JPH11251490A - Semiconductor device and semiconductor package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor device for suppressing the radiation of unwanted electromagnetic waves from a connector without causing increase in the price of the connector. SOLUTION: A semiconductor package is provided with a high-speed signal wiring 4 that is formed on a printed circuit board 1, and a connector that is formed on the printed circuit board 1 and has the first, a first connector terminal 3a connected to the high-speed wiring 4 and has a second connector 3b formed adjacent to the first, first connector terminal 3a. A high-speed inversion signal is inputted to the second, the first connector terminal 3a is inputted to the second, second connector terminal 3b.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device and a semiconductor package for suppressing emission of unnecessary electromagnetic waves.

[0002]

2. Description of the Related Art With the development of multimedia, demands for high-speed data processing and data communication are increasing. In response to these demands, research and development are being actively conducted in both hardware and software, and remarkable performance improvements have been made.

In particular, in the field of semiconductor technology, the speed and function of microprocessors, which are the core of computers, and the speed and capacity of memory cells are increasing, and high-speed data processing and data communication are possible even with inexpensive personal computers. Is possible.

[0004] However, as the speed and function of LSIs increase, unnecessary electromagnetic waves radiated from electronic devices also increase with intensity and frequency, not only adversely affecting other electronic devices, but also affecting the human body. I have.

[0005] Most of the unnecessary electromagnetic wave radiation
In circuit boards on which electronic components such as SI and passive components are mounted, noise induced between signal wiring, power supply layers, and ground layers due to signal reflection, crosstalk between wirings, switching of semiconductor elements, and the like is caused. Unnecessary electromagnetic waves are radiated from the circuit board due to this noise, and further radiated outside the device through heat dissipation holes or the like of the housing.

[0006] Regarding the electromagnetic wave radiation due to the resonance phenomenon between the power supply layer and the ground layer, see the 11th Circuit Packaging Technology Lecture Meeting of the Japan Institute of Circuit Packaging, “Reduction of unnecessary radiation caused by the power supply / ground layer of the printed wiring board”. As described in “Technique”, it can be suppressed by forming a ground layer on both sides of the power supply layer via an insulating layer.

The radiation of the unnecessary electromagnetic wave from the surface on which the circuit pattern is formed can be obtained by applying a copper paste to the surface of the circuit pattern via an insulator as described in, for example, JP-A-8-228055. There is known a method of connecting the copper paste to the ground for shielding.

Further, as described in Japanese Patent Application Laid-Open No. 9-18099, wirings are arranged symmetrically with ground wiring interposed therebetween, and electromagnetic waves induced from the respective wirings are mutually canceled to thereby reduce unnecessary electromagnetic waves. Methods for preventing the occurrence itself are also known.

On the other hand, unnecessary electromagnetic waves are also emitted from electronic components such as connectors mounted on a printed circuit board. This is mainly because the antenna is constituted by the wiring on the printed board and the pin structure in the connector formed substantially at right angles to the printed board.

As a countermeasure against this, Japanese Patent Application Laid-Open No. 9-199235
As disclosed in Japanese Patent Application Laid-Open No. 9-82420, a ring-shaped core is inserted inside the connector to suppress noise emission, or a conductive cover is formed on the outer wall of the connector as described in Japanese Patent Application Laid-Open No. 9-82420. A method has been proposed in which a pin inside the connector is shielded by connecting to a ground to suppress leakage and emission of electromagnetic waves.

However, in this kind of conventional technology, the structure of the connector is special, so that the price of the connector increases. Since many connectors are used in a semiconductor device, an increase in the price of the connector causes an increase in the price of the semiconductor device.

Another cause of the unnecessary electromagnetic wave radiated from the printed wiring board is a through-hole portion (a signal transmission path is formed in the through-hole). That is, since the structure formed by the through-hole portion and the wiring pattern on the substrate surface connected to the through-hole portion has the same structure as the microstrip antenna, the through-hole portion radiates the electromagnetic wave.

However, in the conventional technique, it has been difficult to suppress unnecessary electromagnetic waves from the through-hole portion. On the other hand, as for the unnecessary electromagnetic wave radiated from the mounting structure of the semiconductor component, a problem of radiation from the pin portion has been reported in, for example, the 1997 IEICE Communication Society Conference Paper Collection B-4-17.

