JPH11233963A - Sealing structure for electronic equipment - Google Patents

Sealing structure for electronic equipment

Info

Publication number
JPH11233963A
JPH11233963A JP4630198A JP4630198A JPH11233963A JP H11233963 A JPH11233963 A JP H11233963A JP 4630198 A JP4630198 A JP 4630198A JP 4630198 A JP4630198 A JP 4630198A JP H11233963 A JPH11233963 A JP H11233963A
Authority
JP
Japan
Prior art keywords
bottom plate
peripheral edge
guide groove
seal structure
groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4630198A
Other languages
Japanese (ja)
Inventor
Tomohiro Fukuhara
智博 福原
Hitoshi Doi
仁 土居
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Omron Corp
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Corp, Omron Tateisi Electronics Co filed Critical Omron Corp
Priority to JP4630198A priority Critical patent/JPH11233963A/en
Publication of JPH11233963A publication Critical patent/JPH11233963A/en
Pending legal-status Critical Current

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  • Casings For Electric Apparatus (AREA)

Abstract

PROBLEM TO BE SOLVED: To quickly and surely seal a bottom plate by providing projections for accelerating shunt at the intersections of guide grooves, which connect a sealing compound storing recessed section at the center of the bottom plate to the peripheral edge, etc., of the bottom plate and the peripheral edge of the bottom plate. SOLUTION: An enclosure 1 of an electromagnetic relay is constituted with a bottom plate 3 inserted into a case 2 and guide grooves 6a-6u which connect a sealing compound storing recessed section 4 at the central part of the bottom plate 3 to the peripheral edge groove 7 of the bottom plate 3, and the peripheries of terminals 5a-5i are provided between the section 4 and groove 7 and terminals 5a-5i. By utilizing guide grooves 6a-6u, a liquid sealing compound is fed to the groove 7 and peripheries of the terminals 5a-5i. Of the intersections of the guide grooves 6a-6u and peripheral edge groove 7, the intersections of the guide grooves 6a, 6d, 6q, etc., and the peripheral edge groove 7 are selected, excepting the intersections at the four corners A1-A4 of the bottom plate 3 and projections 8a-8d are respectively provided to the intersections 9a-9d. Therefore, the airspace at the peripheral edge, etc., of the bottom plate can be sealed quickly.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、底板(ベース)を嵌合
して形成されるケースに必然的に生じた隙間をシール剤
で充填するようにした電気機器のシール構造に係り、特
に毛細管現象を利用することにより、例えば電磁継電器
等の電気機器の底板周縁の隙間を迅速かつ欠陥なくシー
ル剤で充填するようにしたシール技術に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sealing structure for electric equipment in which a gap formed in a case formed by fitting a bottom plate (base) is filled with a sealant, and more particularly to a capillary tube. The present invention relates to a sealing technique that uses a phenomenon to fill a gap around a bottom plate of an electric device such as an electromagnetic relay with a sealing agent quickly and without defects.

【0002】[0002]

【従来の技術】従来のこの種の電気機器のシール構造が
適用される電磁継電器は、一般にリレーを収納するた
め、底板を嵌合して形成されるケースを用いており、ま
た、ケースに嵌合される底板には、リレーに接続された
端子をケース外部へ引き出すために端子突出孔が形成さ
れている。
2. Description of the Related Art A conventional electromagnetic relay to which a sealing structure for an electric device of this kind is applied generally uses a case formed by fitting a bottom plate to accommodate a relay. A terminal protruding hole is formed in the bottom plate to be connected to draw out a terminal connected to the relay to the outside of the case.

【0003】このため、底板周縁並びに底板の端子周り
には厳密な寸法規制を行なっても必然的に微細な隙間が
生じる。
[0003] For this reason, a minute gap is inevitably formed around the periphery of the bottom plate and around the terminals of the bottom plate even if strict size control is performed.

【0004】これらの隙間をシールする従来の一例を図
7に示す。同図に示されるように、電磁継電器の筐体1
01は、ケース102に底板103を嵌合して構成され
る。この構成において、底板103の略中央のシール剤
溜凹部104と底板103の周縁部並びに底板103の
端子突出孔105との間に、それらを結ぶガイド溝10
6を設け、このガイド溝106を利用して、上記のシー
ル剤溜凹部104から底板103の周縁の隙間、並び
に、底板103の端子107周りの隙間へと液状シール
剤を充填するようにしていた。
FIG. 7 shows an example of a conventional technique for sealing these gaps. As shown in FIG.
Reference numeral 01 is formed by fitting a bottom plate 103 to a case 102. In this configuration, a guide groove 10 is provided between the sealant storage recess 104 substantially at the center of the bottom plate 103, the peripheral edge of the bottom plate 103, and the terminal projecting hole 105 of the bottom plate 103.
6, the guide groove 106 is used to fill the gap between the sealant storage recess 104 and the periphery of the bottom plate 103 and the gap around the terminal 107 of the bottom plate 103 with the liquid sealant. .

