JPH11220191A - Solid-state laser - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the working efficiency of assembly or maintenance by facilitating the assembly around a laser oscillator, and at the same time by reducing the number of installations/removals of connectors or pipings. SOLUTION: A laser oscillation part assembly is constituted of a pair of lower manifold blocks 10 and 12, a plurality of positioning pins 14, and an oscillator chamber 18 mounted on the lower manifold blocks 10 and 12 by a plurality of bolts 16. External piping connectors 20 and 22 of the lower manifold blocks 10 and 12 are connected to a piping 32 for a cooling-water supply line from a cooling-water supply source and the piping for a recovery line, respectively. An upper manifold is constituted of a solid-state oscillator built into the oscillator chamber 18, a pair of upper manifold blocks, and a base plate 38. In the oscillator chamber 18, the cooling medium passage for each part of the oscillator is connected to the external connection port of the upper manifold by piping or the like.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0010]

The present invention relates to a solid-state laser device, and more particularly to a mechanism for supplying a cooling medium to a laser oscillator.

[0020]

2. Description of the Related Art FIGS. 7 and 8 show a configuration of a laser oscillator using a slab type solid-state laser medium.

The laser oscillator includes a slab-shaped solid laser medium 100, a heat-conductive holding section for cooling while supporting or holding the solid laser medium 100, and an excitation section for supplying excitation light to the solid laser medium 100. And

The solid-state laser medium 100 is, for example, Nd: Y
AG, Nd: GGG, Nd: Cr; made of a medium material such as GSGG, and having a rectangular parallelepiped with a rectangular cross section, and having both end faces 1
00a and 100b are cut at a predetermined angle obliquely to the optical axis direction (longitudinal direction).

Of the four side surfaces of the solid-state laser medium 100, a pair of parallel side surfaces 100c and 100d, which form an oblique angle with respect to both end surfaces 100a and 100b, have an inner side that totally reflects the laser beam LB in the medium. The outer side of the reflection surface is an excitation surface that receives irradiation (supply) of excitation light, and a pair of side surfaces 100e and 100f that are perpendicular to the total reflection surface or the excitation surfaces 100c and 100d and parallel to each other are cooled by a heat transfer method. It is a cooling surface.

The holding portion is made of a material having a high thermal conductivity, such as a block of copper or aluminum, which holds the solid-state laser medium 100 in direct contact with the upper and lower cooling surfaces 100e and 100f of the solid-state laser medium 100. It is composed of holding parts 102 and 104.

As shown in FIG. 7, a longitudinal groove 104a is formed at the center of the upper surface of the lower holding portion 104.
The solid-state laser medium 100 is placed in the groove 104a with the lower cooling surface 100f facing downward. Then, the upper holding portion 102 is put on the lower holding portion 104 from above, and the convex portion 102a of the upper holding portion 102 comes into contact with the upper cooling surface 100e of the solid-state laser medium 100 with a predetermined pressing force.

The upper and lower holders 102, 10
Cooling water passages for flowing a cooling medium, for example, cooling water, are provided inside the cooling water passage 4, and at the inlet and outlet of each cooling water passage, connectors [106, 108] for pipe connection,
[110, 112] are attached.

A piping (not shown) and ports [106, 108], [110, 1] are supplied from a cooling water supply source (not shown).
12], the cooling water circulated and supplied through the respective cooling water passages cools both holding portions 102 and 104, so that the solid-state laser medium 100 is cooled by both holding portions in a heat transfer manner. Has become.

The excitation section is provided with a plurality of, for example, four semiconductor laser units 114A, 114A, which are arranged in the recesses of the lower holding section 104b so as to irradiate the excitation surfaces 100c, 100d of the solid-state laser medium 100 with the excitation laser beam EB. 114
B, 114C and 114D.

