JPH11233811A - Photocoupler and its manufacture - Google Patents
Photocoupler and its manufactureInfo
- Publication number
- JPH11233811A JPH11233811A JP3344198A JP3344198A JPH11233811A JP H11233811 A JPH11233811 A JP H11233811A JP 3344198 A JP3344198 A JP 3344198A JP 3344198 A JP3344198 A JP 3344198A JP H11233811 A JPH11233811 A JP H11233811A
- Authority
- JP
- Japan
- Prior art keywords
- light
- optical coupling
- epoxy resin
- emitting element
- coupling device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、モールド樹脂によ
り被覆されて成る光結合装置（フォトカプラ）及びその
製造方法に関し、特にリフロー等の加熱処理により光伝
達効率変動等の特性劣化を抑えることができる光結合装
置及びその製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical coupling device (photocoupler) coated with a mold resin and a method of manufacturing the same, and more particularly, to suppressing deterioration of characteristics such as light transmission efficiency fluctuation by heat treatment such as reflow. The present invention relates to a possible optical coupling device and a manufacturing method thereof.
【０００２】[0002]
【従来の技術】従来の光結合装置としては、例えば、発
光素子と受光素子の間を透明シリコーン樹脂で封止し、
その周辺を遮光用の不透明エポキシ樹脂でトランスファ
ーモールドするものがあった。2. Description of the Related Art As a conventional optical coupling device, for example, a space between a light emitting element and a light receiving element is sealed with a transparent silicone resin.
In some cases, the periphery is transfer-molded with a light-shielding opaque epoxy resin.
【０００３】その製造方法としては、発光素子（ＡｌＡ
ｓ発光ダイオード等）と受光素子（Ｓｉフォトトランジ
スタ等）を、それぞれＡｇペーストにて金属製のリード
フレームに接続し、また、素子の電極部とリードフレー
ムとをＡｕワイヤーにて接続する。As a manufacturing method, a light emitting device (AlA
The light emitting diode (s) and the light receiving element (Si phototransistor and the like) are each connected to a metal lead frame with an Ag paste, and the electrode part of the element and the lead frame are connected with an Au wire.
【０００４】ここで、従来の光結合装置について、その
要部断面図を示す図６，７を用いて、より詳細に説明す
る。なお、図６のものは平面搭載型タイプと呼ばれるも
のであり、図７のものは対向型タイプと呼ばれるもので
ある。Here, a conventional optical coupling device will be described in more detail with reference to FIGS. 6 is called a planar mounting type, and FIG. 7 is called a facing type.
【０００５】図６に示す平面搭載型タイプのものでは、
まず、前述のとおり、Ａｕワイヤー４等を用いてリード
フレーム１に、発光素子２と受光素子３を接続する。そ
して、リードフレーム１に接続された発光素子２と受光
素子３を絶縁シート１０上の平面に配置し、これらを透
明シリコーン樹脂にて封止して光結合部１５（光結合
路）を形成する。その後、金型を用いたトランスファー
モールド成形により、遮光用エポキシモールド樹脂７に
よる封止を行った後に、外部リードフレームの形状加工
を施し、装置の作製を完了する。[0005] In the planar mounting type shown in FIG.
First, as described above, the light emitting element 2 and the light receiving element 3 are connected to the lead frame 1 using the Au wire 4 or the like. Then, the light emitting element 2 and the light receiving element 3 connected to the lead frame 1 are arranged on a plane on the insulating sheet 10, and these are sealed with a transparent silicone resin to form an optical coupling portion 15 (optical coupling path). . Then, after encapsulating with the light-shielding epoxy mold resin 7 by transfer molding using a mold, the external lead frame is subjected to shape processing to complete the fabrication of the device.
【０００６】また、図７に示す対向型タイプのもので
は、まず、前述のとおり、Ａｕワイヤー４等を用いてリ
ードフレーム１に、発光素子２と受光素子３を接続す
る。そして、リードフレーム１に接続された発光素子２
と受光素子３を対向して配置し、これらを透明シリコー
ン樹脂にて封止して光結合部６（光結合路）を形成す
る。その後、金型を用いたトランスファーモールド成形
により、遮光用エポキシモールド樹脂７による封止を行
った後に、外部リードフレームの形状加工を施し、装置
の作製を完了する。In the facing type shown in FIG. 7, first, as described above, the light emitting element 2 and the light receiving element 3 are connected to the lead frame 1 using the Au wire 4 or the like. Then, the light emitting element 2 connected to the lead frame 1
And the light receiving element 3 are arranged to face each other, and these are sealed with a transparent silicone resin to form an optical coupling portion 6 (optical coupling path). Then, after encapsulating with the light-shielding epoxy mold resin 7 by transfer molding using a mold, the external lead frame is subjected to shape processing to complete the fabrication of the device.
【０００７】[0007]
【発明が解決しようとする課題】上記の従来の光結合装
置では、発光素子２と受光素子３との間を透明シリコー
ン樹脂でドッキング（光結合パス）を施した後（光結合
部１５形成後）、その周辺を遮光用エポキシモールド樹
脂７でトランスファーモールドした構造であり、光結合
部１５のシリコーン樹脂とエポキシ樹脂７との密着部で
の反射を利用して光伝達効率を高めるというものであ
る。In the above-mentioned conventional optical coupling device, after the light emitting element 2 and the light receiving element 3 are docked (optical coupling path) with a transparent silicone resin (after the optical coupling section 15 is formed). ), And a structure in which the periphery thereof is transfer-molded with a light-shielding epoxy mold resin 7 to enhance light transmission efficiency by utilizing reflection at a contact portion between the silicone resin and the epoxy resin 7 of the optical coupling portion 15. .