【0005】この従来方式においては、底板103略中
央のシール剤溜凹部104に液状シール剤を供給すると
同時に、その液状シール剤が流れ込むことになるガイド
溝106では、横断面形状が図8に示されるように平ら
な底面から両端部を直角に立ち上げた凹形状であるた
め、液状シール剤はガイド溝106の底面角部である両
端部(2箇所)にて毛細管現象によりスピードが速くな
る。よってガイド溝106では、液状シール剤の粘性も
相俟ってその両端部での流れに引っ張られるかたちで液
状シール剤全体が流れる。
In this conventional method, the liquid sealing agent is supplied to the sealing agent storage recess 104 substantially at the center of the bottom plate 103, and at the same time, the guide groove 106 into which the liquid sealing agent flows is shown in FIG. As shown in the figure, the liquid sealant has a concave shape in which both ends are raised at a right angle from the flat bottom surface, so that the speed of the liquid sealant is increased at both end portions (two places), which are the corner portions of the bottom surface of the guide groove 106, by capillary action. Therefore, in the guide groove 106, the entire liquid sealing agent flows in a state where the liquid sealing agent is pulled by the flow at both ends thereof due to the viscosity of the liquid sealing agent.

【0006】一方、筐体101は、ケース102と底板
103との嵌合構造であり、一般的に、図9に示される
ように、底板103の周縁部分においてガイド溝106
(底板103)の終端(周縁)とケース102との間に
ガイド溝106に対してほぼ直交される方向に延びる隙
間Xが生じる。このため、図10(a)〜(e)にそれ
ぞれに示されるように、ガイド溝106及び隙間Xによ
りほぼT字形状の流路が形成される。
On the other hand, the housing 101 is a fitting structure of the case 102 and the bottom plate 103, and generally, as shown in FIG.
A gap X is formed between the end (peripheral edge) of the (bottom plate 103) and the case 102 and extends in a direction substantially orthogonal to the guide groove 106. Therefore, as shown in FIGS. 10A to 10E, a substantially T-shaped flow path is formed by the guide groove 106 and the gap X.

【0007】この場合、図10(a)〜(e)の如く液
状シール剤Yの流れの先頭部が順次遷移され、ガイド溝
106の終端部分では液状シール剤Yの流れの先頭部が
カバー102に対し突き当り、次いで向きを変えて隙間
Xに沿って広がる流れとなる。しかし、その突き当って
広がる流れの状態では液状シール剤Yの流れに滞留が生
じるため、この滞留が生じたガイド溝106毎に液状シ
ール剤の流れのスピードが抑制される。
In this case, as shown in FIGS. 10 (a) to 10 (e), the leading portion of the flow of the liquid sealant Y is sequentially shifted, and the leading end of the flow of the liquid sealant Y is located at the end of the guide groove 106. Then, the flow changes direction and spreads along the gap X. However, the flow of the liquid sealant Y is stagnated in the flow state in which it abuts and spreads, so that the flow speed of the liquid sealant is suppressed for each guide groove 106 in which the stagnation occurs.

【0008】[0008]

【発明が解決しようとする課題】このように、従来にお
いては底板の周縁にて液状シール剤Yの流れに滞留が生
じ、この滞留が生じたガイド溝毎に液状シール剤Yの流
れのスピードが抑制されるため、シール剤の硬化特性で
定まる所定時間内に図7における底板103の周縁の隙
間まで液状シール剤Yが満遍なく行亘らなかったり、そ
の所定時間を経過して液状シール剤Yが途中で硬化され
たりする虞れがある。
As described above, in the prior art, the flow of the liquid sealant Y is stagnated at the periphery of the bottom plate, and the flow speed of the liquid sealant Y is reduced for each guide groove where the stagnation occurs. For this reason, the liquid sealant Y does not evenly reach the gap at the periphery of the bottom plate 103 in FIG. 7 within a predetermined time determined by the curing characteristics of the sealant, or the liquid sealant Y There is a risk of being cured in the middle.

【0009】従って、従来の電気機器のシール構造によ
ると、その底板103の周縁の隙間を所望通りにシール
することができないという不具合がしばしば生じた。
Therefore, according to the conventional sealing structure for electric equipment, there often occurs a problem that the gap at the peripheral edge of the bottom plate 103 cannot be sealed as desired.

