JPH11222581A - Adhesive tape - Google Patents

Adhesive tape

Info

Publication number
JPH11222581A
JPH11222581A JP2533698A JP2533698A JPH11222581A JP H11222581 A JPH11222581 A JP H11222581A JP 2533698 A JP2533698 A JP 2533698A JP 2533698 A JP2533698 A JP 2533698A JP H11222581 A JPH11222581 A JP H11222581A
Authority
JP
Japan
Prior art keywords
tape
pressure
sensitive adhesive
adhesive
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2533698A
Other languages
Japanese (ja)
Inventor
Yukio Suzuki
幸男 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to JP2533698A priority Critical patent/JPH11222581A/en
Publication of JPH11222581A publication Critical patent/JPH11222581A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To provide an adhesive tape wherein force is scattered over the entire tape width when a large winding pressure is applied and wherein the adhesive is fixed in the depressed part to prevent weaving. SOLUTION: In an adhesive tape partially having a region A wherein an adhesive is arranged in the width direction on the surface of a tape base, a depressed part is formed on one or both sides of the base within the adhesive- coated region A. Preferably, the depth (a) of the depressed part is from 0.1 to 1.2 times as large as the thickness (b) of the adhesive layer. This allows the force to be scattered over the entire width of the tape when a large winding pressure is applied, and also strongly inhibits weaving since the adhesive is fixed at the depressed part. Therefore, shear in the rolled form is inhibited when the tension applied to the tape grows larger as the application rate grows faster or when the tape is under storage. Furthermore, even when the rolled-up length of the tape is long, an extremely stable product which allows little weaving, is obtained.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、テープ基材表面の
幅方向に粘着剤を部分的に塗布して、非粘着部分と粘着
部分との組合せを少なくとも1対以上設けて成る(以
下、「部分粘着剤塗工」ともいう。)粘着テープに関
し、テープの巻き形状を安定化させることを主たる目的
とする。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention comprises at least one pair of a non-adhesive portion and an adhesive portion provided by partially applying an adhesive in the width direction of the surface of a tape base material (hereinafter, referred to as "the adhesive"). Also referred to as "partial pressure-sensitive adhesive coating.") The main purpose of the pressure-sensitive adhesive tape is to stabilize the winding shape of the tape.

【0002】[0002]

【従来の技術】従来の部分粘着剤塗工の感圧性粘着テー
プは、粘着部分が非粘着部分よりも粘着剤層の厚み分だ
け粘着テープ全体の総厚みが高まるので、テープ状に巻
いた場合、巻き圧力が加わると、粘着剤が塗布された部
分に力が集中して巻きズレを起こしやすい。巻きズレを
起こすと、テープ取り付け治具にセット出来ない。ま
た、見栄えが悪い事が多く見受けられた。
2. Description of the Related Art In a conventional pressure-sensitive adhesive tape coated with a partial adhesive, since the total thickness of the entire adhesive tape is increased by the thickness of the adhesive layer in the adhesive portion compared to the non-adhesive portion, the tape is wound in a tape shape. When the winding pressure is applied, the force is concentrated on the portion where the adhesive is applied, and the winding is easily shifted. If the roll is misaligned, it cannot be set on the tape attachment jig. Also, the appearance was often bad.

【0003】[0003]

【発明が解決しようとする課題】本発明は、上記欠点を
なくし、テープの巻きズレが起きにくい粘着テープの提
供を目的とする。
SUMMARY OF THE INVENTION An object of the present invention is to provide an adhesive tape which eliminates the above-mentioned drawbacks and is less likely to cause a tape displacement.

【0004】[0004]

【課題を解決するための手段】本発明者は、テープ全体
の総厚みを均一化させるために基材に窪みを設け、その
窪みの中に、および/または窪みと反対側の基材面に、
粘着剤を配することで、上記課題を解決するに至った。
In order to make the total thickness of the entire tape uniform, the present inventor has provided a depression in the substrate, and in the depression and / or on the surface of the substrate opposite to the depression. ,
By arranging the adhesive, the above problem has been solved.

