JPH11243283A - Electronic unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To secure an electronic unit which is adequately enhanced in waterproofness and moisture-proofness, regardless of the shape and size of parts mounted on a circuit board and capable of ensuring performance and service life for the mounted components. SOLUTION: An electronic unit is equipped with a unit case 13, which is composed of a base member 11 where a circuit board 23 mounted with electronic components 24 to 26 is mounted and a cover member 12 which is fitted to the base member 11 so as to cover a circuit board 23, a groove 14 is provided to the periphery of the base member 11, the periphery of the cover member 12 is put in the groove 14, and sealing material 31 is filled into the groove 14 and cured, whereby the joint section between the base member 11 and the cover member is sealed up hermetically.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic unit having an improved waterproof and moisture-proof structure.

[0002]

2. Description of the Related Art As is well known, a circuit board on which electronic components such as a transistor and a diode are mounted is used in an electronic unit used for a control device of an electric appliance such as a washing machine. If water is applied to the board, or if dust adheres and becomes wet,
Leakage currents flowed between live parts, which progressively carbonized and eventually had the potential to cause tracking or short-circuits between the live parts.

On the other hand, conventionally, an electronic unit configured as shown in FIG. 13 is provided. These are electronic components 1, 2, 3, lead wire 4 and connector 5
Is mounted in a dish-shaped case 7 and fixed with screws 8. In the case 7, a sealing material 9 made of, for example, urethane resin is charged in each of the mounted components 1 to 5. The portion (lead or bare conductor) is filled and solidified to a position where it is buried, and the filled and solidified sealing material 9 prevents water and moisture from entering the charged portions of the mounted components 1 to 5. Things.

[0004]

However, the mounted parts 1 to 5 are generally irregular in height and shape, and particularly in their charged parts are irregular in length. For this reason, for example, in the case where the length of the charging portion is large, such as the electronic component 2,
It is difficult to completely fill the charged portion with the sealing material 9, leaving a possibility that water or moisture adheres to the exposed portion.

On the other hand, in a case where the length of the charged portion is small, such as the electronic component 1, the main body of the component is filled with the sealing material 9 so that, for example, a thermosensitive electronic component such as a thermal fuse can be used. The sensitivity is reduced, and the performance is reduced.
In the case of a component that generates heat such as a resistor, the degree of heat generation may be increased, and the sealing material 9 may be burnt or the life of the component itself may be shortened.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and its object is mainly to obtain a sufficient waterproof and moisture-proof effect irrespective of the shape and dimensions of a mounted component of a circuit board, and to provide a mounting component. An object of the present invention is to provide an electronic unit capable of ensuring good performance and long life.

[0007]

In order to achieve the above object, an electronic unit according to the present invention comprises a circuit board on which electronic components are mounted, a base member on which the circuit board is mounted, and a circuit board mounted on the base member. A unit case comprising a cover member fitted so as to cover the base member, a groove is formed in the periphery of the base member, the periphery of the cover member is put in the groove, and the groove is filled with a sealing material and solidified. Thus, the mating portion between the base member and the cover member is hermetically sealed.

[0008] According to this, at the mating portion of the base member and the cover member, the unit case is hermetically sealed with respect to the entire inside of the circuit board, and the parts mounted on the circuit board are not sealed. The encapsulant is also prevented from adhering.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a first embodiment of the present invention will be described with reference to FIGS. First, FIG. 1 shows an overall configuration of an electronic unit used for a control device of an electric device, for example, a washing machine. A unit case 13 including a base member 11 and a cover member 12 is used as an outer shell. Among them, the base member 11 is formed in a rectangular dish shape as shown in FIG. 2 using an electric insulating material, for example, a synthetic resin.
A plurality of screwing portions 15 shown in FIG. 1 are formed on the inside.