In each of the semiconductor laser units 114, a semiconductor laser for an excitation light source, for example, a laser diode (LD) is provided in a line between one end (front surface) of a main body made of a metal having a high thermal conductivity and conductivity, for example, copper. This laser diode array LDA is
00 excitation planes 100c and 100d.

A cooling water passage for flowing a cooling medium, such as cooling water, is provided inside the main body of each semiconductor laser unit 114, and piping connectors [116, 118] are attached to the inlet and outlet of the cooling water passage. ing. Cooling water circulated and supplied from a cooling water supply source (not shown) through a pipe (not shown) and ports [116, 118] flows through a cooling water passage in the unit, and a laser diode
Heat generated by array LDA is absorbed by cooling water (radiation)
It is supposed to be.

As shown in FIG. 8, the laser beam LB oscillated and output by the laser oscillator is transmitted between the total reflection surfaces on the back side (inside) of the pair of parallel excitation surfaces 100c and 100d in the solid-state laser medium 100. The output mirror 120 and the total reflection mirror 122 take a zigzag optical path while repeating reflection, and face both end faces 100a and 100b.
Repetition of reflection between the (optical resonator mirrors) results in resonance amplification and emission from the output mirror 120.

[0140]

As described above, in this type of solid-state laser device, a cooling medium supply source supplies cooling medium to a cooling medium passage provided in each block or unit constituting a holding unit and an excitation unit of a laser oscillator. Supply of cooling medium. Conventionally, the ports (inlet / outlet) of the cooling medium passage of each block or unit are individually connected to a cooling medium supply source via each dedicated pipe.

However, in such a cooling medium supply mechanism, since a large number of individual pipes are routed in a complicated manner, it is difficult to form an integrated small assembly around the laser oscillator. At the time of attachment / detachment, there is an inconvenience that connectors / plumbing must be attached / detached for all blocks or units.

The present invention has been made in view of the above-mentioned problems, and facilitates assembly around a laser oscillator, and improves the workability of assembling or maintenance by reducing attachment / detachment of connectors or piping. It is an object of the present invention to provide a solid-state laser device as described above.

[0170]

To achieve the above object, a first solid-state laser device according to the present invention is connected to a solid-state laser oscillator having a cooling medium passage and an excitation medium supply source via a pipe. A first manifold having an external connection port and an internal connection port communicating with the external connection port via an internal passage, wherein the internal connection port is provided so as to be exposed on a predetermined connection surface; An external connection port connected to the cooling medium passage of the oscillator via a pipe; and an internal connection port communicating with the external connection port via an internal passage, wherein the internal connection port is connected to the internal connection of the first manifold. A second manifold provided in a shape and size corresponding to a port and exposed on a predetermined connection surface, and the respective connection surfaces are butted against each other such that the corresponding internal connection ports are connected to each other. It has a configuration comprising a coupling means for detachably coupling the first and second manifold.

Further, the second solid-state laser device of the present invention comprises:
In the first solid-state laser device, the second manifold includes a part of a base plate supporting the laser oscillator.

Further, the third solid-state laser device of the present invention comprises:
In the first or second solid-state laser device, the solid-state laser oscillator is a slab-type solid-state laser medium, a heat-conductive holding unit that holds the solid-state laser medium in contact with a cooling surface of the solid-state laser medium, An oscillator chamber that includes an excitation unit that supplies excitation light to an excitation surface of the solid-state laser medium and the second manifold; and an optical resonator mirror that is disposed outside the oscillator chamber. Each of the excitation units has a cooling medium passage.

A fourth solid-state laser device according to the present invention, in the third solid-state laser device, wherein the coupling means is fixedly attached to a support member common to the first manifold, and a predetermined portion of the oscillator chamber is provided. A positioning member for detachably engaging with the first manifold and a positioning member for detachably engaging the second manifold with the first manifold, and the oscillator chamber being detachably attached to the first manifold. And a fixing member for fixing the fixing member.

[0210]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS.