【0010】本発明は、上記した課題に着目してなされ
たものであり、その目的とするところは、底板の周縁の
隙間を迅速かつ確実にシールすることができる電気機器
のシール構造を提供することにある。
SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a seal structure for electric equipment which can quickly and reliably seal a gap at a peripheral edge of a bottom plate. It is in.

【0011】[0011]

【課題を解決するための手段】この出願の請求項1に記
載の発明は、底板略中央のシール剤溜凹部と底板周縁等
との間を結ぶガイド溝を設け、該ガイド溝を利用して、
前記シール剤溜凹部から前記底板周縁の隙間等へと液状
シール剤を充填するようにした電気機器のシール構造に
おいて、前記ガイド溝と前記底板周縁との交点位置に、
分流促進用突起を、設けたことを特徴とする電気機器の
シール構造にある。
According to the first aspect of the present invention, a guide groove is provided for connecting a sealant storage recess substantially at the center of the bottom plate to the peripheral edge of the bottom plate, and the guide groove is used. ,
In the seal structure of an electric device that is filled with a liquid sealant from the sealant storage recess to a gap or the like on the peripheral edge of the bottom plate, at an intersection point between the guide groove and the peripheral edge of the bottom plate,
The present invention provides a seal structure for electric equipment, wherein a protrusion for diverting flow is provided.

【0012】そして、この出願の請求項1に記載の発明
によれば、液状シール剤は、ガイド溝と底板周縁との交
点位置にて、分流促進用突起により案内されて底板周縁
に沿う2方向へ速やかに分流されるため、確実にその2
方向へ移行される。
According to the invention described in claim 1 of the present application, the liquid sealant is guided by the diversion-promoting protrusions at the intersection of the guide groove and the peripheral edge of the bottom plate, and is guided in two directions along the peripheral edge of the bottom plate. To be diverted quickly to
Moved in the direction.

【0013】このため、シール剤の硬化特性で定まる所
定時間内に、ガイド溝の受け持ち単位毎に、底板周縁の
隙間全てにまで、液状シール剤を満遍なく行亘たらせる
ことができ、底板周縁部分の良好な気密を確保できよ
う。
For this reason, the liquid sealant can be spread evenly over all the gaps of the bottom plate per unit of the guide groove within a predetermined time determined by the curing characteristics of the sealant, and the bottom plate peripheral portion Good airtightness.

【0014】この出願の請求項2に記載の発明は、前記
分流促進用突起は、前記底板周縁との嵌合部分をなすケ
ース内面に設けられることを特徴とする請求項1に記載
の電気機器のシール構造にある。
According to a second aspect of the present invention, in the electric apparatus according to the first aspect, the flow promoting projection is provided on an inner surface of the case forming a fitting portion with the peripheral edge of the bottom plate. Seal structure.

【0015】そして、この出願の請求項2に記載の発明
によれば、ケース作製時に、ガイド溝に軸心が一致され
るように、分流促進用突起をケース内面に設けることが
できるので、ガイド溝と底板周縁との交点位置に、別工
程でその突起を設けることなく、本発明によるシール構
造を構成できよう。
According to the invention as set forth in claim 2 of the present application, when the case is manufactured, the diversion promoting projection can be provided on the inner surface of the case so that the axis of the guide groove coincides with the guide groove. The seal structure according to the present invention could be constructed without providing the projection in a separate step at the intersection of the groove and the peripheral edge of the bottom plate.

【0016】この出願の請求項3に記載の発明は、前記
分流促進用突起を設けた交点位置まで継がるガイド溝
は、前記分流促進用突起の先端部分を囲める位置まで延
出されていることを特徴とする請求項1〜2の何れかに
記載の電気機器のシール構造にある。
In the invention according to claim 3 of the present application, the guide groove extending to the intersection point provided with the flow-promoting protrusion is extended to a position surrounding the tip portion of the flow-promoting protrusion. The seal structure of an electric device according to any one of claims 1 to 2, characterized in that:

【0017】そして、この出願の請求項3に記載の発明
によれば、ガイド溝の延出部分にて突起の先端部分が囲
まれているため、分流促進用突起により案内されて底板
周縁に沿う2方向へ液状シール剤が分流される際、分流
促進用突起の先端部分の周囲で、その分流作用が生じ
る。この状態では、分流促進用突起を設けた交点位置ま
で継がるガイド溝の受け持ち単位毎に、分流促進用突起
の利用効率が高くなるので、液状シール剤の広がりスピ
ードがより速くなる。よって、底板周縁の隙間全てにま
で、液状シール剤を満遍なく行亘たらせるための所要の
リードタイムが短縮されよう。
According to the third aspect of the present invention, since the leading end of the projection is surrounded by the extending portion of the guide groove, the projection is guided by the diversion promoting projection and follows the peripheral edge of the bottom plate. When the liquid sealant is split in two directions, the splitting action occurs around the tip of the splitting promoting protrusion. In this state, the use efficiency of the flow-promoting protrusions is increased for each unit of the guide groove that continues to the intersection point where the flow-promoting protrusions are provided, so that the spreading speed of the liquid sealant is further increased. Therefore, the required lead time for uniformly spreading the liquid sealant to all the gaps on the periphery of the bottom plate will be reduced.

