JPH11227089A - Heat ray shielding transparent resin structure and heat ray shielding film laminate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat ray shielding film laminate for easily strongly bringing into contact with a transparent plastic plate. SOLUTION: The heat ray shielding transparent resin structure comprises a film laminate obtained by sequentially laminating a heat ray shielding film A having a heat ray shielding layer on one surface and a transparent resin film B in this order. In this case, a ratio Tm/Tmr of a melting point Tm of a resin for forming the film B to a melting point Tmr of a resin for forming the film A satisfies a range of 0.5<=Tm/Tmr<=0.95. And, a haze value of the laminate of the film A and the film B is 5% or less. A total visible light permeability of a wavelength of 400 to 750 nm is 55% or more. And, a total infrared permeability of a wavelength of 50 to 2100 nm of the laminate is 50% or less.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a heat ray shielding film laminate and a heat ray shielding transparent resin structure in which the laminate is laminated on a transparent resin plate. More specifically, a heat-shielding transparent resin structure in which a heat-shielding film is laminated on one side of a transparent resin plate that is lighter, safer and more processable than transparent glass, and a heat ray for the structure The present invention relates to a shielding film laminate.

[0002]

2. Description of the Related Art A heat ray shielding film laminate is generally made of a transparent polyester film as a base material, and a metal thin film layer made of gold, silver, copper or the like having a high refractive index is formed on its surface as an optical laminate (heat ray shielding layer). This is a laminate in which transparent dielectric layers are laminated, and has a property of transmitting visible light but reflecting light from near-infrared to infrared. Taking advantage of this property, the heat ray shielding film laminate reduces the heat radiation from the monitoring window in high-temperature work, and improves the cooling and heating effect by blocking the solar energy that enters from the windows of vehicles such as buildings, cars or trains. It is used for improving the heat shielding property of a transparent plant container, or for improving the cold preservation effect in a freezing and refrigerated showcase. However, most of the base material of these transparent openings is made of a glass plate, and the heat ray shielding film laminate is attached to the glass plate via an adhesive.

In recent years, a transparent resin (plastic) plate has been increasingly used in place of a glass plate from various aspects such as danger due to breakage of the glass plate, suitability for handling, weight reduction, workability, and cost. In such a structure, when the heat ray shielding film laminate is stuck with a conventional adhesive, there is a problem that bubbles tend to be generated due to residual gas generated from the adhesive at a high temperature, and the transparent appearance is impaired. In order to solve this problem, various types of pressure-sensitive adhesives have been studied.However, fluctuations in pressure-sensitive adhesive strength due to aging of the pressure-sensitive adhesive and tackiness of the pressure-sensitive adhesive itself deteriorate handling in the process, thereby satisfying practical characteristics. Is not found.

[0004] On the other hand, the present inventor has tried a method of directly heating and pressing a heat ray shielding film laminate to a transparent resin plate.
A structure having strong bonding and good transparency could not be obtained.
Further, even if a molten resin was supplied on the surface of the heat ray shielding film laminate to form a transparent resin plate, a strongly adhered structure was not obtained, and the heat ray shielding film laminate was easily peeled off. .

[0005]

SUMMARY OF THE INVENTION It is a first object of the present invention to provide a heat ray shielding film laminate which can be easily and strongly adhered to a transparent resin plate used for a substrate such as a transparent opening. It is in. A second object of the present invention is to provide a structure in which a heat ray shielding film laminate and a transparent resin plate are firmly joined to each other and have a transparent and beautiful appearance.

[0006]

Accordingly, the present inventor has conducted research to achieve the above object, and as a result, it has been found that one side of the heat ray shielding film has a certain range with respect to the melting point of the resin forming the film. When a transparent resin film formed of a resin having a lower melting point is laminated, it is found that the transparent resin plate is directly bonded through the transparent resin film, and the bonding surface is firmly bonded and has an excellent appearance. Was issued.

