JPH1124058A - Substrate with light shielding layer and its production as well as color filter substrate and liquid crystal display element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make it possible to maintain high light shielding performance by using a non-chromium metallic film even if the thickness thereof is thin by using a material essentially consisting of Ni and additives effective for lowering the Curie temp. of Ni for a light shielding layer. SOLUTION: This process for producing the substate with the light shielding layer formed by a magnetron sputtering method consists in using the material essentially consisting of the Ni and the additives effective for lowering the Curie temp. the Ni for the light shielding layer. The light shielding layer consists essentially of the Ni and the additives, such as V, Sb, Si, Ge, Mo, W, Os, Ir and Ru, effective for lowering the Curie temp. of the Ni. For example, a first layer 3 for suppressing reflection is formed on the substate 1 side and a second layer 4 having a high light shielding degree is formed thereon. An oxide film of the Ni, an oxide film of an alloy essentially consisting of the Ni and the effective additives, a nitride film of the Ni, a nitride film of an alloy essentially consisting of the Ni and the effective additives, etc., are adequately usable for the first layer 3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate with a light-shielding layer, a method of manufacturing the same, a color filter substrate, and a liquid crystal display device.

[0002]

2. Description of the Related Art In recent years, colorization of flat panel displays such as a liquid crystal display (LCD), a plasma display (PDP), and an electroluminescence display (ELD) has been advanced.

In each of these color panels, a light-shielding layer having a light-shielding function is provided between the RGB color filters in order to improve the contrast of the screen and improve the visibility. Chromium,
Examples include a metal film such as nichrome and tantalum, and a resin containing a black pigment such as carbon.

As a method of forming a light-shielding layer on a substrate, in the case of a metal film such as chromium, a thin film having a thickness of about 100 nm is formed on the substrate by sputtering or the like, and then a resist pattern is formed by photolithography. Then, using this as a mask, etching is performed to form a desired metal pattern.

[0005] In particular, when it is desired to obtain a light-shielding layer having a low surface reflectance, a metal oxide or oxynitride is deposited on a substrate in a thickness of 50 nm.
A structure in which a metal film having a thickness of about 100 nm is stacked after being formed to a thickness of about 100 nm is also used.

On the other hand, in the case of a resin containing a black pigment, a method in which an ink in which a black pigment powder is dispersed in a resin is printed into a print pattern by a printing method, and then cured by heating to form a light-shielding layer is used. In some cases, an ink in which a black pigment powder is dispersed in a photosensitive resin is applied, and a light-shielding layer having a desired pattern is formed by photolithography.

[0007]

The light-shielding layer using a conventional metal such as chromium or nichrome, its oxide, or its oxynitride is mainly formed by a vacuum film forming method such as a sputtering method. A pattern is formed by photolithography and etching of the resist. Therefore, there are disadvantages that the productivity is low and the production cost is high, but there is an advantage that occurrence of pinholes and the like is extremely small, and sufficient light shielding performance can be obtained even with a film thickness of about 100 nm. However, in recent years, there has been a demand for a light shielding layer metal material that does not use chromium, in which environmental considerations have been strongly called for.

On the other hand, in the case of a resin containing a black pigment, the productivity is high and the manufacturing cost is low because the vacuum film forming method is not required, but the pattern thickness is about 2 μm in order to obtain a sufficient light shielding performance. Must be very thick,
A large step occurs between a portion where the light-shielding layer is provided and a portion where the light-blocking layer is not provided on the substrate. This step may adversely affect the alignment control of the liquid crystal.

SUMMARY OF THE INVENTION In view of the above problems, the present invention provides a substrate with a light-shielding layer that uses a non-chromium metal film having a performance equal to or higher than that of a chromium film, has high light-shielding performance even if the thickness is small, and has little adverse effect on the environment The purpose is to provide.

[0010]

SUMMARY OF THE INVENTION The present invention provides a method for forming an N
In a method of manufacturing a substrate with a light-shielding layer for forming an i-type light-shielding layer, the light-shielding layer is formed by a magnetron sputtering method using a material mainly containing Ni and an additive effective for lowering the Curie temperature of Ni. The present invention provides a method for manufacturing a substrate with a light-shielding layer, characterized by being performed.

V, Sb, Si, Ge and M are effective additives for lowering the Curie temperature of Ni.
Provided is a method for manufacturing a substrate with a light-shielding layer, wherein at least one element selected from the group consisting of o, W, Os, Ir, and Ru is used.

