JPH11239764A - Electronic part inspection apparatus - Google Patents

Electronic part inspection apparatus

Info

Publication number
JPH11239764A
JPH11239764A JP10044079A JP4407998A JPH11239764A JP H11239764 A JPH11239764 A JP H11239764A JP 10044079 A JP10044079 A JP 10044079A JP 4407998 A JP4407998 A JP 4407998A JP H11239764 A JPH11239764 A JP H11239764A
Authority
JP
Japan
Prior art keywords
electronic component
electronic
index table
insertion guide
electronic part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10044079A
Other languages
Japanese (ja)
Other versions
JP3833809B2 (en
Inventor
Hiroki Arimatsu
宏樹 有松
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP04407998A priority Critical patent/JP3833809B2/en
Publication of JPH11239764A publication Critical patent/JPH11239764A/en
Application granted granted Critical
Publication of JP3833809B2 publication Critical patent/JP3833809B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

PROBLEM TO BE SOLVED: To prevent decrease in productivity of electronic parts in the case a trouble occurs in electronic part insertion operation from an insertion guide part in an electronic part inspection apparatus which judges whether an electronic part satisfies specifications or not and removes defective part. SOLUTION: This electronic part inspection apparatus comprises an index table 40 having a large number of cut grooves 42 capable of housing electronic part one by one and an insertion guide part for carrying out insertion operation of arranging a large number of electronic parts in a row and inserting the parts in the cut grooves 42 one by one. While transporting electron parts inserted in the cut grooves 42 by rotating the index table 40, the apparatus judges whether the electronic parts housed in the cut grooves 42 satisfy a standard or not and removes unsatisfactory ones from the cut grooves 42. In the case a trouble occurs in the electronic part insertion in the insertion guide part, obstacle removing operation including processes of detecting the electron part which is an obstacle of insertion and automatically removing the obstacle electronic part is repeated two or more times.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】この発明は、電子部品検査装
置に関する。
The present invention relates to an electronic component inspection device.

【0002】[0002]

【従来の技術】従来、製造工程が終了したチップ型の電
子部品を、個別的に外形及び電気的な規格等に適合して
いるか否かの良否判別を行い、不良品を排除し、良品の
みを次の包装工程に送る電子部品検査装置があり、同電
子部品検査装置は、多数の切欠溝を形成したインデック
ステーブルと、同切欠溝に電子部品を一個づつ挿入する
挿入ガイド部とを具備して、同切欠溝に挿入された電子
部品を、外形及び電気的な規格等に適合しているか否か
の良否判別を個別的に行い、不良品を排除し、良品のみ
を包装工程に送るようにしている。また、外形的な良否
判別は上記挿入ガイド部と切欠溝とに設けたセンサによ
って行うようにしており、同センサが不良品を検出する
と、挿入ガイド部の間隔を広げて当該不良品をフリーに
し、真空装置に吸引して挿入ガイド部と切欠溝とから除
去するようにしている。
2. Description of the Related Art Conventionally, a chip-type electronic component, whose manufacturing process has been completed, is individually judged as to whether or not it conforms to the external shape and electrical standards. There is an electronic component inspection device that sends an electronic component to the next packaging process, the electronic component inspection device includes an index table having a number of notched grooves, and an insertion guide portion that inserts electronic components one by one into the notched grooves. The electronic components inserted into the notch grooves are individually checked for conformity to the external shape and electrical standards, etc., and defective products are eliminated, and only non-defective products are sent to the packaging process. I have to. In addition, the external quality is determined by sensors provided in the insertion guide portion and the notch groove. When the sensor detects a defective product, the interval between the insertion guide portions is increased to make the defective product free. , And is removed from the insertion guide portion and the notch groove by suctioning to a vacuum device.

