JPH11233935A - Component-mounting apparatus and method for mounting the component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide with a simple construction a component-mounting apparatus and a method therefor, capable of preventing soldering failures of components with suspect to a substrate. SOLUTION: In a component-mounting apparatus which mounts components with a solder supplied by a solder supplying means, the apparatus comprise a first and a second solder-supplying means and the solder comprises a first solder 300 and a second solder 500, and the first and second solders are supplied by the first and the second solder supplying means, respectively.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting apparatus for mounting a component on a board by soldering and a method for mounting a component on a board by soldering.

[0002]

2. Description of the Related Art Conventionally, components, especially electronic components, etc. have been mounted on a substrate as follows. That is, soldering is performed to mount an electronic component on a substrate. Among the soldering, for example, a reflow soldering method is performed through a process as shown in FIG. 5 (1) -1
Is a substrate on which electronic components are mounted. The substrate 1 is provided with lands 2. Then, in this state, solder, for example, cream solder 3 is placed on the land 2 as shown in FIG. This cream solder 3 is supplied by a printing method.

[0005] Thereafter, as shown in FIG. 5 (3), a surface mount component 4, which is an electronic component having terminals, is mounted on the land 2 of the substrate 1 via the cream solder 3. Then, reflow soldering is performed in this state. That is, in a state where the terminals of the surface mount component 4 are placed on the lands 2 of the substrate 1 via the cream solder 3, the terminals are placed in a heating furnace, infrared ray, laser beam, hot air or a liquid whose boiling point is slightly higher than the solder melting point. Soldering is performed by utilizing heat or the like released when the vapors of the particles coagulate. By soldering in this manner, as shown in FIG. 5D, the terminals of the surface mount component 4 are bonded to the lands 2 of the substrate 1 by the molten cream solder 3, and the component is mounted.

[0004]

FIG. 6 also shows a case in which a component is mounted by soldering as described above. In other words, (1) and (2) of FIG. 6 show a case where the cream solder 3 is placed on the land 2 provided on the substrate 1 by printing in the same manner as described above.
However, in FIG. 6, as shown in (3), since the length of the terminal 4 a of the surface mount component 4 is shorter than the other terminals, the flatness of the terminal becomes larger than the printed thickness of the cream solder 3. . Therefore, if reflow soldering is performed in this state, the terminal 4a is not bonded to the land 2 as shown in FIG.

[0005] Such a terminal floating defect was found in an inspection step after the reflow soldering step, and had to be individually corrected with a soldering iron or the like. In addition, when the soldering of the terminals is not sufficient although the terminal is not lifted, the market is often defective. By the way, in recent years, due to the demand for multifunctional and compact mounting, the use of surface mount components 4 having a small terminal pitch has increased in many cases.
In mounting the surface mount component 4, it is necessary to perform the cream solder 3 more precisely. For this reason, the thickness of the printing screen of the cream solder 3 is more likely to be thinner. As described above, when the thickness of the printing screen is reduced, the flatness of the terminal of the surface mount component 4 is often larger than the printing thickness of the cream solder 3,
For this reason, a floating defect or the like of the terminal is likely to occur.

In view of the above, it is an object of the present invention to provide a component mounting apparatus and a component mounting method capable of preventing a component from being defectively soldered to a substrate with a simple configuration.

[0007]

According to the present invention, there is provided, in accordance with the present invention, a component mounting apparatus for mounting a component on a substrate using solder supplied by solder supplying means, wherein the solder supplying means comprises: It is composed of a solder supply means and a second solder supply means, and the solder is also composed of a first solder and a second solder. The first and second solder supply means respectively This is achieved by a component mounting apparatus to which first and second solders are supplied.

According to the present invention, there is provided a component mounting method for mounting a component on a substrate by using solder supplied by solder supplying means, wherein the first solder supplying means included in the solder supplying means comprises: This can be achieved by a component mounting method in which the second solder is supplied by the second solder supply unit included in the solder supply unit after the first solder is supplied.

According to the above configuration, the first solder is supplied from the first solder supply means to the substrate, and then the second solder is supplied on the first solder.
The components mounted on this substrate can be more reliably joined by soldering.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to FIGS.
Note that the embodiments described below are preferred specific examples of the present invention, and therefore, various technically preferable limitations are added. However, the scope of the present invention particularly limits the present invention in the following description. It is not limited to these embodiments unless otherwise stated.