In addition, one of the light-shielding layers formed is
An alloy mainly composed of Ni and an additive effective for lowering the Curie temperature of Ni, a nitride of the alloy,
Provided is a method for manufacturing a substrate with a light-shielding layer, which is a layer of an oxide of the alloy, a carbide of the alloy, or a composite thereof.

Further, the light-shielding layer has a structure of two or more layers, and the first layer reduces Ni oxide, Ni nitride, Ni oxynitride, and the Curie temperature of Ni and Ni from the base side. Consisting of an oxide of an alloy mainly containing an additive effective to cause a nitride of the alloy, or an oxynitride of the alloy,
And an alloy containing Ni and an additive effective for lowering the Curie temperature of Ni as a main component, a nitride of the alloy having a lower degree of nitridation than the first layer, or a second layer stacked thereon. Provided is a method for manufacturing a substrate having a light-shielding layer made of a carbide of an alloy.

Further, the light-shielding layer has a two-layer or three-layer structure, and is mainly composed of an alloy containing Ni and an additive effective for lowering the Curie temperature of Ni, a nitride of the alloy, or A second layer made of carbide of the alloy and an oxide of Ni or an additive effective to lower the Curie temperature of Ni and Ni formed on the surface of the second layer opposite to the substrate. Provided is a method for manufacturing a substrate with a light-shielding layer, which has at least a third layer mainly containing an oxide of an alloy as a main component.

Further, the light shielding layer has a structure of two or more layers,
The first layer is composed of Ni oxide, Ni nitride, Ni
An oxynitride, an oxide of an alloy containing Ni and an additive effective for lowering the Curie temperature of Ni, a nitride of the alloy, or an oxynitride of the alloy, and An alloy mainly composed of Ni and an additive effective to lower the Curie temperature of Ni, a nitride of the alloy having a lower degree of nitridation than the first layer, or a carbide of the alloy. And a substrate provided with a light-shielding layer.

Further, the light-shielding layer has a two-layer or three-layer structure, and is mainly composed of an alloy containing Ni and an additive effective for lowering the Curie temperature of Ni, a nitride of the alloy, or a nitride of the alloy. A second layer made of a carbide of an alloy, and an oxide of Ni or Ni and Ni formed on a surface of the second layer opposite to the substrate;
And a third layer mainly composed of an oxide of an alloy mainly containing an additive effective for lowering the Curie temperature of the alloy.

Furthermore, it is preferable that a color filter layer is formed on a substrate with a light-shielding layer manufactured by these manufacturing methods or a substrate with such a light-shielding layer, and an electrode is further formed thereon via an insulating layer. A color filter substrate characterized by providing a liquid crystal layer sandwiched between the color filter substrate and another electrode-attached substrate.

[0018]

BEST MODE FOR CARRYING OUT THE INVENTION The light-shielding layer according to the present invention is an additive (hereinafter referred to as an effective additive for lowering the Curie temperature of Ni and Ni, such as V, Sb, Si, Ge, Mo, W, Os, Ir and Ru). "An additive effective for lowering the Curie temperature of Ni" is also referred to as "effective additive".
The alloy, an oxide, a nitride, a carbide of the alloy, or a composite thereof is used. Examples of the composite include oxynitride and oxynitride carbide. For this reason, it has the same light-shielding performance and productivity as the chrome light-shielding layer, and the adverse effect on the environment is reduced.

FIG. 1, FIG. 2 and FIG. 3 are cross-sectional views of a substrate with a light shielding layer of the present invention. FIG. 1 shows an example in which the light-shielding layer has three layers, FIG. 2 shows an example in which the light-shielding layer has two layers, and FIG.
The example of a layer is shown. In each figure, 1 is a substrate such as glass, 2
Indicates a light shielding layer, 3 indicates a first layer, 4 indicates a second layer, and 5 indicates a third layer. In the example of FIG. 1, the first layer 3, the second layer 4, and the third layer 5 constitute a light-shielding layer 2. FIG. 2 shows an example in which the light-shielding layer 2 is composed of two layers, that is, a first layer 3 and a second layer 4. FIG. 3 shows an example in which the light-shielding layer 2 is constituted by a single layer of the second layer 4.