【0003】[0003]

【発明が解決しようとする課題】ところが、上記電子部
品が微細であるため、上記真空の影響下にある複数の電
子部品、即ち、当該不良品に後続する20〜30個の未
判別電子部品が、挿入ガイド部のスライドによって排出
口が開いている間に除去され、間隔を狭めるために挿入
ガイド部が復帰する間に、除去途中の電子部品の姿勢が
横向きになったり(図4参照)、斜めなったりすると、
挿入ガイド部が正常な間隔に復帰できず、電子部品が詰
まって切欠溝に挿入できなくなり、作業を中止せざるを
得なくなる。このような不具合を解消するには、手作業
で障害となる電子部品を排除する必要があり、生産性が
低下するばかりでなく、多くの人手を要するという問題
があった。
However, since the electronic component is fine, a plurality of electronic components under the influence of the vacuum, that is, 20 to 30 unidentified electronic components following the defective product, are required. The electronic component is removed while the discharge port is opened by the slide of the insertion guide, and the posture of the electronic component being removed is turned sideways while the insertion guide is returned to reduce the interval (see FIG. 4). When it becomes diagonal,
Since the insertion guide cannot return to the normal interval, the electronic components are clogged and cannot be inserted into the cutout grooves, and the work must be stopped. In order to solve such a problem, it is necessary to manually remove the electronic parts that cause an obstacle, which not only reduces the productivity but also requires a lot of labor.

【0004】[0004]

【課題を解決するための手段】この発明では、電子部品
を一個づつ収納可能の切欠溝を多数形成したインデック
ステーブルと、多数の電子部品を一列に整列させて一個
づつ上記切欠溝に挿入する挿入動作を行う挿入ガイド部
とを具備し、同インデックステーブルの回転により、切
欠溝に収納した電子部品を搬送しながら、この電子部品
が規格に適合しているか否かを判別して、不良品を上記
切欠溝から除去するようにした電子部品検査装置におい
て、挿入ガイド部で、電子部品挿入の障害が発生した場
合は、上記挿入の障害となる電子部品を検出して、自動
的に障害となる電子部品を除去する障害除去動作を繰り
返すことを特徴とする電子部品検査装置を提供せんとす
るものである。
According to the present invention, there is provided an index table in which a number of notch grooves capable of accommodating electronic components one by one are formed, and an insertion in which a number of electronic components are aligned in a line and inserted one by one into the notch grooves. And an insertion guide section for performing an operation.By rotating the index table, while transporting the electronic component stored in the notch groove, it is determined whether or not the electronic component conforms to the standard, and a defective product is determined. In the electronic component inspection device that is removed from the cutout groove, when an electronic component insertion failure occurs in the insertion guide section, the electronic component that interferes with the insertion is detected and automatically becomes a failure. It is an object of the present invention to provide an electronic component inspection apparatus characterized by repeating a failure removing operation for removing an electronic component.

【0005】また、上記障害除去動作の繰り返し回数を
2回以上に設定したことにも特徴を有する。
Another feature is that the number of repetitions of the obstacle removal operation is set to two or more.

【0006】[0006]

【発明の実施の形態】この発明では、製造工程を経た電
子部品は、まずパーツフィーダに投入され、同パーツフ
ィーダで一列に整列させ、挿入ガイド部を介してインデ
ックステーブルの外周に形成した切欠溝に一個づつ挿入
する。この際、割れやメッキカス付着や寸法不揃い等の
外形的な不良品があると、挿入ガイド部の間隔を広げて
不良品をフリーにし、挿入ガイド部のスライドによって
開閉する排出口に連通した真空式の吸引装置によって、
この不良品を挿入ガイド部と切欠溝とから除去して、爾
後の作業に支障のないようにしている。
In the present invention, an electronic component that has undergone a manufacturing process is first put into a parts feeder, aligned in a line with the parts feeder, and formed with a notch groove formed on the outer periphery of an index table via an insertion guide. One by one. At this time, if there are external defects such as cracks, adhesion of plating residue, irregular dimensions, etc., the spacing between the insertion guides is widened to make defective products free, and the vacuum type connected to the discharge port that opens and closes by sliding the insertion guides By the suction device of
The defective product is removed from the insertion guide portion and the cutout groove so that subsequent operations are not hindered.

