子2を光
学的に対向配置させて、透光性樹脂8にて1次モールド
を行う。さらに、バリ取りを施した後、遮光性樹脂9に
て2次モールドを行う。
To manufacture this optical coupling device, first, a light emitting element 1 and a light receiving element 2 are connected to respective lead frames 3, 4 respectively.
Is bonded with a conductive paste 5 such as a silver paste or the like, and a wire bond is applied to each with a conductive wire 6 such as a gold wire, and then the light emitting element 1 is pre-coated with a silicon resin 7.
Then, the light-emitting element 1 and the light-receiving element 2 are optically opposed to each other by, for example, spot welding or setting on a loading frame, and primary molding is performed with the translucent resin 8. Further, after deburring, secondary molding is performed with the light-shielding resin 9.

【0004】次に、これを基板10に実装する。この
際、従来では、端子部分をフラックス等の粘着性の高い
ものを接着剤14として使用して借り止めをすることに
より、実装位置の位置決めを行っていた。
Next, this is mounted on a substrate 10. In this case, the mounting position is conventionally determined by borrowing the terminal portion using a highly adhesive material such as flux as the adhesive 14.

【0005】また、公開技法番号92−30192号に
は、遮光性樹脂9の基板10との実装面に凸部9dを設
け、基板10にはその凸部9dに嵌合するように対応し
て形成された凹部10dが設けられた構成のものが開示
されている(図6参照)。この光結合装置では、これら
凸部9dと凹部10dとを嵌合させることにより、実装
時の位置決めを行っていた。
[0005] In the technique disclosed in Japanese Patent Application Laid-Open No. 92-30192, a projection 9d is provided on the surface of the light-shielding resin 9 mounted on the substrate 10, and the substrate 10 is adapted to fit into the projection 9d. A configuration in which the formed recess 10d is provided is disclosed (see FIG. 6). In this optical coupling device, positioning at the time of mounting is performed by fitting these convex portions 9d and concave portions 10d.

【0006】[0006]

【発明が解決しようとする課題】しかしながら、上記の
図5に示した従来の面実装タイプの光結合装置では、実
装位置が大きくばらついてしまうという問題があった。
このため、発光素子1と受光素子2との位置が逆転して
しまうような逆挿入という問題も発生した。
However, the conventional surface mounting type optical coupling device shown in FIG. 5 has a problem that the mounting positions vary greatly.
For this reason, a problem of reverse insertion in which the positions of the light emitting element 1 and the light receiving element 2 are reversed occurs.

【0007】一方、図6に示した光結合装置では、図5
に示したもののような実装位置のばらつきは発生しない
ものの、凸部及び凹部を軸とする回転方向のズレが発生
した。したがって、この構成のものでも、やはり逆挿入
が発生していた。
On the other hand, in the optical coupling device shown in FIG.
Although there is no variation in the mounting position as shown in (1), there is a shift in the rotation direction about the convex and concave portions as axes. Therefore, even with this configuration, reverse insertion has also occurred.

【0008】本発明は、上記のような課題を解決するた
めになされたものであって、基板への実装位置のばらつ
き、実装面での回転方向のずれ、発光素子と受光素子と
の位置が逆転する逆挿入を防止して、基板実装時の位置
決めを容易に行うことができる光結合装置及びその製造
方法を提供することを目的とする。
SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and there is a problem that the position of the light-emitting element and the light-receiving element are different from each other in the variation of the mounting position on the substrate, the shift in the rotation direction on the mounting surface. It is an object of the present invention to provide an optical coupling device and a method for manufacturing the optical coupling device, which can easily perform positioning at the time of mounting on a board by preventing reverse insertion.

【0009】[0009]

【課題を解決するための手段】上記課題を解決するため
に、請求項1に記載の発明では、電気信号を光信号に変
換する発光素子とその光信号を電気信号に変換する受光
素子とが異なるリードフレームに対向配置されてモール
ドされ、基板上に実装されて構成される光結合装置にお
いて、基板との実装面に複数の凸部を設けると共に、そ
の凸部に対応した複数の凹部を基板に設けて構成してい
る。
According to the first aspect of the present invention, there is provided a light emitting device for converting an electric signal into an optical signal and a light receiving device for converting the optical signal into an electric signal. In an optical coupling device configured to be disposed opposite to a different lead frame, molded and mounted on a substrate, a plurality of convex portions are provided on a mounting surface with the substrate, and a plurality of concave portions corresponding to the convex portions are formed on the substrate. Is provided.

【0010】請求項1に記載の発明によれば、基板との
実装面に複数の凸部を設けると共に、その凸部に対応し
た複数の凹部を基板に設けて構成しているので、基板へ
の実装位置のばらつき、実装面での回転方向のずれ、発
光素子と受光素子との位置が逆転する逆挿入を防止し
て、基板実装時の位置決めを容易に行うことができる。
According to the first aspect of the present invention, a plurality of protrusions are provided on the mounting surface with the substrate, and a plurality of recesses corresponding to the protrusions are provided on the substrate. Of the light emitting element and the light receiving element can be prevented from being reversely inserted such that the positions of the light emitting element and the light receiving element are reversed.