FIGS. 1 to 3 show the configuration of a laser oscillation unit assembly of a solid-state laser device according to an embodiment of the present invention. 1 is an exploded perspective view, FIG. 2 is a perspective view, and FIG. 3 is a bottom view.

As shown in FIGS. 1 and 2, this laser oscillation section assembly is composed of a pair of rectangular parallelepiped lower manifold blocks 10 and 12 each fixedly mounted on a substrate (not shown) of the apparatus main body. Locating pins 14 and these lower manifold blocks 10,
And an oscillator chamber 18 positioned on the positioning pin 14 by a positioning pin 14 and removably mounted by a plurality of bolts 16. In the oscillator chamber 18,
For example, a laser oscillator assembly (not including an optical resonator mirror) similar to that shown in FIG. 7 is incorporated.

Each lower manifold block 10, 12
Is made of metal with good workability, for example, aluminum,
External connection ports (not shown) are provided on one side surface 10a, 12a, and the external connection connectors 2
0 and 22 are respectively attached. Block 1
0, 12 flat upper surfaces 10b, 12b are connection surfaces,
A plurality of, for example, six internal connection ports [24A to 24F] and [26A to 26F] are respectively exposed on these connection surfaces 10b and 12b.

As will be described later, the internal passages [1] of the supply system are provided inside the lower manifold blocks 10 and 12.
1, 13] and the internal passages [15, 17] of the recovery system (FIG. 6). In this embodiment, the pair of lower manifold blocks 10 and 12 constitute a lower (first) manifold.

In addition, the lower manifold block 10,
A pair of external connection ports (not shown) for exchanging a cooling medium, such as cooling water, between lower manifold blocks is provided on each of the inner surfaces 10c, 12c (10c is not shown) of each of the inner surfaces 10c. A pair of piping connectors [28A, 28B], [30A, 30B] at the external connection port
Are respectively attached. As shown in FIG. 3, these piping connectors [28A, 28B], [30A, 30
B] are connected to each other below the oscillator chamber 18 via pipes 27 and 29.

In FIG. 1 and FIG. 2, the piping connector 20 on one lower manifold block 10 side is connected to a piping 32 of a cooling water supply line from a cooling water supply source. The piping connector 22 on the other lower manifold block 12 side is connected to a piping 34 of a cooling water recovery (drain) line of a cooling water supply source. Upper surfaces (connection surfaces) 10b, 12b of both lower manifold blocks 10, 12
Is formed with a screw hole 36 for receiving and screwing the mounting bolt 16.

The oscillator chamber 18 has a base plate 38 made of a metal having good workability, for example, aluminum, and a box-shaped cover 40 which is detachably mounted so as to cover the base plate 38. .

At the periphery of the base plate 38, bolt through holes 38a are formed at positions corresponding to the screw holes 36 of the lower manifold blocks 10, 12, and the positioning pins 1
4, a pin through hole 38b is formed, and a pair of holes 38c for passing pipes 42, 44 and electric cables 46, 48 are also formed.

The base plate 38 has internal connection ports [24A to 24A] of the lower manifold blocks 10 and 12.
F], [26A-26F], and internal connection ports [38A-38F] formed of through holes of a shape and size to be fitted with those internal connection ports, respectively.
[38A 'to 38F'] are provided.

Note that, for simplicity of illustration, the base plate 38
Internal connection ports [38A-38F], [38A'-38]
F ′], only a part (38B, 38D, 38F) is shown in FIG. 5, and the other external connection ports are not shown.

Among them, the lower manifold block 1
Pipe connectors 50 and 52 are attached to upper outlets of the internal connection ports 38A and 38A 'of the base plate 38 facing the internal connection ports 24A and 26A of 0 and 12, respectively. One end of each of the 44 is connected.

In this embodiment, an upper manifold is constituted by the base plate 38 and a pair of upper manifold blocks 72, 74 described later, and faces the upper surfaces (connection surfaces) 10b, 12b of the lower manifold blocks 10, 12. The lower surface portion of the base plate 38 forms a connection surface of the lower manifold.