【0018】この出願の請求項4に記載の発明は、前記
分流促進用突起を設けた交点位置は、前記ガイド溝と前
記底板周縁との交点位置が角部となる当該底板角部の交
点位置を除外して、シール剤の硬化特性に応じて選定し
た位置に構成されることを特徴とする請求項1〜3の何
れかに記載の電気機器のシール構造にある。
In the invention described in claim 4 of the present application, the intersection point at which the diversion-promoting projection is provided is an intersection point of the bottom plate corner where the intersection between the guide groove and the bottom plate periphery is a corner. The seal structure of an electric device according to any one of claims 1 to 3, wherein the seal structure is configured at a position selected in accordance with the curing characteristics of the sealant.

【0019】そして、この出願の請求項4に記載の発明
によれば、角部の交点位置では、液状シール剤の広がり
スピードが速くなるように設ける分流促進用突起が無く
ても、液状シール剤の広がりスピードが速くなるため、
底板角部の交点位置を除外して、シール剤の硬化特性に
応じて選定した位置に、分流促進用突起を設けた交点位
置を構成できよう。この構成の場合、シール剤の硬化特
性で定まる所定時間内に、底板周縁の全域に亘る隙間へ
と液状シール剤を満遍なく行亘たらせるために必要とな
る分流促進用突起を設けた交点位置の数を最小限に抑え
ることができ、本発明によるシール構造を構成する際、
工数や作製コスト等の低減を図る観点で有利になるであ
ろう。
According to the invention as set forth in claim 4 of the present application, at the intersection of the corners, even if there is no diversion-promoting projection provided to increase the spreading speed of the liquid sealant, the liquid sealant can be used. Because the spreading speed of the
Except for the position of the intersection of the corners of the bottom plate, the position of the intersection provided with the diversion-promoting protrusion may be configured at a position selected according to the curing characteristics of the sealant. In the case of this configuration, within a predetermined time determined by the curing characteristics of the sealant, the intersection position of the intersection position where the diversion promoting projections necessary for uniformly spreading the liquid sealant to the gap over the entire area of the bottom plate peripheral edge are provided. When configuring the seal structure according to the present invention, the number can be minimized,
This would be advantageous from the viewpoint of reducing man-hours and manufacturing costs.

【0020】[0020]

【発明の実施の形態】以下、本発明が適用された電磁継
電器のシール構造の好ましい実施形態につき、図面に基
づき詳細に説明する。図1は、本発明の適用構造とされ
た電磁継電器の底板面側をシール前状態で示す平面図で
ある。同図において、1は電磁継電器の筐体、2はケー
ス、3は底板、4はシール剤溜凹部、5a〜5iは端
子、6a〜6uはガイド溝、7は底板周縁溝、8a〜8
dは分流促進用の突起、9a〜9dは本発明適用の交点
位置である。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of a seal structure of an electromagnetic relay to which the present invention is applied will be described below in detail with reference to the drawings. FIG. 1 is a plan view showing a bottom plate surface side of an electromagnetic relay having an application structure of the present invention in a state before sealing. In the figure, 1 is a housing of an electromagnetic relay, 2 is a case, 3 is a bottom plate, 4 is a sealant storage recess, 5a to 5i are terminals, 6a to 6u are guide grooves, 7 is a bottom plate peripheral groove, 8a to 8
d is a protrusion for promoting flow splitting, and 9a to 9d are intersection points of the present invention.

【0021】同図に示されるように、電磁継電器の筐体
1は、ケース2に底板3を嵌合して構成される。この構
成において、底板3の略中央のシール剤溜凹部4と底板
周縁溝7並びに端子5a〜5i周りとの間に、それらを
結ぶガイド溝6a〜6uを設け、このガイド溝6a〜6
uを利用して、上記のシール剤溜凹部4から底板周縁溝
7、並びに、端子5a〜5i周りへと液状シール剤を充
填するようにした電磁継電器のシール構造のものであ
る。この点に関しては、従来と実質的に同じである。
As shown in FIG. 1, the housing 1 of the electromagnetic relay is constructed by fitting a bottom plate 3 to a case 2. In this configuration, guide grooves 6a to 6u are provided between the sealant storage recess 4 substantially at the center of the bottom plate 3 and the bottom plate peripheral groove 7 and around the terminals 5a to 5i.
The seal structure of the electromagnetic relay is configured such that a liquid sealant is filled from the sealant reservoir concave portion 4 to the bottom plate peripheral groove 7 and the periphery of the terminals 5a to 5i by utilizing u. In this regard, it is substantially the same as the conventional one.