【0011】さらに、請求項2に記載の発明では、請求
項1に記載の光結合装置において、複数の凸部及び複数
の凹部を、発光素子側と受光素子側とで非対象になるよ
うに配置して構成している。
Further, according to the invention described in claim 2, in the optical coupling device described in claim 1, the plurality of protrusions and the plurality of recesses are set so as to be asymmetric on the light emitting element side and the light receiving element side. It is arranged and configured.

【0012】請求項2に記載の発明によれば、複数の凸
部及び複数の凹部を発光素子側と受光素子側とで非対象
になるように配置して構成しているので、発光素子と受
光素子との位置が逆転する逆挿入を防止して、基板実装
時の位置決めを容易に行うことができる。ここで、凸部
及び凹部の非対称な配置とは、複数の凸部及び凹部の間
隔を変化させたり、発光素子側か受光素子側かのいずれ
か一方にのみ位置する凸部及び凹部を配置したり、複数
の凸部及び凹部の形状や大きさを発光素子側と受光素子
側とで変化させるなど、発光素子側と受光素子側とを誤
って基板実装しないようにするものである。
According to the second aspect of the present invention, the plurality of convex portions and the plurality of concave portions are arranged so as to be asymmetric on the light emitting element side and the light receiving element side, so that the light emitting element By preventing reverse insertion in which the position with respect to the light receiving element is reversed, positioning at the time of mounting on the substrate can be easily performed. Here, the asymmetric arrangement of the convex portions and the concave portions means that the intervals between the plural convex portions and the concave portions are changed, or the convex portions and the concave portions located only on one of the light emitting element side and the light receiving element side are arranged. In addition, the light emitting element side and the light receiving element side are prevented from being erroneously mounted on the substrate, for example, by changing the shape and size of the plurality of convex portions and concave portions between the light emitting element side and the light receiving element side.

【0013】さらに、請求項3に記載の発明では、請求
項1又は2に記載の光結合装置において、凹部の幅をそ
れに対応する凸部の幅よりも10〜60μm大きくして
構成している。
Further, according to the third aspect of the present invention, in the optical coupling device according to the first or second aspect, the width of the concave portion is larger than that of the corresponding convex portion by 10 to 60 μm. .

【0014】請求項3に記載の発明によれば、凹部の幅
をそれに対応する凸部の幅よりも10〜60μm大きく
して構成しているので、凸部をそれに対応する凹部に容
易に嵌合することができ、基板実装時の作業性が向上す
る。
According to the third aspect of the present invention, since the width of the concave portion is set to be larger than the width of the corresponding convex portion by 10 to 60 μm, the convex portion can be easily fitted into the corresponding concave portion. And workability during mounting on a substrate is improved.

【0015】また、請求項4に記載の発明では、電気信
号を光信号に変換する発光素子とその光信号を電気信号
に変換する受光素子とが異なるリードフレームに対向配
置してモールドし、基板上に実装する光結合装置の製造
方法において、最も外側のモールドを行うときにモール
ド装置のイジェクトピンを用いて基板との実装面に複数
の凸部を形成し、その複数の凸部のそれぞれに対応する
複数の凹部を基板に形成することとしている。
According to the present invention, a light emitting element for converting an electric signal into an optical signal and a light receiving element for converting the optical signal into an electric signal are arranged opposite to a different lead frame and molded. In the manufacturing method of the optical coupling device to be mounted on, when performing the outermost molding, a plurality of convex portions are formed on the mounting surface with the substrate using the eject pins of the molding device, and each of the plurality of convex portions is formed. A plurality of corresponding concave portions are formed in the substrate.

【0016】請求項4に記載の発明によれば、最も外側
のモールドを行うときにモールド装置のイジェクトピン
を用いて基板との実装面に複数の凸部を形成し、その複
数の凸部のそれぞれに対応する複数の凹部を基板に形成
するので、容易に凸部を形成でき、基板への実装位置の
ばらつき、実装面での回転方向のずれ、発光素子と受光
素子との位置が逆転する逆挿入を防止して、基板実装時
の位置決めを容易に行うことが可能な光結合装置を製造
することができる。なお、逆挿入を防止するには、複数
の凸部及び凹部の間隔を変化させたり、発光素子側か受
光素子側かのいずれか一方にのみ位置する凸部及び凹部
を配置したり、複数の凸部及び凹部の形状や大きさを発
光素子側と受光素子側とで変化させるなど、複数の凸部
及び凹部を発光素子側と受光素子側とで非対象となるよ
うな位置に形成すれば良い。
According to the fourth aspect of the present invention, when performing the outermost molding, a plurality of convex portions are formed on the mounting surface with the substrate by using an eject pin of the molding device, and the plurality of convex portions are formed. Since a plurality of concave portions corresponding to each are formed on the substrate, the convex portions can be easily formed, and the mounting position on the substrate varies, the rotational direction shifts on the mounting surface, and the positions of the light emitting element and the light receiving element are reversed. It is possible to manufacture an optical coupling device that can prevent reverse insertion and can easily perform positioning during mounting on a substrate. In order to prevent reverse insertion, the interval between the plurality of convex portions and concave portions may be changed, or the convex portions and concave portions located only on one of the light emitting element side and the light receiving element side may be arranged. If a plurality of convex portions and concave portions are formed at positions that are asymmetric on the light emitting element side and the light receiving element side, such as changing the shape and size of the convex portions and concave portions between the light emitting element side and the light receiving element side good.