According to the present invention, the following heat ray shielding transparent resin structure is provided. (1) A heat ray shielding transparent resin structure in which a heat ray shielding film (A) having a heat ray shielding layer on one side, (2) a transparent resin film (B) and (3) a transparent resin plate (C) are laminated in this order. (I) the ratio (Tm) of the melting point (Tm) of the resin forming the transparent resin film (B) to the melting point (Tmr) of the resin forming the heat ray shielding film (A);
m / Tmr) is 0.5 ≦ (Tm / Tmr) ≦ 0.95
(Ii) a haze value of 5% or less in a laminate of the heat ray shielding film (A) and the transparent resin film (B), and (iii) a wavelength of 400 to 750 in the laminate.
a heat ray shielding transparent resin structure, wherein the total visible light transmittance at 55 nm or more is 55% or more; and (iv) the total infrared light transmittance at a wavelength of 750 to 2100 nm is 50% or less in the laminate.

Further, according to the present invention, the following heat ray shielding film laminate is provided. (1) A film laminate obtained by laminating a heat ray shielding film (A) having a heat ray shielding layer on one side and (2) a transparent resin film (B) in this order, and (i) the transparent resin film (B) And the melting point (Tm) of the resin forming the heat ray shielding film (A).
r) (Tm / Tmr) is 0.5 ≦ (Tm / Tm
r) satisfies the range of 0.95, (ii) the haze value of the laminate of the heat ray shielding film (A) and the transparent resin film (B) is 5% or less, and (iii) the wavelength of the laminate. A heat ray shielding film laminate, wherein the total visible light transmittance at 400 to 750 nm is 55% or more, and (iv) the total infrared transmittance at a wavelength of 750 to 2100 nm is 50% or less in the laminate.

Next, the present invention will be described in more detail. First, a heat ray shielding film laminate will be described, and then a heat ray shielding transparent resin structure and a method for producing the same will be described. As described above, the heat ray shielding film laminate of the present invention is constituted by (1) a heat ray shielding film (A) having a heat ray shielding layer on one surface and (2) a transparent resin film (B).

[0010] The base film forming the heat ray shielding film (A) is transparent and flexible, and when a metal deposition film is formed on the surface thereof by a sputtering method, a vacuum deposition method, or the like, the operation is performed. It is preferably a thermoplastic resin film having heat resistance to withstand temperature.

Examples of the polymer constituting the thermoplastic resin film include polyesters represented by polyethylene terephthalate and polyethylene-2,6-naphthalate, aliphatic polyamides, aromatic polyamides, polyethylene, polypropylene and the like. Of these, polyester is more preferred. Further, among the thermoplastic resin films, a biaxially oriented polyethylene terephthalate film having excellent heat resistance and mechanical strength is particularly preferable.

Such a thermoplastic resin film (base film) can be produced by a conventionally known method. For example, the production of a biaxially oriented polyester film will be described.
m to (Tm + 70) ° C. (where Tm is the melting point of the polyester), melted by an extruder, extruded from a die (eg, T-die, I-die, etc.) onto a rotary cooling drum,
The unstretched film is quenched at a temperature of (Tg-10) to (Tg + 70) ° C. (Tg: glass transition temperature of polyester) at 2.5 to 8 ° C. Stretched at a magnification of 0. 0, 2.5 to
It is stretched at a magnification of 8.0 times, and if necessary, 180-250.
It can be produced by heat setting at a temperature of 1 to 60 seconds. The thickness of the base film is preferably in the range of 25 to 250 μm, particularly preferably in the range of 50 to 200 μm.