【０００８】しかしながら、後工程でリフロー等の加熱
処理が行われると、そのときの熱によりシリコーン樹脂
とエポキシ樹脂との密着部の状態が変化し、光伝達効率
が変動（劣化）してしまうという問題があった。However, if heat treatment such as reflow is performed in a later step, the heat at that time changes the state of the contact portion between the silicone resin and the epoxy resin, and the light transmission efficiency fluctuates (deteriorates). There was a problem.
【０００９】本発明は、上記のような課題を解決するた
めになされたものであって、光結合装置（フォトカプ
ラ）の製造工程におけるリフロー等の加熱処理の熱によ
る光伝達効率の変動（劣化）を大幅に低減させて、高性
能化を実現できる光結合装置及びその製造方法を提供す
ることを目的とする。SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and has been made in order to solve the above-mentioned problems. It is an object of the present invention to provide an optical coupling device and a method for manufacturing the same, which are capable of realizing high performance by greatly reducing the above.
【００１０】[0010]
【課題を解決するための手段】上記課題を解決するため
に、請求項１に記載の発明では、電気信号を光信号に変
換する発光素子と、その光信号を電気信号に変換する受
光素子と、発光素子と受光素子との間の光路を含む光結
合部と、発光素子、受光素子、及び光結合部を被覆する
遮光用モールド樹脂とを備えた光結合装置において、光
結合部が透光性エポキシ樹脂から成り、その光結合部を
成す透光性エポキシ樹脂表面を変質させて構成してい
る。According to the first aspect of the present invention, there is provided a light emitting element for converting an electric signal into an optical signal, and a light receiving element for converting the optical signal into an electric signal. A light coupling unit including an optical path including an optical path between the light emitting element and the light receiving element; and a light shielding mold resin covering the light emitting element, the light receiving element, and the light coupling part. It is made of a transparent epoxy resin, and the surface of the translucent epoxy resin forming the optical coupling portion is modified.
【００１１】請求項１に記載の発明によれば、光結合部
を成す透光性エポキシ樹脂表面を変質させているので、
製造工程におけるリフロー等の加熱処理の熱によって、
光結合部の樹脂材料と遮光用モールド樹脂との密着部に
おける状態変化を防止することができ、従来発生してい
た光伝達効率の変動（劣化）を大幅に低減することが可
能となる。According to the first aspect of the present invention, since the surface of the translucent epoxy resin forming the optical coupling portion is altered,
By the heat of heat treatment such as reflow in the manufacturing process,
It is possible to prevent a state change in a close contact portion between the resin material of the optical coupling portion and the light shielding mold resin, and it is possible to greatly reduce a change (deterioration) in light transmission efficiency which has conventionally occurred.
【００１２】さらに、請求項２に記載の発明では、請求
項１に記載の光結合装置において、光結合部の断面形状
が略楕円形状、略台形形状、又は略三角形形状であり、
平面搭載型タイプであることとしてる。Furthermore, in the invention according to claim 2, in the optical coupling device according to claim 1, the cross-sectional shape of the optical coupling portion is substantially elliptical, substantially trapezoidal, or substantially triangular.
It is a flat-mount type.
【００１３】請求項２に記載の発明によれば、光結合部
の形状が様々な平面搭載型タイプの光結合装置において
も、従来発生していた光伝達効率の変動（劣化）を大幅
に低減することが可能となる。According to the second aspect of the present invention, the fluctuation (deterioration) of the light transmission efficiency, which has conventionally occurred, can be greatly reduced even in a planar mounting type optical coupling device having various optical coupling portions. It is possible to do.
【００１４】また、請求項３に記載の発明では、光結合
部の形状が略球形形状又は略直方体形状であり、対向型
タイプであることとしている。According to the third aspect of the present invention, the shape of the optical coupling portion is a substantially spherical shape or a substantially rectangular parallelepiped shape, and is of a facing type.
【００１５】請求項３に記載の発明によれば、光結合部
の形状が様々な対向型タイプの光結合装置においても、
従来発生していた光伝達効率の変動（劣化）を大幅に低
減することが可能となる。According to the third aspect of the present invention, even in a facing type optical coupling device having various optical coupling portions,
Fluctuations (deterioration) in light transmission efficiency, which have conventionally occurred, can be greatly reduced.
【００１６】また、請求項４に記載の発明では、電気信
号を光信号に変換する発光素子と、その光信号を電気信
号に変換する受光素子と、発光素子と受光素子との間の
光路を含む光結合部と、発光素子、受光素子、及び光結
合部を被覆する遮光用モールド樹脂とを備えた光結合装
置の製造方法において、発光素子と受光素子とが光結合
するようにこれらを配置して透光性エポキシ樹脂により
被覆して光結合部を形成し、その光結合部を成す透光性
エポキシ樹脂の表面を変質させた後に、その表面を遮光
用モールド樹脂により封止することとしている。Further, according to the present invention, a light emitting element for converting an electric signal into an optical signal, a light receiving element for converting the optical signal into an electric signal, and an optical path between the light emitting element and the light receiving element are provided. In a method of manufacturing an optical coupling device including a light coupling section, a light emitting element, a light receiving element, and a light-shielding mold resin covering the optical coupling section, these are arranged so that the light emitting element and the light receiving element are optically coupled. After forming an optical coupling part by covering with a translucent epoxy resin, modifying the surface of the translucent epoxy resin forming the optical coupling part, and sealing the surface with a light shielding mold resin I have.