The light-shielding layer 2 in the present invention is formed of a material containing Ni and an effective additive as main components. In particular,
An alloy film of Ni and an effective additive having a high light shielding degree, a nitride film of Ni and an effective additive, or a carbide film of Ni and an effective additive can be suitably used. This light-shielding layer is preferably used in a three-layer or two-layer structure as shown in FIG. 1 or FIG.

In this case, one preferable embodiment is as follows.
A first layer 3 for suppressing reflection is formed on the substrate 1 side, and a second layer 4 having a high light blocking degree is formed thereon. This first layer 3
Are an oxide film of Ni, an oxide film of an alloy mainly containing Ni and an effective additive, a nitride film of Ni, a nitride film of an alloy mainly containing Ni and an effective additive, and an acid of Ni. A nitride film or an oxynitride film of an alloy mainly containing Ni and an effective additive is preferably used.

The second layer 4 is made of an alloy film mainly composed of Ni and an effective additive, a nitride film of an alloy mainly composed of Ni and an effective additive, or Ni and an effective additive. A carbide film of an alloy mainly composed of

In another preferred embodiment, the durability of the single layer of the second layer alone or the second layer 4 of the laminate of the first and second layers on the side opposite to the substrate is improved. The third layer 5 is formed for the purpose of improvement. The third layer 5 is an oxide film of Ni or an oxide film of an alloy containing Ni and an effective additive as main components. The material used for each of these layers has a content of nitrogen, oxygen, and carbon suitable for each layer.

That is, both the first layer and the second layer have N
It can also be used as a nitride film of an alloy containing i and an effective additive as main components. In this case, the nitride film of the alloy mainly composed of Ni and the effective additive of the first layer has a nitrogen content such that the reflection gloss is smaller than the degree of light shielding, and the second layer has a nitrogen content.
It is preferable that the nitride film of the alloy containing Ni and the effective additive as main components has a nitrogen content that increases the degree of light shielding.

According to the present invention, at least one of the light-shielding layers is made of N
It is a material containing i and an effective additive as main components. When the light-shielding layer is composed of a plurality of layers, it is preferable that all the layers are made of a material mainly containing Ni and an effective additive.

As the effective additives, V, Sb, S
It is preferable to use one or more elements selected from i, Ge, Mo, W, Os, Ir, and Ru. For this reason, in order to easily form Ni into a film by the magnetron sputtering method, it is necessary to lower the magnetism of Ni, and the additive element can lower the Curie temperature with a smaller addition amount. That is, it is effective in reducing magnetism.

The effective additive is preferably contained in the Ni alloy in a range of 3 to 25 atomic%.
If it exceeds 25 at%, durability such as heat resistance and acid resistance tends to decrease. If the content is less than 3 atomic%, strong magnetism remains on the target, making it difficult to attach and detach the target. In addition, the magnetic field on the back of the target is trapped in the target during magnetron sputtering, making it difficult to obtain a sufficient sputtering rate, thereby increasing productivity. Tends to decrease.

Particularly, in forming the second layer having a large thickness and a high light-shielding purpose, it is very effective because the film can be formed stably and at high speed. Further, with respect to the first layer, the second layer, and the third layer, the types and amounts of the effective additives may be different within a range that does not impair the features of the present invention.

The light-shielding layer 2 is made of a nitride film or a carbide film thereof in addition to an alloy film containing Ni and an effective additive as main components. Can be controlled. An alloy film mainly composed of Ni and an effective additive, a nitride film of an alloy mainly composed of Ni and an effective additive, and a carbide film composed of an alloy mainly composed of Ni and an effective additive are appropriately laminated. You may use it.

The thickness of the light-shielding layer 2 is about 50 to 1000 nm, and preferably about 80 to 300 nm. If it is less than 80 nm, it is difficult to obtain high light-shielding performance, and if it is more than 300 nm, the internal stress of the film is increased, the film is peeled off, or the film formation time and the etching time are unnecessarily long.

The light-shielding layer 2 has a two-layer structure as shown in FIG. 2, and a first layer 3 for suppressing reflection is formed on the first layer, and a second layer 4 having a high light-shielding degree is formed thereon. Is preferred. The first layer for suppressing the reflection is, as described above, specifically, an oxide film of an alloy of Ni and an effective additive, a nitride film of an alloy of Ni and an effective additive, or an alloy film of Ni and an effective additive. An oxynitride film is preferably used.