【0007】しかし、上記電子部品が微細であるため、
上記真空の影響下にある複数の電子部品、即ち、当該不
良品に後続する20〜30個の未判別電子部品が、挿入
ガイド部のスライドによって排出口が開いている間に除
去され、間隔を狭めるために挿入ガイド部がスライドす
る間に、除去途中の電子部品の姿勢が、横向きや斜めに
なって、挿入ガイド部が正常な間隔に復帰できなくなる
状態が、ある程度の確率で発生し、挿入ガイド部に電子
部品が詰まったり、ガイドが不正確になったりして、電
子部品を切欠溝に挿入できなくなり、作業を中止せざる
を得なくなることがある。
However, since the above electronic components are fine,
A plurality of electronic components under the influence of the vacuum, that is, 20 to 30 unidentified electronic components subsequent to the defective product are removed while the outlet is opened by the slide of the insertion guide portion, and the interval is reduced. While the insertion guide slides to make it narrower, the state of the electronic component being removed becomes sideways or oblique, and the insertion guide cannot return to the normal interval with a certain probability. The electronic part may be clogged in the guide portion or the guide may be inaccurate, so that the electronic part cannot be inserted into the cutout groove, and the operation may be forced to be stopped.

【0008】本実施例では、上述した挿入ガイド部の復
帰不可能状態を検出して、前述した不良品排出動作と全
く同一手順の障害除去動作を2回繰り返す間に復帰の障
害となる電子部品を挿入ガイド部から除去されて、挿入
ガイド部が復帰可能になると作業を再開し、障害除去動
作を2回繰り返しても、挿入ガイド部が復帰不可能であ
るときは、装置を停止し、警報を発してオペレータにこ
の旨を報知するようにしている。
In the present embodiment, the above-mentioned state in which the insertion guide portion cannot be returned is detected, and the electronic component which causes a return failure while repeating the failure removing operation in exactly the same procedure as the defective product discharging operation described above is repeated twice. When the insertion guide is removed from the insertion guide and the insertion guide can be returned, the operation is restarted. If the insertion guide cannot be returned even after the obstacle removing operation is repeated twice, the device is stopped and an alarm is issued. To notify the operator of this.

【0009】[0009]

【実施例】この発明の実施例を図面にもとづき詳説す
る。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described in detail with reference to the drawings.

【0010】図1において、Aは製造工程から搬送され
てきた電子部品Tをテーピングするテーピング包装装置
である。Bは電子部品Tを包装したテープの編集を行う
編集装置である。Dは電子部品検査装置であって、テー
ピング包装装置A中に組込まれており、上記完成電子部
品をテーピング包装する前に、予め不良部品を除去し
て、不良品が出荷されないようにしておくものである。
Cは上記各装置A,D の作動を制御するためのコンピュー
タを内蔵した制御装置であり、機台の内部に収納・配設
されている。
In FIG. 1, reference numeral A denotes a taping and packaging apparatus for taping an electronic component T transported from a manufacturing process. B is an editing device for editing a tape wrapping the electronic component T. D is an electronic component inspection device that is incorporated in the taping and packaging device A and that removes defective components in advance before taping and packaging the completed electronic component so that defective products are not shipped. It is.
A control device C has a built-in computer for controlling the operation of each of the devices A and D, and is stored and arranged inside the machine base.