【0017】また、請求項5に記載の発明では、電気信
号を光信号に変換する発光素子とその光信号を電気信号
に変換する受光素子とが異なるリードフレームに対向配
置してモールドし、基板上に実装する光結合装置の製造
方法において、最も外側のモールドを行うときにモール
ド金型の形状により基板との実装面に複数の凸部を形成
し、その複数の凸部のそれぞれに対応する複数の凹部を
基板に形成することとしている。
According to the fifth aspect of the present invention, a light emitting element for converting an electric signal into an optical signal and a light receiving element for converting the optical signal into an electric signal are opposed to a different lead frame and molded. In the method of manufacturing the optical coupling device mounted on the upper surface, when performing the outermost molding, a plurality of convex portions are formed on the mounting surface with the substrate by the shape of the mold, and the plurality of convex portions correspond to each of the plurality of convex portions. A plurality of recesses are formed in the substrate.

【0018】請求項5に記載の発明によれば、最も外側
のモールドを行うときにモールド金型の形状により基板
との実装面に複数の凸部を形成し、その複数の凸部のそ
れぞれに対応する複数の凹部を基板に形成するので、容
易に凸部を形成でき、基板への実装位置のばらつき、実
装面での回転方向のずれ、発光素子と受光素子との位置
が逆転する逆挿入を防止して、基板実装時の位置決めを
容易に行うことが可能な光結合装置を製造することがで
きる。なお、逆挿入を防止するには、複数の凸部及び凹
部の間隔を変化させたり、発光素子側か受光素子側かの
いずれか一方にのみ位置する凸部及び凹部を配置した
り、複数の凸部及び凹部の形状や大きさを発光素子側と
受光素子側とで変化させるなど、複数の凸部及び凹部を
発光素子側と受光素子側とで非対象となるような位置に
形成すれば良い。
According to the fifth aspect of the present invention, when the outermost molding is performed, a plurality of convex portions are formed on the mounting surface with the substrate according to the shape of the mold, and each of the plurality of convex portions is formed. Since a plurality of corresponding concave parts are formed on the substrate, convex parts can be easily formed, and the mounting position on the substrate varies, the rotation direction on the mounting surface shifts, and the light emitting element and the light receiving element reversely insert. Thus, an optical coupling device capable of easily performing positioning at the time of mounting on a substrate can be manufactured. In order to prevent reverse insertion, the interval between the plurality of convex portions and concave portions may be changed, or the convex portions and concave portions located only on one of the light emitting element side and the light receiving element side may be arranged. If a plurality of convex portions and concave portions are formed at positions that are asymmetrical on the light emitting element side and the light receiving element side, such as changing the shape and size of the convex portions and concave portions between the light emitting element side and the light receiving element side good.

【0019】[0019]

【発明の実施の形態】以下、本発明の実施の形態につい
て、図面を参照して説明する。なお、以下の説明におい
て、前述の従来技術と同じ構成には、同一符号を用い
る。また、本発明は、以下の実施形態に限定されるもの
ではない。
Embodiments of the present invention will be described below with reference to the drawings. In the following description, the same reference numerals are used for the same components as those of the above-described conventional technology. Further, the present invention is not limited to the following embodiments.

【0020】〔第1の実施形態〕第1の実施形態の光結
合装置の概略構造を、図1の要部断面図に示す。本実施
形態の光結合装置は、図1に示すように、リードフレー
ム3,4に、発光素子1,受光素子2が対向して配置さ
れ、発光素子1と受光素子2とが透光性樹脂8によりモ
ールドされ、さらにその周囲が遮光性樹脂9によりモー
ルドされ、これが基板10上に実装されて構成されるも
のである。そして、遮光性樹脂9には2つの凸部9a,
9bが設けられ、基板10には2つの凹部10a,10
bが設けられている。
[First Embodiment] A schematic structure of an optical coupling device according to a first embodiment is shown in a sectional view of a main part of FIG. As shown in FIG. 1, the optical coupling device according to the present embodiment has a light emitting element 1 and a light receiving element 2 arranged opposite to each other on lead frames 3 and 4, and the light emitting element 1 and the light receiving element 2 are made of a light-transmitting resin. 8 and the periphery thereof is molded with a light-shielding resin 9, which is mounted on a substrate 10. The light-shielding resin 9 has two projections 9a,
9b are provided, and the substrate 10 has two concave portions 10a and 10a.
b is provided.