FIG. 1 is a diagram showing a state in which components are mounted by the first embodiment of the component mounting apparatus and the component mounting method according to the present invention. FIG. 1A is a diagram illustrating a state in which a land 200 that is a portion to be soldered is provided on a substrate 100 on which components are mounted. And
On the land 200, for example, cream solder 300, which is the first solder, is arranged as shown in FIG. The cream solder 300 is printed on the land 200 by a printing method by a cream solder supply unit (not shown), which is a first solder supply unit. Here, this cream solder 3
The thickness of the printing screen of 00 is relatively thin. This corresponds to the terminal 4 of the surface mount component 400 described later.
This is because the pitch of 00a is small.

When the cream solder 300 having a relatively thin printing screen is arranged on the land 200,
As shown in FIG. 1C, a gap may be formed between the surface of the cream solder 300 and the terminal 400a of the surface mount component 400, which is a component such as an IC, a transistor, a resistor, and a capacitor. This is because the solder paste 300 having a relatively thin printing screen is used, and when the flatness of the terminal 400a of the surface mount component 400 is poor, the thickness is insufficient. In such a case, in the component mounting apparatus and the component mounting method according to the present embodiment, the square chip component type solder 500 as the second solder is replaced with the second solder as shown in FIG. The supply unit 700 (see FIG. 3) of the square chip component type solder, which is a supply unit,
It is placed on the cream solder 300. When reflow soldering is performed in a state where the square chip component type solder 500 is placed on the cream solder 300, the square chip component type solder 500 and the cream solder 300 are melted as shown in FIG. The molten solder 600 is formed, and the terminal 400a of the surface mount component 400 and the land 200 are soldered.

Here, the reflow soldering is performed by melting the square chip component type solder 500 and the cream solder 300 by heat or the like supplied by a device (not shown) to form a molten solder 600. Here, the heat includes not only a heating furnace, an infrared ray, a laser beam, and hot air, but also heat that is released when liquid vapor having a boiling point slightly higher than the melting point of the solder aggregates.

FIG. 2 shows a square chip component type solder 500 used in the component mounting apparatus and the component mounting method according to the present embodiment.
FIG. Here, the square chip component type solder 500
Are small square chip components (1005, 0
804, 0603, etc.), for example, a cubic as shown in FIG.
Is 0.6 mm, Y is 0.3 mm, and T is 0.3 mm. By forming the solder into a shape similar to that of the small square chip component, an existing small square chip component supply mechanism can be used as a mechanism for supplying the square chip component type solder.

FIG. 3 is a view showing a square chip component type solder supply unit 700 used in the component mounting apparatus and the component mounting method according to the present embodiment. The supply section 700 of the square chip component type solder is a tape-shaped solder supply section, and as shown in FIG. 3, a plurality of circular feed round holes 710 are provided at equal intervals in a tape-shaped upper portion. The diameter of the circular feed round hole 710 is, for example, 1.5 mm. When the circular feed round hole 710 meshes with a feed device (not shown), the supply portion 700 of the square chip component type solder is fed in the pull-out direction.
Below the circular feed round hole 700, a plurality of square chip component type solder mounting holes 720 for mounting the square chip component type solder 500 are provided at equal intervals. The square chip component type solder mounting hole 720 is, for example, a rectangular opening, and the square chip component type solder 500 is mounted in this opening.

Here, the square chip component type solder 500 has the same shape as the existing small square chip components (1005, 0804, 0603, etc.) mounted on a board or the like as described above. The tape-shaped component supply unit used in the component mounter can be used as it is as the square chip component type solder supply unit 700. Therefore, according to the component mounting apparatus and the component mounting method according to the present embodiment, new equipment is not required to supply the square chip component type solder 500 by the square chip component type solder supply unit 700, and the existing device is not required. The component mounting equipment and mounting method can be used as they are. Further, the solder paste 300 having a relatively thin printing screen is used, and the surface mount component 4 is used.
When the thickness of the cream solder 300 is insufficient when the flatness of the terminal 400a is poor, the square chip component type solder 500 is placed on the cream solder 300 and reflow soldering is performed. Accordingly, the terminals 400a of the surface mount component 400 and the lands 200 are securely soldered. Therefore, after the reflow soldering, the terminal 40
Oa floating failure can be prevented from occurring. Further, occurrence of insufficient solder joint between the terminal 400a and the land 200 can be prevented beforehand. therefore,
The production quality and market quality of the product can be significantly improved.

