JPH1123432A - Compression bonding ball forming jig - Google Patents
Compression bonding ball forming jigInfo
- Publication number
- JPH1123432A JPH1123432A JP18273297A JP18273297A JPH1123432A JP H1123432 A JPH1123432 A JP H1123432A JP 18273297 A JP18273297 A JP 18273297A JP 18273297 A JP18273297 A JP 18273297A JP H1123432 A JPH1123432 A JP H1123432A
- Authority
- JP
- Japan
- Prior art keywords
- ball
- jig
- bonding
- compression bonding
- hardness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8512—Aligning
- H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
Landscapes
- Sampling And Sample Adjustment (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Wire Bonding (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、ボンディングワイ
ヤーの先端部に電気放電により形成されたボールを所定
の荷重及び超音波を負荷して潰し、硬度測定用のボール
試料を作成するために用いる治具に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a treatment used to prepare a ball sample for hardness measurement by crushing a ball formed by electric discharge at the tip of a bonding wire by applying a predetermined load and ultrasonic waves. About the tool.
【０００２】[0002]
【従来の技術】従来、ワイヤーボンディング工程で発生
するパッド下クラックに代表されるデバイスの損傷は、
ボンディング時の荷重や超音波による衝撃が主因と考え
られていた。しかし、かかるパッド下クラックの発生頻
度は低かったため、ボンディングワイヤー側からその発
生を抑制する方法の検討はなされていなかった。2. Description of the Related Art Conventionally, device damage typified by cracks under a pad generated in a wire bonding process is as follows.
The main cause was considered to be the load at the time of bonding and the impact due to ultrasonic waves. However, since the frequency of occurrence of such cracks under the pad was low, no method of suppressing the occurrence from the bonding wire side has been studied.
【０００３】ところで、近年の半導体デバイスの高密度
化，高集積度化による多ピン化傾向は、チップ電極や外
部リードの狭ピッチ化，チップ電極と外部リードとの長
距離化へと繋がり、結線用として使用される金細線もよ
り高強度で高硬質のものが要求されてきている。又、半
導体デバイスの高密度化，高集積度化は、電極構造の微
細化や多層化，薄膜化へと繋がり、その結果ボンディン
グ時の荷重や超音波の衝撃を、ボンディングワイヤーの
先端部に形成されるボールのみでは吸収しきれなくなっ
てきている。この結果、パッド下クラックの発生頻度も
高くなってきている。Meanwhile, the recent trend of increasing the number of pins due to the higher density and higher integration of semiconductor devices has led to narrower pitches of chip electrodes and external leads and longer distances between chip electrodes and external leads. Also, gold wires used for applications are required to have higher strength and higher rigidity. In addition, higher density and higher integration of semiconductor devices lead to finer electrode structure, multilayer structure and thinner film. As a result, the load during bonding and the impact of ultrasonic waves are formed at the tip of the bonding wire. It is becoming impossible for the ball to be absorbed alone. As a result, the frequency of occurrence of cracks under the pads has been increasing.
【０００４】このような状況において、パッド下クラッ
クの発生には、ボンディングワイヤーの先端部に形成さ
れたボールの硬度、特に押し潰した状態の圧着ボールの
硬度が大きく寄与していると考えられている。従って、
ボンディングワイヤーの製造に際しても、疑似半導体等
を用いてワイヤーボンディングを行い、圧着されたボー
ルの硬度を知る必要がある。しかし、この目的のために
確立されたボール硬度の測定方法はない。一般には、ボ
ンディングした試料をアルカリ等でエッチング処理して
電極からボールを剥離させ、採集したボールを樹脂に埋
め込み、ボールの接合面を研磨機で鏡面研磨し、この鏡
面研磨面を硬度計を用いて硬度測定している。In such a situation, it is considered that the hardness of the ball formed at the tip of the bonding wire, particularly the hardness of the compressed ball in a crushed state, greatly contributes to the occurrence of the crack under the pad. I have. Therefore,
In the production of a bonding wire, it is necessary to perform wire bonding using a pseudo semiconductor or the like and to know the hardness of the pressed ball. However, there is no established method for measuring ball hardness for this purpose. Generally, the bonded sample is etched with an alkali or the like to separate the ball from the electrode, the collected ball is embedded in a resin, the joint surface of the ball is mirror-polished with a polishing machine, and the mirror-polished surface is measured using a hardness meter. The hardness is measured.