【0011】テーピング包装装置Aは、図1〜図3で示
すように、パーツフィーダ1と、電子部品検査装置Dと
テーピング包装部2とに接続しており、パーツフィーダ
1は中央部に配設したターンテーブル11の周縁に沿って
ギャラリ12を配置し、同ギャラリ12の終端に、搬送溝31
を形成した搬送樋30の始端を接続して、ターンテーブル
11上に投入された多数の電子部品Tを一定姿勢で一列に
整列させて、次工程の電子部品検査装置Dに搬送するよ
うにしている。図1中、13はターンテーブル11に電子部
品Tを供給するためのホッパである。
As shown in FIGS. 1 to 3, the taping and packaging apparatus A is connected to a parts feeder 1, an electronic component inspection apparatus D and a taping and packaging section 2, and the parts feeder 1 is disposed at the center. The gallery 12 is arranged along the periphery of the turntable 11 and the transport groove 31 is provided at the end of the gallery 12.
Connect the start end of the transfer gutter 30 with the
A large number of electronic components T loaded on 11 are arranged in a line in a fixed posture, and are conveyed to an electronic component inspection device D in the next step. In FIG. 1, reference numeral 13 denotes a hopper for supplying an electronic component T to the turntable 11.

【0012】搬送樋30の終端には挿入ガイド部32を連設
して、上記搬送溝31の終端を後述するインデックステー
ブル40の周縁に臨ませている。
An insertion guide portion 32 is connected to the end of the transfer gutter 30 so that the end of the transfer groove 31 faces the periphery of an index table 40 described later.

【0013】インデックステーブル40は、図2及び図3
で示すように、間欠回転するテーブル本体41の周縁部に
電子部品Tを1個だけ収納できる切欠溝42を多数形成
し、同切欠溝42の奥部に真空発生装置(図示せず)に連
通した吸着孔43を開口させて、負圧により切欠溝42中の
電子部品Tを吸着保持するようにしており、インデック
ステーブル40の回転休止時に、同切欠溝42の開口部を前
記搬送溝31に正対させ、搬送溝31からの電子部品Tを切
欠溝42中に収納して、インデックステーブル40の間欠回
転により、同インデックステーブル40の周縁に沿って配
設した各良否判別部50,51 に搬送するようにしている。
The index table 40 is shown in FIGS.
As shown in the figure, a large number of notch grooves 42 for accommodating only one electronic component T are formed in the peripheral portion of the table body 41 which rotates intermittently, and a deep portion of the notch groove 42 communicates with a vacuum generator (not shown). The electronic component T in the notch groove 42 is sucked and held by the negative pressure by opening the suction hole 43 thus formed. When the rotation of the index table 40 is stopped, the opening of the notch groove 42 is inserted into the transport groove 31. The electronic component T from the transport groove 31 is stored in the notch groove 42 and the pass / fail determination sections 50 and 51 disposed along the periphery of the index table 40 by the intermittent rotation of the index table 40. It is transported.

【0014】また、上記挿入ガイド部32の搬送溝31を形
成する終端ガイド壁33の一方を横方向にスライド可能と
し、挿入ガイド部32の底壁に、終端ガイド壁33のスライ
ドにより開閉する不良品吸入孔63を設け、同不良品吸入
孔63を吸入ホース64を介して真空式の不良品回収装置に
接続している。
Further, one of the end guide walls 33 forming the transfer groove 31 of the insertion guide portion 32 is slidable in the horizontal direction, and the bottom wall of the insertion guide portion 32 cannot be opened and closed by the slide of the end guide wall 33. A non-defective product suction hole 63 is provided, and the defective product suction hole 63 is connected to a vacuum type defective product collection device via a suction hose 64.