Although the productivity of the first layer is slightly reduced during the film formation for the above-mentioned reason, Ni oxides, nitrides or oxynitrides are also used because the film thickness is relatively small. it can. The first layer can be appropriately selected depending on the reflection suppressing performance and the patterning performance, and may not be provided in some cases.

A third layer 5 made of an oxide film of an alloy containing Ni and an effective additive as a main component is formed on the second layer 4 having a high light-shielding degree to form a two-layer or three-layer structure. Is preferred. Also in this case, since the thickness of the third layer is relatively small, N
An oxide of i can be used.

Although it is most preferable to have a three-layer structure as shown in FIG. 1, a first layer for suppressing reflection may not be provided. This third layer improves the durability of the light shielding layer. Thereby, in a process such as cleaning or photolithography during the color filter forming process, the disadvantages that the performance of the light-shielding layer is deteriorated and a pinhole is generated are suppressed.

The thickness of the first layer is preferably about 10 to 100 nm, and if it is less than 10 nm, it is difficult to obtain sufficient antireflection performance. It takes etching time. Therefore, a film thickness that satisfies the required reflection suppression performance may be selected within such a range.

The second layer having a high light-shielding degree is, as described above, specifically, an alloy film of Ni and an effective additive or a nitride film of an alloy of Ni and an effective additive or a film of Ni having an effective light-shielding degree. A carbide film of an alloy with an additive is preferably used. This second
The layer may be appropriately selected and used depending on the degree of light shielding and patterning performance. The thickness of the second layer is set to about 50 to 1000 nm as described above.

The thickness of the third layer is preferably about 1 to 50 nm, and if it is less than 1 nm, it is difficult to obtain high durability, and if it exceeds 50 nm, the patterning property of the light-shielding film is undesirably reduced. Therefore, a film thickness satisfying the required durability may be selected within such a range.

A film containing Ni and an effective additive as main components and N
The i-film has a higher light-shielding property as the content of Ni and the effective additive with respect to the contained oxygen, nitrogen, and carbon increases. On the other hand, the transparency increases as the amount of oxygen contained increases. Also, as with oxygen, the higher the content of nitrogen, the higher the transparency, but the effect is small compared to oxygen,
Suitable for precisely controlling transparency and refractive index. On the other hand, as the carbon content increases, the etching rate decreases.

Utilizing these features, oxygen to Ni, which is a material of the light-shielding layer, and an effective additive, so as to satisfy desired light-shielding properties and patterning properties, and furthermore, anti-reflection performance.
What is necessary is just to select the addition amount of nitrogen and carbon.

As a method of forming the light-shielding layer of the present invention, it is preferable that the light-shielding layer is formed by a magnetron sputtering method because there are few foreign matters and pinhole defects and light-shielding performance can be easily obtained. In particular, in the case of the magnetron sputtering method, N
A high effect can be obtained by lowering the magnetism of i.

At this time, when obtaining an oxide film, a nitride film, an oxynitride film, and a carbide film, they are prepared by adding an appropriate amount of oxygen, nitrogen, methane, carbon dioxide gas or the like to a sputtering gas. . Specifically, the flow rate of oxygen, nitrogen, methane, carbon dioxide gas, or the like may be changed experimentally so that the light-shielding layer obtains desired performance.

As a method of patterning the light-shielding layer, after a desired resist pattern is formed on the light-shielding layer by photolithography, etching and patterning may be performed using an acidic aqueous solution containing an oxidizing agent. The etchant includes, but is not limited to, an aqueous solution comprising ceric ammonium nitrate and perchloric acid. Thereafter, the resist is dissolved and separated to form a light-shielding layer.

In the present invention, Ni and effective additives, ie, V, Sb, Si, Ge, Mo, W, O
By using a material containing at least one of s, Ir, and Ru as a main component, the magnetism of Ni can be reduced without impairing the excellent characteristics of Ni, and the light shielding layer can be formed by magnetron sputtering. Film formation can be performed efficiently.

A ceric ammonium nitrate and perchloric acid-based etchant used for patterning a conventional chromium-based light-shielding film can be used, and patterning performance equivalent to that of a chromium-based film can be obtained. Further, the same durability as the chromium film system can be obtained in heat resistance and alkali resistance. further,
Since the degree of oxidation, nitridation, and carbonization can be easily controlled, there is also an advantage that reflection suppression performance equivalent to that of a chromium-based film can be easily obtained.