The heat ray shielding film (A) used in the present invention has a heat ray shielding layer on one side of a base film. As the metal material constituting the heat ray shielding layer,
Sb-doped SnO ₂ or Sn-doped In ₂ O ₃
(ITO) or other semiconductor thin film having a wide optical band gap and high free electron density, or Au, Ag, Cu, A
Metals such as 1 are exemplified. Among them, Ag, which hardly absorbs visible light, is particularly preferable. In addition, you may use 2 or more types of metal substances together as needed. As a method for forming such a metal layer, a vapor phase growth method is preferable, and a vacuum deposition method, a sputtering method or a plasma CVD method is particularly preferable. The thickness of the metal layer is set so that the integrated visible light transmittance at a wavelength of 400 to 750 nm of the film laminate of the present invention satisfies the range of 55% or more and the integrated near infrared transmittance at a wavelength of 750 to 2100 nm of 50% or less. Should be. The thickness of the metal layer is preferably in the range of 5 nm to 1000 nm. When the thickness is less than 5 nm, a sufficient heat ray shielding effect is not exhibited, and the infrared transmittance is increased.
If it exceeds 00 nm, the visible light transmittance is reduced and the transparency is deteriorated.

The heat ray shielding film (A) used in the present invention is preferably provided with a transparent dielectric layer having a high refractive index in order to suppress reflection of visible light and enhance transparency. Such dielectrics include TiO ₂ , Zr
O ₂ , SnO ₂ , In ₂ O _{3 and the} like can be mentioned. TiO ₂ or ZrO ₂ derived from an organic compound obtained by hydrolysis of alkyl titanate or alkyl zirconium is more preferred because of excellent workability. In addition, indium oxide or tin oxide can be applied as a dielectric layer in a single layer or a multilayer.
As a method for forming such a dielectric layer, a vapor phase growth method is preferable, and further, a vacuum deposition method, a sputtering method,
The VD method is particularly preferred. Also, the dielectric layer has a laminated structure sandwiching the above-described metal layer in a sandwich shape,
This is more preferable because the effect of improving transparency is increased. It is necessary to set the thickness of such a dielectric layer together with the above-mentioned metal layer so as to satisfy the optical characteristic range of the film laminate. The thickness of the dielectric layer is preferably in the range of 0 nm to 750 nm.

As the heat ray shielding film (A) used in the present invention, a heat-resistant base film is usually used because a metal is laminated by sputtering, and the resin forming the film has a melting temperature as described above. A high thermoplastic is selected. For this reason, the adhesion between the base film and the transparent resin plate having a low melting temperature has a large difference in melting temperature, and it is difficult to bond the two by heat fusion. Therefore, in order to improve the adhesion between the heat ray shielding film (A) and the transparent resin plate (C), it is necessary to form a structure in which a transparent resin film (B) having a low melting temperature is laminated on one side of the heat ray shielding film. There is.

The resin forming the transparent resin film (B) is preferably a thermoplastic resin. The melting point (Tm) of the resin forming the transparent resin film (B) and the melting point of the resin forming the heat ray shielding film (A) are preferred. (Tmr)
It must be in the range of 0.5 ≦ (Tm / Tmr) ≦ 0.95. If the temperature ratio is less than 0.5, it is not preferable because lamination of the transparent resin plate (C) on the heat ray shielding film (A) becomes difficult. On the other hand, if the temperature ratio exceeds 0.95, the adhesive strength between the film laminate of the present invention and the transparent resin plate (C) is undesirably reduced.

In the present invention, the melting point of the resin is crystalline, and in the case of a resin having a distinct peak in differential scanning calorimetry (DSC), the peak temperature is defined as the melting point (° C.).
In the case of other amorphous resins, the glass transition temperature (° C.) is defined as the melting point. In particular, bisphenol A
Is treated as the melting point (° C.) described in “Polycarbonate Resin Handbook” (published by Nikkan Kogyo Shimbun, First Edition, First Edition, 1992).

The resin forming the transparent resin film (B) is preferably a thermoplastic resin, and particularly has a melting point of 1
Resins having a temperature between 00 and 240 ° C are preferred. Particularly, polyester, polycarbonate, polyethylene, polypropylene and the like represented by polyethylene terephthalate are exemplified. When the base film of the heat ray shielding film (A) is a biaxially oriented polyethylene terephthalate film, the transparent resin film (B) is preferably a polycarbonate film or a copolymerized polyethylene terephthalate film. This copolymerized polyethylene terephthalate advantageously has a melting point of from 180 to 240 ° C.