【0015】そして、インデックステーブル40の切欠溝
42に、割れ、寸法不揃い、メッキカス付着等の外形的不
良品T1が供給されると、該外形的不良品T1や後続の電子
部品Tなどが、終端ガイド壁33とインデックステーブル
40との間に挟まって、インデックステーブル40が回転不
能になることがあり、このような場合には、インデック
ステーブル40の回転を停止させ、吸着孔43の負圧を解除
し、終端ガイド壁33をスライドさせて電子部品Tの挟持
を緩め、不良品吸入孔63を開口し、真空の風圧によっ
て、インデックステーブル40回転の障害となる電子部品
Tを上記切欠溝42と挿入ガイド部32とから除去するとい
う不良品除去動作を行うようにしている。
The notch groove of the index table 40
When an external defective product T1 such as a crack, irregular dimensions, or adhesion of plating residue is supplied to the terminal 42, the external defective product T1 or a subsequent electronic component T is attached to the terminal guide wall 33 and the index table.
In some cases, the index table 40 may not be able to rotate.In such a case, the rotation of the index table 40 is stopped, the negative pressure of the suction hole 43 is released, and the end guide wall 33 is stopped. To loosen the holding of the electronic component T, open the defective product suction hole 63, and remove the electronic component T obstructing the rotation of the index table 40 from the cutout groove 42 and the insertion guide portion 32 by the vacuum wind pressure. Is performed.

【0016】このように、外形的不良品T1の排除が真空
の風圧によって行われるので、ある程度の確率で不良品
除去動作が完璧に行われないことがあり、図4で示すよ
うに、電子部品Tが横向きなる等の原因で、終端ガイド
壁33とインデックステーブル40との間に挟まり、終端ガ
イド壁33が正常なガイド位置に復帰できなくなって作業
が中断することがあり、このような場合、前述した不良
品除去動作と全く同一の障害除去動作を行うだけで、終
端ガイド壁33の復帰阻止状態が、高い確率で解消される
ことが知られている。
As described above, since the externally defective product T1 is eliminated by the wind pressure of the vacuum, the defective product removal operation may not be perfectly performed with a certain probability. As shown in FIG. For example, the T may be interposed between the end guide wall 33 and the index table 40 due to the horizontal orientation, and the end guide wall 33 may not be able to return to the normal guide position, and the work may be interrupted. It is known that the return prevention state of the terminal guide wall 33 is eliminated with a high probability only by performing exactly the same failure removal operation as the above-described defective product removal operation.

【0017】そこで、本実施例では、制御装置C中のコ
ンピュータに、図5のフローチャートで示す障害除去サ
ブルーチンを設定して、電子部品検査装置Dの作動を制
御するようにしている。
Therefore, in this embodiment, a failure removal subroutine shown in the flowchart of FIG. 5 is set in the computer in the control device C to control the operation of the electronic component inspection device D.

【0018】即ち、電子部品検査装置Dの作動を制御す
るメインルーチン中に、終端ガイド壁33の復帰状態を監
視して、終端ガイド壁33の復帰が阻止された場合に、下
記のサブルーチンに移行する条件分岐を設け、復帰阻止
が発生すると(101) 、カウンタをリセットし(102) 、電
子部品検査装置Dの作動を一時停止し(103) 、障害とな
る電子部品T排出のための終端ガイド壁33の開閉を行い
(104) 、終端ガイド壁33の復帰状態を監視して(105) 、
復帰阻止されていれば(105Y)、カウンタをインクリメン
トして(106) 、カウント数が3以下であれば(107Y)、ス
テップ(104) に戻って終端ガイド壁33を開閉させる。
That is, during the main routine for controlling the operation of the electronic component inspection apparatus D, the return state of the terminal guide wall 33 is monitored, and if the return of the terminal guide wall 33 is prevented, the process proceeds to the following subroutine. When the return is prevented (101), the counter is reset (102), the operation of the electronic component inspection device D is temporarily stopped (103), and a terminal guide for discharging the electronic component T which becomes an obstacle is provided. Open and close wall 33
(104), monitor the return state of the end guide wall 33 (105),
If the return is prevented (105Y), the counter is incremented (106), and if the count is 3 or less (107Y), the process returns to step (104) to open and close the end guide wall 33.

【0019】また、(105)のステップで、終端ガイド壁
33の復帰が阻止されていなければ(105N)、電子部品検査
装置Dを起動して(108) 、メインルーチンにリターンす
る。
In the step (105), the terminal guide wall is provided.
If the return of 33 is not prevented (105N), the electronic component inspection apparatus D is started (108), and the process returns to the main routine.