【0005】すなわち、本発明は、次の通りである。 テープ基材の表面の幅方向に粘着剤が配された領域を
部分的に有する粘着テープにおいて、粘着剤塗布領域に
おける基材の片面または両面に凹部が形成されている粘
着テープ。 粘着剤が配されたテープ基材面に凹部が形成されてい
るの粘着テープ。 粘着剤が配されたテープ基材面に対して反対側の面に
凹部が形成されているの粘着テープ。 粘着剤が配されたテープ基材の両面に凹部が形成され
ているの粘着テープ。 凹部の深さ(基材の表面を基準とする。但し、テープ
基材の両面の相対する部位の両面に凹部が形成されてい
る場合には、相対する両面の凹部の深さの合計)が粘着
剤層の厚みの0.1倍〜1.2倍であるの粘着テー
プ。
That is, the present invention is as follows. A pressure-sensitive adhesive tape having a pressure-sensitive adhesive tape partially having a region where a pressure-sensitive adhesive is arranged in a width direction of a surface of a tape substrate, wherein a concave portion is formed on one or both surfaces of the substrate in a pressure-sensitive adhesive applied region. An adhesive tape in which a concave portion is formed on a surface of a tape substrate on which an adhesive is disposed. An adhesive tape having a concave portion formed on a surface opposite to a surface of a tape substrate on which an adhesive is disposed. An adhesive tape in which concave portions are formed on both sides of a tape base on which an adhesive is disposed. The depth of the recess (based on the surface of the base material; however, when recesses are formed on both sides of the opposite portion of the tape base material, the sum of the depths of the recesses on the opposite sides) An adhesive tape having a thickness of 0.1 to 1.2 times the thickness of the adhesive layer.

【0006】[0006]

【発明の実施の形態】本発明に用いられる基材として
は、特に制限はないが、例えば、ポリプロピレン、ポリ
エステル、ポリエチレン、ポリ塩化ビニルなどのプラス
チック基材が挙げられる。本発明で使用される基材に
は、必要に応じて、背面処理または下塗りなどを行って
もよい。背面処理は長鎖アルキル系剥離剤またはシリコ
ーン系剥離剤などが使用される。本発明で使用される基
材の厚みは、通常10〜150μm程度、好ましくは2
0〜60μmである。
DESCRIPTION OF THE PREFERRED EMBODIMENTS The substrate used in the present invention is not particularly limited, and examples thereof include plastic substrates such as polypropylene, polyester, polyethylene and polyvinyl chloride. The substrate used in the present invention may be subjected to a back surface treatment or an undercoat, if necessary. For the back surface treatment, a long-chain alkyl-based release agent or a silicone-based release agent is used. The thickness of the substrate used in the present invention is usually about 10 to 150 μm, preferably 2 to 150 μm.
0 to 60 μm.

【0007】基材の表面に形成される凹部は、通常、テ
ープの長手方向(経方向)に連続的なものであるが、所
定間隔を空けた断続的なものであってもよい。凹部は、
粘着剤が塗布されているテープ基材面および/またはそ
の反対側の面であって、テープ基材の表面の幅方向に粘
着剤が塗布された領域に設けられる。ただし、テープ基
材の表面の幅方向に粘着剤が塗布された領域(粘着剤塗
布領域)とは、塗布された粘着剤がテープ基材の表面上
を実際に占める領域に限るものではなく、多少の広狭の
ものであってもよい。
The recesses formed on the surface of the substrate are generally continuous in the longitudinal direction (longitudinal direction) of the tape, but may be intermittent at predetermined intervals. The recess is
The tape is provided on the surface of the tape substrate on which the pressure-sensitive adhesive is applied and / or on the surface opposite to the surface, on which the pressure-sensitive adhesive is applied in the width direction of the surface of the tape substrate. However, the area where the pressure-sensitive adhesive is applied in the width direction of the surface of the tape base material (adhesive application area) is not limited to the area where the applied pressure-sensitive adhesive actually occupies the surface of the tape base material. It may be somewhat wide or narrow.