On the other hand, the cover member 12 is also formed of a synthetic resin into a rectangular box shape having an open lower surface, and has a pressure adjusting means 16. In this case, as shown in detail in FIG. 3A, the pressure adjusting means 16 is formed by sealing an opening 17 formed at the center of the upper surface of the cover member 12 with a pressure responsive body 18. The opening 17 is circular and the pressure responsive body 18 is also circular.
A pressure responsive body 18 is hermetically adhered to the peripheral portion of the pressure sensitive member. Further, in this case, the pressure responsive body 18 is formed in a diaphragm shape by a sheet of a synthetic resin, and as shown in FIGS. 3B and 3C, the flexible member deflects inside and outside the cover member 12. It has nature.

A thin portion 19 shown in FIG. 4 is formed around the upper surface of the cover member 12. The thin portion 19 is formed to have a thickness that can be easily cut by a knife or the like by making a V-shaped cut 20 around the upper surface of the cover member 12. As shown in FIG. 2, the cover member 12 is continuous in a rectangular frame shape around the entire periphery of the upper surface of the cover member 12.

Further, as shown in FIG. 1, a notch 21 is formed at one place (right side in the figure) around the cover member 12, and the cutout 21 extends outward all around. An overhanging flange portion 22 is formed. In this case,
The notch 21 has a depth smaller than the depth of the groove 14 of the base member 11.

On the other hand, the circuit board 23 is formed of, for example, a printed wiring board, and the electronic components 24, 2
5, 26 and the connector 27 are mounted by soldering their charged parts (leads and the like).
A lead wire 28 is connected to the connector 27 by fitting a connector 29 that forms a pair with the connector 27.

The circuit board 23 is located inside the base member 11 of the unit case 13,
By mounting on the screwing portion 15 and then fixing to the screwing portion 15 with the screw 30,
It is attached to the base member 11.

In this state, the circuit board 23 is further covered with the cover member 12 so that the cover member 12 is fitted to the base member 11. At this time, the cover member 1
The second flange portion 22 is inserted into the groove portion 14 of the base member 11, and the lead wire 28 led out of the cover member 12 from the circuit board 23 is held down by the notch portion 21. Note that the notch 21 is larger than the diameter of the lead wire 28, and accommodates a part of the lead wire 28 so that no gap is formed between the cover member 12 and the base member 11.

Thereafter, the groove 14 of the base member 11
For example, a sealing material 31 made of, for example, urethane resin is filled and solidified to the vicinity of the uppermost portion thereof, whereby the mating portion between the base member 11 and the cover member 12 is hermetically sealed. Further, in the case of this configuration, the solidified sealing material 31 also couples and fixes the base member 11 and the cover member 12, and furthermore, the lead wire led out of the circuit board 23 to the outside of the unit case 13. 28 may be held by the groove 14 of the base member 11.

In addition, the above-mentioned thin portion 19 is formed so as to be easily cut with a knife or the like as described above. Is formed so as to be continuous in a rectangular frame shape larger than the planar shape of the above, thereby making it possible to cut out and open the cover member 12 to a size that allows the circuit board 23 to be taken in and out.

Now, in the case of the structure as described above,
The unit case 13 in which the circuit board 23 is accommodated has a sealing material 31 for joining the base member 11 and the cover member 12 together.
The base case 11 and the cover member 12 form a unit case 13
Is hermetically sealed with respect to the entire interior. This allows
Unlike the conventional one, the component 2 mounted on the circuit board 23
Regardless of the shapes and dimensions of 4 to 27, sufficient waterproofing and moistureproofing effects can be obtained for all of them.

The components 24 to 2 mounted on the circuit board 23
The sealing material 31 does not adhere to 7. As a result, these components 24 to 27 are not adversely affected by the performance and the life due to the adhesion of the sealing material 31, and the performance and the life thereof can be secured well. You can do nothing.