【0021】この光結合装置の作製は、まず、発光素子
1と受光素子2とを、各々個別のリードフレーム3,4
に銀ペースト等の導電性ペースト5でダイボンドし、発
光素子1及び受光素子2のそれぞれに金線等の導電性ワ
イヤ6でワイヤボンドを施した後、発光素子1にシリコ
ン樹脂7でプリコートする。そして、これらをスポット
溶接やローディングフレームにセットするなどして、発
光素子1と受光素子2とを光学的に対向配置させて、透
光性樹脂8にて1次モールドを行う。さらに、バリ取り
を施した後、遮光性樹脂9にて2次モールドを行う。
In manufacturing the optical coupling device, first, the light emitting element 1 and the light receiving element 2 are connected to the respective lead frames 3 and 4 respectively.
Then, the light emitting element 1 and the light receiving element 2 are wire-bonded with a conductive wire 6 such as a gold wire, respectively, and then the light emitting element 1 is pre-coated with a silicon resin 7. The light emitting element 1 and the light receiving element 2 are optically opposed to each other by, for example, spot welding or setting on a loading frame, and the primary molding is performed with the translucent resin 8. Further, after deburring, secondary molding is performed with the light-shielding resin 9.

【0022】この2次モールドの際に、凸部9a,9b
を2箇所に形成するが、その方法について、図2を用い
て説明する。モールド装置内部には、遮光性樹脂9によ
る2次モールドに用いる上金型12、下金型13、及び
イジェクトピン11が備えられている。そして、イジェ
クトピン11には凸部9a,9bを形成するための凹部
11a,11bが設けられており、これにより、2次モ
ールドのときに容易に2箇所の凸部9a,9bを形成す
ることができる。
At the time of this secondary molding, the projections 9a, 9b
Are formed in two places, and the method will be described with reference to FIG. An upper mold 12, a lower mold 13, and an eject pin 11 used for a secondary molding using the light-shielding resin 9 are provided inside the molding apparatus. The eject pin 11 is provided with concave portions 11a and 11b for forming the convex portions 9a and 9b, thereby easily forming two convex portions 9a and 9b at the time of secondary molding. Can be.

【0023】図2に示したものの他に、図3に示すよう
にしても、2次モールドの際に凸部9a,9bを容易に
形成することが可能である。すなわち、図3のもので
は、図2に示すものと異なり、一方のモールド金型であ
る下金型13に、凸部9a,9bを形成するための凹部
13a,13bを設けており、これによっても容易に2
箇所の凸部9a,9bを形成することができる。なお、
図3の上金型12は図2の上金型12と同様のものであ
り、図3のイジェクトピン11は図2のイジェクトピン
11と異なり凹部11a,11bが設けられていないも
のである。
In addition to the one shown in FIG. 2, the projections 9a and 9b can be easily formed at the time of the secondary molding, as shown in FIG. That is, in FIG. 3, unlike the one shown in FIG. 2, concave portions 13 a and 13 b for forming the convex portions 9 a and 9 b are provided in the lower mold 13 which is one of the mold dies. Easily 2
The convex portions 9a and 9b at the locations can be formed. In addition,
The upper mold 12 of FIG. 3 is similar to the upper mold 12 of FIG. 2, and the eject pin 11 of FIG. 3 is different from the eject pin 11 of FIG. 2 in that the recesses 11a and 11b are not provided.

【0024】次に、これを基板10に実装する。図1に
示すように、あらかじめ、基板10には、凸部9a,9
bに対応して嵌合するように、凹部10a,10bを形
成しておく。このとき、凹部10a,10bの溝幅は、
凸部9a,9bの幅よりも、10μm〜60μm大きく
形成する。
Next, this is mounted on the substrate 10. As shown in FIG. 1, the projections 9a and 9
The recesses 10a and 10b are formed so as to be fitted in correspondence with b. At this time, the groove width of the concave portions 10a and 10b is
The width is formed to be 10 μm to 60 μm larger than the width of the protrusions 9 a and 9 b.

【0025】本実施形態において、以上の構成で基板実
装を行ったところ、遮光性樹脂9に複数の凸部9a,9
bを、基板10に複数の凹部10a,10bを形成した
ので、基板10への実装位置のばらつき、及び実装面で
の回転方向のずれを防止して、基板実装時の位置決めを
容易に行うことができた。そして、凹部10a,10b
の幅をそれに対応する凸部9a,9bの幅よりも10μ
m〜60μm大きくしたので、凸部9a,9bをそれに
対応する凹部10a,10bに容易に嵌合することがで
き、基板実装時の作業性が良好であった。
In this embodiment, when the substrate is mounted with the above configuration, a plurality of convex portions 9a, 9
b, since a plurality of recesses 10a and 10b are formed in the substrate 10, it is possible to prevent a variation in a mounting position on the substrate 10 and a shift in a rotation direction on a mounting surface, and to easily perform positioning when mounting the substrate. Was completed. And the recesses 10a, 10b
Is 10 μm larger than the width of the corresponding projections 9a and 9b.
Since the size was increased by m to 60 μm, the protrusions 9a and 9b could be easily fitted into the corresponding recesses 10a and 10b, and the workability at the time of mounting the board was good.

【0026】なお、凸部9a,9b及び凹部10a,1
0bについて詳述しなかったが、凸部の形状としては円
柱形状や角柱形状とすることができ、凹部はそれに対応
した形状とすれば良い。本実施形態では、凸部9a,9
bの形状を同形状としたが、これらの形状を発光素子1
側と受光素子2側とで非対象にるように異ならせば、発
光素子と受光素子との位置が逆転する逆挿入を防止する
ことができる。
The projections 9a, 9b and the depressions 10a, 1
Although 0b was not described in detail, the shape of the convex portion may be a columnar shape or a prismatic shape, and the concave portion may have a shape corresponding thereto. In the present embodiment, the protrusions 9a, 9
b were the same shape, but these shapes were
If the light-receiving element 2 and the light-receiving element 2 are made different from each other so as to be asymmetrical, reverse insertion in which the positions of the light-emitting element and the light-receiving element are reversed can be prevented.