【0008】テープ基材の表面に凹部を形成する方法と
しては、例えば以下の方法が挙げられる。 プラスチック基材に部分的に熱を加え、その時、幅方
向に引っ張り、熱のかかった部分だけを引き伸ばす。引
き伸ばされた部分は厚みが薄くなり、その薄くなった部
分が本発明における凹部を構成する。 基材を押し出し成形するとき、押し出された基材の幅
方向の一部領域が薄くなるようなダイを予め押出機の出
口先端に取り付け、溶融樹脂を押し出して、薄膜部分を
形成する。この薄膜部分が本発明における凹部を構成す
る。 プラスチック基材を基材の幅よりも細い幅の熱ロール
で圧着して、基材の表面の一部領域に物理的に窪みを持
たせる。この窪みが本発明における凹部を構成する。
As a method of forming a concave portion on the surface of the tape substrate, for example, the following method can be mentioned. Heat is applied partially to the plastic substrate, and then it is stretched in the width direction to stretch only the heated portions. The stretched portion has a reduced thickness, and the thinned portion constitutes a concave portion in the present invention. When extruding a base material, a die in which a part of the extruded base material in the width direction is thinned is attached in advance to the exit end of the extruder, and the molten resin is extruded to form a thin film portion. This thin film portion constitutes the concave portion in the present invention. The plastic substrate is pressed with a hot roll having a width smaller than the width of the substrate, so that a part of the surface of the substrate is physically recessed. This depression constitutes the concave portion in the present invention.

【0009】本発明に用いられる粘着剤としては、特に
制限されるものではなく公知の粘着剤を適宜選択して使
用することができる。例えば、ゴム系粘着剤、アクリル
系粘着剤およびシリコーン系粘着剤などが挙げられる。
The pressure-sensitive adhesive used in the present invention is not particularly limited, and a known pressure-sensitive adhesive can be appropriately selected and used. For example, a rubber-based adhesive, an acrylic-based adhesive, and a silicone-based adhesive can be used.

【0010】ゴム系粘着剤は、天然ゴム系および合成ゴ
ム系粘着剤の何れを用いてもよい。合成ゴム系粘着剤と
しては、例えば、スチレン−イソプレンブロック共重合
体(SIS)、スチレン−ブタジエンゴム(SBR)、
イソプレンゴム(IR)、ポリイソブチレン(PI
B)、ブチルゴム(IIR)などのゴム系ポリマーを主
体とする粘着剤が挙げられる。
As the rubber-based pressure-sensitive adhesive, any of a natural rubber-based pressure-sensitive adhesive and a synthetic rubber-based pressure-sensitive adhesive may be used. Examples of the synthetic rubber-based adhesive include styrene-isoprene block copolymer (SIS), styrene-butadiene rubber (SBR),
Isoprene rubber (IR), polyisobutylene (PI
B) and an adhesive mainly composed of a rubber-based polymer such as butyl rubber (IIR).

【0011】アクリル系粘着剤としては、例えば、エチ
ルアクリレート、メチルメタクリレート、2−ヒドロキ
シエチルアクリレート、ブチルアクリレート、2−エチ
ルヘキシルアクリレート等の(メタ)アクリル酸アルキ
ルエステルモノマーや、アクリル酸、メタクリル酸、イ
タコン酸、マレイン酸、クロトン酸等のカルボキシル基
含有モノマーなどのアクリル系モノマーの単独重合体あ
るいは共重合体が挙げられる。さらに、これらのモノマ
ーと該モノマーと共重合可能なモノマーとの共重合体な
ども挙げられる。具体的には、アクリル酸またはメタク
リル酸等のアルキルエステル系ポリマー、あるいはアク
リル酸またはメタクリル酸等のアルキルエステル50〜
99.5重量%と、これと共重合可能な他の不飽和単量
体0.5〜50重量%との共重合体からなる平均分子量
が5,000〜3,000,000のアクリル系ポリマ
ー等を主体とする粘着剤等が挙げられる。重合は、特に
制限はされず、例えば、溶液重合、エマルジョン重合、
塊状重合、けん濁重合などが挙げられる。
Examples of the acrylic pressure-sensitive adhesive include alkyl (meth) acrylate monomers such as ethyl acrylate, methyl methacrylate, 2-hydroxyethyl acrylate, butyl acrylate, and 2-ethylhexyl acrylate, acrylic acid, methacrylic acid, and itacone. A homopolymer or a copolymer of an acrylic monomer such as a carboxyl group-containing monomer such as an acid, maleic acid, and crotonic acid may be used. Further, copolymers of these monomers and monomers copolymerizable with the monomers are also included. Specifically, an alkyl ester polymer such as acrylic acid or methacrylic acid, or an alkyl ester polymer such as acrylic acid or methacrylic acid
Acrylic polymer having an average molecular weight of 5,000 to 3,000,000, comprising a copolymer of 99.5% by weight and 0.5 to 50% by weight of another copolymerizable unsaturated monomer. And the like. Polymerization is not particularly limited, for example, solution polymerization, emulsion polymerization,
Examples include bulk polymerization and suspension polymerization.