【０００５】しかしながら、このような方法では、非常
に多くの時間と労力を要し、且つボールを研磨するため
にボールの加工度を一定に保つことは困難である。この
ため、測定値がばらつき必ずしも正しい値が得られると
は限らないという問題がある。[0005] However, such a method requires a great deal of time and labor, and it is difficult to maintain a constant degree of processing of the ball in order to polish the ball. For this reason, there is a problem that the measured values vary and a correct value is not always obtained.
【０００６】[0006]
【発明が解決しようとする課題】そこで、上記問題点を
解決するために、本発明は、アルカリエッチング，樹脂
の埋め込み，研磨作業といった煩雑な作業を必要とせ
ず、高精度の硬度測定が可能な圧着ボールを容易に作成
することのできる治具を提供することを目的とする。Therefore, in order to solve the above-mentioned problems, the present invention does not require complicated operations such as alkali etching, resin embedding, and polishing operations, and enables highly accurate hardness measurement. An object of the present invention is to provide a jig capable of easily producing a press-bonded ball.
【０００７】[0007]
【課題を解決するための手段】上記目的を達成するた
め、本発明による圧着ボール作成治具は、ワイヤーボン
ディング工程において、ワイヤーの先端部に電気放電に
より形成されたボールを所定の荷重及び超音波を負荷し
て潰し、硬度測定用のボール試料を作成するための治具
であって、ビッカース硬度が１００以上の鋼材，セラミ
ック又はルビーからなり、前記ボールを圧着する面は表
面粗さが０．１〜０．８μｍの鏡面で形成されているこ
とを特徴とする。尚、本発明の圧着ボール作成治具は、
ボンディング装置のキャピラリー取り付け貫通孔に着脱
可能に取り付けられる。In order to achieve the above-mentioned object, a jig for producing a press-bonded ball according to the present invention is characterized in that, in a wire bonding step, a ball formed by electric discharge at the tip of a wire is subjected to a predetermined load and an ultrasonic wave. Is a jig for preparing a ball sample for measuring hardness by loading the ball, made of steel, ceramic or ruby having a Vickers hardness of 100 or more, and having a surface roughness of 0. It is characterized by being formed with a mirror surface of 1 to 0.8 μm. In addition, the jig for making a press-bonded ball of the present invention
It is detachably attached to the capillary attachment through hole of the bonding device.
【０００８】[0008]
【発明の実施の形態】図１は本発明の圧着ボール作成治
具の構成を示す斜視図である。この圧着ボール作成治具
１は円柱形状の部材を２つ接合して形成されている。特
に、ボールを圧着する面を有する下方部の円柱部材の直
径をキャピラリー貫通孔に挿入する上方部のそれより若
干大きくしてある。しかし、必ずしも治具１の下方部の
円柱部材の直径の方を大きくしなければならないわけで
はなく、上方部と同一直径の円柱状に形成しても何ら差
し支えない。尚、治具１の形状はキャピラリー貫通孔と
の着脱が可能であれば、特に円柱状でなくともよく、例
えば角柱状であっても構わない。DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a perspective view showing the structure of a crimped ball making jig according to the present invention. The jig 1 for forming a press-bonded ball is formed by joining two cylindrical members. In particular, the diameter of the lower cylindrical member having a surface to which the ball is pressed is slightly larger than that of the upper cylindrical member inserted into the capillary through hole. However, the diameter of the cylindrical member at the lower part of the jig 1 does not necessarily have to be larger, and it may be formed in a cylindrical shape having the same diameter as the upper part. Note that the shape of the jig 1 does not need to be particularly columnar as long as it can be attached to and detached from the capillary through-hole, and may be, for example, prismatic.