【００１７】請求項４に記載の発明によれば、光結合部
を成す透光性エポキシ樹脂の表面を変質させているの
で、製造工程におけるリフロー等の加熱処理の熱によっ
て、光結合部の樹脂材料と遮光用モールド樹脂との密着
部における状態変化を防止することができ、従来発生し
ていた光伝達効率の変動（劣化）を大幅に低減すること
が可能となる。According to the fourth aspect of the present invention, since the surface of the translucent epoxy resin forming the optical coupling portion is altered, the resin of the optical coupling portion is heated by heat such as reflow in the manufacturing process. It is possible to prevent a state change in a contact portion between the material and the light-shielding mold resin, and it is possible to greatly reduce a change (deterioration) in light transmission efficiency which has conventionally occurred.
【００１８】さらに、請求項５に記載の発明では、請求
項４に記載の光結合装置の製造方法において、光結合部
を成す透光性エポキシ樹脂の表面を変質させるのに、そ
の透光性エポキシ樹脂に紫外線硬化性樹脂成分を含有さ
せ、紫外線照射によりその表面を変質させることとして
いる。According to a fifth aspect of the present invention, in the method for manufacturing an optical coupling device according to the fourth aspect, when the surface of the light-transmitting epoxy resin forming the light-coupling portion is deteriorated, the light-transmitting epoxy resin is used. The epoxy resin contains an ultraviolet curable resin component, and its surface is modified by irradiation with ultraviolet light.
【００１９】請求項５に記載の発明によれば、光結合部
を成す透光性エポキシ樹脂の表面を変質させるのに、そ
の透光性エポキシ樹脂に紫外線硬化性樹脂成分を含有さ
せ、紫外線照射によりその表面を変質させるようにして
いるので、紫外線照射という製造プロセス上容易な工程
により、請求項４に記載の光結合装置の製造方法を実現
できる。According to the fifth aspect of the present invention, in order to alter the surface of the translucent epoxy resin forming the optical coupling portion, the translucent epoxy resin contains an ultraviolet curable resin component and is irradiated with ultraviolet light. Thus, the surface of the optical coupling device can be modified by a simple process of ultraviolet irradiation, which is an easy process in the production process.
【００２０】[0020]
【発明の実施の形態】以下、本発明の実施の形態につい
て、図面を参照して説明する。なお、以下の説明におい
て、前述の従来技術と同じ構成には、同一符号を用い
る。 〔第１の実施形態〕まず、第１の実施形態として、光結
合部の断面形状を略楕円形状とした平面搭載型タイプの
光結合装置について、図１を用いて説明する。Embodiments of the present invention will be described below with reference to the drawings. In the following description, the same reference numerals are used for the same components as those of the above-described conventional technology. First Embodiment First, as a first embodiment, a planar mounting type optical coupling device in which a cross-sectional shape of an optical coupling portion is substantially elliptical will be described with reference to FIG.
【００２１】図１に示すように、本実施形態の光結合装
置は、それぞれＡｕワイヤー４によりリードフレーム１
に接続された発光素子２及び受光素子３と、それらの光
路を構成し透光性エポキシ樹脂から成る光結合部５と、
その表面を封止するように全体を被覆する遮光用モール
ド樹脂７とから構成される。なお、本実施形態は、平面
搭載型タイプで、光結合部５の断面形状を略楕円形状と
したものである。As shown in FIG. 1, the optical coupling device according to the present embodiment has a lead frame 1 with Au wires 4 respectively.
A light-emitting element 2 and a light-receiving element 3 connected to the light-emitting element, an optical coupling section 5 that forms an optical path of the light-emitting element 2 and the light-transmitting epoxy resin,
And a light-shielding mold resin 7 covering the entire surface so as to seal the surface. In the present embodiment, the cross-sectional shape of the optical coupling unit 5 is a substantially elliptical shape in a planar mounting type.
【００２２】次に、本実施形態の光結合装置の製造方法
について説明する。まず、Ａｕワイヤー４を用いてリー
ドフレーム１に、発光素子２と受光素子３のワイヤーボ
ンドを施す。そして、リードフレーム１に接続された発
光素子２と受光素子３を平面に配置し、これらを透光性
のエポキシ樹脂を用いて、その断面が略楕円形状となる
ようにトランスファーモールド成形を行って、光結合部
５を形成する。Next, a method of manufacturing the optical coupling device according to the present embodiment will be described. First, wire bonding between the light emitting element 2 and the light receiving element 3 is performed on the lead frame 1 using the Au wire 4. Then, the light emitting element 2 and the light receiving element 3 connected to the lead frame 1 are arranged on a plane, and these are subjected to transfer molding using a translucent epoxy resin so that the cross section thereof becomes substantially elliptical. , The optical coupling part 5 is formed.