【0022】本実施形態では、上記基本構成に加えて、
ガイド溝と底板周縁溝7との交点位置のうち、底板角部
A1,A2,A3,A4の交点位置を除外し、シール剤
の硬化特性に応じて、ガイド溝6aと底板周縁溝7との
交点位置9a、ガイド溝6dと底板周縁溝7との交点位
置9b、ガイド溝6qと底板周縁溝7との交点位置9
c、ガイド溝6jと底板周縁溝7との交点位置9dを選
定し、この選定された各交点位置9a,9b,9c,9
dでは、各々突起8a,8b,8c,8dを設けた構成
のものにしている。
In this embodiment, in addition to the above basic configuration,
Of the intersections between the guide groove and the bottom plate peripheral groove 7, the intersections of the bottom plate corners A1, A2, A3, and A4 are excluded, and the guide groove 6a and the bottom plate peripheral groove 7 are formed according to the curing characteristics of the sealant. Intersection position 9a, Intersection position 9b between guide groove 6d and bottom plate peripheral groove 7, Intersection position 9 between guide groove 6q and bottom plate peripheral groove 7
c, an intersection point 9d between the guide groove 6j and the bottom plate peripheral groove 7 is selected, and each of the selected intersection points 9a, 9b, 9c, 9 is selected.
In the case of d, the projections 8a, 8b, 8c, and 8d are provided.

【0023】即ち、本実施形態にあっては、図2
(a),(b)の詳細説明図に示されるように、前記選
定された各交点位置9a〜9dにおいて、底板3の周縁
との嵌合部分をなすケース2の内面には、ガイド溝6
a,6d,6q,6jに軸心を一致させるようにして、
ガイド溝6a,6d,6q,6jよりも幅狭に形成した
突起8a〜8dを、設けている。また、各交点位置9a
〜9dまで継がるガイド溝6a,6d,6q,6jは、
突起8a,8b,8c,8dの先端部分を囲める位置ま
で延出させている。なお、同図(a)は底板を上向き配
置したときの要部上面図、同図(b)はその要部側断面
図である。
That is, in the present embodiment, FIG.
As shown in the detailed explanatory views of (a) and (b), at each of the selected intersection points 9a to 9d, a guide groove 6 is formed on the inner surface of the case 2 forming a fitting portion with the peripheral edge of the bottom plate 3.
a, 6d, 6q, 6j
Protrusions 8a to 8d formed narrower than the guide grooves 6a, 6d, 6q, 6j are provided. In addition, each intersection point 9a
Guide grooves 6a, 6d, 6q, and 6j that continue to
The projections 8a, 8b, 8c, and 8d extend to a position surrounding the distal ends thereof. 1A is a top view of a main part when the bottom plate is arranged upward, and FIG. 1B is a sectional side view of the main part.

【0024】このため、前記選定された各交点位置9a
〜9dにおいては、図3に示されるように、ノズル10
から液状シール剤を吐出させて底板3略中央のシール剤
溜凹部4に液状シール剤が供給され、同時にその液状シ
ール剤がガイド溝6a,6d,6q,6jに流れ込んだ
際、図4(a)〜(e)に示されるように、液状シール
剤Yの流れの先頭部が順次遷移され、ガイド溝6a,6
d,6q,6jの終端から送り出される。この送り出さ
れた液状シール剤Yの流れの先頭部がケース2の内面に
突き当り、次いで向きを変えて底板周縁溝7に沿って広
がる流れとなる。なお、この時点で、端子5a〜5i周
りには液状シール剤が充填された状態となる。
For this reason, each of the selected intersection points 9a
3 to 9d, as shown in FIG.
When the liquid sealing agent is discharged from the bottom plate 3 and the liquid sealing agent is supplied to the sealing agent storage recess 4 substantially at the center of the bottom plate 3, and at the same time, the liquid sealing agent flows into the guide grooves 6a, 6d, 6q, and 6j, FIG. As shown in (e) to (e), the leading part of the flow of the liquid sealant Y is sequentially shifted, and the guide grooves 6a, 6
It is sent from the end of d, 6q, 6j. The head of the flow of the liquid sealant Y that has been sent abuts against the inner surface of the case 2, and then changes direction and becomes a flow that spreads along the bottom plate peripheral groove 7. At this point, the liquid sealant is filled around the terminals 5a to 5i.