However, EM magazine for environmental electromagnetic engineering
As pointed out in C No. 114 (pages 72 to 77), the current semiconductor package structure is not designed to suppress electromagnetic wave radiation, and there are no reports of specific improvement plans or patent applications. Has been considered as an issue for the future.

By the way, unnecessary electromagnetic waves radiated from the semiconductor package are caused by a structure formed by wiring formed on the wiring board and leads of the semiconductor package serving as an antenna.

Here, it is technically possible to reduce the emission of unnecessary electromagnetic waves by changing the lead shape.
Since the standards for semiconductor components including lead shapes are defined by global standards, it is extremely difficult to change the lead structure,
Time is needed.

[0017] However, regulations on unnecessary electromagnetic wave radiation are being promoted in various countries around the world as an environmental problem. Therefore, a method capable of suppressing electromagnetic wave radiation is required even in the current standard.

[0018]

As described above, as described above,
The technology for suppressing unnecessary electromagnetic waves radiated from the connector disclosed in JP-A-199235 and JP-A-9-82420 has a problem that the price of the connector is increased.

Since the structure formed by the through hole and the wiring pattern on the substrate surface connected to the through hole has the same structure as the microstrip antenna, unnecessary electromagnetic waves are radiated from the through hole. Problem.

Further, since the structure formed by the wiring of the wiring board and the leads of the semiconductor package serves as an antenna, there is a problem that unnecessary electromagnetic waves are radiated from the semiconductor package mounted on the wiring board.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a semiconductor device capable of suppressing the emission of unnecessary electromagnetic waves from a connector without increasing the price of the connector. It is in.

Another object of the present invention is to provide a semiconductor device capable of suppressing the emission of an electromagnetic wave from a through hole. Still another object of the present invention is to provide a semiconductor package capable of suppressing emission of unnecessary electromagnetic waves and a semiconductor device using the same.

[0023]

Means for Solving the Problems [Structure] To achieve the above object, a semiconductor device according to the present invention (claim 1)
Signal wiring formed on the substrate, and formed on the substrate,
A first connector terminal connected to the signal wiring; and a connector having a second connector terminal formed adjacent to the first connector terminal, wherein the second connector terminal includes the first connector terminal. Characterized in that an inverted signal of the input signal input to the connector terminal is input.

Here, the voltage amplitude of the inverted signal is preferably different from the voltage amplitude of the input signal. Further, another semiconductor device according to the present invention (claim 2) includes a first through-hole portion formed in the substrate, and a first through-hole portion formed in the substrate.
And a second through hole formed adjacent to the first through hole. The second through hole has an inverted signal of an input signal input to the first through hole. Is input.

Here, the through-hole portion is, for example, one in which the inside of the through-hole is buried with a protruding electrode. Also,
The protruding electrodes are formed of a paste such as a silver paste or a copper paste.

In addition, wirings through which high-speed signals are propagated, such as clock wirings and data wirings, are connected to the through-holes. Another semiconductor package according to the present invention (claim 3) is a semiconductor package on which a semiconductor chip is mounted, wherein a first signal input section to which a first signal is input and a first signal input section are provided. Part is provided next to the first part.
And a second signal input unit to which an inverted signal of the above signal is input.

Here, the voltage amplitude of the inverted signal is preferably larger than the voltage amplitude of the input signal. Further, another semiconductor device according to the present invention (claim 4) includes a semiconductor package according to the present invention (claim 3) formed on a wiring board, and a semiconductor chip mounted on the semiconductor package. It is characterized by being.

According to the present invention (claim 1), an inverted signal of the input signal inputted to the first connector terminal is inputted to the second connector terminal, and the first and second connector terminals are inputted. Since unnecessary electromagnetic waves radiated from the connector cancel each other, unnecessary electromagnetic waves radiated from the connector can be suppressed.

In addition, with such a technique for suppressing the emission of unnecessary electromagnetic waves, only connector terminals and signal sources are basically added, and it is not necessary to employ a special connector structure. Can be suppressed.

Therefore, according to the present invention (claim 1), it is possible to realize a semiconductor device capable of suppressing emission of unnecessary electromagnetic waves from the connector without increasing the price of the connector.

According to the present invention (claim 2), the second
An inverted signal of the input signal input to the first through-hole is input to the through-hole, and unnecessary electromagnetic waves radiated from the first and second through-holes cancel each other. The emitted unnecessary electromagnetic waves can be suppressed.