【００２３】その後、この光結合部５を成す透光性エポ
キシ樹脂の表面層６を変質させる。本実施形態では、光
結合部５を成す透光性エポキシ樹脂にＴｉＯ2を含む紫
外線硬化樹脂成分を含有させ、紫外線を外部から照射し
た。すると、エポキシ樹脂表面層６が変質して、その表
面のみ白濁したような白色への変色が観察された。Thereafter, the surface layer 6 of the translucent epoxy resin forming the optical coupling portion 5 is altered. In the present embodiment, the translucent epoxy resin forming the optical coupling portion 5 contains an ultraviolet curable resin component containing TiO 2 , and is irradiated with ultraviolet light from the outside. As a result, the epoxy resin surface layer 6 was deteriorated, and discoloration to white such that only the surface became cloudy was observed.
【００２４】そして、これらを覆う遮光用モールド樹脂
７として不透明エポキシ樹脂を用いて、トランスファー
モールド成形を行った後、外部リードフレームの形状加
工を行い、本実施形態の光結合装置の製造を完了する。Then, transfer molding is performed using an opaque epoxy resin as the light-shielding mold resin 7 covering these, and then the external lead frame is shaped to complete the manufacture of the optical coupling device of the present embodiment. .
【００２５】本実施形態によれば、光結合部５を成す透
光性エポキシ樹脂の表面層６に紫外線を外部から照射す
ることによって、その表面層６を変質させたので、後工
程としてリフロー等の加熱処理を施しても、光結合部５
の透光性エポキシ樹脂と遮光用モールド樹脂７の不透明
エポキシ樹脂との密着部分で状態変化が起こることがな
かった。これにより、発光素子２からの光を、透光性エ
ポキシ樹脂の表面層６で安定して反射し、受光素子３に
て受光することができ、光伝送効率の変動（劣化）を防
止することが可能となった。According to the present embodiment, the surface layer 6 of the translucent epoxy resin forming the optical coupling portion 5 is irradiated with ultraviolet rays from the outside to alter the surface layer 6, so that a reflow process or the like is performed as a post-process. Even when the heat treatment of
No state change occurred at the contact portion between the transparent epoxy resin and the opaque epoxy resin of the light shielding mold resin 7. Thereby, the light from the light emitting element 2 can be stably reflected on the surface layer 6 of the translucent epoxy resin and can be received by the light receiving element 3, thereby preventing the fluctuation (deterioration) of the light transmission efficiency. Became possible.
【００２６】なお、上記実施形態では、光結合部５を成
す透光性エポキシ樹脂を変質させるのに、ＴｉＯ2を含
む紫外線硬化樹脂成分を含有さて、紫外線を外部から照
射したが、本発明がこれに限定されるものではない。こ
れ以外に、例えば、透光性エポキシ樹脂にＴｉを含有さ
せ、高温で熱処理することにより、含有されたＴｉが酸
化されてＴｉＯ2として、その表面を変質（白色に変
色）させるなど、上記実施形態と同様に、光結合部の樹
脂と遮光性モールド樹脂との樹脂界面での状態変化を防
止できるものであればよい。In the above embodiment, an ultraviolet curing resin component containing TiO 2 is contained and UV light is irradiated from the outside to alter the light-transmitting epoxy resin forming the optical coupling portion 5. It is not limited to this. In addition to the above, for example, the translucent epoxy resin contains Ti and is heat-treated at a high temperature to oxidize the contained Ti to form TiO 2 and alter its surface (discolor to white). As in the case of the embodiment, any material can be used as long as it can prevent a state change at the resin interface between the resin of the optical coupling portion and the light-shielding mold resin.
【００２７】〔第２の実施形態〕第２の実施形態とし
て、光結合部の断面形状を略台形形状とした平面搭載型
タイプの光結合装置について、図２を用いて説明する。[Second Embodiment] As a second embodiment, a planar mounting type optical coupling device in which the cross-sectional shape of the optical coupling portion is substantially trapezoidal will be described with reference to FIG.
【００２８】図２に示すように、第２の実施形態の光結
合装置が上記第１の実施形態と異なる点は、光結合部５
の断面形状を略台形形状としただけで、その他は上記第
１の実施形態と同様のものである。As shown in FIG. 2, the optical coupling device of the second embodiment is different from that of the first embodiment in that
Are the same as those in the first embodiment except that the cross-sectional shape of the first embodiment is substantially trapezoidal.
【００２９】第２の実施形態の光結合装置の製造方法に
ついても、上記第１の実施形態と異なる点は、光結合部
５形成時に、断面形状が略楕円形状となるようにトラン
スファーモールド成形を行っただけであり、その他は上
記第１の実施形態と同様のものである。The method of manufacturing the optical coupling device of the second embodiment is different from that of the first embodiment in that transfer molding is performed so that the cross-sectional shape becomes substantially elliptical when the optical coupling portion 5 is formed. The other steps are the same as those of the first embodiment.
【００３０】本実施形態によっても、上記第１の実施形
態と同様に、光結合部５を成す透光性エポキシ樹脂の表
面層６に紫外線を外部から照射することによって、その
表面層６における反射特性が変化し、後工程としてリフ
ロー等の加熱処理を施しても、光結合部５の透光性エポ
キシ樹脂と遮光用モールド樹脂７の不透明エポキシ樹脂
との密着部分で状態変化が起こることがなかった。これ
により、発光素子２からの光を、透光性エポキシ樹脂の
表面層６で安定して反射し、受光素子３にて受光するこ
とができ、光伝送効率の変動（劣化）を防止することが
可能となった。Also in this embodiment, as in the first embodiment, the surface layer 6 of the translucent epoxy resin forming the optical coupling portion 5 is irradiated with ultraviolet rays from the outside, so that the reflection on the surface layer 6 is achieved. Even if the characteristics are changed and a heat treatment such as reflow is performed as a post-process, a state change does not occur at a contact portion between the light-transmitting epoxy resin of the optical coupling portion 5 and the opaque epoxy resin of the light-shielding mold resin 7. Was. Thereby, the light from the light emitting element 2 can be stably reflected on the surface layer 6 of the translucent epoxy resin and can be received by the light receiving element 3, thereby preventing the fluctuation (deterioration) of the light transmission efficiency. Became possible.