The copolymerized polyethylene terephthalate copolymer component may be an acid component or a glycol component, and the acid component may be an aromatic dibasic acid such as isophthalic acid, phthalic acid or naphthalenedicarboxylic acid; adipic acid, azelaic acid, Alicyclic dicarboxylic acids such as sebacic acid and decane dicarboxylic acid can be exemplified. Examples of the glycol component include aliphatic diols such as butanediol and hexanediol; and alicyclic diols such as cyclohexanedimethanol. These can be used alone or in combination of two or more.

The above polycarbonates include aromatic polycarbonates containing bisphenol as a dihydroxy component. In particular, bisphenol A to which phenol is bonded via an isopropylidene group
Is preferred because it has good thermal properties and excellent adhesion to the transparent resin plate (C).

Further, as the thermoplastic resin forming the transparent resin film (B), a polycarbonate / polyethylene terephthalate alloy or the like or a modified version thereof may be used.

The thickness of the transparent resin film (B) is 2
5-750 μm is preferred. If it is less than 25 μm, the appearance will be poor. A particularly preferred thickness is 50 to 500 μm.

There are roughly two methods for laminating the transparent resin film (B) on the heat ray shielding film (A).

First, when the base film of the heat ray shielding film (A) is formed, the transparent resin film (B) can be extruded and laminated by a co-extrusion method. In this case, in the laminated film obtained by the co-extrusion method, a heat ray shielding layer is formed on the base film surface of the film (A) by a vapor deposition method.

As another method, a film laminate may be formed by laminating the heat ray shielding film (A) and the transparent resin film (B) with an adhesive such as acrylic or urethane. In this case, the transparent resin film (B) may be laminated on any one side of the heat ray shielding film (A). That is, the transparent resin film (B) may be laminated on the heat ray shielding layer side of the heat ray shielding film (A), or may be laminated on the opposite surface.

In order to protect the heat ray shielding layer of the film laminate of the present invention and to prevent the surface from being scratched,
A hard coat treatment may be performed on the heat ray shielding layer surface. Even in the case of a film laminate in which the transparent resin film (B) is laminated on the heat ray shielding layer surface, the heat ray shielding film (A)
It is preferable to perform a hard coat treatment on the side opposite to the heat ray shielding layer. In this hard coat treatment method, a known acrylic or silicone hard coat agent can be used. As these treatment methods, known coating methods such as a bar coating method, a doctor blade method, a reverse roll coating method, and a gravure roll coating method can be used, and the thickness of the coating film is preferably 1 to 10 μm. In the hard coat treatment, besides directly coating the surface, for example, a film obtained by performing a hard coat treatment on a polyethylene terephthalate film may be laminated via an adhesive.

The film laminate of the present invention, in which the heat ray shielding film (A) and the transparent resin film (B) are laminated, has a total thickness of 50 to 1000 μm, preferably 75 to 7 μm.
Advantageously, it is in the range of 50 μm. This total thickness is 5
When the thickness is less than 0 μm, handling and processing operations become difficult, and the yield decreases. On the other hand, when the thickness exceeds 1000 μm, it becomes difficult to handle the film as a long roll product.

The heat ray shielding film laminate of the present invention is required to be transparent because it is used for a transparent portion of an opening such as a glass window, and the haze value of the laminate must be 5% or less. It is. A haze value of 5% or more is not preferred because the transparency becomes poor. Therefore, as the base film of the heat ray shielding film (A) and the transparent resin film (B) to be laminated, it is preferable to use a transparent film having as few additives and impurities as possible.

The heat ray shielding film laminate of the present invention has an integrated visible light transmittance of 55% or more at a wavelength of 400 to 750 nm in order to maintain the transparency of the transparent portion of the opening and to function as a heat ray shielding effect. Must be 60% or more, and the integrated near-infrared transmittance at a wavelength of 750 to 2100 nm is 50% or less, preferably 40% or less. If the integrated visible light transmittance is less than 55%, the transparency of the laminate is reduced, which is not preferable. If the integrated near-infrared transmittance exceeds 50%, the heat ray shielding effect of the laminate is undesirably reduced.