【0012】シリコーン系粘着剤としては、例えば、過
酸化物架橋型シリコーン系粘着剤、ヒドロシリル型(付
加反応型)シリコーン系粘着剤などの公知のシリコーン
系粘着剤が挙げられる。
Examples of the silicone-based pressure-sensitive adhesive include known silicone-based pressure-sensitive adhesives such as a peroxide-crosslinkable silicone-based pressure-sensitive adhesive and a hydrosilyl-type (addition-reaction-type) silicone-based pressure-sensitive adhesive.

【0013】粘着剤には必要に応じて、石油系樹脂、テ
ルペン系樹脂、ロジン系樹脂、クマロン系樹脂などの粘
着付与剤、架橋剤、タッキファイヤー、軟化剤、老化防
止剤、充填剤、離型剤、可塑剤、安定剤、顔料、酸化防
止剤などの公知の添加剤が配合されていてもよい。
The pressure-sensitive adhesive may be, if necessary, a tackifier such as a petroleum resin, a terpene resin, a rosin resin, a cumarone resin, a crosslinking agent, a tackifier, a softener, an antioxidant, a filler, a release agent, or the like. Known additives such as a mold agent, a plasticizer, a stabilizer, a pigment, and an antioxidant may be blended.

【0014】基材に粘着剤を塗布するに際しては、自体
既知の方法で行えばよい。例えば、上記の粘着剤をトル
エン、酢酸エチル等の溶剤に溶解し、得られる粘着剤溶
液をロールコーター、グラビアコーター、キスコーター
等を用いて塗布する方法等が挙げられる。粘着剤層の厚
み(乾燥後)は目的によって適宜決定され、通常5〜1
00μm程度であり、好ましくは10〜40μmであ
る。ただし、粘着剤が基材の表面に塗布されるとき、す
なわち基材の表面に形成された凹部に粘着剤が塗布され
るときは、粘着剤層の厚み(乾燥後)は、5〜100μ
m程度であり、好ましくは10〜40μm程度とする。
The application of the pressure-sensitive adhesive to the substrate may be performed by a method known per se. For example, there is a method in which the above-mentioned pressure-sensitive adhesive is dissolved in a solvent such as toluene or ethyl acetate, and the obtained pressure-sensitive adhesive solution is applied using a roll coater, a gravure coater, a kiss coater, or the like. The thickness (after drying) of the pressure-sensitive adhesive layer is appropriately determined depending on the purpose, and is usually 5 to 1
It is about 00 μm, preferably 10 to 40 μm. However, when the pressure-sensitive adhesive is applied to the surface of the substrate, that is, when the pressure-sensitive adhesive is applied to the concave portion formed on the surface of the substrate, the thickness of the pressure-sensitive adhesive layer (after drying) is 5 to 100 μm.
m, and preferably about 10 to 40 μm.