FIG. 4 is a cross-sectional view of a color filter substrate using the substrate with a light-shielding layer of the present invention. 1, 2, and 3, the thickness of the light-shielding layer 2 is extremely thick to explain the light-shielding layer, whereas FIG. 4 shows the relationship between the light-shielding layer 2 and other members. It is described with the thickness reduced.
In FIG. 4, 1 is a substrate, 2 is a light shielding layer, 6 is a color filter layer formed thereon, 7 is an insulating layer thereon, and 8 is an electrode thereon.

The color filter layer 6 may be manufactured by a known color filter manufacturing method, and includes a manufacturing method such as a pigment dispersion method, a printing method, an electrodeposition method, and an ink jet method. In this drawing, the light-shielding layer is formed so as to partially overlap with the light-shielding layer. However, the light-shielding layer may be in close contact with each other, or the color filter layers may be in close contact with each other. Usually, a color filter layer of three colors of RGB is arranged, but it is not limited to this.

The insulating layer 7 on the color filter layer usually also serves as a flattening layer for smoothing the unevenness of the color filter layer. Specifically, resins such as acrylic resin, epoxy resin, silicone resin, polyimide, and polyamide are used. Further, an inorganic film such as SiO ₂ , SiN, or TiO ₂ may be formed on this layer for the purpose of improving the bonding property with the electrode.

The electrode 8 is made of ITO (In ₂ O ₃ --SnO).
₂ ), transparent electrodes such as SnO ₂ and ZnO can be used. Further, when used as a liquid crystal display element, an alignment film such as polyimide or polyamide is applied and dried on the electrode and the insulating layer, and subjected to an alignment treatment by rubbing or the like. In the case of a liquid crystal display element, the color filter substrate formed in this way and a separately manufactured substrate with electrodes are arranged so that the electrode surfaces face each other, and a liquid crystal layer is sandwiched therebetween.

As the liquid crystal layer sandwiched between the electrodes,
Nematic liquid crystals are used for ordinary twisted nematic (TN) type liquid crystal display devices, STN type liquid crystal display devices, and the like. In addition, liquid crystal liquids such as guest-host liquid crystal, cholesteric liquid crystal, and ferroelectric liquid crystal using dichroic dye, solid polymer liquid crystal, and dispersed liquid crystal in which liquid crystal is dispersed in resin matrix Can also be used.

In the above description, an example in which the present invention is used for a liquid crystal display element has been described. However, the substrate with a light shielding layer according to the present invention can be used for other elements with a light shielding layer, especially display elements such as PDP, ELD,
It can also be applied to a flat panel display such as an electrochromic display (ECD).

[0051]

【Example】

Examples 1 to 13 A light-shielding layer having the composition and film configuration shown in Table 1 was formed on a glass substrate ("AN glass" manufactured by Asahi Glass Co., Ltd.). The first layer is a layer on the glass substrate side for suppressing reflection, and is a first layer, a fourth layer, and a seventh layer.
And in Example 13, it is not formed. The second layer is a layer for the purpose of shielding light, and was always formed. In Examples 3, 6, 9, and 11, a third layer was formed for the purpose of improving moisture resistance.

The light shielding layer was formed by magnetron sputtering. As the targets, metal targets mainly containing Ni and effective additives shown in Table 1 were used. The columns of the additives in Tables 1 and 2 show the composition of the target, and the amount of the additives is represented by atomic% with respect to the total amount of Ni and the additives.

"Gas 1" and "Gas 3" are the first
Argon (Ar) during layer sputtering and third layer sputtering
The flow ratio of gas / oxygen gas is shown. The gas “gas 2” at the time of the second layer sputtering was performed under the same conditions of Ar / oxygen = 100/0. “Film 1” and “Film 3” indicate the thicknesses (nm) of the first and third layers, respectively. This is also the second
The film thickness of each layer “film 2” was all set to a constant 100 nm.

When forming the second layer alloy film for the purpose of shading, the film is formed in an atmosphere of 3 mTorr using only argon gas. As shown in the column of the flow ratio of "gas 1", oxygen was added to argon gas, and a film was formed at a total sputtering gas pressure of 3 mTorr. Third
As for the layer, as shown in “Gas 3”, a film was formed using only oxygen gas in an atmosphere of 3 mTorr. The thickness of each film was adjusted by the sputtering power and the film formation time.