【0027】〔第2の実施形態〕第2の実施形態の光結
合装置の概略構造を、図4の要部断面図に示す。本実施
形態の光結合装置は、図4に示すように、リードフレー
ム3,4に、発光素子1,受光素子2が対向して配置さ
れ、発光素子1と受光素子2とが透光性樹脂8によりモ
ールドされ、さらにその周囲が遮光性樹脂9によりモー
ルドされ、これが基板10上に実装されて構成されるも
のである。そして、遮光性樹脂9には3つの凸部9a,
9b,9cが設けられ、基板10には2つの凹部10
a,10b,10cが設けられている。なお、凸部9
a,9b,9c及び凹部10a,10b,10cの間隔
は、発光素子1側と受光素子2側とで非対象にるよう
に、凸部9a−9b(凹部10a−10b)の間隔と、
凸部9b−9c(凹部10b−10c)の間隔とが異な
るように配置しているものである。
Second Embodiment A schematic structure of an optical coupling device according to a second embodiment is shown in FIG. As shown in FIG. 4, in the optical coupling device of the present embodiment, the light emitting element 1 and the light receiving element 2 are arranged on the lead frames 3 and 4 so that the light emitting element 1 and the light receiving element 2 are made of a transparent resin. 8 and the periphery thereof is molded with a light-shielding resin 9, which is mounted on a substrate 10. The light-shielding resin 9 has three projections 9a,
9b and 9c are provided.
a, 10b, and 10c are provided. The protrusion 9
The intervals between the projections 9a-9b (recesses 10a-10b) are set so as to be asymmetric between the light emitting element 1 side and the light receiving element 2 side.
The projections 9b-9c (recesses 10b-10c) are arranged so as to have different intervals.

【0028】この光結合装置の作製は、まず、発光素子
1と受光素子2とを、各々個別のリードフレーム3,4
に銀ペースト等の導電性ペースト5でダイボンドし、発
光素子1及び受光素子2のそれぞれに金線等の導電性ワ
イヤ6でワイヤボンドを施した後、発光素子1にシリコ
ン樹脂7でプリコートする。そして、これらをスポット
溶接やローディングフレームにセットするなどして、発
光素子1と受光素子2とを光学的に対向配置させて、透
光性樹脂8にて1次モールドを行う。さらに、バリ取り
を施した後、遮光性樹脂9にて2次モールドを行う。
In manufacturing the optical coupling device, first, the light emitting element 1 and the light receiving element 2 are connected to the respective lead frames 3, 4 respectively.
Then, the light emitting element 1 and the light receiving element 2 are each wire-bonded with a conductive wire 6 such as a gold wire, and then the light emitting element 1 is pre-coated with a silicon resin 7. The light emitting element 1 and the light receiving element 2 are optically opposed to each other by, for example, spot welding or setting on a loading frame, and the primary molding is performed with the translucent resin 8. Further, after deburring, secondary molding is performed with the light-shielding resin 9.

【0029】この2次モールドの際に、凸部9a,9
b,9cを3箇所に形成するが、その方法については、
上記第1の実施形態と同様に、イジェクトピン11に凹
部を設けるか(図2参照)、下金型13に凹部を設ける
かして(図3参照)、容易に3箇所の凸部9a,9b,
9cを形成することができる。
At the time of this secondary molding, the protrusions 9a, 9
b and 9c are formed at three places.
As in the first embodiment, whether the eject pin 11 is provided with a recess (see FIG. 2) or the lower mold 13 is provided with a recess (see FIG. 3), the three protrusions 9a, 3 are easily provided. 9b,
9c can be formed.

【0030】次に、これを基板10に実装する。図4に
示すように、あらかじめ、基板10には、凸部9a,9
b,9cに対応して嵌合するように、凹部10a,10
b、10cを形成しておく。このとき、凹部10a,1
0b,10cの溝幅は、凸部9a,9b,9cの幅より
も、10μm〜60μm大きく形成する。
Next, this is mounted on the substrate 10. As shown in FIG. 4, the projections 9a and 9
b, 9c so that the recesses 10a, 10c
b and 10c are formed in advance. At this time, the concave portions 10a, 1
The groove widths of 0b and 10c are formed to be 10 μm to 60 μm larger than the widths of the protrusions 9a, 9b and 9c.