Next, the heat ray shielding resin structure laminated on the transparent resin plate (C) using the above heat ray shielding film laminate will be described. In this structure of the present invention, a transparent resin plate (C) is laminated on the transparent resin film (B) side of the heat ray shielding film laminate, and the lamination is performed without using an adhesive or an adhesive. The feature is that it is directly fixed. This fixation is performed by a method described later, and the two are firmly adhered to each other by fusion or thermal bonding.

The transparent resin plate (C) to be laminated on the film laminate is usually used as an organic glass and may be any as long as it has transparency and strength. Specific examples include a transparent plate formed of a polycarbonate resin, a polymethyl methacrylate resin, an acrylonitrile-styrene resin, a polystyrene resin, a methyl methacrylate-styrene copolymer or a polyolefin resin. Of these, a polycarbonate resin plate is most preferred.

The transparent resin plate (C) only needs to be transparent, and may be colorless or colored. It is desirable that the integrated visible light transmittance is 30% or more, preferably 40% or more. Transparent resin plate (C)
It is practical to have a thickness of 2 to 15 mm, preferably 3 to 12 mm.

According to the study of the present inventors, it has been found that the lamination of the heat ray reflective film laminate and the transparent resin plate (C) can be advantageously performed by the following two methods.

<Molding method (I)> The transparent resin melted on the transparent resin film (B) side of the film laminate comprising the heat ray shielding film (A) having a heat ray shielding layer on one side and the transparent resin film (B) Method of forming into a plate shape. This molding method (I) is a method in which a transparent resin melted on the film (B) surface of the film laminate is molded into a plate shape. The film laminate is attached to one surface of a mold, and A method of pouring a molten resin into a mold (injection molding method) is advantageous. It is also possible to arrange the film laminate horizontally and cast a molten resin thereon to form the film.

<Molding method (II)> A laminate comprising a heat ray shielding film (A) having a heat ray shielding layer on one side and a transparent resin film (B) is heated on the transparent resin film (B) side to obtain a transparent material. A method of thermocompression bonding to the resin plate (C). This molding method (II) is a method in which a transparent resin plate (C) molded in advance is used, and a film laminate is thermocompression-bonded thereto. The thermocompression bonding is performed by melting the transparent resin film (B) in the film laminate (Tm) to (Tm).
The heating is performed by heating at least the laminated surface of the transparent resin plate (C) in the range of (m + 110) ° C. Thus, a structure in which the film laminate and the transparent resin plate (C) are laminated can be obtained.

The heat ray shielding resin structure obtained by the above method has a total thickness of 3 to 15 mm, preferably 5 to 1 mm.
It is desirably in the range of 2 mm, and the integrated visible light transmittance of the structure is desirably 20% or more, preferably 30% or more.

[0037]

The present invention will be described below in detail with reference to examples. In addition, the measurement of the characteristic of the film was implemented according to the following method.

(1) Measurement of Melting Point (Tm, Tmr) The base film of the heat ray shielding film (A) and the transparent resin film (B) were each used alone, and the Dupont Instrum was used.
The measurement is performed at a heating rate of 20 ° C./min using an ents 910 DSC. The sample amount is about 20 mg.

(2) Integrated Visible Light Transmittance and Integrated Near-Infrared Transmittance Both characteristics were measured for the heat ray shielding film laminate using Shimadzu Corporation UV-3101PC in the following wavelength range, and the integrated visible light transmittance and integrated near-infrared light transmittance were measured. JIS for integrated near-infrared reflectance
Calculated based on -A 5759. Visible light region 400-750 nm Near infrared light region 750-2100 nm

(3) Haze The haze is measured using a haze meter (NDH-2D) manufactured by Nippon Denshoku Industries Co., Ltd.