【0015】テープ基材の表面の幅方向において、粘着
剤が塗布された領域と、粘着剤が塗布されていない領域
との比率は、通常、0.1:99.9〜50:50であ
り、好ましくは1:99〜20:80である。基材の表
面に形成された凹部に粘着剤を塗布するときは、凹部の
深さは、粘着剤層の厚みの0.1倍〜1.2倍が好まし
く、特に0.8倍〜1.2倍、さらに0.9倍〜1.1
倍がより好ましい。なお、この深さの基準は基材の表面
を基準とするものである。また、テープ基材の相対する
部位の両面に凹部が形成されている場合であって、その
相対する両面の凹部に粘着剤領域を形成する場合(図4
の態様)には、その各々の凹部の深さは、上記に述べた
厚みであればよく、その相対する両面に凹部が形成さ
れ、しかもその片面の凹部のみに粘着剤領域を形成する
場合(図3の態様)には上記0.8倍〜1.2倍の厚み
は相対する両面の凹部の深さの合計についてのものであ
る。
In the width direction of the surface of the tape substrate, the ratio of the area where the adhesive is applied to the area where the adhesive is not applied is usually 0.1: 99.9 to 50:50. , Preferably 1:99 to 20:80. When the pressure-sensitive adhesive is applied to the concave portion formed on the surface of the base material, the depth of the concave portion is preferably 0.1 to 1.2 times the thickness of the pressure-sensitive adhesive layer, and particularly preferably 0.8 to 1. 2 times, further 0.9 times to 1.1 times
Double is more preferred. In addition, the reference of this depth is based on the surface of the base material. Further, the case where concave portions are formed on both surfaces of the opposite portion of the tape base material and the case where an adhesive region is formed in the concave portions of the opposite both surfaces (FIG. 4)
In the embodiment, the depth of each of the recesses may be the thickness described above, and the recesses are formed on both opposing surfaces, and the pressure-sensitive adhesive region is formed only on the recesses on one side ( In the embodiment of FIG. 3), the thickness of 0.8 to 1.2 times refers to the sum of the depths of the concave portions on the opposite surfaces.

【0016】上記した基材の少なくとも片面に粘着剤を
塗布して粘着剤層を設けることにより、本発明の粘着テ
ープが得られる。本発明の粘着テープは、基材の両面に
形成された凹部に粘着剤層を設けることにより、両面粘
着テープとすることができる。基材の両面に粘着剤層を
設けるときは、例えば、基材の両面に形成された凹部に
直接粘着剤を塗布して粘着剤層を形成したり、基材の凹
部に相対する剥離紙上の位置に粘着剤を塗布・乾燥させ
て、剥離紙上に粘着剤層を予め形成した後、基材表面の
凹部に粘着剤層を転写する方法を採用すればよい。
The pressure-sensitive adhesive tape of the present invention can be obtained by applying a pressure-sensitive adhesive to at least one surface of the above-mentioned substrate and providing a pressure-sensitive adhesive layer. The pressure-sensitive adhesive tape of the present invention can be formed into a double-sided pressure-sensitive adhesive tape by providing a pressure-sensitive adhesive layer in concave portions formed on both surfaces of the substrate. When providing the pressure-sensitive adhesive layer on both sides of the substrate, for example, directly apply the pressure-sensitive adhesive to the recesses formed on both sides of the substrate to form the pressure-sensitive adhesive layer, or on the release paper facing the recesses of the substrate A method in which an adhesive is applied to the position and dried to form an adhesive layer on release paper in advance, and then the adhesive layer is transferred to a concave portion on the surface of the base material may be adopted.

【0017】[0017]

【実施例】本発明の実施例および比較例を以下に示す
が、本発明はこれらによって限定されるものではない。
EXAMPLES Examples and comparative examples of the present invention are shown below, but the present invention is not limited by these examples.

【0018】〔実施例1〕Tダイでポリエチレンを溶融
押し出しすることによって、図1に示すように、凹部を
有するポリエチレンフィルム(厚み20μm)を基材と
して得た。凹部の深さ(a)は、4μmであった。この
凹部の中に、ダイコーターにて天然ゴム系粘着剤を塗布
し、天然ゴム系粘着剤層を形成して、幅方向に粘着剤が
塗布された領域(A)を部分的に有する粘着テープを作
製した。天然ゴム系粘着剤層の厚み(b)は、40μm
であった。
Example 1 A polyethylene film having a concave portion (thickness: 20 μm) was obtained as shown in FIG. 1 by melt-extruding polyethylene using a T-die. The depth (a) of the concave portion was 4 μm. A natural rubber-based pressure-sensitive adhesive is applied to the recess by a die coater to form a natural rubber-based pressure-sensitive adhesive layer, and the pressure-sensitive adhesive tape partially has a region (A) to which the pressure-sensitive adhesive is applied in the width direction Was prepared. The thickness (b) of the natural rubber-based pressure-sensitive adhesive layer is 40 μm
Met.

【0019】〔実施例2〕凹部と反対側の基材面に天然
ゴム系粘着剤層(厚み40μm)を形成した以外は、実
施例1と同様にして図2に示す粘着テープを作製した。
Example 2 An adhesive tape shown in FIG. 2 was produced in the same manner as in Example 1 except that a natural rubber-based pressure-sensitive adhesive layer (40 μm in thickness) was formed on the substrate surface opposite to the concave portion.