【0025】詳しくは、液状シール剤Yの流れの先頭部
が各交点位置9a〜9dまで移動してくると、各交点位
置9a〜9dでは、図4(c)に示されるように、液状
シール剤Yの流れの先頭部がケース2に対し突き当ると
き、各突起8a〜8dにより各々案内されて底板3の周
縁に沿う底板周縁溝7上の2方向へ速やかに分流される
ため、確実にその2方向へ移行される。
More specifically, when the head of the flow of the liquid sealant Y moves to each of the intersection points 9a to 9d, at each of the intersection points 9a to 9d, as shown in FIG. When the head of the flow of the agent Y abuts against the case 2, it is guided by each of the projections 8 a to 8 d and quickly diverted in two directions on the bottom plate peripheral groove 7 along the periphery of the bottom plate 3. The movement is made in the two directions.

【0026】特に、ガイド溝6a,6d,6q,6jの
延出部分6Aにて突起8a〜8dの先端部分が囲まれて
いるため、突起8a〜8dにより案内されて底板周縁に
沿う2方向へ液状シール剤が分流される際、突起8a〜
8dの先端部分の周囲で、その分流作用が生じる。この
状態では、突起8a〜8dを設けた交点位置9a〜9d
まで継がるガイド溝6a,6d,6q,6jの受け持ち
単位毎に、突起の利用効率が高くなるので、液状シール
剤Yの広がりスピードが速くなる。よって、底板周縁の
隙間全てにまで、液状シール剤Yを満遍なく行亘たらせ
るための所要のリードタイムが短縮されることになる。
In particular, since the distal ends of the projections 8a to 8d are surrounded by the extended portions 6A of the guide grooves 6a, 6d, 6q, 6j, the projections 8a to 8d guide the guides 8a to 8d in two directions along the periphery of the bottom plate. When the liquid sealant is divided, the projections 8a to 8a
Around the tip of 8d, the shunt action occurs. In this state, the intersection points 9a to 9d where the projections 8a to 8d are provided
The use efficiency of the projections increases for each of the units of the guide grooves 6a, 6d, 6q, 6j which continue to reach, so that the spreading speed of the liquid sealant Y increases. Therefore, the required lead time for spreading the liquid sealant Y evenly over all the gaps at the periphery of the bottom plate is reduced.

【0027】一方、底板角部A1,A2,A3,A4の
各交点位置では、上記したように液状シール剤の広がり
スピードが速くなるように設ける分流促進用突起が無く
ても、液状シール剤の広がりスピードが速くなる。この
ため、底板角部A1,A2,A3,A4の各交点位置を
除外して、シール剤の硬化特性に応じて選定した底板3
各辺の略中央位置に、突起を設けた各交点位置9a〜9
dが構成されたものにしている。
On the other hand, at the respective intersections of the bottom plate corners A1, A2, A3, and A4, even if there is no diversion-promoting projection provided to increase the spreading speed of the liquid sealant as described above, the liquid sealant can be used. Spreading speed increases. For this reason, the bottom plate 3 selected according to the curing characteristics of the sealant, excluding the intersections of the bottom plate corners A1, A2, A3, and A4.
Each intersection position 9a to 9 provided with a protrusion at a substantially central position of each side.
d is configured.

【0028】この構成の場合、シール剤の硬化特性で定
まる所定時間内に、底板周縁の全域に亘る隙間へと液状
シール剤を満遍なく行亘たらせるために必要となる分流
促進用突起を設けた交点位置の数を最小限に抑えること
ができ、本発明によるシール構造を構成する際、工数や
作製コスト等の低減を図る観点で有利になる。また、ケ
ース作製時に、ガイド溝に軸心が一致されるように、分
流促進用突起をケース内面に設けることができるので、
ガイド溝と底板周縁との交点位置に、別工程でその突起
を設けることなく、本発明によるシール構造を構成でき
る利点もある。
In the case of this configuration, a diversion-promoting projection, which is necessary to spread the liquid sealing agent evenly in the gap over the entire periphery of the bottom plate within a predetermined time determined by the curing characteristics of the sealing agent, is provided. The number of intersection points can be minimized, which is advantageous from the viewpoint of reducing man-hours and manufacturing costs when configuring the seal structure according to the present invention. In addition, at the time of manufacturing the case, a flow-promoting protrusion can be provided on the inner surface of the case so that the axis of the guide groove is aligned with the guide groove.
There is also an advantage that the seal structure according to the present invention can be configured without providing a projection in a separate step at the intersection of the guide groove and the peripheral edge of the bottom plate.