【０００９】図２（ａ）〜（ｃ）は本発明の圧着ボール
作成治具１を用いて圧着ボールを作成する手順を説明す
るための図である。順に同図（ａ）〜（ｃ）の過程を経
ることにより圧着ボールが作成される。図２（ａ）で
は、ボンディングアーム２のキャピラリー貫通孔３に圧
着ボール作成治具１が取り付けられ、次いで図示しない
ワイヤーボンダーで作成された金ボール４がボンディン
グステージ６のリードフレームアイランド５上にセット
されている様子を示している。尚、このとき、治具１を
強固にキャピラリー貫通孔３に取り付ける必要がある
が、その取り付け方法は特に限定されず、ネジ止めによ
るものであっても他の方法によるものであってもよい。
同図（ｂ）では、金ボール４の中心の位置と前記ワイヤ
ーボンダーのテレビモニターのクロスライン（治具１の
ボール圧着面の中心の位置）とを合わせ、任意の荷重及
び超音波を負荷して一定時間圧着している様子を示して
いる。更に、同図（ｃ）では、圧着ボールが完成し、ボ
ンディングアーム２が所定の位置まで引き上げられた様
子を示している。FIGS. 2 (a) to 2 (c) are views for explaining a procedure for preparing a press-bonded ball using the press-bonded ball forming jig 1 of the present invention. A pressure-bonded ball is prepared by sequentially performing the processes shown in FIGS. In FIG. 2A, a crimping ball making jig 1 is attached to a capillary through hole 3 of a bonding arm 2, and then a gold ball 4 made by a wire bonder (not shown) is set on a lead frame island 5 of a bonding stage 6. It is shown that it is being done. At this time, it is necessary to firmly attach the jig 1 to the capillary through-hole 3, but the attaching method is not particularly limited, and may be a method using a screw or another method.
In FIG. 3B, the center position of the gold ball 4 is aligned with the cross line of the TV monitor of the wire bonder (the center position of the ball pressing surface of the jig 1), and an arbitrary load and ultrasonic wave are applied. This shows a state in which crimping is performed for a certain period of time. Further, FIG. 3C shows a state in which the press-bonded ball is completed and the bonding arm 2 is pulled up to a predetermined position.
【００１０】このように、本発明の圧着ボール作成治具
１をキャピラリー貫通孔３に取り付け、図２（ａ）〜
（ｃ）に基づき説明した手順を経るだけで、金ボール４
は治具１によって直接容易に圧着され、高精度の硬度測
定用試料が作成される。As described above, the jig 1 for producing a press-bonded ball according to the present invention is attached to the capillary through-hole 3, and FIG.
Only through the procedure described based on (c), the gold ball 4
Is easily pressed directly by the jig 1 to prepare a highly accurate hardness measurement sample.
【００１１】ここで、前述のように、本発明の圧着ボー
ル作成治具１はワイヤーボンダーで作成された金ボール
４を直接圧着するため、治具１の材質には金ボール４の
硬度よりも硬いものを選ぶことが必要である。そこで、
本発明の圧着ボール作成治具１には、ビッカース硬度が
１００以上の材質（通常は鋼材）が用いられることが好
ましい。勿論、この治具１の材質は特に鋼材に限定され
るわけではなく、ビッカース硬度が１００以上のものな
らばどのようなものでもよい。例えばセラミックやルビ
ー等を用いてもよい。更に、本発明の圧着ボール作成治
具１を用いて作成された圧着ボールの硬度はかかるボー
ルの表面を直接用いて測定される。従って、治具１の金
ボール４を打ち付ける面は、表面粗さが０．１〜０．８
μｍの鏡面に仕上げることが好ましい。尚、かかる鏡面
の表面粗さが０．１〜０．８μｍの範囲を逸脱するとボ
ール試料の測定精度が劣化する虞がある。Here, as described above, the jig 1 for producing a press-bonded ball of the present invention directly press-bonds the gold ball 4 formed by a wire bonder. It is necessary to choose something hard. Therefore,
It is preferable that a material (normally, a steel material) having a Vickers hardness of 100 or more is used for the jig 1 for producing a press-bonded ball of the present invention. Of course, the material of the jig 1 is not particularly limited to steel, and any material having a Vickers hardness of 100 or more may be used. For example, ceramic or ruby may be used. Further, the hardness of the press-bonded ball prepared by using the press-bonded ball making jig 1 of the present invention is measured by directly using the surface of the ball. Therefore, the surface of the jig 1 on which the gold ball 4 is hit has a surface roughness of 0.1 to 0.8.