【0020】また、(107) のステップで、カウント数が
3以下でなければ(107N)、電子部品検査装置Dを起動せ
ず、警報を作動させる(109)このように、終端ガイド壁3
3の復帰阻止を常時監視し、復帰阻止が発生した場合
は、終端ガイド壁33復帰の障害となる電子部品を除去
し、終端ガイド壁33の復帰を確認して、正常であれば、
自動的に作業を再開させるようにしているので、生産性
を大幅に高めることができ、しかも、手作業による点検
・修復作業を大幅に省力化できる。
In the step (107), if the counted number is not less than 3 (107N), the electronic component inspection apparatus D is not activated and an alarm is activated (109).
The return inhibition of 3 is constantly monitored, and if the return inhibition occurs, the electronic components that hinder the return of the terminal guide wall 33 are removed, and the return of the terminal guide wall 33 is confirmed.
Since the work is automatically restarted, productivity can be greatly increased, and manual inspection and repair work can be greatly reduced.

【0021】しかも、予め設定した回数(本実施例では
3回)だけ障害除去動作を繰り返しても、挿入ガイド部
32の終端ガイド壁33が復帰できないときは、警報を発し
て装置を停止させるので、前記以外の原因で終端ガイド
壁33が復帰不可能になった場合に、徒に障害除去動作を
繰り返して不具合が拡大するのを防止できる。
Further, even if the fault removing operation is repeated a preset number of times (three times in this embodiment), the insertion guide
When the terminal guide wall 33 of the 32 cannot be returned, an alarm is issued and the device is stopped, so if the terminal guide wall 33 cannot be returned for any reason other than the above, the fault removal operation is repeated and the trouble is removed. Can be prevented from expanding.

【0022】また、図3で示すように、インデックステ
ーブル40の周縁には、インデックステーブル40の回転方
向に従って、第1・第2電気的良否判別部50,51 と、第
1不良品排出部60と、確認部52と、第2不良品排出部61
と、テーピング包装部2の良品排出部21とを配置してお
り、第1・第2電気的良否判別部50,51 で検出した電気
的不良品T2を第1不良品排出部60から排出し、更に確認
部52で検出した電気的不良品T2を第2不良品排出部61か
ら排出して、良品のみを良品排出部21を介し、テーピン
グ包装部2中を走行するテープ22上に落下させ、テーピ
ング包装して編集装置Bに送るようにしている。
As shown in FIG. 3, on the periphery of the index table 40, first and second electrical pass / fail determination sections 50 and 51 and a first defective product discharge section 60 are provided in accordance with the rotation direction of the index table 40. , Confirmation unit 52 and second defective product discharge unit 61
And the non-defective product discharging section 21 of the taping and wrapping section 2, and discharges the electrically defective product T 2 detected by the first and second electrical pass / fail determination sections 50 and 51 from the first defective product discharging section 60. Further, the electrically defective product T2 detected by the confirmation unit 52 is discharged from the second defective product discharge unit 61, and only the non-defective product is dropped onto the tape 22 running through the taping packaging unit 2 via the non-defective product discharge unit 21. , Taping and packaging and sending to the editing device B.

【0023】第1・第2不良品排出部60,61 は、図6及
び図7で示すように、下方向に延出した不良品排出孔65
と、上方の外気に連通した給気孔66とを設けて、同不良
品排出孔65を真空発生装置(図示せず)に連通してお
り、電気的不良品T2が第1・第2不良品排出部60,61 に
さしかかった際に、吸着孔43の負圧を解除すると共に、
不良品排出孔65に負圧を作用させ、給気孔66から流入す
る気流に乗せて、不良品排出孔65を介し、電気的不良品
T2を切欠溝42から下方に排出するという不良品除去動作
を行うようにしている。
As shown in FIGS. 6 and 7, the first and second defective product discharge portions 60 and 61 have defective product discharge holes 65 extending downward.
And an air supply hole 66 communicating with the outside air above, and the defective product discharge hole 65 is communicated with a vacuum generator (not shown), and the electrically defective product T2 is replaced with the first and second defective products. When approaching the discharge sections 60 and 61, the negative pressure of the suction hole 43 is released,
A negative pressure is applied to the defective product discharge hole 65, and the defective product is put on the airflow flowing from the air supply hole 66.
The defective product removing operation of discharging T2 downward from the notch groove 42 is performed.