Therefore, according to the present invention (claim 2), it is possible to realize a semiconductor device capable of suppressing emission of unnecessary electromagnetic waves from the through-hole portion. According to the present invention (claims 3 and 4), an inverted signal of the input signal input to the first signal input unit is input to the second signal input unit of the semiconductor package, and the first and second signals are input to the second signal input unit of the semiconductor package. Unnecessary electromagnetic waves radiated from the signal input unit cancel each other, so that unnecessary electromagnetic waves radiated from the signal input unit can be suppressed.

Therefore, according to the present invention (claims 3 and 4), it is possible to realize a semiconductor package capable of suppressing emission of unnecessary electromagnetic waves from a signal input portion and a semiconductor device using the same.

With such a technique for suppressing unnecessary electromagnetic wave radiation, basically only the signal input section and the signal source need to be added, and the shape of the signal input section does not need to be changed. Therefore, according to the present invention, even when the signal input unit is defined by a global standard such as a standard of a lead of a semiconductor package, emission of unnecessary electromagnetic waves can be suppressed.

[0035]

Embodiments of the present invention (hereinafter, referred to as embodiments) will be described below with reference to the drawings. (First Embodiment) FIG. 1 is a schematic diagram showing a semiconductor device according to a first embodiment of the present invention.

Referring to FIG. 1, reference numeral 1 denotes a printed board on which a flat cable connector 2 is mounted. The flat cable connector 2 has a plurality of connector terminals, of which a first first connector terminal 3 a is connected to a high-speed signal wiring 4. A high-speed signal such as a clock signal is input to the high-speed signal wiring 4.

The second connector terminal 3b adjacent to the first connector terminal 3a is connected to the inverted signal wiring 5. An inverted signal of the high-speed signal input to the high-speed signal wiring 4 is input to the inverted signal wiring 5.

FIG. 1 shows a state in which one first connector terminal 3a is provided with one second connector terminal 3b, but one first first connector terminal 3a is provided. Connector terminal 3a
May be provided with two second connector terminals 3b.

That is, the first first connector terminal 3a
One second connector terminal 3b may be provided on both sides of the connector. Further, depending on the type of the connector, it is possible to provide three or more second connector terminals 3b for one first connector terminal 3a.

The number of the first connector terminals 3a may be two or more. In this case, at least one second connector terminal 3b is provided adjacent to each first connector terminal 3a.

FIG. 2 shows the first connector terminals 3a (3b).
FIG. 4 is an enlarged view of a connection portion between the high-speed signal wiring 4 and the high-speed signal wiring 4 (inverted signal wiring 5). A through hole 6 is formed in the printed circuit board 1. Further, an end portion (connection portion) 7 of the high-speed signal wiring 4 (inverted signal wiring 5) is formed in a ring shape. The inner wall of the through hole is covered with a conductive film (not shown). The first connector terminal 3a (3b) has a through hole 6
The annular end 7 communicates with the conductive film (not shown) covering the inner wall of the through hole 6 and the annular end 7 by soldering or the like.

According to this embodiment, an inverted signal of the input signal input to the first connector terminal 3a is input to the second connector terminal 3b, and the first connector terminals 3a, 3b
Unnecessary electromagnetic waves radiating from each other cancel each other out,
Unnecessary electromagnetic waves radiated from the flat cable connector 2 can be suppressed.

With such a technique for suppressing unnecessary electromagnetic wave radiation, basically only the second connector terminal 3b and the signal source of the inverted signal need to be added, and there is no need to adopt a special connector structure. Thus, an increase in the price of the connector can be suppressed.

Therefore, according to the present embodiment, emission of unnecessary electromagnetic waves from the flat cable connector 2 can be suppressed without increasing the price of the flat cable connector 2.

FIG. 3 is a block diagram of a circuit module used for checking unnecessary electromagnetic waves radiated from the connector structure of FIG. In the figure, reference numeral 14 corresponds to the connector structure of FIG. 1, and indicates an electromagnetic wave measurement connector in which a 10-pin flat cable connector is mounted on a printed circuit board. Wiring signal on printed circuit board is 50Ω
Is controlled.