On the upper surface of the cover 40, a terminal connection plate 56, which is formed by fixing a pair of contacts 54 to an insulating plate, is mounted so as to float from the cover. The cables 58 and 60 and the electric cables 46 and 48 on the device side are electrically connected via the contacts 54 on the rear side of the connection plate 56.

The piping 42, 44 and the electric cable 46,
The reference numeral 48 passes under the oscillator chamber 18 through the piping / wiring through hole 38c of the base plate 38. Then, as shown in FIG. 3, the other ends of the pipes 42 and 44 are connected to pipe connectors 62 and 64 attached to the base plate 38, respectively.
The other ends of the electric cables 46 and 48 are connected to terminals 66 and 68 attached to the base plate 38, respectively. The piping connectors 62 and 64 are connected to a cooling water inlet connector 110 and an outlet connector 112 of the lower holding portion 104 of the laser oscillator via a joint pipe (not shown) provided in the oscillator chamber 18, respectively.

FIG. 4 is a plan view showing the configuration inside the oscillator chamber 18. FIG. 5 shows a partial cross-sectional structure of the upper manifold and the lower manifold. FIG. 6 schematically shows a fluid circuit system of the cooling water supply mechanism in the present embodiment.

As shown in FIG. 4, an assembly 70 of laser oscillators (100, 101, 103) is positioned at the center of the oscillator chamber 18 and mounted on the base plate 38, and a pair of rectangular parallelepipeds is provided on both sides thereof. The upper manifold blocks 72 and 74 are mounted on the base plate 38.

[0380] Upper manifold blocks 72, 74
Is made of metal with good workability, for example, aluminum,
It is integrally connected to the base plate 38 by bolts 65 to form an upper (second) manifold.

In the upper manifold blocks 72 and 74, internal connection ports (through holes) [38A to 3A] of the base plate 38 are provided.
8F] and [38A 'to 38F'] are provided with internal connection ports or internal passages corresponding to (communication with) the outlets of the respective internal paths, that is, external connection ports [72A to 72F],
Piping connectors [50, 71, 7] at [74A-74F]
3, 75, 77, 79], [52, 76, 78, 80,
82, 84].

For simplicity of illustration, the external connection ports [72A to 72A] of the upper manifold blocks 72 and 74 are provided.
F] and a part (72B, 72F) of [74A to 74F].
D, 72F) is shown in FIG. 5, and the other external connection ports are not shown.

As shown in FIG. 5, each of the internal connection ports [24A to 24F] of the lower manifold blocks 10 and 12
O-rings 21 and 23 are interposed as sealing members in [26A to 26F] and the internal connection ports [38A to 38F] and [38A 'to 38F'] of the base plate 38,
The water passage (inner passage) inside the manifold has a closed structure.

As shown schematically in FIG. 6, inside the lower manifold blocks 10 and 12, internal passages [11, 13] of the supply system and internal passages [15, 1] of the recovery system are provided.
7] are provided.

On the other hand, in the lower manifold block 10, an internal connection port [24A, 24
B, 24D, 24F] and piping connectors 20, 28A
The internal connection ports [24C, 24E] and the piping connector 28B communicate with the internal passage 15 of the recovery system.

In the other lower manifold block 12, an internal connection port [26C, 26
E] and the piping connector 30A communicate with each other, and the internal connection ports [26A, 26B, 26
D, 26F] and the piping connectors 22, 30B.

Accordingly, in one upper manifold block 72, the piping connectors [71, 75, 7
9] communicates with the internal passage 11 of the supply system of the lower manifold block 10, and the piping connectors [73, 77] communicate with the internal passage 15 of the collection system of the block 10.

In the other upper manifold block 74, the piping connector [80, 84] communicates with the internal passage 13 of the supply system of the lower manifold block 12,
A piping connector [76, 78, 82] communicates with the internal passage 17 of the collection system of the block 12.