【0024】[0024]

【発明の効果】本発明によれば次のような効果を得るこ
とができる。
According to the present invention, the following effects can be obtained.

【0025】請求項1記載の発明では、電子部品を一個
づつ収納可能の切欠溝を多数形成したインデックステー
ブルと、多数の電子部品を一列に整列させて一個づつ上
記切欠溝に挿入する挿入動作を行う挿入ガイド部とを具
備し、同インデックステーブルの回転により、切欠溝に
収納した電子部品を搬送しながら、この電子部品が規格
に適合しているか否かを判別して、不良品を上記切欠溝
から除去するようにした電子部品検査装置において、挿
入ガイド部で、電子部品挿入の障害が発生した場合は、
上記挿入の障害となる電子部品を検出して、自動的に障
害となる電子部品を除去する障害除去動作を繰り返すこ
とによって、上記障害の除去に人手を要せず、また、短
時間の休止時間で作業を再開できるので、生産性と省力
かを大幅に向上することができる。
According to the first aspect of the present invention, there is provided an index table in which a plurality of cutout grooves capable of accommodating electronic components one by one are formed, and an insertion operation of aligning a large number of electronic components in a line and inserting one by one into the cutout grooves. And an insertion guide section for carrying out, by rotating the index table, while transporting the electronic component stored in the notch groove, it is determined whether or not this electronic component conforms to the standard, and the defective product is cut out by the notch. In the electronic component inspection device that is to be removed from the groove, if a failure of the electronic component insertion occurs in the insertion guide portion,
Detecting the electronic component that is an obstacle to the insertion, and repeating the obstacle removing operation of automatically removing the electronic component that becomes the obstacle, eliminates the need for human intervention for the removal of the obstacle, and also provides a short pause time. Since the work can be resumed, productivity and labor saving can be greatly improved.

【0026】請求項2記載の発明では、上記障害除去動
作繰り返し回数を2回以上に設定したことよって、前記
以外の原因で終端ガイド壁が復帰不可能になった場合
に、徒に障害除去動作を繰り返して不具合が拡大するの
を防止できる。
According to the second aspect of the present invention, when the number of repetitions of the obstacle removal operation is set to two or more, if the end guide wall cannot be returned due to a cause other than the above, the obstacle removal operation is performed without notice. Can be prevented from increasing the number of defects.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明に係る電子部品検査装置を具備するテー
ピング包装及び編集装置の全体図。
FIG. 1 is an overall view of a taping packaging and editing device including an electronic component inspection device according to the present invention.

【図2】電子部品供給装置の構成を示す斜視説明図。FIG. 2 is a perspective explanatory view showing a configuration of an electronic component supply device.

【図3】インデックステーブル回りの配置を示す平面説
明図。
FIG. 3 is an explanatory plan view showing an arrangement around an index table.

【図4】終端ガイド壁の復帰阻止状態を示す平面説明
図。
FIG. 4 is an explanatory plan view showing a state in which the end guide wall is prevented from returning.

【図5】障害除去動作のフローチャート。FIG. 5 is a flowchart of a failure removal operation.

【図6】インデックステーブル及び第1・第2排出部の
構成を示す一部断面側面図。
FIG. 6 is a partial cross-sectional side view illustrating a configuration of an index table and first and second discharge units.

【図7】インデックステーブル及び第1・第2排出部の
構成を示す一部断面平面図。
FIG. 7 is a partial cross-sectional plan view showing the configuration of an index table and first and second discharge units.