【0029】以上のようにして、端子5a〜5i周り
と、底板周縁溝7とに、液状シール剤が満遍なく行亘た
ると、図5に示されるように、液状シール剤Yが充填さ
れた状態でその液状シール剤Yが硬化され、シールの信
頼性が高い電磁継電器のシール構造が得られる。
As described above, when the liquid sealant uniformly spreads around the terminals 5a to 5i and the bottom plate peripheral groove 7, the liquid sealant Y is filled as shown in FIG. The liquid sealant Y is cured, and a seal structure of the electromagnetic relay with high seal reliability is obtained.

【0030】また、図1に示される底板面側の構成にす
ると共に、例えば、実開昭61ー36938号公報に開
示されている技術、即ち、図6に示されるように、ガイ
ド溝6の底面に、この溝6に沿って延びる例えばV字状
細溝6Bを形成する技術を応用すると、ガイド溝6に対
し角部を増加させて毛細管現象を促進させる効果を発揮
できる。よって、底板周縁の隙間全てにまで、液状シー
ル剤Yを満遍なく行亘たらせるための所要のリードタイ
ムを、更に短縮させること可能になる。
In addition to the configuration on the bottom plate surface side shown in FIG. 1, for example, the technique disclosed in Japanese Utility Model Laid-Open Publication No. 61-36938, that is, as shown in FIG. When a technique of forming, for example, a V-shaped narrow groove 6B extending along the groove 6 on the bottom surface is applied, an effect of increasing a corner portion with respect to the guide groove 6 and promoting a capillary phenomenon can be exerted. Therefore, it is possible to further reduce the required lead time for uniformly spreading the liquid sealant Y to all the gaps around the peripheral edge of the bottom plate.

【0031】また、本発明は電磁継電器以外の電気機器
について、前述の実施形態のようにガイド溝と底板周縁
との交点位置に、ガイド溝に軸心を一致させるようにし
て形成した分流促進用突起を、設けたシール構造とする
ことができる。これらの実施形態については前述の実施
形態と作用及び効果がほぼ同様なので、ここでは説明を
省略する。
Further, according to the present invention, for an electric device other than an electromagnetic relay, a diverting flow promoting device is formed at the intersection of the guide groove and the peripheral edge of the bottom plate such that the axis is aligned with the guide groove as in the above embodiment. The projection may be a seal structure provided. The operation and effects of these embodiments are almost the same as those of the above-described embodiments, and thus description thereof will be omitted.

【0032】[0032]

【発明の効果】以上の説明から明かなように、本発明に
よれば、底板の周縁等の隙間を迅速かつ確実にシールす
ることができる電気機器のシール構造を提供できる。
As is apparent from the above description, according to the present invention, it is possible to provide a seal structure for electric equipment which can quickly and reliably seal a gap such as a peripheral edge of a bottom plate.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の適用構造とされた電磁継電器の底板面
側をシール前状態で示す平面図である。
FIG. 1 is a plan view showing a bottom plate surface side of an electromagnetic relay having an application structure of the present invention in a state before sealing.

【図2】本発明の適用構造の要部をなす交点位置の詳細
説明図である。
FIG. 2 is a detailed explanatory view of an intersection position forming a main part of the application structure of the present invention.

【図3】底板略中央のシール剤溜凹部に液状シール剤を
供給する状態を示す斜視図である。
FIG. 3 is a perspective view showing a state in which a liquid sealant is supplied to a sealant storage recess substantially at the center of a bottom plate.

【図4】本発明の実施形態における液状シール剤の流れ
が遷移される過程を示す図である。
FIG. 4 is a diagram illustrating a process of transition of a flow of a liquid sealant in the embodiment of the present invention.

【図5】本発明の実施形態における電磁継電器のシール
完成状態を示す斜視図である。
FIG. 5 is a perspective view showing a completed state of the seal of the electromagnetic relay according to the embodiment of the present invention.

【図6】底面にV字状細溝を設けたガイド溝の実施形態
を示す横断面図である。
FIG. 6 is a cross-sectional view showing an embodiment of a guide groove provided with a V-shaped narrow groove on the bottom surface.

【図7】従来の電磁継電器のシール構造の構成を示す斜
視図である。
FIG. 7 is a perspective view showing a configuration of a conventional electromagnetic relay seal structure.

【図8】従来のガイド溝を示す横断面図である。FIG. 8 is a cross-sectional view showing a conventional guide groove.