Further, the sealing material 31 is sufficient to fill the groove 14 of the base member 11 with a small amount and use only a small amount.
It is not necessary to fill up to the height at which the whole of the charged part is buried in accordance with the height of the charged part of 4 to 27. Therefore, the time until the sealing material 31 is solidified can be shortened, and productivity can be improved. In addition, since the sealing material 31 itself can be used in a small amount, the cost can be reduced. It can also be reduced.

In the case of the above configuration, the unit case 13 has the pressure adjusting means 16. The pressure adjusting means 16 changes the internal volume in response to pressure fluctuations inside the unit case 13.
When the pressures inside and outside of the pressure response device 3 are balanced,
8 is in a substantially horizontal state shown in FIG. On the other hand, when the temperature in the unit case 13 is lower than the external temperature, the pressure in the unit case 13 is reduced, and the pressure responsive body 18 moves inward (see FIG. 3B). (In the figure, downward)
3 has the effect of reducing the internal volume and eliminating the internal / external pressure difference.

On the other hand, when the temperature inside the unit case 13 is higher than the outside temperature, the pressure inside the unit case 13 is increased, so that the pressure responsive body 18 moves outward (as shown in FIG. 3C). It flexes upward (in the figure) to increase the internal volume inside the unit case 13 and to eliminate internal and external pressure differences. Thus, the pressure responding member 18 functions as the pressure adjusting means 16 responding to the pressure fluctuation in the unit case 13. This can eliminate the ingress and egress phenomenon of air due to the repetition of the above-described pressure change, so-called respiratory action, and minimize the opportunity for moisture to enter, so that the moisture-proof effect can be further enhanced and the maintenance can be performed for a long time. Over time.

The pressure adjusting means 16 includes an opening 17 formed in a part of the unit case 13.
Can be realized by a structure in which only the pressure responsive body 18 having a flexible structure is used for sealing, and it is simple, so that an increase in cost can be suppressed. In addition, due to the simplicity of the structure and the uniform pressure change everywhere in the unit case 13, they are not limited to the cover member 12 of the unit case 13, but can be provided on the base member 11. It has the advantage that it can be easily provided at any position.

The unit case 13 includes a circuit board 23.
Has a thin portion 19 that can be cut out and opened to a size that can take in and out. As a result, when inspecting, repairing, and replacing the circuit board 23 and the mounting components 24 to 27 thereof, the thin portion 19 is cut with a knife or the like so that the unit case 13 (cover) is cut as shown in FIG. An opening 32 is formed in the member 12), through which the necessary work can be facilitated. Moreover, in this case, the circuit board 23 in the unit case 13 is not buried and fixed with a sealing material as in the conventional case,
The circuit board 23 can be easily replaced, and the unit case 13 can be easily replaced.
It is possible to avoid the irrationality of replacing the entire electronic unit including the electronic unit.

Here, as described above, the unit case 13
As shown in FIG. 5, a repair sheet having the same flexibility as the pressure responsive body 18, in particular, an adhesive sheet 33 is attached to the opening 32 formed by cutting out to seal the opening 32. By doing so, it can be repaired.

In this case, the pressure responsive body 18 is also removed together with the formation of the opening 32.
Has the same flexibility as the pressure responsive body 18 as described above, and therefore has the same function and function as the pressure responsive body 18.
That is, when the internal pressure is low due to the temperature difference between the inside and outside of the unit case 13, the sheet 33 bends inward as shown by the solid line in FIG. (B) adjusts the pressure by flexing outward as shown by the two-dot chain line, and thus, even after restoration, the effect of repeated air pressure changes due to repeated pressure changes, so-called respiratory effects, is obtained. Therefore, the opportunity for moisture to enter can be minimized, so that the moisture-proof effect can be enhanced and maintained for a long period of time.

In the above-described configuration, the thin portion 19 is continuous in a rectangular frame shape with one line. However, the present invention is not limited to this and may be discontinuous. Further, the thin portion 19 is not limited to one formed in a single frame shape larger than the planar shape of the circuit board 23. For example, the thin portion 19 may be formed at a plurality of locations in a plurality of divided sizes, and Some of them may be cut and pulled out. Furthermore, this thin portion 19
May be formed not by the V-shaped cut 20 but by a concave portion of another shape such as a U-shape.