(4) Adhesion After the sample in which the heat ray shielding film laminate was adhered to the transparent resin plate was immersed in hot water at 100 ° C. for 2 hours, the surface on the side of the heat ray shielding film was cut into 100 grids with a cutter. Make a cut so that (one piece is about 1 mm ² ). An adhesive tape is stuck on the grid, and the number of grids on which the film does not peel when peeled off is evaluated according to the following criteria. 〇: 100 △: 90 to 99 ×: 89 or less

Example 1 A 10-nm thick indium oxide layer (dielectric layer: first layer) was formed on one side of a biaxially oriented polyethylene terephthalate film (hereinafter sometimes referred to as a PET film) having a thickness of 50 μm. Provided. This first
A silver thin film layer (metal layer: second layer) having a thickness of 12 nm is formed on the surface of the layer.
Layer), and then a 20 nm-thick indium oxide layer (dielectric layer: third layer) was provided on the surface of the layer to form a heat ray shielding film (A). The first to third layers were formed by a sputtering method under vacuum (5 × 10 ⁻⁵ Torr). Further, as a surface protection of the heat ray shielding layer, a UV-curable polyfunctional acrylic resin was applied on the heat ray shielding layer in an amount such that a coating thickness after drying became 5 μm to form a hard coat layer. Next, polyethylene terephthalate obtained by copolymerizing 12% by mole of isophthalic acid (copolymerized PET)
Is melt-extruded at 280 ° C., quenched and solidified to form an unstretched film, and then the unstretched film is stretched 3.0 times at a longitudinal stretching temperature of 100 ° C., and then a transverse stretching starting temperature of 110 ° C. and an ending temperature of 160 ° C. 3.1 And then stretched by a factor of 190
Transparent resin film (B) having a thickness of 50 μm by heat setting at ℃
It was created. This transparent resin film (B) was laminated with a urethane-based adhesive on the surface of the above-mentioned heat ray shielding film (A) opposite to the hard coat layer to prepare a heat ray shielding film laminate. Table 1 shows the characteristics of the laminate. Then, this heat ray shielding film laminate was set in a mold for extrusion molding, and a polycarbonate heated and melted at 325 ° C. was injection-molded on the surface on the copolymerized PET side to obtain a polycarbonate transparent resin plate (7 mm thick). Was. Table 1 shows the adhesion between the polycarbonate plate and the heat ray shielding film laminate.

Example 2 When a PET film (base film of a heat ray shielding film) having a thickness of 50 μm was formed, the same copolymerized PET as in Example 1 was simultaneously extruded from a die, and a laminated film was formed in the same manner as in Example 1. It was created. A heat ray shielding film laminate was prepared from this laminated film in the same manner as in Example 1, and a polycarbonate transparent resin plate was further produced in the same manner as in Example 1. Table 1 shows the properties of the heat ray shielding film laminate and the adhesion between the polycarbonate plate and the heat ray shielding film laminate.

Example 3 A heat ray shielding film laminate was prepared in the same manner as in Example 1 except that a polycarbonate film having a thickness of 100 μm was used instead of copolymerized PET. A transparent resin plate was created. Table 1 shows the properties of the heat ray shielding film laminate and the adhesion between the polycarbonate and the heat ray shielding film laminate.

Example 4 In the heat ray shielding film laminate prepared in Example 1, an ultraviolet-curable polyfunctional acrylic resin layer was formed as a protective layer on the surface of the polyester film opposite to the heat ray shielding layer. Was formed to a thickness of 5 μm. Next, the transparent copolymer PET film (B) obtained in Example 1 was laminated with a urethane-based adhesive on the surface of the heat ray shielding layer of the film laminate to produce a heat ray shielding film laminate. Table 1 shows the characteristics of this laminate.
Shown in Then, this heat ray shielding film laminate was set in an extrusion mold in the same manner as in Example 1, and the copolymer P
Polycarbonate was injection-molded on the ET side to obtain a polycarbonate transparent resin plate (thickness: 7 mm). Table 1 shows the adhesion between the polycarbonate plate and the heat ray shielding film laminate.