In the figure, reference numeral 11 denotes a crystal oscillator which is a signal source, and this crystal oscillator 11 outputs a rectangular signal of 30 MHz. This rectangular signal is input to the central connector terminal 15 of the electromagnetic wave measurement connector 14 via the timing circuit 13. Further, the inverted signal of the rectangular signal inverted by the signal inverting circuit 12 is supplied to the connector terminals 16, 1 on both sides of the connector terminal 15 via the timing circuit 13.
7 is input. The phase difference between the rectangular signal and the inverted signal is controlled to 180 degrees ± 1 degree.

The measurement of the electromagnetic wave is performed by using three connector terminals 15.
The measurement was performed by measuring the electric field near to 17 with a spectrum analyzer. FIG. 4A shows an experimental result when the circuit module is operated and no inversion signal is applied to the connector terminals 16 and 17 at both ends, that is, when the connector terminals 16 and 17 at both ends are at the ground potential (conventional). FIG.
(B) shows an experimental result when the circuit module is operated and inverted signals are given to the connector terminals 16 and 17 at both ends (the present invention). In FIG. 4, the horizontal axis represents frequency, and the vertical axis represents noise level.

FIG. 4 shows that the connector structure according to the present invention
It can be seen that the noise level is reduced in almost all frequency bands as compared with the conventional case, and in particular, it can be seen that unnecessary electromagnetic waves, which often occur in the low frequency region in the related art, are drastically reduced. From this experimental result, it has been clarified that the connector structure of FIG. 1 is a structure suitable for reducing unnecessary electromagnetic waves.

Next, a description will be given of an experimental result on the effect of the ratio of the voltage amplitude of the inverted signal to the voltage amplitude of the high-speed signal on suppressing the emission of unnecessary electromagnetic waves. For the experiment,
The circuit module shown in FIG. 3 was used. Then, the voltage amplitude of the high-speed signal was fixed at 5.0 V, and the radiated electromagnetic wave was measured while changing the amplitude voltage of the inverted signal in the range of 0 V to 6 V.

FIG. 5 shows the measurement results. From FIG.
It can be seen that the voltage amplitude at which the noise level is minimum is 2.3 V, which is smaller than 5 V of the high-speed signal. In the case of FIG.
Since the noise level when no inverted signal is input is set to 100%, the noise level can be reduced to 2% by selecting an appropriate voltage amplitude.

Therefore, in the apparatus shown in FIG. 1, by optimizing the voltage amplitude of the inverted signal input to the inverted signal wiring 5, a very effective EMI measure can be taken.
In the present embodiment, the case where a flat cable connector is used has been described. However, the present invention can be applied to various connectors having pin-shaped terminals, and particularly when the connector is mounted, the connector is attached to the surface of the board. A great effect is obtained when the pins are substantially vertical. (Second Embodiment) FIG. 6 is a sectional view showing a through-hole structure of a semiconductor device according to a second embodiment of the present invention.

In the figure, reference numeral 21 denotes a double-sided printed circuit board. The double-sided printed circuit board 21 has a first through hole 22 formed therein. On the inner wall of the first through hole 22, a first conductive film 23 is formed. Further, the first conductive film 23 is electrically connected to a high-speed signal wiring 24 formed on the double-sided printed circuit board 21 and through which a high-speed signal such as a clock signal propagates. The first through hole 22 and the first conductive film 23 constitute a first through hole.

Further, a second through hole 25 is opened in the double-sided printed circuit board 21 close to the first through hole 22. A second conductive film 26 is formed on the inner wall of the second through hole 25. Further, the second conductive film 26 is electrically connected to an inverted signal wiring 27 formed on the double-sided printed circuit board 21 and through which an inverted signal of a high-speed signal such as a clock signal propagates. The second through hole 25 and the second conductive film 26 constitute a second through hole.

According to this embodiment, an inverted signal of the input signal input to the second through-hole is input to the first through-hole, and is radiated from the first and second through-holes. Since the unnecessary electromagnetic waves cancel each other, the unnecessary electromagnetic waves radiated from the through-hole portions can be suppressed.

Therefore, according to the present embodiment, it is possible to realize a semiconductor device capable of suppressing emission of unnecessary electromagnetic waves from the through-hole portion. FIG. 7 shows an experimental result of examining the effect of reducing unnecessary electromagnetic waves by forming the through-hole structures of the related art and the present embodiment on a double-sided printed circuit board made of glass epoxy.