【００３１】〔第３の実施形態〕第３の実施形態とし
て、光結合部の断面形状を略三角形形状とした平面搭載
型タイプの光結合装置について、図３を用いて説明す
る。Third Embodiment As a third embodiment, a planar mounting type optical coupling device in which the cross-sectional shape of the optical coupling portion is substantially triangular will be described with reference to FIG.
【００３２】図３に示すように、第３の実施形態の光結
合装置が上記第１の実施形態と異なる点は、光結合部５
の断面形状を略三角形形状としただけで、その他は上記
第１の実施形態と同様のものである。As shown in FIG. 3, the optical coupling device of the third embodiment is different from that of the first embodiment in that
Are the same as those in the first embodiment, except that the cross-sectional shape of this is only a substantially triangular shape.
【００３３】第３の実施形態の光結合装置の製造方法に
ついても、上記第１の実施形態と異なる点は、光結合部
５形成時に、断面形状が略三角形形状となるようにトラ
ンスファーモールド成形を行っただけであり、その他は
上記第１の実施形態と同様のものである。The method of manufacturing the optical coupling device of the third embodiment is different from that of the first embodiment in that transfer molding is performed so that the cross-sectional shape becomes substantially triangular when the optical coupling portion 5 is formed. The other steps are the same as those of the first embodiment.
【００３４】本実施形態によっても、上記第１の実施形
態と同様に、光結合部５を成す透光性エポキシ樹脂の表
面層６に紫外線を外部から照射することによって、その
表面層６における反射特性が変化し、後工程としてリフ
ロー等の加熱処理を施しても、光結合部５の透光性エポ
キシ樹脂と遮光用モールド樹脂７の不透明エポキシ樹脂
との密着部分で状態変化が起こることがなかった。これ
により、発光素子２からの光を、透光性エポキシ樹脂の
表面層６で安定して反射し、受光素子３にて受光するこ
とができ、光伝送効率の変動（劣化）を防止することが
可能となった。Also in this embodiment, as in the first embodiment, the surface layer 6 of the translucent epoxy resin forming the optical coupling portion 5 is irradiated with ultraviolet rays from the outside, so that the reflection on the surface layer 6 is achieved. Even if the characteristics are changed and a heat treatment such as reflow is performed as a post-process, a state change does not occur at a contact portion between the light-transmitting epoxy resin of the optical coupling portion 5 and the opaque epoxy resin of the light-shielding mold resin 7. Was. Thereby, the light from the light emitting element 2 can be stably reflected on the surface layer 6 of the translucent epoxy resin and can be received by the light receiving element 3, thereby preventing the fluctuation (deterioration) of the light transmission efficiency. Became possible.
【００３５】〔第４の実施形態〕第４の実施形態とし
て、光結合部の形状を略球形形状とした対向型タイプの
光結合装置について、図４を用いて説明する。Fourth Embodiment As a fourth embodiment, a facing-type optical coupling device in which the optical coupling portion has a substantially spherical shape will be described with reference to FIG.
【００３６】図４に示すように、本実施形態の光結合装
置は、それぞれＡｕワイヤー４によりリードフレーム１
に接続された発光素子２及び受光素子３と、それらの光
路を構成し透光性エポキシ樹脂から成る光結合部５と、
その表面を封止するように全体を被覆する遮光用モール
ド樹脂７とから構成される。なお、本実施形態は、対向
型タイプで、光結合部５の形状を略球形形状としたもの
である。As shown in FIG. 4, the optical coupling device according to the present embodiment has a lead frame 1 with Au wires 4 respectively.
A light-emitting element 2 and a light-receiving element 3 connected to the light-emitting element, an optical coupling section 5 that forms an optical path of the light-emitting element 2 and the light-transmitting epoxy resin,
And a light-shielding mold resin 7 covering the entire surface so as to seal the surface. In the present embodiment, the opposing type is used, and the shape of the optical coupling portion 5 is substantially spherical.
【００３７】次に、本実施形態の光結合装置の製造方法
について説明する。まず、発光素子２と受光素子３とが
対向して配置できるように、リードフレーム１の素子が
接続される部分をオフセット折り曲げを行い、そのリー
ドフレーム１にＡｕワイヤー４を用いて発光素子２と受
光素子３のワイヤーボンドを施す。そして、リードフレ
ーム１に接続された発光素子２と受光素子３を対向させ
て配置し、これらを透光性のエポキシ樹脂を用いて、そ
の形状が略球形形状となるようにトランスファーモール
ド成形を行って、光結合部５を形成する。Next, a method for manufacturing the optical coupling device of the present embodiment will be described. First, a part of the lead frame 1 to which the element is connected is offset-bent so that the light emitting element 2 and the light receiving element 3 can be arranged facing each other. The light receiving element 3 is subjected to wire bonding. Then, the light emitting element 2 and the light receiving element 3 connected to the lead frame 1 are arranged so as to face each other, and transfer molding is performed using a translucent epoxy resin so that the shape becomes substantially spherical. Thus, the optical coupling section 5 is formed.