Comparative Example 1 A PET film having a thickness of 7 μm was used instead of a 50 μm-thick PET film (base film of a heat ray shielding film).
Using 5 μm PET film and copolymerized PET
A heat ray shielding film was prepared in the same manner as in Example 1 except that no resin was laminated, and a polycarbonate transparent resin plate was further produced in the same manner as in Example 1. This heat ray shielding film is substantially 25 μm thick PE as compared with that of Example 1.
The configuration is the same as the configuration in which the T film is laminated on a PET film having a thickness of 50 μm. Table 1 shows the properties of the heat ray shielding film and the adhesion between the polycarbonate and the heat ray shielding film.

[0047]

[Table 1] ---------------------------------------------- --------------- Transparent resin Tm / Tmr Haze Visible light Infrared light Adhesive melting point Transmittance Transmittance (° C) (−) (%) (%) (%) ( %) ------------------------------------------------ ------------- Example 1 202 0.79 3.4 67 46 ○ Example 2 202 0.79 3.6 68 46 ○ Example 3 220 0.86 2.7 71 47 ○ Example 4 202 0.79 3.5 67 46 ○ Comparative Example 1 255 1.00 2.7 71 47 × ---------------------- ---------------------------------------

[0048]

According to the present invention, transparency, heat ray shielding property,
A heat ray shielding film laminate having excellent adhesion and a structure of the laminate and a transparent resin plate can be provided.

Claims (30)