In addition, in the case of the above-described configuration, the lead wires 2 led out of the circuit board 23 to the outside of the unit case 13 are provided.
8 is held in the groove 14 of the base member 11 by the sealing material 31. Thereby, even when an external force such as pulling the lead wire 28 is applied at the time of assembling or the like, it is possible to prevent the external force from being applied to the mating portion between the base member 11 and the cover member 12 by the sealing material 31, and It is possible to prevent a gap from occurring between them. Further, in this case, an external force is applied to the circuit board 2.
The connection between the lead wire 28 and the sealing material 3
1 can be prevented, and the connection relationship can be kept good.

Further, the sealing material 31 exhibiting these effects is provided.
Is originally intended to hermetically seal the mating portion between the base member 11 and the cover member 12, and this can be used to perform the above, so that component efficiency is high. Also, assembling work for holding the lead wire 28 can be performed at the same time by filling and solidifying the sealing material 31 in the groove portion 14 of the base member 11, so that the working efficiency is good.

6 to 12 show the second to eighth embodiments of the present invention. The same parts as those in the first embodiment are denoted by the same reference numerals and the description is omitted. Only the different parts will be described.

[Second Embodiment] In a second embodiment shown in FIG. 6, a light emitting element 41 is mounted on a circuit board 23 as an electronic component.
Are mounted, for example. On the other hand, the cover member 12 of the unit case 13 is made of a material that does not allow light to pass through, or is subjected to a coating process that does not allow light to pass therethrough, and a light-transmitting window 42 is formed on each of the portions facing the light-emitting element 41. A light-shielding wall 43 is formed on the lower surface to surround the opposing portions of the light-transmitting window 42 and the light-emitting element 41, respectively. And
A translucent display sheet 44 that covers the translucent window 42 in common is attached to the upper surface of the cover member 12.

According to this structure, although the light emitting element 41 is sealed in the unit case 13 and the light emitting element 41 is separated from the cover member 12, the light emitted from the light emitting element 41 is not blocked by the light shielding wall. 43 prevents the light from leaking to the surroundings and effectively reaches the light-transmitting window 42, so that a clear display can be achieved.

Third Embodiment In a third embodiment shown in FIG. 7, a light emitting element 51 is mounted on a circuit board 23 as an electronic component. On the other hand, in this case, the cover member 12 of the unit case 13 is made of a light-transmitting material,
For example, a columnar body 52 as a light-transmissive member that is formed of a transparent resin and extends to a position close to the light emitting element 51 is provided integrally on a lower surface of a portion facing the light emitting element 51. Further, in this case, the upper surface of the cover member 12 is placed on the non-translucent panel 5 having the translucent window 53 directly above the columnar body 52.
4, and a translucent display sheet 55 that covers the translucent window 53 is attached to the upper surface of the panel 54.

Also in this case, although the light-emitting element 51 is sealed in the unit case 13 and the light-emitting element 51 is separated from the cover member 12, the light emitted from the light-emitting element 51 emits a columnar body ( The light is effectively guided to the cover member 12 through the (light transmitting member) 52 and further above the cover member 12, so that a clear display can be performed as described above.

[Fourth Embodiment] In a fourth embodiment shown in FIG. 8, a heat generating component 61 is mounted on a circuit board 23. On the other hand, the base member 11 of the unit case 13 is provided on the lower surface with a heat radiating plate 6 made of metal as a heat transfer material.
2 and the radiating plate 62 has a convex portion 62 at an end thereof.
a protrudes into the unit case 13 from the opening 63 formed in the base member 11.