【００３８】その後、上記第１の実施形態と同様に、こ
の光結合部５を成す透光性エポキシ樹脂の表面層６に紫
外線を外部から照射する。すると、エポキシ樹脂表面層
６において、反射特性の変化が観察された。Thereafter, similarly to the first embodiment, the surface layer 6 of the translucent epoxy resin forming the optical coupling portion 5 is irradiated with ultraviolet rays from outside. As a result, a change in the reflection characteristics of the epoxy resin surface layer 6 was observed.
【００３９】そして、これ以降も、上記第１の実施形態
と同様に、これらを覆う遮光用モールド樹脂７として不
透明エポキシ樹脂を用いて、トランスファーモールド成
形を行った後、外部リードフレームの形状加工を行い、
本実施形態の光結合装置の製造を完了する。Thereafter, as in the first embodiment, transfer molding is performed using an opaque epoxy resin as the light-shielding mold resin 7 for covering them, and then the external lead frame is shaped. Do
The manufacture of the optical coupling device of the present embodiment is completed.
【００４０】本実施形態によっても、上記第１の実施形
態と同様に、光結合部５を成す透光性エポキシ樹脂の表
面層６に紫外線を外部から照射することによって、その
表面層６における反射特性が変化し、後工程としてリフ
ロー等の加熱処理を施しても、光結合部５の透光性エポ
キシ樹脂と遮光用モールド樹脂７の不透明エポキシ樹脂
との密着部分で状態変化が起こることがなかった。これ
により、発光素子２からの光を、透光性エポキシ樹脂の
表面層６で安定して反射し、受光素子３にて受光するこ
とができ、光伝送効率の変動（劣化）を防止することが
可能となった。According to the present embodiment, similarly to the first embodiment, the surface layer 6 of the translucent epoxy resin forming the optical coupling portion 5 is irradiated with ultraviolet rays from the outside, so that the reflection on the surface layer 6 is achieved. Even if the characteristics are changed and a heat treatment such as reflow is performed as a post-process, a state change does not occur at a contact portion between the light-transmitting epoxy resin of the optical coupling portion 5 and the opaque epoxy resin of the light-shielding mold resin 7. Was. Thereby, the light from the light emitting element 2 can be stably reflected on the surface layer 6 of the translucent epoxy resin and can be received by the light receiving element 3, thereby preventing the fluctuation (deterioration) of the light transmission efficiency. Became possible.
【００４１】〔第５の実施形態〕第５の実施形態とし
て、光結合部の形状を略直方体形状とした対向型タイプ
の光結合装置について、図５を用いて説明する。Fifth Embodiment As a fifth embodiment, a facing type optical coupling device in which the optical coupling portion has a substantially rectangular parallelepiped shape will be described with reference to FIG.
【００４２】図５に示すように、第５の実施形態の光結
合装置が上記第４の実施形態と異なる点は、光結合部５
の形状を略直方体形状としただけで、その他は上記第４
の実施形態と同様のものである。As shown in FIG. 5, the optical coupling device of the fifth embodiment is different from that of the fourth embodiment in that
Is merely a rectangular parallelepiped shape.
This is the same as the embodiment.
【００４３】第５の実施形態の光結合装置の製造方法に
ついても、上記第４の実施形態と異なる点は、光結合部
５形成時に、形状が略直方体形状となるようにトランス
ファーモールド成形を行っただけであり、その他は上記
第４の実施形態と同様のものである。The method of manufacturing the optical coupling device according to the fifth embodiment is different from that of the fourth embodiment in that transfer molding is performed so that the optical coupling portion 5 is formed into a substantially rectangular parallelepiped shape. The other points are the same as those in the fourth embodiment.
【００４４】本実施形態によっても、上記第１の実施形
態と同様に、光結合部５を成す透光性エポキシ樹脂の表
面層６に紫外線を外部から照射することによって、その
表面層６における反射特性が変化し、後工程としてリフ
ロー等の加熱処理を施しても、光結合部５の透光性エポ
キシ樹脂と遮光用モールド樹脂７の不透明エポキシ樹脂
との密着部分で状態変化が起こることがなかった。これ
により、発光素子２からの光を、透光性エポキシ樹脂の
表面層６で安定して反射し、受光素子３にて受光するこ
とができ、光伝送効率の変動（劣化）を防止することが
可能となった。In this embodiment, as in the first embodiment, the surface layer 6 of the translucent epoxy resin forming the optical coupling portion 5 is irradiated with ultraviolet rays from the outside, so that the reflection on the surface layer 6 is achieved. Even if the characteristics are changed and a heat treatment such as reflow is performed as a post-process, a state change does not occur at a contact portion between the light-transmitting epoxy resin of the optical coupling portion 5 and the opaque epoxy resin of the light-shielding mold resin 7. Was. Thereby, the light from the light emitting element 2 can be stably reflected on the surface layer 6 of the translucent epoxy resin and can be received by the light receiving element 3, thereby preventing the fluctuation (deterioration) of the light transmission efficiency. Became possible.