【0031】本実施形態において、以上の構成で基板実
装を行ったところ、遮光性樹脂9に複数の凸部9a,9
b,9cを、基板10に複数の凹部10a,10b,1
0cを形成したので、基板10への実装位置のばらつ
き、及び実装面での回転方向のずれを防止して、基板実
装時の位置決めを容易に行うことができた。そして、凹
部10a,10b,10cの幅をそれに対応する凸部9
a,9b,9cの幅よりも10μm〜60μm大きくし
たので、凸部9a,9b,9cをそれに対応する凹部1
0a,10b,10cに容易に嵌合することができ、基
板実装時の作業性が良好であった。
In this embodiment, when the substrate is mounted with the above configuration, a plurality of convex portions 9a, 9
b, 9c are formed in the substrate 10 by a plurality of recesses 10a, 10b, 1
Since 0c was formed, variation in the mounting position on the substrate 10 and deviation in the rotation direction on the mounting surface were prevented, and positioning at the time of mounting the substrate could be easily performed. Then, the widths of the concave portions 10a, 10b, and 10c are set to the corresponding convex portions 9.
Since the widths of the projections 9a, 9b, 9c are larger than the widths of the projections 9a, 9b, 9c by 10 μm to 60 μm,
0a, 10b, and 10c could be easily fitted, and workability at the time of board mounting was good.

【0032】さらに、本実施形態では、凸部9a,9
b,9c及び凹部10a,10b,10cの間隔は、発
光素子1側と受光素子2側とで非対象となるように、凸
部9a−9b(凹部10a−10b)の間隔と、凸部9
b−9c(凹部10b−10c)の間隔とが異なるよう
に形成したので、発光素子と受光素子との位置が逆転す
る逆挿入を、基板実装の際に防止することができた。
Further, in the present embodiment, the convex portions 9a, 9
The distance between the convex portions 9a-9b (the concave portions 10a-10b) and the convex portions 9a and 9c and the concave portions 10a, 10b, and 10c are set so as to be asymmetric on the light emitting element 1 side and the light receiving element 2 side.
Since the gap between b-9c (recesses 10b-10c) was formed differently, the reverse insertion in which the positions of the light emitting element and the light receiving element were reversed could be prevented during the mounting on the substrate.

【0033】なお、凸部9a,9b,9c及び凹部10
a,10b,10cについて詳述しなかったが、凸部の
形状としては円柱形状や角柱形状とすることができ、凹
部はそれに対応した形状とすれば良い。本実施形態で
は、上記第1の実施形態と同様に、凸部9a,9b,9
cの形状を同形状としたが、上述のとおり、凸部9a,
9b,9c及び凹部10a,10b,10cの間隔を変
化させたので、これらの形状を変化させなくとも、発光
素子と受光素子との位置が逆転する逆挿入を防止するこ
とができた。
The projections 9a, 9b, 9c and the recess 10
Although a, 10b, and 10c have not been described in detail, the shape of the convex portion may be a column shape or a prism shape, and the concave portion may have a shape corresponding thereto. In the present embodiment, similarly to the first embodiment, the protrusions 9a, 9b, 9
The shape of c is the same, but as described above, the protrusions 9a,
Since the intervals between 9b, 9c and recesses 10a, 10b, 10c were changed, it was possible to prevent reverse insertion in which the positions of the light emitting element and the light receiving element were reversed without changing their shapes.

【0034】[0034]

【発明の効果】以上のように、請求項1に記載の発明に
よれば、基板との実装面に複数の凸部を設けると共に、
その凸部に対応した複数の凹部を基板に設けて構成して
いるので、基板への実装位置のばらつき、実装面での回
転方向のずれ、発光素子と受光素子との位置が逆転する
逆挿入を防止して、基板実装時の位置決めを容易に行う
ことができる。
As described above, according to the first aspect of the present invention, a plurality of projections are provided on the mounting surface with the substrate,
A plurality of concave portions corresponding to the convex portions are provided on the substrate, so that the mounting position on the substrate varies, the rotation direction on the mounting surface shifts, and the light emitting element and the light receiving element are reversed in reverse insertion. Is prevented, and positioning at the time of mounting on the substrate can be easily performed.

【0035】さらに、請求項2に記載の発明によれば、
複数の凸部及び複数の凹部を発光素子側と受光素子側と
で非対象になるように配置して構成しているので、発光
素子と受光素子との位置が逆転する逆挿入を防止して、
基板実装時の位置決めを容易に行うことができる。ここ
で、凸部及び凹部の非対称な配置とは、複数の凸部及び
凹部の間隔を変化させたり、発光素子側か受光素子側か
のいずれか一方にのみ位置する凸部及び凹部を配置した
り、複数の凸部及び凹部の形状や大きさを発光素子側と
受光素子側とで変化させるなど、発光素子側と受光素子
側とを誤って基板実装しないようにするものである。
Further, according to the second aspect of the present invention,
Since the plurality of convex portions and the plurality of concave portions are arranged so as to be asymmetrical on the light emitting element side and the light receiving element side, it is possible to prevent reverse insertion in which the positions of the light emitting element and the light receiving element are reversed. ,
Positioning at the time of board mounting can be easily performed. Here, the asymmetric arrangement of the convex portions and the concave portions means that the intervals between the plural convex portions and the concave portions are changed, or the convex portions and the concave portions located only on one of the light emitting element side and the light receiving element side are arranged. In addition, the light emitting element side and the light receiving element side are prevented from being erroneously mounted on the substrate, for example, by changing the shape and size of the plurality of convex portions and concave portions between the light emitting element side and the light receiving element side.

