JPH11233592A - Structure of vacuum chucking collet - Google Patents

Abstract

PROBLEM TO BE SOLVED: To do so that the chucking mistake or dropping of a semiconductor chip from a collet can be surely lessened by cutting grooves communicating with suction holes into the top end planes of collect pieces. SOLUTION: The top end of a collet piece 2 has a plane 3 perpendicular to the axial line 2a of the collet piece 2, a plurality of suction holes 4 are bored into the top end plane 3 so as to each communicates with inside, and a cross groove 5 is cut into the top end plane 3 of the collet piece 2 so as to communicate the suction holes 4 through the groove 5. If the suction holes 4 are only partly clogged with a semiconductor chip 6, the rapid reduction of vacuum suction force to the semiconductor chip 6 can be surely avoided by the existence of the cross groove 5.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a semiconductor device such as a transistor or a diode. The present invention relates to a structure of a vacuum suction type collet which is transferred to a collet.

[0002]

2. Description of the Related Art Heretofore, this type of collet has a collet piece whose inside is communicated with a vacuum source such as a vacuum pump, and the tip of the collet piece is formed on a single plane. The semiconductor chip is vacuum-adsorbed to the front end plane of the collet by piercing each suction hole so as to communicate with the inside.

[0003]

When a semiconductor chip is vacuum-suctioned by a collet provided with a plurality of suction holes, the lateral displacement between the collet and the semiconductor chip is small, and each of the suction holes has a small diameter. When it is in a state where everything is closed with a semiconductor chip, the vacuum suction force is
Since it is generated for the total cross-sectional area of each suction hole as a whole, a large suction force can be obtained.

However, on the other hand, if the lateral displacement between the collet and the semiconductor chip is large, only a part of the suction holes among the suction holes is closed by the semiconductor chip. The vacuum suction force is generated only in the cross-sectional area of the suction hole closed by the semiconductor chip in each of the suction holes, and the suction force is reduced. There has been a problem that a suction error indicating that the semiconductor chip cannot be performed or a semiconductor chip may drop from the collet.

[0005] It is a technical object of the present invention to reliably reduce the occurrence of a suction error and the drop of a semiconductor chip from a collet as described above.

[0006]

In order to achieve this technical object, the present invention provides a method in which the tip of a collet piece whose inside communicates with a vacuum source such as a vacuum pump is formed on one plane,
In this collet, a plurality of suction holes are formed in the front end plane so that the suction holes communicate with each other. In the front end plane of the collet piece, a communication groove communicating between the suction holes is formed. Engrave. ".

[0007]

Operation and effect of the present invention
When vacuum suction is performed on an object to be suctioned such as a semiconductor chip, a vacuum suction force is also generated in a communication groove portion engraved so as to communicate between the suction holes on the front end plane of the collet. Since the area of suction can be increased to the portion of the communication groove, the lateral displacement between the collet and the object to be sucked is large, and only a part of the suction holes among the suction holes is in the object to be sucked. The presence of the communication groove can surely prevent the vacuum suction force on the object to be abruptly reduced when the object is closed.

Therefore, according to the present invention, when vacuum-adsorbing an object such as a semiconductor chip or the like, an adsorption error that the object cannot be adsorbed occurs, or the object drops. Can be reliably prevented, and the reliability of vacuum suction can be greatly improved.

[0009]

Embodiments of the present invention will be described below with reference to the drawings. 1 to 4 show a first embodiment, in which reference numeral 1 denotes a collet holder whose inside is connected to a vacuum generating source such as a vacuum pump (not shown). At the lower end, a collet piece 2 formed in a hollow shape is detachably mounted so that the inside thereof communicates with the inside of the collet holder 1.

The tip of the collet piece 2 is formed on one plane 3 perpendicular to the axis 2a of the collet piece 2, and the tip plane 3 has a plurality of (five in this embodiment) suction holes. 4 are formed so that the respective suction holes 4 communicate with the inside. A cross-shaped communication groove 5 is engraved on the front end plane of the collet piece 2 so as to communicate between the communication holes 4 at the cross-shaped communication groove 5.

With such a structure, when the semiconductor chip 6 is vacuum-sucked, the cross-shaped communication groove 5 is formed so as to communicate between the suction holes 4 on the front end face 3 of the collet piece 2. In addition, the vacuum suction force is generated and the area of the vacuum suction is increased, so that the lateral displacement between the collet 2 and the semiconductor chip 6 is large, and two points are shown in FIG. 2, FIG. 3 and FIG. As shown by the dashed line, when only three of the five suction holes 4 are blocked by the semiconductor chip 6, the semiconductor chip 6 of the cross-shaped communication groove 5 is closed. Since a vacuum suction force is generated in a portion communicating between the closed suction holes 4, only a part of the suction holes 4 is closed by the semiconductor chip 6. In such a state, the true It can be reliably prevented by the presence of the cross-shaped communicating groove 5 to the suction force decreases rapidly.

In the above embodiment, five suction holes 4 are used. However, when three suction holes 4 'are used as in the second embodiment shown in FIG. What is necessary is just to comprise so that it may communicate between each suction hole 4 'by the Y-shaped communication groove 5', and similarly, it can be applied also to the case of four suction holes or six suction holes. Needless to say.

In particular, as shown in FIGS. 2 and 5, the communication grooves 5, 5 'are formed in a cross shape or a Y-shape so that both ends of the communication grooves 5, 5' are sucked. The portion between the holes 4, 4 'is bent inwardly in the radial direction, and between the suction holes 4, 4' arranged in the circumferential direction, inward in the radial direction. Since the extending end plane can be secured, there is an advantage that the stability of the posture when the semiconductor chip 6 is vacuum-sucked to the end plane 3 of the collet piece 2 can be improved.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional front view showing an embodiment of the present invention.

FIG. 2 is an enlarged bottom view taken along the line II-II of FIG.

FIG. 3 is a sectional view taken along line III-III of FIG. 2;

FIG. 4 is a sectional view taken along line IV-IV of FIG. 2;

FIG. 5 is a bottom view showing another embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Collet holder 2 Collet piece 2a Collet piece axis line 3 Tip plane 4, 4 'Suction hole 5, 5' Communication groove

Claims (1)

[Claims] 1. A tip of a collet piece whose inside communicates with a vacuum source such as a vacuum pump is formed in one plane, and a plurality of suction holes are formed in the front end plane. In a collet formed so as to communicate with each other, a communication groove communicating between suction holes is formed in a front end plane of the collet piece.