It is preferable to make the mirror surface of μm. If the surface roughness of the mirror surface deviates from the range of 0.1 to 0.8 μm, there is a possibility that the measurement accuracy of the ball sample is deteriorated.
【００１２】以下、本発明の実施例を示す。Hereinafter, embodiments of the present invention will be described.
【００１３】実施例 ボールを打ち付ける面の平均表面粗さを０．５μｍとし
たステンレス製の圧着ボール作成治具１（図１参照）と
金合金ワイヤーとを用い、荷重５０ｇ，超音波出力６０
ｍＷ，印加時間０．０１５秒のボンディング条件で圧着
したボールを２０個作成した。次に、得られたボール試
料をリードフレームごと微小硬度計の試料台にセット
し、ボールの平坦部をダイヤモンド圧子で一定時間押し
付け、ビッカース硬度を測定した。この結果は下記表１
に示す通りである。 Example A stainless steel crimped ball making jig 1 (see FIG. 1) having an average surface roughness of 0.5 μm on which a ball is struck was used and a gold alloy wire, and a load of 50 g and an ultrasonic output of 60 were used.
Twenty balls were crimped under the bonding conditions of mW and application time of 0.015 seconds. Next, the obtained ball sample was set on a sample table of a microhardness meter together with the lead frame, and the flat portion of the ball was pressed with a diamond indenter for a certain period of time to measure Vickers hardness. The results are shown in Table 1 below.
As shown in FIG.
【００１４】一方、本発明の効果と対比するため、従来
方法によるボール試料の作成を試みた。ここでは、リー
ドアイランド部にワイヤーボンダーを用いて２０点のボ
ンディングを行い、これをエッチング剥離して樹脂に埋
め込みボール試料を作成した後、ボール試料を鏡面研磨
して研磨面の硬度を測定した。尚、ボンディングの条件
は本発明の圧着ボール作成治具を用いた場合と同様に設
定した。この結果は下記表１に示す通りである。On the other hand, in order to compare with the effect of the present invention, an attempt was made to prepare a ball sample by a conventional method. Here, 20 points of bonding were performed on the lead island portion using a wire bonder, and the bonding was performed by etching and peeling to form a ball sample embedded in resin. Then, the ball sample was mirror-polished to measure the hardness of the polished surface. The bonding conditions were set in the same manner as in the case where the jig for making a press-bonded ball of the present invention was used. The results are as shown in Table 1 below.
【００１５】下記の表１は、本発明の圧着ボール作成治
具を用いて作成したボール試料と従来方法により作成し
たボール試料とにおいて、夫々のボール試料の硬度の測
定結果、試料作成から硬度測定終了までに要した作業時
間を記したものである。Table 1 below shows the results of measuring the hardness of each of the ball samples prepared by using the jig of the present invention and the ball samples prepared by the conventional method. It shows the work time required until the end.