【0036】さらに、請求項3に記載の発明によれば、
凹部の幅をそれに対応する凸部の幅よりも10〜60μ
m大きくして構成しているので、凸部をそれに対応する
凹部に容易に嵌合することができ、基板実装時の作業性
が向上する。
Further, according to the third aspect of the present invention,
The width of the recess is 10 to 60 μm larger than the width of the corresponding projection.
Since it is configured to have a larger m, the convex portion can be easily fitted into the corresponding concave portion, and workability at the time of mounting the substrate is improved.

【0037】また、請求項4に記載の発明によれば、最
も外側のモールドを行うときにモールド装置のイジェク
トピンを用いて基板との実装面に複数の凸部を形成し、
その複数の凸部のそれぞれに対応する複数の凹部を基板
に形成するので、容易に凸部を形成でき、基板への実装
位置のばらつき、実装面での回転方向のずれ、発光素子
と受光素子との位置が逆転する逆挿入を防止して、基板
実装時の位置決めを容易に行うことが可能な光結合装置
を製造することができる。なお、逆挿入を防止するに
は、複数の凸部及び凹部の間隔を変化させたり、発光素
子側か受光素子側かのいずれか一方にのみ位置する凸部
及び凹部を配置したり、複数の凸部及び凹部の形状や大
きさを発光素子側と受光素子側とで変化させるなど、複
数の凸部及び凹部を発光素子側と受光素子側とで非対象
となるような位置に形成すれば良い。
According to the fourth aspect of the present invention, when performing the outermost molding, a plurality of projections are formed on the mounting surface with the substrate by using an eject pin of the molding apparatus,
Since a plurality of concave portions corresponding to each of the plurality of convex portions are formed on the substrate, the convex portions can be easily formed, and a variation in a mounting position on the substrate, a shift in a rotation direction on the mounting surface, a light emitting element and a light receiving element. It is possible to manufacture an optical coupling device capable of preventing reverse insertion where the position is reversed and easily performing positioning at the time of mounting on a substrate. In order to prevent reverse insertion, the interval between the plurality of convex portions and concave portions may be changed, or the convex portions and concave portions located only on one of the light emitting element side and the light receiving element side may be arranged. If a plurality of convex portions and concave portions are formed at positions that are asymmetrical on the light emitting element side and the light receiving element side, such as changing the shape and size of the convex portions and concave portions between the light emitting element side and the light receiving element side good.

【0038】また、請求項5に記載の発明によれば、最
も外側のモールドを行うときにモールド金型の形状によ
り基板との実装面に複数の凸部を形成し、その複数の凸
部のそれぞれに対応する複数の凹部を基板に形成するの
で、容易に凸部を形成でき、基板への実装位置のばらつ
き、実装面での回転方向のずれ、発光素子と受光素子と
の位置が逆転する逆挿入を防止して、基板実装時の位置
決めを容易に行うことが可能な光結合装置を製造するこ
とができる。なお、逆挿入を防止するには、複数の凸部
及び凹部の間隔を変化させたり、発光素子側か受光素子
側かのいずれか一方にのみ位置する凸部及び凹部を配置
したり、複数の凸部及び凹部の形状や大きさを発光素子
側と受光素子側とで変化させるなど、複数の凸部及び凹
部を発光素子側と受光素子側とで非対象となるような位
置に形成すれば良い。
According to the fifth aspect of the present invention, when performing the outermost molding, a plurality of convex portions are formed on the mounting surface with the substrate by the shape of the mold, and the plurality of convex portions are formed. Since a plurality of concave portions corresponding to each are formed on the substrate, a convex portion can be easily formed, and the mounting position on the substrate varies, the rotational direction shifts on the mounting surface, and the positions of the light emitting element and the light receiving element are reversed. It is possible to manufacture an optical coupling device that can prevent reverse insertion and can easily perform positioning during mounting on a substrate. In order to prevent reverse insertion, the interval between the plurality of convex portions and concave portions may be changed, or the convex portions and concave portions located only on one of the light emitting element side and the light receiving element side may be arranged. If a plurality of convex portions and concave portions are formed at positions that are asymmetrical on the light emitting element side and the light receiving element side, such as changing the shape and size of the convex portions and concave portions between the light emitting element side and the light receiving element side good.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の第1の実施形態の光結合装置の概略構
造を示す要部断面図である。
FIG. 1 is a sectional view of a main part showing a schematic structure of an optical coupling device according to a first embodiment of the present invention.

【図2】図1に示した遮光性樹脂9の凸部9a,9bを
形成するためのモールド装置内部の要部断面図である。
FIG. 2 is a sectional view of a main part inside a molding apparatus for forming projections 9a and 9b of the light-shielding resin 9 shown in FIG.

【図3】図1に示した遮光性樹脂9の凸部9a,9bを
形成するためのモールド装置内部の要部断面図である。
FIG. 3 is a sectional view of a main part inside a molding apparatus for forming protrusions 9a and 9b of the light-shielding resin 9 shown in FIG.

【図4】第2の実施形態の光結合装置の概略構造を示す
要部断面図である。
FIG. 4 is a cross-sectional view of a main part showing a schematic structure of an optical coupling device according to a second embodiment.