The piping connector 50 on the base plate 38 communicates with the internal passage 11 of the supply system of the lower manifold block 10, and the piping connector 52 communicates with the internal passage 17 of the recovery system of the lower manifold block 12. I do.

In FIG. 4, one of the upper manifolds
The block 72 faces the back surfaces of the two semiconductor laser units 114A and 114B on one side of the laser oscillator assembly 70. The piping connectors 71 and 75 of the supply system of the upper manifold block 72 are unit 114A,
Connectors 116A, 11B on the inlet side of the cooling water passage 114B;
6B via piping (not shown), and piping connectors 73 and 77 of the recovery system are connected to the units 114A and 114A.
14B, a piping connector 118A, 1 on the outlet side of the cooling water passage.
18B via a pipe (not shown).

The other upper manifold block 74
Faces the back surfaces of the two semiconductor laser units 114C and 114D on the opposite side of the laser oscillator assembly 70. The piping connectors 80 and 84 of the supply system of the upper manifold block 74 are connected to the units 114C and 1C.
14D piping connector 116C, 1 on the inlet side of cooling water passage
16D via a pipe (not shown),
The collection system piping connectors 78 and 82 are connected to the unit 114C,
A piping connector 118C on the outlet side of the cooling water passage 114C,
118D is connected to each via a pipe (not shown).

The pair of piping connectors 85 and 86 attached to the upper surface 70a of the laser oscillator assembly 70 are connected to the cooling water passage inlet and outlet connectors 106 and 108 of the upper holding portion 102 via joint pipes (not shown). Each is connected. Outside the laser oscillator assembly 70, one pipe connector 85 is connected to a supply pipe connector 79 of the upper manifold block 72 via a pipe (not shown), and the other pipe connector 86 is connected to a pipe (not shown). Z)
Is connected to the piping connector 76 of the recovery system of the upper manifold block 74 via the

In this configuration, the cooling water sent from the cooling water supply source via the supply line piping 32 passes through the external piping connector 20 through the external connection port, and is supplied to the supply system in the lower manifold block 10. Enter the internal passage 11.

[0520] The cooling water is supplied from the internal passage 11 to the internal connection port [24] of the supply system of the lower manifold block 10.
A, 24B, 24D, 24F], and the corresponding internal connection ports [38A, 38B, 38D, 38] of the base plate 38.
F].

Among these, the internal connection port 38A of the base plate 38
The entered cooling water flows from the piping connector 50 on the base plate 38 to the bottom (rear) of the oscillator chamber 18 through the piping 42, passes through the piping connector 62, the joint member and the inlet connector 110, and cools the lower holding portion 104. It is supplied to the water passage.

The cooling water that has exited through the cooling water passage of the lower holding portion 104 through the connector 112 at the outlet is supplied to the joint member and the piping connector 64 below the oscillator chamber 18.
From the pipe connector 52 to the internal connection port 38A 'of the base plate 38, and from there, to the internal connection port 2 of the lower manifold block 12.
Through 6A, it enters the internal passage 17 of the collection system in the block 12.

The corresponding internal connection ports [38B, 38D, 38F] of the base plate 38 from the internal passage 11 of the supply system in the lower manifold block 10 through the internal connection ports [24B, 24D, 24F] of this block 10. ] Is sent to the external connection ports [72B, 72D, 72F] of the upper manifold block 72, and supply piping connectors 71, 75, and 75 corresponding to those external connection ports.
79 to the semiconductor laser unit 114
A, 114B and the cooling water passage of the upper holding unit 102.

[0560] Semiconductor laser units 114A and 114B
The cooling water flowing out of the cooling water passage passes through piping from outlet connectors 118A and 118B of each unit, and piping connectors 73 and 75 of a recovery system of the upper manifold block 72.
From the external manifold [72C, 72E] of the upper manifold block 72, the internal manifold [38C ', 38E'] of the base plate 38, and the lower manifold block 72.
It is collected in the internal passage 11 of the collection system in the block 10 through the internal connection ports [24C, 24E] of the block 10.