FIG. 4 is a diagram showing a state in which components are mounted according to the second embodiment of the component mounting apparatus and the component mounting method according to the present invention. In FIG. 4A, a surface mounted component 1400, which is a component already mounted via a land 200, is disposed on the left side of the substrate 100. Then, the substrate 100
The flux 1500 is applied on the land 200 on the right side of FIG. Here, the flux 1500 is intended mainly to reduce the surface oxide of the land 200 and the square chip component type solder 500 to prevent re-oxidation. Then, after the flux 1500 is applied to the land 200, as shown in FIG. 4 (2), the same square chip component type solder 500 as in the first embodiment is placed thereon. The square chip component type solder 500 is supplied from the tape-shaped square chip component type solder supply unit 700 as in the first embodiment.

Thereafter, as shown in FIG. 4C, the portion on which the square chip component type solder 500 is placed is locally heated or the like to form a molten solder 1600, so that the land 200 is precoated with the molten solder 1600. can do. In the component mounting apparatus and the component mounting method according to the present embodiment, the cream solder 300 is
Unlike the first embodiment in which the components are mounted on the surface of the device and the surface mounting component 1400, which is a component already mounted, is used, the square chip component type solder 500 is used. can do. That is, the present embodiment differs from the first embodiment in that the square chip component type solder 500 can be locally melted by heating or the like to form the molten solder 1600. Further, in the component mounting apparatus and the component mounting method according to the present embodiment, when mounting or repairing the component on the substrate 100, a precise amount of the square chip component type solder 500 is applied to a necessary portion on the land 2.
It is also different from the first embodiment in that it can be pre-coated at 00.

In the above-described embodiment, the component mounting apparatus and the component mounting method applied to the reflow soldering and the solder precoat have been described. However, the present invention is not limited to this, and is applicable to other soldering methods. Clearly what you can do.

[0020]

As described above, according to the present invention, it is possible to provide a component mounting apparatus and a component mounting method that can prevent defective soldering of a component to a substrate with a simple configuration.

[Brief description of the drawings]

FIG. 1 is a diagram showing a state in which components are mounted according to a first embodiment of a component mounting apparatus and a component mounting method according to the present invention.

FIG. 2 is a diagram illustrating a square chip component type solder used in the component mounting apparatus and the component mounting method according to the first embodiment.

FIG. 3 is a diagram illustrating a supply unit of square chip component type solder used in the component mounting apparatus and the component mounting method according to the first embodiment.

FIG. 4 is a diagram showing a state in which components are mounted according to a second embodiment of the component mounting apparatus and the component mounting method according to the present invention.

FIG. 5 is a diagram showing a state in which components are mounted by a conventional component mounting apparatus and component mounting method.

FIG. 6 is another diagram showing a state in which components are mounted by a conventional component mounting apparatus and a conventional component mounting method.

[Explanation of symbols]

100 ... substrate, 200 ... land, 300 ...
Cream solder, 400 ・ ・ ・ Surface mount parts, 400a ・
..Terminal, 500 ... Square chip part type solder, 600.
..Molded solder

Claims (8)

[Claims] 1. A component mounting apparatus for mounting a component on a substrate using solder supplied by solder supply means, wherein the solder supply means comprises first solder supply means and second solder supply means. In addition, the solder is also composed of a first solder and a second solder, and the first and second solder supply means supply the first and second solders, respectively. Component mounting equipment. 2. The second solder supply means for a part of the first solder supplied to the substrate from the first solder supply means, which is insufficiently soldered to a terminal of a component to be mounted. The component mounting apparatus according to claim 1, wherein the second solder is configured to supply the second solder. 3. The device according to claim 1, wherein the second solder is a component-type solder, and the second solder supply unit is a tape-shaped solder supply unit on which the component-type solder is mounted. Component mounting equipment. 4. The device according to claim 2, wherein the second solder is a component-type solder, and the second solder supply unit is a tape-shaped solder supply unit on which the component-type solder is mounted. Component mounting equipment. 5. The solder according to claim 1, wherein the first solder is cream solder.
The second solder is a square chip component type solder, and the second solder
5. The component mounting apparatus according to claim 4, wherein the solder supplying means is a tape-shaped solder supplying section on which the square chip component type solder is mounted. 6. A component mounting method for mounting a component on a board by means of solder supplied by solder supply means, comprising: supplying first solder by first solder supply means included in the solder supply means; A component mounting method, wherein a second solder is supplied by a second solder supply unit included in the solder supply unit. 7. A part of the first solder supplied from the first solder supply means to the substrate, which is insufficiently soldered to a terminal of a component to be mounted, and further includes a second solder supply means. 7. The component mounting method according to claim 6, wherein the second solder is supplied by the following method. 8. The solder according to claim 1, wherein the first solder is a cream solder,
The second solder is a square chip component type solder, and the second solder
8. The component mounting method according to claim 7, wherein said solder supplying means is a tape-shaped solder supplying section on which said square chip component type solder is mounted.