The projections 62a of the radiator plate 62 are
2 is made of the same metal (heat transfer material) as the other parts, and is essentially a heat radiating part. Therefore, the unit case 13 integrally has this heat radiating part (convex part 62a). On the upper surface of the convex portion 62a, a main body portion 61a of the heat generating component 61 is provided.
Are fixed closely by screws 64. Note that a large number of radiating fins 65 are formed on the lower surface of the convex portion 62a.

According to this structure, although the heat-generating component 61 is sealed in the unit case 13, the heat generated by the heat-generating component 61 is generated by the convex portion (radiator) 62 of the heat radiating plate 62.
a, it is effectively released to the outside of the unit case 13 so that the performance of the heat-generating component 61 itself can be satisfactorily exhibited, and heat influence on other electronic components in the unit case 13 can be avoided. I can do it for sure. Note that the size, shape, and the like of the heat radiating portion can be appropriately determined in consideration of the required heat radiating performance.

[Fifth Embodiment] Also in the fifth embodiment shown in FIG. 9, a heat generating component 71 is mounted on the circuit board 23. On the other hand, the base member 72 of the unit case 13 is made of metal instead of the base member 11, and the end of the base member 72 is the same as the protrusion 62a of the heat sink 62 of the fourth embodiment. 72a are formed, and the unit case 13 is configured to have a heat radiating portion (convex portion 72a). The main body 71a of the heat-generating component 71 is fixed on the upper surface of the convex portion 72a with a screw 73 so as to be in close contact therewith. Note that a large number of heat radiation fins 74 are formed on the lower surface of the convex portion 72a of the base member 72.

Also in this case, the heat generated by the heat generating component 71 sealed in the unit case 13 is transferred to the base member 7.
Unit case 13 through the second convex portion (radiator) 72a
It can be effectively released to the outside, and in this case, since a separate heat sink is not required, the configuration can be simplified accordingly.

[Sixth Embodiment] Also in the sixth embodiment shown in FIG. 10, a heat generating component 81 is mounted on the circuit board 23. On the other hand, the cover member 82 of the unit case 13 is made of metal instead of the cover member 12, and a part 82 a of the cover member 82 serves as a heat radiation part of the unit case 13. Thus, a part (a heat radiating portion) 82 a of the cover member 82 is provided with the main body 8 of the heat generating component 81.
1a is closely fixed with a screw 83.

Also in this case, the heat generated by the heat-generating component 81 sealed in the unit case 13 is transferred to the cover member 8.
Unit case 13 through the second convex portion (radiating portion) 82a.
Since it can be effectively released to the outside, and in this case, a separate radiator plate is not required, the configuration can be simplified accordingly. This configuration is suitable when the distance between the circuit board 23 and the cover member 82 can be reduced.

[Seventh Embodiment] In a seventh embodiment shown in FIG. 11, a storage portion 91 having a downward opening is formed inside one side wall of the cover member 12 of the unit case 13.
The desiccant 93 contained in the bag 92 is accommodated therein, so that the desiccant 93 is sealed inside the unit case 13.

According to this embodiment, even if moisture remains in the unit case 13 during assembly or repair after the cover member 12 is cut out, the moisture is absorbed by the desiccant 93, so that the circuit board 23 Further, it is possible to eliminate adverse effects (for example, the above-described tracking) due to moisture on various electronic components mounted thereon.

Moreover, since the desiccant 93 is stored and held in the storage portion 91, the desiccant 93 can be prevented from moving in the unit case 13 due to vibration or the like, and thereby the electronic component can be prevented from moving. The adverse effects can be prevented.

[Eighth Embodiment] In the eighth embodiment shown in FIG. 12, a second unit member 102 is constructed by further stacking a second cover member 101 on a cover member 12 of a unit case 13. doing. Therefore, in this case,
The cover member 12 of the unit case 13 also serves as a base member of the second unit case 102, and has a groove 103 formed on the entire outer periphery thereof and a plurality of screwing portions 104 formed therein. . Also, the screwed portion 10
4, the second circuit board 1 on which the electronic component 105 is mounted
06 is fixed by screws 107.