FIG. 7A shows the result of measuring the electric field intensity near the conventional through-hole structure (only the first through-hole portion in FIG. 7) with a spectrum analyzer. FIG. 7B shows the result of measurement of the double-sided printed circuit board having the through-hole structure of the present embodiment in FIG. 7 in the same manner as in FIG. 7A. In FIG. 7, the horizontal axis represents frequency, and the vertical axis represents noise level.
FIG. 7 shows that the through-hole structure of the present embodiment has a high effect of reducing unnecessary electromagnetic waves. (Third Embodiment) FIG. 8 is a sectional view showing a through-hole structure of a semiconductor device according to a third embodiment of the present invention. Parts corresponding to those in FIG. 6 are denoted by the same reference numerals as in FIG. 6, and detailed description is omitted.

The main difference between this embodiment and the second embodiment is that the signal propagation path in the through-hole portion is formed by a bump 28 made of a metal paste such as a silver paste.

In FIG. 8, three bumps 28 are lands 29
1 shows a signal transmission path having a structure stacked through the layers.
In the present embodiment, the multilayer printed wiring board 21a
Are used, and bumps 28 are used for connection between wirings formed in the different layers.

In the present embodiment, as in the third embodiment, unnecessary electromagnetic waves radiated from the through holes can be greatly reduced. In the second and third embodiments, the case of the through-hole portion penetrating from the front to the back of the printed circuit board has been described. Also applicable to

Further, the present invention is not limited to a printed circuit board,
For example, through-holes, contact holes or contact pillars for interlayer connection are formed, such as thin-film multilayer substrates for multi-chip modules, hybrid substrates by pressure film technology, built-up printed circuit boards, ceramic packages, resin packages or conductive chips. Other structures. (Fourth Embodiment) FIG. 9 is a sectional view showing a semiconductor device according to a fourth embodiment of the present invention.

In the figure, reference numeral 31 denotes a wiring board, on which a pin grid array package (PGA) 32 on which a semiconductor chip (not shown) is mounted is mounted.

The PGA 32 has a plurality of pin-shaped leads for supplying power and inputting / outputting a signal. Among them, a first pin-shaped lead 33 (first signal input section) has a high-speed signal such as a clock signal. This is a lead to which a signal is input. This first
A second pin-shaped lead 34 (a second signal input portion) to which an inverted signal of the high-speed signal is input is formed adjacent to the pin-shaped lead 33.

The number of the first pin-shaped leads 33 may be plural. Also in this case, a second pin-shaped lead 34 is formed adjacent to each first pin-shaped lead 33. A plurality of second pin-shaped leads 34 are provided next to each first pin-shaped lead 33.
May be formed. For example, one second pin-shaped lead 34 is formed on both sides of the first pin-shaped lead 33, and a total of two pin-shaped leads 34 are formed.

Here, the inverted signal wiring through which the inverted signal propagates is not connected to the semiconductor chip, but is terminated or opened inside the PGA 32. For example, as shown in FIG. 10, the inverted signal wiring 36 is not connected to the semiconductor chip 35 but is terminated by a resistor 37. In this case, it is desirable to terminate with a resistor 37 having the same resistance value as the characteristic impedance of the inverted signal wiring 36.

In FIG. 10, reference numeral 38 denotes a high-speed signal wiring, 39 denotes a ground line or a power supply line, and 40 denotes a bonding wire. According to the present embodiment, the inverted signal of the high-speed signal input to the first pin-shaped lead 33 is input to the second pin-shaped lead 34 of the PGA 32, and the first and second pin-shaped leads 33, 34 are provided. Unnecessary electromagnetic waves radiated from the first pin-shaped lead 33 can be suppressed because the unnecessary electromagnetic waves radiated from the first cancel each other.

Therefore, according to the present embodiment, the PGA 32 that can suppress the emission of the unnecessary electromagnetic wave from the pin-shaped lead is provided.
Semiconductor device using the same can be realized. Also, according to the research of the present inventor, the inverted signal is set to 18
It has been found that when the phase difference falls within the range of 0 degrees ± 5 degrees, a large effect of reducing unnecessary electromagnetic waves can be obtained.

FIG. 11 is a block diagram of a circuit module used for examining unnecessary electromagnetic waves radiated from the package structure of FIG. Parts corresponding to those in FIG. 3 are denoted by the same reference numerals as those in FIG. 3, and detailed description is omitted.