【0020】〔実施例3〕図3に示すように、基材とし
ての二軸延伸ポリプロピレンフィルム(厚み40μm)
に部分的に熱を加え、幅方向に引っ張り、熱のかかった
部分だけを引き伸ばして、フィルムの両面に凹部を形成
した。各凹部の深さ(a)は、20μmであった。この
各凹部の中に、ダイコーターにて天然ゴム系粘着剤を塗
布し、天然ゴム系粘着剤層を形成して、幅方向に粘着剤
が塗布された領域(A)を部分的に有する粘着テープを
作製した。天然ゴム系粘着剤層の厚み(b)は、17μ
mであった。
Example 3 As shown in FIG. 3, a biaxially oriented polypropylene film (40 μm thick) as a substrate
The film was partially heated, pulled in the width direction, and only the heated portion was stretched to form recesses on both surfaces of the film. The depth (a) of each recess was 20 μm. A natural rubber-based pressure-sensitive adhesive is applied to each of the concave portions by a die coater to form a natural rubber-based pressure-sensitive adhesive layer, and the pressure-sensitive adhesive partially has a region (A) where the pressure-sensitive adhesive is applied in the width direction. A tape was made. The thickness (b) of the natural rubber-based pressure-sensitive adhesive layer is 17 μm.
m.

【0021】〔比較例〕50mmの幅の二軸延伸ポリプ
ロピレンフィルム(厚み40μm)の幅方向端部から2
0mmの部分に、ここを中心とする幅10mm、厚み3
0μmの粘着剤層を形成して粘着テープを作製した。粘
着剤は、天然ゴム系粘着剤を使用し、塗布は、ダイコー
ターにて行った。
[Comparative Example] A biaxially oriented polypropylene film having a width of 50 mm (thickness: 40 μm) was measured from the end in the width direction by 2 mm.
0mm part, width 10mm and thickness 3 centered here
An adhesive layer having a thickness of 0 μm was formed to produce an adhesive tape. As the pressure-sensitive adhesive, a natural rubber-based pressure-sensitive adhesive was used, and the application was performed with a die coater.

【0022】〔試験例〕上記の実施例および比較例によ
り得られた各シートを高速に巻いて、下記の条件下でテ
ープを保持したときの巻きズレの評価を行った。評価
は、巻き取ったテープを40℃にて3日間放置し、側面
のズレ量で判定した。側面のズレ量が、1.0mm未満
のときには「○」、1.0mm以上2.0以下のときに
は「△」、2.1以上のときには「×」を表1に記し
た。
[Test Example] Each of the sheets obtained in the above Examples and Comparative Examples was wound at a high speed, and the evaluation of the winding deviation when the tape was held under the following conditions was evaluated. The evaluation was performed by leaving the wound tape at 40 ° C. for 3 days and determining the amount of side displacement. Table 1 shows “○” when the amount of deviation of the side face is less than 1.0 mm, “Δ” when it is 1.0 mm or more and 2.0 or less, and “×” when it is 2.1 or more.

【0023】[0023]

【表1】 [Table 1]

【0024】[0024]

【発明の効果】本発明の粘着テープによれば、巻き圧力
が大きくかかってもテープ幅全体に力が分散し、また凹
部に粘着剤が固定されることにより、巻きずれが非常に
起こりにくい。したがって、塗工速度が速くなって、テ
ープにかかるテンションが大きくなったとき、あるいは
保存状態でのテープの巻き姿のズレを生じにくい。さら
にテープ巻き長さが長いときでも非常に安定した巻きズ
レの発生しにくい製品を得ることが可能である。
According to the pressure-sensitive adhesive tape of the present invention, even if a high pressure is applied, the force is dispersed over the entire width of the tape, and the pressure-sensitive adhesive is fixed in the concave portion, so that the winding deviation is very unlikely to occur. Therefore, when the coating speed is increased and the tension applied to the tape is increased, or when the tape is wound in a stored state, the tape is hardly displaced. Further, even when the tape winding length is long, it is possible to obtain a product which is very stable and does not easily cause a winding deviation.