On the other hand, a flange 108 is formed on the periphery of the second cover member 101 so as to project outward. The flange 108 is inserted into the groove 103 of the cover member 12 and The member 101 is aligned with the cover member 12, and the entire circuit board 106 is covered by the second cover member 101. The groove portion 103 is filled with a sealing material 109 made of, for example, urethane resin and solidified, whereby the mating portion between the cover member 12 and the second cover member 101 is hermetically sealed, and at the same time, They also have their fixation. Note that the second cover member 1
In FIG. 1, a thin portion 110 that functions similarly to the thin portion 19 described above is also formed around the upper surface portion.

According to this, when the second circuit board 106 is used in addition to the circuit board 23,
Second unit case 10 accommodating the circuit board 106 of FIG.
2 can be stacked above the unit case 13, so that the entire occupied area can be reduced.
In this case, the cover member 12 of the lower unit case 13 serves as the base member of the second unit case 102.
Can be used, so that the structure can be prevented from becoming complicated. Furthermore,
Not only the unit case 13 but also the second unit case 102 can achieve the same waterproof and moisture-proof effects.

In addition, a circuit board 23 on which a tall electronic component 111 is mounted is disposed in the lower unit case 13, and a short electronic component 105 is mounted in the upper second unit case 102. When various types of electronic components and the like are used, for example, by disposing the circuit board 106, the assembling arrangement for each type is possible, and the size can be efficiently reduced. In this case, in the second unit case 102 in which the short electronic components 105 are arranged, the electronic components 105 as in the related art are placed inside the second unit case 102.
The sealing material may be filled to a height at which the charged portion is filled and solidified. In addition, the present invention is not limited to the embodiment described above and shown in the drawings, and can be implemented with appropriate modifications without departing from the scope of the invention.

[0049]

The present invention is as described above.
The following effects are obtained. According to the electronic unit of the first aspect, a sufficient waterproof and moisture-proof effect can be obtained irrespective of the shape and dimensions of the mounted components of the circuit board housed in the unit case, and the performance and life of the mounted components are also good. Can be secured, and further, productivity can be improved and costs can be reduced.

According to the electronic unit of the second aspect, the occurrence of a respiratory action due to a temperature difference between the inside and outside of the unit case can be prevented, and the moisture-proof effect can be further enhanced and maintained for a long time. According to the electronic unit of the third aspect, the above-described effect of further enhancing the moisture-proof effect can be realized with a simple structure, and the structure can be easily provided at an arbitrary position.

According to the electronic unit of the fourth aspect, it is possible to easily inspect, repair, and replace the circuit board sealed in the unit case and the components mounted thereon. Claim 5
According to the electronic unit, even when an external force such as pulling a lead wire is applied at the time of assembly or the like, it is possible to prevent a gap from being generated in a lead wire lead-out portion of the unit case,
The connection state of the lead wire can be kept good, and
This can be achieved with high component efficiency and high assembly efficiency.

According to the electronic unit of the sixth aspect, the light emitted from the light emitting element sealed in the unit case can effectively reach the light transmitting window of the unit case without leaking to the surroundings. Can be displayed. According to the electronic unit of the seventh aspect, the light emitted from the light emitting element similarly sealed in the unit case can be effectively guided, and clear display can be performed.

According to the electronic unit of the eighth aspect, the heat generated by the heat-generating component sealed in the unit case can be effectively released to the outside of the unit case, and the performance of the heat-generating component can be exhibited well. At the same time, heat influence on other electronic components in the unit case can be reliably avoided.
According to the electronic unit of the ninth aspect, even when moisture remains in the case at the time of assembling or repairing the unit case, it is possible to eliminate adverse effects of the moisture on the circuit board and various electronic components mounted thereon.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view of an entire electronic unit showing a first embodiment of the present invention.