【００４５】なお、上記第１〜第５の実施形態では、光
結合部５を成す透光性エポキシ樹脂を変質させるのに、
ＴｉＯ2を含む紫外線硬化樹脂成分を含有さて、紫外線
を外部から照射したが、本発明がこれに限定されるもの
ではない。これ以外に、例えば、透光性エポキシ樹脂に
Ｔｉを含有させ、高温で熱処理することにより、含有さ
れたＴｉが酸化されてＴｉＯ2として、その表面を変質
（白色に変色）させるなど、上記実施形態と同様に、光
結合部の樹脂と遮光性モールド樹脂との樹脂界面での状
態変化を防止できるものであれば良い。In the first to fifth embodiments, the light-transmitting epoxy resin forming the optical coupling portion 5 is changed in quality.
Ultraviolet rays were externally irradiated by containing an ultraviolet curable resin component containing TiO 2 , but the present invention is not limited to this. In addition to the above, for example, the translucent epoxy resin contains Ti and is heat-treated at a high temperature to oxidize the contained Ti to form TiO 2 and alter its surface (discolor to white). Similar to the embodiment, any material can be used as long as it can prevent a state change at the resin interface between the resin of the optical coupling portion and the light-shielding mold resin.
【００４６】[0046]
【発明の効果】以上のように、請求項１に記載の発明に
よれば、光結合部を成す透光性エポキシ樹脂表面を変質
させているので、製造工程におけるリフロー等の加熱処
理の熱によって、光結合部の樹脂材料と遮光用モールド
樹脂との密着部における状態変化を防止することがで
き、従来発生していた光伝達効率の変動（劣化）を大幅
に低減することが可能となる。As described above, according to the first aspect of the present invention, the surface of the light-transmitting epoxy resin forming the optical coupling portion is altered, so that the heat of the heat treatment such as reflow in the manufacturing process. In addition, it is possible to prevent a change in the state of the close contact portion between the resin material of the optical coupling portion and the light-shielding mold resin, and it is possible to significantly reduce the fluctuation (deterioration) of the light transmission efficiency that has conventionally occurred.
【００４７】さらに、請求項２に記載の発明によれば、
光結合部の形状が様々な平面搭載型タイプの光結合装置
においても、従来発生していた光伝達効率の変動（劣
化）を大幅に低減することが可能となる。Further, according to the second aspect of the present invention,
Variations (deterioration) in light transmission efficiency, which have conventionally occurred, can be significantly reduced even in a planar mounting type optical coupling device having various optical coupling portions.
【００４８】また、請求項３に記載の発明によれば、光
結合部の形状が様々な対向型タイプの光結合装置におい
ても、従来発生していた光伝達効率の変動（劣化）を大
幅に低減することが可能となる。Further, according to the third aspect of the present invention, the fluctuation (deterioration) of the light transmission efficiency, which has conventionally occurred, is greatly reduced even in the facing type optical coupling device having various optical coupling portions. It becomes possible to reduce.
【００４９】また、請求項４に記載の発明によれば、光
結合部を成す透光性エポキシ樹脂の表面を変質させてい
るので、製造工程におけるリフロー等の加熱処理の熱に
よって、光結合部の樹脂材料と遮光用モールド樹脂との
密着部における状態変化を防止することができ、従来発
生していた光伝達効率の変動（劣化）を大幅に低減する
ことが可能となる。According to the fourth aspect of the present invention, since the surface of the translucent epoxy resin forming the optical coupling portion is altered, the optical coupling portion is heated by heat such as reflow in the manufacturing process. A change in the state at the contact portion between the resin material and the light-shielding mold resin can be prevented, and the fluctuation (deterioration) of the light transmission efficiency that has occurred conventionally can be greatly reduced.
【００５０】請求項５に記載の発明によれば、光結合部
を成す透光性エポキシ樹脂の表面を変質させるのに、そ
の透光性エポキシ樹脂に紫外線硬化性樹脂成分を含有さ
せ、紫外線照射によりその表面を変質させるようにして
いるので、紫外線照射という製造プロセス上容易な工程
により、請求項４に記載の光結合装置の製造方法を実現
できる。According to the fifth aspect of the present invention, in order to alter the surface of the light-transmitting epoxy resin forming the optical coupling portion, the light-transmitting epoxy resin contains an ultraviolet-curable resin component and is irradiated with ultraviolet light. Thus, the surface of the optical coupling device can be modified by a simple process of ultraviolet irradiation, which is an easy process in the production process.
【図１】本発明の第１の実施形態である光結合部の断面
形状を略楕円形状とした平面搭載型タイプの光結合装置
の概略構造を示す要部断面図である。FIG. 1 is a cross-sectional view of a main part showing a schematic structure of a planar mounting type optical coupling device in which a cross-sectional shape of an optical coupling portion according to a first embodiment of the present invention is substantially elliptical.
【図２】本発明の第２の実施形態である光結合部の断面
形状を略台形形状とした平面搭載型タイプの光結合装置
の概略構造を示す要部断面図である。FIG. 2 is a cross-sectional view of a principal part showing a schematic structure of a planar mounting type optical coupling device in which a cross-sectional shape of an optical coupling portion according to a second embodiment of the present invention is substantially trapezoidal.
【図３】本発明の第３の実施形態である光結合部の断面
形状を略三角形形状とした平面搭載型タイプの光結合装
置の概略構造を示す要部断面図である。FIG. 3 is a cross-sectional view of a principal part showing a schematic structure of a planar mounting type optical coupling device having a substantially triangular cross-sectional shape of an optical coupling portion according to a third embodiment of the present invention.