[0570] The cooling water collected in the internal passage 11 in the lower manifold block 12 passes through the pipe 29 from the pipe connector 28B of the block 12, and flows into the lower manifold block.
It is sent to the piping connector 30B of the block 12 and enters the internal passage 17 of the collection system in the block 12.

The cooling water flowing out of the cooling water passage of the upper holding unit 102 is sent from the outlet connector 108 to the recovery system piping 76 of the upper manifold block 74 via the joint member, the connector 86, and the piping, and from there, the block. 74 external connection port 74F, base plate 38 internal connection port 3
8F ′ and the internal connection port 26F of the lower manifold block 12 to enter the internal passage 17 of the collection system in the block 12.

A part of the cooling water from the internal passage 11 of the lower manifold block 10 is sent from the pipe connector 28A to the pipe connector 30A of the lower manifold block 12 through the pipe 27, and the supply system in the block 12 therefrom. Into the internal passage 13.

Then, the base plate 3 is
8 and cooling water is supplied to the cooling water passages of the two opposite semiconductor laser units 114C and 114D through the water passages and pipes of the supply system of the upper manifold block 74, and exits from the cooling water passages of those units. The cooling water is collected in the internal passage 17 of the collection system in the lower manifold block 12 through a pipe or the like, or the water passage of the collection system of the upper manifold block 74 and the base plate 38.

The cooling water collected in the internal passage 17 of the collecting system of the lower manifold block 12 is sent from the external piping connector 22 of the block 12 to the collecting section of the cooling water supply source through the piping 34 of the collecting system line. .

FIG. 4 shows the semiconductor laser unit 114
A, 114B, 114C, and 114D are electrically connected in series to supply power to each unit, for example, a copper plate or a copper bar 87, 88, 89, 90, 91, 92,
93,94,95,96 are shown. FA, FB, FC
, FD are the units 114A, 114B, 114C,
114D is a cathode terminal. Terminal bar 87, 96
Are electrically connected to the terminals 68, 66 on the lower surface of the oscillator unit 18 and therefore the electric cables 48, 4
6 and 60, 58 electrically.

The current from the anode side terminal 87 passes through the conductor connectors 88 and 89, and the semiconductor laser unit 114
Enter the C anode terminal. The current from the cathode terminal FC of the unit 114C enters the anode terminal of the semiconductor laser unit 114D through the copper bar 90. The current from the cathode terminal FD of the unit 114D is
1 and 92, and enters the anode terminal of the semiconductor laser unit 114B.

The current from the cathode terminal FB of the unit 114B enters the anode terminal of the semiconductor laser unit 114A through the copper bar 93. And the unit 11
The current from the 4 A cathode terminal FA is applied to the copper bar 94,
It flows to the cathode side terminal 96 through 95.

In FIG. 4, a shutter plate 51 is coupled to a rotary solenoid 47 via a shutter driving plate 53 beside the laser oscillator assembly 70 on the optical axis of the main laser beam LB. Optical sensors 55 and 57 for detecting the position of the shutter plate 51 (light shielding position / retreat position).
Are also located. A circuit board 43 (FIG. 3) on which a sensor circuit (not shown) is mounted is attached to the opening or window 45. An end of an optical path cover (not shown) is attached to the cylindrical frame 41 of the emission window of the main laser beam LB.

As described above, in the solid-state laser device of this embodiment, the slab type solid-state laser medium 100 and the holding unit 10
1 (102, 104) and the excitation unit 103 (114A-
114D) is integrally formed with an upper manifold composed of a pair of upper manifold blocks 72 and 74 and a base plate 38, and this integral subassembly is housed in the oscillator chamber 18. . Then, in the chamber 18, the external connection port of the upper manifold is connected to the cooling water passage of each part of the laser oscillator assembly 70 via a pipe connector and a pipe.