【００１６】 [0016]
【００１７】この表１から、本発明の圧着ボール作成治
具を用いて作成されたボール試料の硬度の標準偏差は従
来方法により作成されたボール試料の約１／２、同様に
最大値Ｍと最小値ｍとの差（Ｍ−ｍ）は約１／３となっ
ている。又、作業に要した時間も本発明の圧着ボール作
成治具を用いれば従来の約１／３となり、格段に短縮さ
れていることが分かる。From Table 1, it can be seen that the standard deviation of the hardness of the ball sample prepared by using the jig of the present invention is about 1/2 of that of the ball sample prepared by the conventional method. The difference (M-m) from the minimum value m is about 1/3. Also, the time required for the operation is reduced to about 1/3 of that of the conventional case using the crimped ball making jig of the present invention, and it can be seen that it is significantly reduced.
【００１８】[0018]
【発明の効果】上述のように、本発明による圧着ボール
作成治具を用いれば、作成されるボール試料の硬度のば
らつきは従来方法により作成されるものに比べ約１／２
に減少し、作業時間も約１／３に短縮され、高精度の硬
度測定用試料が容易に作成できる。As described above, the use of the jig for producing a press-bonded ball according to the present invention makes the variation in hardness of the ball sample to be produced about 1/2 that of the ball produced by the conventional method.
And the working time is also reduced to about 1/3, and a highly accurate hardness measurement sample can be easily prepared.
【図１】本発明による圧着ボール作成治具の斜視図であ
る。FIG. 1 is a perspective view of a jig for producing a press-bonded ball according to the present invention.
【図２】（ａ）〜（ｃ）は本発明の圧着ボール作成治具
を用いた圧着ボール試料を作成する手順を説明するため
の図である。FIGS. 2A to 2C are diagrams for explaining a procedure for preparing a press-bonded ball sample using the press-bonded ball forming jig of the present invention.
１ 圧着ボール作成治具 ２ ボンディングアーム ３ キャピラリー貫通孔 ４ 金ボール ５ リードフレームアイランド ６ ボンディングステージ DESCRIPTION OF SYMBOLS 1 Jig for making crimped ball 2 Bonding arm 3 Capillary through hole 4 Gold ball 5 Lead frame island 6 Bonding stage
Claims (2)
イヤーの先端部に電気放電により形成されたボールを所
定の荷重及び超音波を負荷して潰し、硬度測定用のボー
ル試料を作成するための治具であって、 ビッカース硬度が１００以上の鋼材，セラミック又はル
ビーからなり、前記ボールを圧着する面は表面粗さが
０．１〜０．８μｍの鏡面で形成されていることを特徴
とする圧着ボール作成治具。1. A jig for preparing a ball sample for hardness measurement by crushing a ball formed by electric discharge on a tip portion of a wire by applying a predetermined load and ultrasonic waves in a wire bonding step. A ball or ball made of steel, ceramic or ruby having a Vickers hardness of 100 or more, and a surface to which the ball is pressed is a mirror surface having a surface roughness of 0.1 to 0.8 μm. Utensils.
け貫通孔に着脱可能に取り付けられることを特徴とする
請求項１に記載の圧着ボール作成治具。2. The jig for producing a press-bonded ball according to claim 1, wherein the jig is formed so as to be detachably attached to a capillary attachment through-hole of a bonding apparatus.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18273297A JPH1123432A (en) | 1997-07-08 | 1997-07-08 | Compression bonding ball forming jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18273297A JPH1123432A (en) | 1997-07-08 | 1997-07-08 | Compression bonding ball forming jig |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH1123432A true JPH1123432A (en) | 1999-01-29 |
Family
ID=16123478
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18273297A Pending JPH1123432A (en) | 1997-07-08 | 1997-07-08 | Compression bonding ball forming jig |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH1123432A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6971155B2 (en) * | 2001-06-08 | 2005-12-06 | Alps Electric Co., Ltd. | Method of manufacturing a magnetic head |
-
1997
- 1997-07-08 JP JP18273297A patent/JPH1123432A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6971155B2 (en) * | 2001-06-08 | 2005-12-06 | Alps Electric Co., Ltd. | Method of manufacturing a magnetic head |
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