[Claims] 1. A heat ray wherein (1) a heat ray shielding film (A) having a heat ray shielding layer on one side, (2) a transparent resin film (B) and (3) a transparent resin plate (C) are laminated on each other in this order. (I) a ratio (Tm) between the melting point (Tm) of the resin forming the transparent resin film (B) and the melting point (Tmr) of the resin forming the heat ray shielding film (A). / Tmr) is 0.5 ≦ (Tm / Tmr) ≦
(Ii) a haze value of 5% or less in a laminate of the heat ray shielding film (A) and the transparent resin film (B), and (iii) a wavelength of 40 in the laminate.
The total visible light transmittance from 0 to 750 nm is 55% or more, and (i
v) A heat ray shielding transparent resin structure, wherein the laminate has a total infrared transmittance of 50% or less at a wavelength of 750 to 2100 nm. 2. The heat ray shielding transparent resin structure according to claim 1, wherein the heat ray shielding film (A) is formed using a biaxially oriented film made of polyethylene terephthalate as a base film. 3. The heat ray shielding transparent resin structure according to claim 1, wherein the heat ray shielding film (A) has a heat ray shielding layer in which a metal layer and a dielectric layer are alternately laminated on one surface of a base film. 4. The heat ray shielding transparent resin structure according to claim 1, wherein the thickness of the base film of the heat ray shielding film (A) is in the range of 25 to 250 μm. 5. The transparent resin film (B) having a melting point of 18
The heat ray shielding transparent resin structure according to claim 1, which is a film formed from copolymerized polyethylene terephthalate at 0 to 240 ° C. 6. The heat ray shielding transparent resin structure according to claim 1, wherein the transparent resin film (B) is a film formed of a polycarbonate resin. 7. The transparent resin film (B) having a thickness of 25
The heat ray shielding transparent resin structure according to claim 1, wherein the thickness is in a range of from 750 to 750 µm. 8. The transparent resin plate (C) is a plate formed from a polycarbonate resin, a polymethyl methacrylate resin, an acrylonitrile-styrene copolymer, a polystyrene resin, a methyl methacrylate-styrene copolymer or a polyolefin resin. 2. The heat ray shielding transparent resin structure according to 1. 9. The heat ray shielding transparent resin structure according to claim 1, wherein the transparent resin plate (C) is a plate formed of a polycarbonate resin. 10. The thickness of the transparent resin plate (C) is 2 to 15 m.
The heat-shielding transparent resin structure according to claim 1, wherein m is in the range of m. 11. The heat ray shielding transparent resin structure according to claim 1, further comprising a hard coat layer on the opposite surface of the heat ray shielding film (A) on which the transparent resin film (B) is laminated. 12. The heat ray shielding transparent resin structure according to claim 1, wherein a transparent resin film (B) is laminated on the heat ray shielding layer of the heat ray shielding film (A). 13. The heat ray shielding transparent resin structure according to claim 1, wherein a transparent resin film (B) is laminated on the heat ray shielding film (A) on the surface opposite to the heat ray shielding layer. 14. The heat ray-shielding transparent resin according to claim 1, wherein the heat ray-shielding film (A) and the transparent resin film (B) are bonded to each other via an adhesive layer, or are laminated by directly fixing both. Structure. 15. The heat ray shielding transparent resin structure according to claim 1, wherein the transparent resin film (B) and the transparent resin plate (C) are laminated by directly fixing both surfaces. 16. The transparent resin plate (C) has a wavelength of 400 to 7
The total visible light transmittance of 50 μm is 30% or more.
The heat ray shielding transparent resin structure according to the above. 17. The heat ray shielding transparent resin structure according to claim 1, wherein the entire thickness is in a range of 3 to 15 mm. 18. On the transparent resin film (B) side of a laminate comprising a heat ray shielding film (A) having a heat ray shielding layer on one side and a transparent resin film (B), a molten transparent resin is formed into a plate shape. The method for molding a heat ray shielding transparent resin structure according to claim 1, wherein 19. A laminate comprising a heat ray shielding film (A) having a heat ray shielding layer on one side and a transparent resin film (B) is provided on the surface of the transparent resin film (B) side,
2. The method for forming a heat ray shielding transparent resin structure according to claim 1, wherein the transparent resin plate (C) is thermocompression bonded. 20. A film laminate comprising: (1) a heat ray shielding film (A) having a heat ray shielding layer on one surface and (2) a transparent resin film (B) laminated in this order, wherein (i) the transparent The ratio (Tm / Tmr) of the melting point (Tm) of the resin forming the resin film (B) to the melting point (Tmr) of the resin forming the heat ray shielding film (A) is 0.5.
≦ (Tm / Tmr) ≦ 0.95, and (ii)
The heat ray shielding film (A) and the transparent resin film (B)
And (iii) the total visible light transmittance of the laminate at a wavelength of 400 to 750 nm is 55% or more, and (iv) the wavelength of the laminate at 750 to 750.
A heat ray shielding film laminate having a total infrared transmittance of 2100 nm of 50% or less. 21. The heat ray shielding film laminate according to claim 20, wherein the heat ray shielding film (A) is formed using a biaxially oriented film made of polyethylene terephthalate as a base film. 22. The heat ray shielding film laminate according to claim 20, wherein the heat ray shielding film (A) is a film having a heat ray shielding layer in which a metal layer and a dielectric layer are alternately laminated on one surface of a base film. 23. The thickness of the base film of the heat ray shielding film (A) is in the range of 25 to 250 μm.
The film laminate according to the above. 24. The transparent resin film (B) having a melting point of 1
The heat ray shielding film laminate according to claim 20, which is a film formed from copolymerized polyethylene terephthalate having a temperature of 80 to 240 ° C. 25. The transparent resin film (B) is a film formed of a polycarbonate resin.
The heat ray shielding film laminate according to the above. 26. The thickness of the transparent resin film (B) is 2
The heat ray shielding film laminate according to claim 20, which has a range of 5 to 750 µm. 27. The heat ray shielding film laminate according to claim 20, further comprising a hard coat layer on the opposite surface of the heat ray shielding film (A) on which the transparent resin film (B) is laminated. 28. The heat ray shielding film laminate according to claim 20, wherein a transparent resin film (B) is laminated on a surface side of the heat ray shielding layer in the heat ray shielding film (A). 29. The heat ray shielding film laminate according to claim 20, wherein a transparent resin film (B) is laminated on the heat ray shielding film (A) on the surface opposite to the heat ray shielding layer. 30. The heat ray shielding film laminate according to claim 20, wherein the heat ray shielding film (A) and the transparent resin film (B) are adhered to each other via an adhesive layer, or are laminated by directly fixing both. body.