【図面の簡単な説明】[Brief description of the drawings]

【図1】実施例1の粘着テープの幅方向断面図である。FIG. 1 is a cross-sectional view in the width direction of an adhesive tape of Example 1.

【図2】実施例2の粘着テープの幅方向断面図である。FIG. 2 is a cross-sectional view in the width direction of the pressure-sensitive adhesive tape of Example 2.

【図3】実施例3の粘着テープの幅方向断面図である。FIG. 3 is a cross-sectional view in the width direction of the pressure-sensitive adhesive tape of Example 3.

【符号の説明】[Explanation of symbols]

A:粘着剤塗布領域 a:凹部の深さ b:粘着剤層の厚み A: adhesive application area a: depth of concave portion b: thickness of adhesive layer

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 テープ基材の表面の幅方向に粘着剤が配
された領域を部分的に有する粘着テープにおいて、粘着
剤塗布領域における基材の片面または両面に凹部が形成
されている粘着テープ。
1. A pressure-sensitive adhesive tape partially having a region in which a pressure-sensitive adhesive is arranged in a width direction of a surface of a tape substrate, wherein a concave portion is formed on one or both surfaces of the substrate in a pressure-sensitive adhesive applied region. .
【請求項2】 粘着剤が配されたテープ基材面に凹部が
形成されている請求項1記載の粘着テープ。
2. The pressure-sensitive adhesive tape according to claim 1, wherein a concave portion is formed on the surface of the tape substrate on which the pressure-sensitive adhesive is disposed.
【請求項3】 粘着剤が配されたテープ基材面に対して
反対側の面に凹部が形成されている請求項1記載の粘着
テープ。
3. The pressure-sensitive adhesive tape according to claim 1, wherein a concave portion is formed on a surface opposite to a surface of the tape substrate on which the pressure-sensitive adhesive is disposed.
【請求項4】 粘着剤が配されたテープ基材の両面に凹
部が形成されている請求項1記載の粘着テープ。
4. The pressure-sensitive adhesive tape according to claim 1, wherein concave portions are formed on both surfaces of the tape substrate on which the pressure-sensitive adhesive is disposed.
【請求項5】 凹部の深さが粘着剤層の厚みの0.1倍
〜1.2倍である請求項1記載の粘着テープ。
5. The pressure-sensitive adhesive tape according to claim 1, wherein the depth of the concave portion is 0.1 to 1.2 times the thickness of the pressure-sensitive adhesive layer.
JP2533698A 1998-02-06 1998-02-06 Adhesive tape Pending JPH11222581A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2533698A JPH11222581A (en) 1998-02-06 1998-02-06 Adhesive tape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2533698A JPH11222581A (en) 1998-02-06 1998-02-06 Adhesive tape

Publications (1)

Publication Number Publication Date
JPH11222581A true JPH11222581A (en) 1999-08-17

Family

ID=12163086

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2533698A Pending JPH11222581A (en) 1998-02-06 1998-02-06 Adhesive tape

Country Status (1)

Country Link
JP (1) JPH11222581A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001345415A (en) * 2000-06-01 2001-12-14 Nitto Denko Corp Lead frame laminate and manufacturing method of semiconductor component
US8247057B2 (en) 2005-09-16 2012-08-21 3M Innovative Properties Company Cover tape and method for manufacture
US8323442B2 (en) 2006-08-09 2012-12-04 3M Innovative Properties Company Carrier tapes having tear-initiated cover tapes and methods of making thereof
JP2015134861A (en) * 2014-01-16 2015-07-27 紫朗 高梨 adhesive sheet

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001345415A (en) * 2000-06-01 2001-12-14 Nitto Denko Corp Lead frame laminate and manufacturing method of semiconductor component
JP4619486B2 (en) * 2000-06-01 2011-01-26 日東電工株式会社 Lead frame laminate and method for manufacturing semiconductor component
US8247057B2 (en) 2005-09-16 2012-08-21 3M Innovative Properties Company Cover tape and method for manufacture
US8323442B2 (en) 2006-08-09 2012-12-04 3M Innovative Properties Company Carrier tapes having tear-initiated cover tapes and methods of making thereof
JP2015134861A (en) * 2014-01-16 2015-07-27 紫朗 高梨 adhesive sheet

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