【図9】従来の底板の周縁の構造を示す断面図である。FIG. 9 is a cross-sectional view illustrating a structure of a peripheral edge of a conventional bottom plate.

【図10】従来の液状シール剤の流れが遷移される過程
を示す図である。
FIG. 10 is a view showing a process in which the flow of a conventional liquid sealant is changed.

【符号の説明】[Explanation of symbols]

1 電磁継電器の筐体 2 ケース 3 底板 4 シール剤溜凹部 5a〜5i 端子 6a〜6u ガイド溝 6A ガイド溝の延出部分 7 底板周縁溝 8a〜8d 分流促進用の突起 9a〜9d 本発明適用の交点位置 10 ノズル Y 液状シール剤 DESCRIPTION OF SYMBOLS 1 Case of electromagnetic relay 2 Case 3 Bottom plate 4 Sealant storage recess 5a-5i Terminal 6a-6u Guide groove 6A Extension part of guide groove 7 Bottom plate peripheral groove 8a-8d Projection for diverting promotion 9a-9d The present invention is applied. Intersection position 10 Nozzle Y Liquid sealant

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 底板略中央のシール剤溜凹部と底板周縁
等とを結ぶガイド溝を設け、該ガイド溝を利用して、前
記シール剤溜凹部から前記底板周縁等の隙間へと液状シ
ール剤を充填するようにした電気機器のシール構造にお
いて、 前記ガイド溝と前記底板周縁との交点位置に、分流促進
用突起を、設けたことを特徴とする電気機器のシール構
造。
A guide groove is provided for connecting a seal agent storage recess at a substantially central portion of a bottom plate to a peripheral edge of the bottom plate, and a liquid sealant is formed from the seal agent storage recess to a gap such as the peripheral edge of the bottom plate using the guide groove. A seal structure for an electric device, characterized in that, in a seal structure of an electric device, a flow-promoting protrusion is provided at an intersection of the guide groove and the peripheral edge of the bottom plate.
【請求項2】 前記分流促進用突起は、前記底板周縁と
の嵌合部分をなすケース内面に設けられることを特徴と
する請求項1に記載の電気機器のシール構造。
2. The seal structure for an electric device according to claim 1, wherein the branching promoting projection is provided on an inner surface of the case forming a fitting portion with the peripheral edge of the bottom plate.
【請求項3】 前記分流促進用突起を設けた交点位置ま
で継がるガイド溝は、前記分流促進用突起の先端部分を
囲める位置まで延出されていることを特徴とする請求項
1〜2の何れかに記載の電気機器のシール構造。
3. The method according to claim 1, wherein the guide groove extending to the intersection point where the branching promotion protrusion is provided extends to a position surrounding the tip of the branching promotion protrusion. A seal structure for an electric device according to any one of the above.
【請求項4】 前記分流促進用突起を設けた交点位置
は、前記ガイド溝と前記底板周縁部との交点位置が角部
となる当該底板角部の交点位置を除外して、シール剤の
硬化特性に応じて選定した位置に構成されることを特徴
とする請求項1〜3の何れかに記載の電気機器のシール
構造。
4. An intersecting position of the diversion-promoting protrusions is set except for an intersecting position of the corner of the bottom plate where an intersection of the guide groove and the peripheral edge of the bottom plate is a corner. The seal structure for an electric device according to any one of claims 1 to 3, wherein the seal structure is configured at a position selected according to characteristics.
JP4630198A 1998-02-12 1998-02-12 Sealing structure for electronic equipment Pending JPH11233963A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4630198A JPH11233963A (en) 1998-02-12 1998-02-12 Sealing structure for electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4630198A JPH11233963A (en) 1998-02-12 1998-02-12 Sealing structure for electronic equipment

Publications (1)

Publication Number Publication Date
JPH11233963A true JPH11233963A (en) 1999-08-27

Family

ID=12743389

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4630198A Pending JPH11233963A (en) 1998-02-12 1998-02-12 Sealing structure for electronic equipment

Country Status (1)

Country Link
JP (1) JPH11233963A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020100447A1 (en) * 2018-11-13 2020-05-22 Necプラットフォームズ株式会社 Heat dissipation structure

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020100447A1 (en) * 2018-11-13 2020-05-22 Necプラットフォームズ株式会社 Heat dissipation structure
JP2020080381A (en) * 2018-11-13 2020-05-28 Necプラットフォームズ株式会社 Heat radiation structure
EP3863389A4 (en) * 2018-11-13 2022-06-29 NEC Platforms, Ltd. Heat dissipation structure
US11979993B2 (en) 2018-11-13 2024-05-07 Nec Platforms, Ltd. Heat dissipation structure

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