【符号の説明】[Explanation of symbols]

T 電子部品 D 電子部品検査装置 40 インデックステーブル 42 切欠溝 T Electronic component D Electronic component inspection device 40 Index table 42 Notch groove

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 電子部品を一個づつ収納可能の切欠溝を
多数形成したインデックステーブルと、多数の電子部品
を一列に整列させて一個づつ上記切欠溝に挿入する挿入
動作を行う挿入ガイド部とを具備し、同インデックステ
ーブルの回転により、切欠溝に収納した電子部品を搬送
しながら、この電子部品が規格に適合しているか否かを
判別して、不良品を上記切欠溝から除去するようにした
電子部品検査装置において、 挿入ガイド部で、電子部品挿入の障害が発生した場合
は、上記挿入の障害となる電子部品を検出して、自動的
に障害となる電子部品を除去する障害除去動作を繰り返
すことを特徴とする電子部品検査装置。
1. An index table having a plurality of notch grooves capable of accommodating electronic components one by one, and an insertion guide portion for performing an insertion operation of aligning a large number of electronic components in a line and inserting them one by one into the notch grooves. With the rotation of the index table, while transporting the electronic component housed in the notch groove, it is determined whether or not this electronic component conforms to the standard, and defective products are removed from the notch groove. In the electronic component inspection apparatus, when an electronic component insertion failure occurs in the insertion guide section, a failure removal operation of detecting the electronic component that is the above-described insertion failure and automatically removing the electronic component that becomes the failure is performed. An electronic component inspection device characterized by repeating the above.
【請求項2】 上記障害除去動作の繰り返し回数を2回
以上に設定したことを特徴とする請求項1記載の電子部
品検査装置。
2. The electronic component inspection apparatus according to claim 1, wherein the number of repetitions of the obstacle removing operation is set to two or more.
JP04407998A 1998-02-25 1998-02-25 Electronic component inspection equipment Expired - Fee Related JP3833809B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP04407998A JP3833809B2 (en) 1998-02-25 1998-02-25 Electronic component inspection equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP04407998A JP3833809B2 (en) 1998-02-25 1998-02-25 Electronic component inspection equipment

Publications (2)

Publication Number Publication Date
JPH11239764A true JPH11239764A (en) 1999-09-07
JP3833809B2 JP3833809B2 (en) 2006-10-18

Family

ID=12681626

Family Applications (1)

Application Number Title Priority Date Filing Date
JP04407998A Expired - Fee Related JP3833809B2 (en) 1998-02-25 1998-02-25 Electronic component inspection equipment

Country Status (1)

Country Link
JP (1) JP3833809B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104190631A (en) * 2014-08-21 2014-12-10 苏州佳视佳机械科技有限公司 Sequential connecting shackle collection device
CN108267662A (en) * 2018-01-30 2018-07-10 蚌埠市金盾电子有限公司 A kind of charging device of no lead resistance overload detection
CN108279322A (en) * 2018-01-30 2018-07-13 蚌埠市金盾电子有限公司 A kind of resistor fixing device of no lead resistance overload detection

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111632862B (en) * 2020-06-12 2021-12-07 郑州航空工业管理学院 Detection equipment for intelligent manufacturing

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104190631A (en) * 2014-08-21 2014-12-10 苏州佳视佳机械科技有限公司 Sequential connecting shackle collection device
CN108267662A (en) * 2018-01-30 2018-07-10 蚌埠市金盾电子有限公司 A kind of charging device of no lead resistance overload detection
CN108279322A (en) * 2018-01-30 2018-07-13 蚌埠市金盾电子有限公司 A kind of resistor fixing device of no lead resistance overload detection
CN108267662B (en) * 2018-01-30 2019-10-11 蚌埠市金盾电子有限公司 A kind of charging device of no lead resistance overload detection
CN108279322B (en) * 2018-01-30 2019-12-10 蚌埠市金盾电子有限公司 resistor fixing device for lead-free resistor overload detection

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