FIG. 2 is a plan view of the entire electronic unit.

FIG. 3 is an enlarged vertical sectional view of a pressure adjusting unit.

FIG. 4 is an enlarged vertical sectional view of a thin portion.

FIG. 5 is an enlarged vertical sectional view showing a repair structure of a cutout opening portion of the unit case.

FIG. 6 is an enlarged view corresponding to FIG. 1 showing a second embodiment of the present invention.

FIG. 7 is an enlarged view corresponding to FIG. 1 showing a third embodiment of the present invention.

FIG. 8 is an enlarged view corresponding to FIG. 1 showing a fourth embodiment of the present invention.

FIG. 9 is an enlarged view corresponding to FIG. 1 showing a fifth embodiment of the present invention.

FIG. 10 is an enlarged view corresponding to FIG. 1 showing a sixth embodiment of the present invention.

FIG. 11 is an enlarged view corresponding to FIG. 1 showing a seventh embodiment of the present invention.

FIG. 12 is a view corresponding to FIG. 1 showing an eighth embodiment of the present invention;

FIG. 13 is a diagram corresponding to FIG. 1 showing a conventional example.

[Explanation of symbols]

11 is a base member, 12 is a cover member, 13 is a unit case, 14 is a groove, 16 is a pressure adjusting means, 17 is an opening, 18 is a pressure responder, 19 is a thin portion, 23 is a circuit board, and 24 to 26 are Electronic component, 28 is a lead wire, 31 is a sealing material, 32 is an opening, 33 is a sheet for repair, 41 is a light emitting element, 42 is a light transmitting window, 43 is a light shielding wall, 51 is a light emitting element, and 52 is a columnar shape. Body (translucent member), 61 is a heat-generating component, 62
a is a convex portion of the heat radiating plate (radiating portion), 71 is a heat generating component, 72 is a base member, 72a is a convex portion of the base member (radiating portion), 8
Reference numeral 1 denotes a heat-generating component, 82 denotes a cover member, 82a denotes a part of the cover member (radiator), 93 denotes a desiccant, 102 denotes a second unit case, and 111 denotes an electronic component.

Claims (9)

[Claims] 1. A circuit board on which electronic components are mounted, a base member on which the circuit board is mounted, and a unit case comprising a cover member fitted to the base member so as to cover the circuit board, the base member A groove was formed in the peripheral portion of the cover member, and the peripheral portion of the cover member was put in the groove portion, and the groove was filled with a sealing material and solidified, whereby the mating portion between the base member and the cover member was hermetically sealed. An electronic unit, characterized in that: 2. The electronic unit according to claim 1, wherein the unit case has pressure adjusting means for changing the internal volume in response to the internal pressure fluctuation. 3. The electronic unit according to claim 1, wherein the pressure adjusting means is formed by sealing an opening formed in a part of the unit case with a pressure responsive body having flexibility. . 4. The electronic unit according to claim 1, wherein the unit case has a thin portion that can be cut out and opened to a size that allows the circuit board to be taken in and out. 5. The electronic unit according to claim 1, further comprising a lead wire led out of the unit case from the circuit board, wherein the lead wire is fixed by a sealing material in a groove around the base member. . 6. A light-emitting element is mounted on a circuit board, and the cover member has a light-transmitting window at a portion facing the light-emitting element, and has a light-shielding wall surrounding the light-transmitting window and a portion facing the light-emitting element. The electronic unit according to claim 1, wherein: 7. The electronic unit according to claim 1, wherein the light emitting element is mounted on the circuit board, and the cover member has a light transmitting member extending to a position close to the light emitting element. 8. The electronic device according to claim 1, wherein a heat generating component is mounted on the circuit board, the unit case has a heat radiating portion made of a heat transfer material, and the heat generating component is closely contacted with the heat radiating portion. unit. 9. The electronic unit according to claim 1, wherein a desiccant is sealed inside the unit case.