In Example 11, a Ni oxide was formed using a Ni target for the first and third layers, and V was added to Ni for the second layer.
This is an example in which a film is formed using a target to which (V) is added at 10 atomic%. As compared with Examples 1 to 10, although the film formation rates of the first and third layers are reduced, the film thicknesses are relatively thin, so the total film formation time for forming the first to third layers is as follows: It wasn't long enough.

Example 12 is a comparative example in which Sb (Sb) was added at 30 atomic% to Ni, in which a reflection suppressing layer was provided as a first layer and a metal light shielding layer was provided as a second layer. Example 13 uses Ni1
This is a comparative example of 00%. Since the cathode magnetic field is trapped due to the ferromagnetic material, the glow discharge cannot be stably maintained and the film forming speed is slow, the film formation was abandoned. Example 14 is a conventional example in which a chromium oxide reflection suppressing layer is provided as a first layer and a chromium layer is provided as a second layer.

The optical characteristics, alkali resistance, acid resistance, moisture resistance, heat resistance, and patterning properties of the substrate with a light-shielding film thus formed were examined. The optical characteristics are initial values, the optical density OD value (the logarithm of the reciprocal of the transmittance), the luminous reflectance Y value, and the reflectance (450 to 6) as the degree of light blocking.
The lowest reflectance (%) in the 50 nm wavelength range was measured. Table 2 shows the results.

The alkali resistance was evaluated at 70 ° C., 5% by weight N
After immersion in an aOH aqueous solution for 30 minutes, the change in the OD value is 0.1%.
It was judged as OK below. In the evaluation of acid resistance, samples without film peeling after immersion in a 5% by weight hydrochloric acid aqueous solution at room temperature for 30 minutes were judged as OK. The moisture resistance evaluation is 60 ° C., 90% R
H, after standing for 24 hours, change in OD value
It was judged as K. The heat resistance was evaluated as OK if the change in the OD value was 0.1 or less and the change in the Y value was 0.5 or less after heating in the air at 250 ° C. for 30 minutes.

The evaluation of the patterning property was performed as follows. A resist is applied to a substrate with a light-shielding layer, and a lattice width of 20 μm and a space portion of 130 ×
A grid-like resist pattern of 300 μm is formed, ceric ammonium nitrate is 165 g, and perchloric acid is 45
Patterning was performed using an etchant consisting of 1,000 ml of water and 1,000 ml of water. Those having a side etching amount of 1.5 μm or less at the pattern edge of the patterned light-shielding layer and having no etching residue were judged as OK.

As a result, the optical characteristics are as shown in Table 2.
Approximately the same performance as the chromium film system of Example 14 conventionally used was obtained. In particular, O which expresses the degree of shading on a log scale
High values were obtained for all D values.

Alkali resistance, acid resistance, moisture resistance, heat resistance,
Regarding the patterning properties, Examples 1 to 1 of the present invention
1 and Conventional Example 14 were OK and had no problem. However, in Example 12, optical characteristics deteriorated after the heat resistance test, and film peeling was observed after the acid resistance test.

As shown in Table 2, in Examples 1 to 11 in which the additive concentration effective for lowering the Curie temperature of Ni is in the range of 3 to 25 atomic% of the total weight of Ni and the effective additive,
It exhibited the same characteristics as the conventional chrome-based light-shielding layer.

Further, when a hot water boiling test is carried out,
In Example 1, Example 2, Example 4, Example 5, Example 7, Example 8, and Example 10 having no layer, a pinhole defect occurred after a 1 hour warm water boiling test, whereas a third layer was provided. In Examples 3, 6, 9, and 11, no change was observed even after the hot water boiling test for 3 hours. As described above, by covering the surface of the second metal light-shielding layer with the metal oxide layer, the durability could be further improved.

[0064]

[Table 1]

[0065]

[Table 2]

[0066]

The substrate with a light-shielding film of the present invention does not use any chromium as the light-shielding layer material for the flat panel display described above. That is, by using a material mainly composed of Ni and an additive effective for lowering the Curie temperature of Ni, a film can be stably formed at a high speed by the magnetron sputtering method.

In particular, V, Sb, Si, Ge, Mo, W,
By using a material containing at least one of Os, Ir, and Ru as a main component, the chromium-based light-shielding layer has the same optical properties, patterning properties, and durability as conventional chromium-based light-shielding layers, In addition, a substrate with a light-shielding film that can be used in the conventional film forming method and patterning method can be easily obtained.