【図5】従来の光結合装置の概略構造を示す要部断面図
である。
FIG. 5 is a sectional view of a main part showing a schematic structure of a conventional optical coupling device.

【図6】従来の光結合装置の概略構造を示す要部断面図
である。
FIG. 6 is a sectional view of a main part showing a schematic structure of a conventional optical coupling device.

【符号の説明】[Explanation of symbols]

1 発光素子 2 受光素子 3,4 リードフレーム 8 透光性樹脂 9 遮光性樹脂 9a,9b,9c 凸部 10 基板 10a,10b,10c 凹部 11 イジェクトピン 12 上金型 13 下金型 DESCRIPTION OF SYMBOLS 1 Light emitting element 2 Light receiving element 3, 4 Lead frame 8 Translucent resin 9 Light shielding resin 9a, 9b, 9c Convex part 10 Substrate 10a, 10b, 10c Concave part 11 Eject pin 12 Upper mold 13 Lower mold

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 電気信号を光信号に変換する発光素子と
該光信号を電気信号に変換する受光素子とが異なるリー
ドフレームに対向配置されてモールドされ、基板上に実
装されて構成される光結合装置において、 前記基板との実装面に複数の凸部が設けられると共に、
該凸部に対応した複数の凹部が前記基板に設けられたこ
とを特徴とする光結合装置。
1. A light-emitting element which converts an electric signal into an optical signal and a light-receiving element which converts the optical signal into an electric signal are arranged oppositely to different lead frames, molded, and mounted on a substrate. In the coupling device, a plurality of protrusions are provided on a mounting surface with the substrate,
An optical coupling device, wherein a plurality of concave portions corresponding to the convex portions are provided on the substrate.
【請求項2】 請求項1に記載の光結合装置において、
前記複数の凸部及び前記複数の凹部が、前記発光素子側
と前記受光素子側とで非対象になるように配置されたこ
とを特徴とする光結合装置。
2. The optical coupling device according to claim 1, wherein
The optical coupling device, wherein the plurality of protrusions and the plurality of recesses are arranged so as to be asymmetric on the light emitting element side and the light receiving element side.
【請求項3】 請求項1又は2に記載の光結合装置にお
いて、前記凹部の幅がそれに対応する凸部の幅よりも1
0〜60μm大きいことを特徴とする光結合装置。
3. The optical coupling device according to claim 1, wherein the width of the concave portion is one more than the width of the corresponding convex portion.
An optical coupling device, which is larger by 0 to 60 μm.
【請求項4】 電気信号を光信号に変換する発光素子と
該光信号を電気信号に変換する受光素子とが異なるリー
ドフレームに対向配置してモールドし、基板上に実装す
る光結合装置の製造方法において、 最も外側のモールドを行うときにモールド装置のイジェ
クトピンを用いて前記基板との実装面に複数の凸部を形
成し、該複数の凸部のそれぞれに対応する複数の凹部を
前記基板に形成することを特徴とする光結合装置の製造
方法。
4. Manufacture of an optical coupling device in which a light emitting element for converting an electric signal into an optical signal and a light receiving element for converting the optical signal into an electric signal are arranged opposite to different lead frames, molded, and mounted on a substrate. In the method, a plurality of protrusions are formed on a mounting surface with the substrate by using an eject pin of a molding apparatus when performing an outermost mold, and a plurality of recesses corresponding to each of the plurality of protrusions are formed on the substrate. A method for manufacturing an optical coupling device, comprising:
【請求項5】 電気信号を光信号に変換する発光素子と
該光信号を電気信号に変換する受光素子とが異なるリー
ドフレームに対向配置してモールドし、基板上に実装す
る光結合装置の製造方法において、 最も外側のモールドを行うときにモールド金型の形状に
より前記基板との実装面に複数の凸部を形成し、該複数
の凸部のそれぞれに対応する複数の凹部を前記基板に形
成することを特徴とする光結合装置の製造方法。
5. A manufacturing method of an optical coupling device in which a light emitting element for converting an electric signal to an optical signal and a light receiving element for converting the optical signal to an electric signal are arranged facing different lead frames, molded, and mounted on a substrate. In the method, when performing the outermost molding, a plurality of convex portions are formed on a mounting surface with the substrate by a shape of a mold, and a plurality of concave portions corresponding to each of the plurality of convex portions are formed on the substrate. A method of manufacturing an optical coupling device.
JP4720698A 1998-02-27 1998-02-27 Photocoupler and its manufacture Pending JPH11251621A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4720698A JPH11251621A (en) 1998-02-27 1998-02-27 Photocoupler and its manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4720698A JPH11251621A (en) 1998-02-27 1998-02-27 Photocoupler and its manufacture

Publications (1)

Publication Number Publication Date
JPH11251621A true JPH11251621A (en) 1999-09-17

Family

ID=12768689

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4720698A Pending JPH11251621A (en) 1998-02-27 1998-02-27 Photocoupler and its manufacture

Country Status (1)

Country Link
JP (1) JPH11251621A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102403296A (en) * 2010-09-13 2012-04-04 英飞凌科技股份有限公司 Semiconductor module and method for production thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102403296A (en) * 2010-09-13 2012-04-04 英飞凌科技股份有限公司 Semiconductor module and method for production thereof

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