The configuration of this circuit module is the same as that of the circuit module of FIG. Here, as an object to be measured, a CMOS IC (74A) in which lead terminals 15a to 17a are formed side by side in parallel.
C11P) is mounted on a printed circuit board using an electromagnetic wave measurement IC 14a. Other configurations are the same as those in FIG.

The measurement of the electromagnetic wave is performed by the three lead terminals 15a.
The measurement was performed by measuring the electric field near to 17a with a spectrum analyzer. FIG. 12A shows a case where the circuit module is operated and no inversion signal is given to the lead terminals 16a and 17a at both ends, that is, the lead terminals 16a and 17 at both ends.
The results when a is the ground potential (conventional) are shown. Also,
FIG. 12B shows the result when the circuit module is operated and inverted signals are applied to the lead terminals 16a and 17a at both ends (the present invention). In FIG. 12, the horizontal axis represents frequency, and the vertical axis represents noise level.

From FIG. 12, it can be seen that the semiconductor package according to the present invention has a reduced noise level at almost all frequencies as compared with the conventional semiconductor package.
It turns out that it has decreased above. From this result, it has been clarified that the semiconductor package structure of FIG. 9 is a structure suitable for reducing unnecessary electromagnetic waves.

Next, a description will be given of an experimental result on the influence of the ratio of the voltage amplitude of the inverted signal to the voltage amplitude of the high-speed signal on the suppression of electromagnetic wave radiation. In the experiment, FIG.
Was used. Then, the voltage amplitude of the high-speed signal is fixed to 5.0 V, and the amplitude voltage of the inverted signal is set to 0.
Electromagnetic waves radiated while changing the voltage from V to 10 V were measured.

FIG. 13 shows the measurement results. From the figure,
It can be seen that the voltage amplitude at which the noise level is minimum is 7.6 V, which is larger than 5 V of the high-speed signal. This is DIP
This is a result of using PGA, but this phenomenon is caused by PGA and QF
This was confirmed in all semiconductor packages on which leads and pins such as P were formed.

In FIG. 13, since the noise level when no inverted signal is input is set to 100%, the noise level can be reduced to 3% by selecting an appropriate voltage amplitude.

Therefore, in the device shown in FIG. 9, by optimizing the voltage amplitude of the inverted signal input to the second pin-shaped lead 34, a very effective EMI measure can be taken.

FIGS. 14 to 16 show modified examples of the present embodiment. FIG. 14 shows a bump grid array (BGA), and FIG.
FIG. 16 shows a modified example using a DIP, and FIG. 16 shows a modified example using a QFP. Note that parts corresponding to FIG. 9 are denoted by the same reference numerals as in FIG.

The present invention can be applied to various semiconductor packages, and can be applied to the PGs shown in the embodiments and the modifications.
In addition to A, BGA, DIP, and QFP, the present invention can be applied to, for example, a lead such as a pin-shaped lead or a tape-shaped lead, or a semiconductor package using a protruding electrode.

The present invention is not limited to the above embodiment. For example, the first embodiment which is characterized by a technique for suppressing unnecessary electromagnetic waves radiated from the connector and the unnecessary electromagnetic waves radiated from the through-hole portion The second and third embodiments, which are characterized by the above suppression technique, and the fourth embodiment, which is characterized by the technique of suppressing unnecessary electromagnetic waves radiated from the semiconductor package, may be appropriately combined. In addition, various modifications can be made without departing from the scope of the present invention.

[0078]

As explained in detail above, the present invention (claim 1)
According to the first aspect, a second connector terminal is formed, an inverted signal of an input signal input to the first connector terminal is input to the second connector terminal, and the signal is radiated from the first and second connector terminals. By canceling unnecessary electromagnetic waves from each other, it is possible to realize a semiconductor device capable of suppressing emission of unnecessary electromagnetic waves from the connector without increasing the price of the connector.

According to the present invention (claim 2), the second
And an inverted signal of an input signal input to the first through-hole is input to the second through-hole, and unnecessary electromagnetic waves radiated from the first and second through-holes are supplied to the second through-hole. By canceling each other out,
A semiconductor device capable of suppressing emission of unnecessary electromagnetic waves from the through-hole portion can be realized.