The present invention can be applied to various applications within a range that does not impair the effects of the present invention.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a preferred example of a substrate with a light-shielding layer of the present invention.

FIG. 2 is a sectional view of a substrate with a light-shielding layer of the present invention.

FIG. 3 is a cross-sectional view of another preferred example of the substrate with a light-shielding layer of the present invention.

FIG. 4 is a cross-sectional view of the color filter substrate of the present invention.

[Explanation of symbols]

 1: substrate 2: light shielding layer 3: first layer 4: second layer 5: third layer 6: color filter layer 7: insulating layer 8: electrode

Claims (9)

[Claims] 1. A method for manufacturing a substrate with a light-shielding layer, wherein a nickel (Ni) -based light-shielding layer is formed on the surface of the substrate, wherein the light-shielding layer comprises Ni and an additive effective for lowering the Curie temperature of Ni as main components. A method for producing a substrate with a light-shielding layer, wherein the substrate is formed by a magnetron sputtering method using the material described above. 2. Additives effective for lowering the Curie temperature of Ni include vanadium (V) and antimony (S).
b), silicon (Si), germanium (Ge), molybdenum (Mo), tungsten (W), osmium (O
s), iridium (Ir), and ruthenium (Ru)
The method for producing a substrate with a light-shielding layer according to claim 1, wherein one or more elements selected from the group consisting of: 3. A light-shielding layer to be formed, wherein at least one layer is made of Ni.
2. A layer of an alloy, a nitride of the alloy, an oxide of the alloy, a carbide of the alloy, or a composite thereof, containing, as a main component, an additive effective for lowering the Curie temperature of Ni. Or the manufacturing method of the board | substrate with a light shielding layer of Claim 2. 4. The light-shielding layer has a structure of two or more layers, and a first layer from the base side lowers Ni oxide, Ni nitride, Ni oxynitride, and Curie temperature of Ni and Ni. And a second layer formed on the oxide of an alloy containing an additive effective as a main component, a nitride of the alloy, or an oxynitride of the alloy. 4. The substrate with a light-shielding layer according to claim 1, wherein the substrate is made of an alloy mainly containing an additive effective for lowering, a nitride of the alloy having a lower degree of nitridation than the first layer, or a carbide of the alloy. Manufacturing method. 5. An alloy, wherein the light-shielding layer has a two-layer or three-layer structure and is mainly composed of Ni and an additive effective for lowering the Curie temperature of Ni, a nitride of the alloy, or the alloy. A second layer made of a carbide of the above, and an oxide of Ni or an additive effective for lowering the Curie temperature of Ni and Ni formed on the surface of the second layer opposite to the substrate. 5. The method for producing a substrate with a light-shielding layer according to claim 1, comprising at least a third layer containing an oxide of an alloy as a main component. 6. The light-shielding layer has a structure of two or more layers, and a first layer from the base side lowers Ni oxide, Ni nitride, Ni oxynitride, and the Curie temperature of Ni and Ni. And a second layer formed on the oxide of an alloy containing an additive effective as a main component, a nitride of the alloy, or an oxynitride of the alloy. A substrate with a light-shielding layer, comprising: an alloy mainly containing an additive effective for lowering the content, a nitride of the alloy having a lower degree of nitridation than the first layer, or a carbide of the alloy. 7. An alloy, wherein the light-shielding layer has a two-layer or three-layer structure, and is mainly composed of Ni and an additive effective for lowering the Curie temperature of Ni, a nitride of the alloy, or the alloy. A second layer made of a carbide of the above, and an oxide of Ni or an additive effective for lowering the Curie temperature of Ni and Ni formed on the surface of the second layer opposite to the substrate. 7. The substrate with a light-blocking layer according to claim 6, comprising at least a third layer containing an oxide of an alloy as a main component. 8. A color filter layer is formed on a substrate with a light-shielding layer manufactured by the method of claim 1, 1, 2, 4, or 5, or a substrate with a light-shielding layer according to claim 6 or 7. And a color filter substrate further comprising electrodes formed thereon via an insulating layer. 9. A liquid crystal display element comprising a liquid crystal layer sandwiched between the color filter substrate according to claim 8 and another substrate with electrodes.