【図４】本発明の第４の実施形態である光結合部の形状
を略球形形状とした対向型タイプの光結合装置の概略構
造を示す要部断面図である。FIG. 4 is a cross-sectional view of a principal part showing a schematic structure of a facing-type optical coupling device in which an optical coupling portion according to a fourth embodiment of the present invention has a substantially spherical shape.
【図５】本発明の第５の実施形態である光結合部の形状
を略直方体形状とした対向型タイプの光結合装置の概略
構造を示す要部断面図である。FIG. 5 is a cross-sectional view of a principal part showing a schematic structure of a facing-type optical coupling device in which a light coupling portion according to a fifth embodiment of the present invention has a substantially rectangular parallelepiped shape.
【図６】従来の平面搭載型タイプの光結合装置の概略構
造を示す要部断面図である。FIG. 6 is a sectional view of a main part showing a schematic structure of a conventional planar mounting type optical coupling device.
【図７】従来の対向型タイプの光結合装置の概略構造を
示す要部断面図である。FIG. 7 is a cross-sectional view of a main part showing a schematic structure of a conventional opposed-type optical coupling device.
２ 発光素子 ３ 受光素子 ５ 光結合部 ６ 表面層 ７ 遮光用モールド樹脂 Reference Signs List 2 light emitting element 3 light receiving element 5 optical coupling part 6 surface layer 7 light shielding mold resin
Claims (5)
と、該光信号を電気信号に変換する受光素子と、前記発
光素子と前記受光素子との間の光路を含む光結合部と、
前記発光素子、前記受光素子、及び前記光結合部を被覆
する遮光用モールド樹脂とを備えた光結合装置におい
て、 前記光結合部が透光性エポキシ樹脂から成り、該光結合
部を成す透光性エポキシ樹脂表面が変質させられている
こと特徴とする光結合装置。A light-emitting element that converts an electric signal into an optical signal; a light-receiving element that converts the optical signal into an electric signal; an optical coupling unit including an optical path between the light-emitting element and the light-receiving element;
An optical coupling device comprising: the light-emitting element, the light-receiving element, and a light-shielding mold resin that covers the optical coupling section; wherein the optical coupling section is made of a translucent epoxy resin, and An optical coupling device, wherein the surface of a reactive epoxy resin is altered.
略台形形状、又は略三角形形状であり、平面搭載型タイ
プであることを特徴とする請求項１に記載の光結合装
置。2. A cross-sectional shape of the optical coupling section is substantially elliptical.
The optical coupling device according to claim 1, wherein the optical coupling device has a substantially trapezoidal shape or a substantially triangular shape, and is of a planar mounting type.
直方体形状であり、対向型タイプであることを特徴とす
る請求項１に記載の光結合装置。3. The optical coupling device according to claim 1, wherein the optical coupling portion has a substantially spherical shape or a substantially rectangular parallelepiped shape, and is of a facing type.
と、該光信号を電気信号に変換する受光素子と、前記発
光素子と前記受光素子との間の光路を含む光結合部と、
前記発光素子、前記受光素子、及び前記光結合部を被覆
する遮光用モールド樹脂とを備えた光結合装置の製造方
法において、 発光素子と受光素子とが光結合するようにこれらを配置
して透光性エポキシ樹脂により被覆して光結合部を形成
し、該光結合部を成す透光性エポキシ樹脂の表面を変質
させた後に、その表面を遮光用モールド樹脂により封止
することを特徴とする光結合装置の製造方法。4. A light emitting element for converting an electric signal to an optical signal, a light receiving element for converting the optical signal to an electric signal, an optical coupling section including an optical path between the light emitting element and the light receiving element,
In a method for manufacturing an optical coupling device comprising the light emitting element, the light receiving element, and a light-shielding mold resin covering the optical coupling portion, the light emitting element and the light receiving element are arranged so that they are optically coupled to each other, and the light transmitting element is transparent. Forming a light coupling portion by coating with a light epoxy resin, modifying the surface of the light transmitting epoxy resin forming the light coupling portion, and then sealing the surface with a light shielding mold resin; A method for manufacturing an optical coupling device.
の表面を変質させるのに、該透光性エポキシ樹脂に紫外
線硬化性樹脂成分を含有させ、紫外線照射によりその表
面を変質させることを特徴とする請求項４に記載の光結
合装置の製造方法。5. The method of modifying the surface of the light-transmitting epoxy resin forming the optical coupling portion by adding an ultraviolet-curable resin component to the light-transmitting epoxy resin and modifying the surface by irradiation with ultraviolet light. The method for manufacturing an optical coupling device according to claim 4, wherein:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3344198A JP3539710B2 (en) | 1998-02-17 | 1998-02-17 | Manufacturing method of optical coupling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3344198A JP3539710B2 (en) | 1998-02-17 | 1998-02-17 | Manufacturing method of optical coupling device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11233811A true JPH11233811A (en) | 1999-08-27 |
| JP3539710B2 JP3539710B2 (en) | 2004-07-07 |
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ID=12386631
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3344198A Expired - Fee Related JP3539710B2 (en) | 1998-02-17 | 1998-02-17 | Manufacturing method of optical coupling device |
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| Country | Link |
|---|---|
| JP (1) | JP3539710B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017050487A (en) * | 2015-09-04 | 2017-03-09 | 株式会社東芝 | Optical coupling device |
-
1998
- 1998-02-17 JP JP3344198A patent/JP3539710B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017050487A (en) * | 2015-09-04 | 2017-03-09 | 株式会社東芝 | Optical coupling device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3539710B2 (en) | 2004-07-07 |
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