According to the present invention (claims 3 and 4),
A second signal input portion is formed in the semiconductor package, and an inverted signal of an input signal input to the first signal input portion is input to the second signal input portion, and the second signal input portion receives the inverted signal from the first and second signal input portions. By canceling the emitted unnecessary electromagnetic waves, a semiconductor package capable of suppressing the emission of the unnecessary electromagnetic waves from the signal input unit and a semiconductor device using the same can be realized.

[Brief description of the drawings]

FIG. 1 is a schematic view showing a semiconductor device according to a first embodiment of the present invention.

FIG. 2 is an enlarged view of a connection portion between a connector terminal and high-speed signal wiring of the semiconductor device of FIG. 1;

FIG. 3 is a block diagram of a circuit module used for examining unnecessary electromagnetic waves radiated from the connector structures of the related art and the present invention.

FIG. 4 is a diagram showing unnecessary electromagnetic waves radiated from the connector structure of the related art and the present invention examined using the circuit module of FIG. 3;

FIG. 5 is a diagram showing an experimental result on the effect of the ratio of the voltage amplitude of the inverted signal to the voltage amplitude of the high-speed signal, which is examined using the circuit module of FIG.

FIG. 6 is a sectional view showing a through-hole structure of a semiconductor device according to a second embodiment of the present invention;

FIG. 7 is a diagram showing the results of experiments on the effect of reducing unnecessary electromagnetic waves by forming the through-hole structures of the conventional and second embodiments on a double-sided printed circuit board.

FIG. 8 is a sectional view showing a through-hole structure of a semiconductor device according to a third embodiment of the present invention;

FIG. 9 is a sectional view showing a semiconductor device according to a fourth embodiment of the present invention.

FIG. 10 is a diagram showing a state of high-speed signal wiring inside PGA;

FIG. 11 is a block diagram of a circuit module used for examining unnecessary electromagnetic waves radiated from the package structure of FIG. 9;

FIG. 12 is a diagram showing unnecessary electromagnetic waves radiated from the semiconductor package connectors of the related art and the present invention, which are examined using the circuit module of FIG. 11;

FIG. 13 is a graph showing the ratio of the voltage amplitude of the inverted signal to the voltage amplitude of the high-speed signal measured using the circuit module of FIG.
Diagram showing experimental results on effects on suppression of electromagnetic radiation

FIG. 14 shows a modification of the fourth embodiment.

FIG. 15 is a view showing another modification of the fourth embodiment;

FIG. 16 is a view showing still another modification of the fourth embodiment;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Printed circuit board 2 ... Flat cable connector 3a ... 1st connector terminal 3b ... 2nd connector terminal 4 ... High-speed signal wiring 5 ... Inversion signal wiring 6 ... Through-hole 7 ... Connection place 11 ... Crystal oscillator 12 ... Signal inversion Circuit 13 Timing circuit 14 Electromagnetic wave measurement connector 15-17 Connector terminal 21 Double-sided printed circuit board 22 First through hole (first through hole) 23 First conductive film (first through hole) 24) High-speed signal wiring 25 ... Second through-hole (second through-hole) 26 ... Second conductive film (second through-hole) 27 ... Inverted signal wiring 28 ... Bump (through-hole) 29 land (through-hole portion) 31 wiring board 32 PGA 33 first pin-shaped lead (first signal input portion) 34 second pin Lead (second signal input section) 35 semiconductor chip 36 inverted signal wiring 37 resistor 38 high-speed signal wiring 39 ground line 40 bonding wire

Claims (4)

[Claims] A signal wiring formed on the substrate; and a first wiring formed on the substrate and connected to the signal wiring.
And a connector having a second connector terminal formed adjacent to the first connector terminal, wherein the second connector terminal has an input input to the first connector terminal. A semiconductor device to which an inverted signal of a signal is input. 2. A semiconductor device comprising: a first through-hole formed in a substrate; and a second through-hole formed in the substrate and adjacent to the first through-hole. The semiconductor device according to claim 1, wherein an inverted signal of an input signal input to the first through hole is input to the second through hole. 3. A semiconductor package on which a semiconductor chip is mounted, wherein the first signal input section receives a first signal, and the first signal input section is provided adjacent to the first signal input section.
And a second signal input unit to which an inverted signal of the above signal is input. 4. A semiconductor device comprising: the semiconductor package according to claim 3 formed on a wiring board; and a semiconductor chip mounted on the semiconductor package.