On the other hand, a lower manifold composed of a pair of lower manifold blocks 10 and 12 is attached to the substrate of the apparatus main body, and pipes 32 and 34 from a cooling water supply source are connected to the lower manifold. Then, the oscillator chamber 18 is placed on the lower manifold blocks 10 and 12.
Are positioned on the positioning pins 14 and attached by bolts 16, the respective internal connection ports of the upper manifold are hermetically connected to the respective internal connection ports of the lower manifold to form an integral manifold, and the external manifold on the upper manifold side is formed. Cooling water is supplied from the connection port to cooling water passages of each part of the laser oscillator assembly 70.

With this configuration, when mounting / removing the laser oscillator assembly 70 during assembly or maintenance, it is only necessary to tighten and loosen the mounting bolts 16, and no mounting / detaching of piping and connectors is required. It is.

When the oscillator chamber 18 is mounted, the chamber 18 or the laser oscillator assembly 70 is positioned on the device substrate by the positioning pins 14, so that
The optical axis of the solid-state laser medium 100 inside the chamber 18 and the optical axes of the optical resonator mirrors 120 and 122 outside the chamber 18 are automatically aligned. Therefore, troublesome optical axis alignment of the laser oscillator is not required.

In addition, the piping around the laser oscillator assembly 70 is housed in the oscillator chamber 18 to realize a simple and compact assembly. This greatly improves handling and workability.

In the above-described embodiment, the upper and lower manifold blocks are each two, but it is also possible to have one or three or more. Each manifold
The structure of the internal connection port, the external connection port, and the cooling water passage in the block can be variously modified. For the connecting means for integrally connecting the upper and lower manifolds, various alternative means having the same function as the mounting bolt 16 and the positioning pin 14 as in the above embodiment are possible. The laser oscillator shown in FIG. 7 is merely an example, and various configurations are possible.

[0720]

As described above, according to the solid-state laser device of the present invention, the first manifold connected to the cooling medium supply source and the second manifold connected to the cooling medium passage of the laser oscillator. The manifolds are detachably connected by abutting their connection surfaces so that the corresponding internal connection ports of the manifolds are sealed and connected to each other, so that assembly around the laser oscillator is easy. In addition, since there is little attachment / detachment of connectors or pipes, workability in assembly or maintenance can be improved.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing a configuration of a laser oscillation unit assembly of a solid-state laser device according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a configuration of a laser oscillation unit assembly in the embodiment.

FIG. 3 is a bottom view illustrating a configuration of a laser oscillation unit assembly in the embodiment.

FIG. 4 is a plan view showing an internal configuration of an oscillator chamber in the embodiment.

FIG. 5 is a partial cross-sectional view showing a connection state (structure) of an upper manifold and a lower manifold in the embodiment.

FIG. 6 is a diagram schematically showing a fluid circuit system of a cooling water supply mechanism in the embodiment.

FIG. 7 is an exploded perspective view showing a configuration of a laser oscillator that can be incorporated in the solid-state laser device of the embodiment.

8 is a partial plan view showing an operation of laser oscillation in the laser oscillator of FIG.

[Explanation of symbols]

10, 12 Lower manifold block 11, 13, 15.17 Internal passage 14 Locating pin 16 Mounting bolt 18 Oscillator chamber 20, 22 External piping connector 21, 23 O-ring 24A, 24B, 24C, 24D, 24E, 24F Internal connection port 26A, 26B, 26C, 26D, 26E, 26F Internal connection port 28A, 28B, 30A, 30B Piping connector 38 Base plate 38B, 38D, 38F Internal connection port 40 Cover 50, 52 Piping connector 70 Laser oscillator assembly 72, 74 Upper part Manifold block 72B, 72D, 72F Internal connection port 71, 73, 75, 77, 79 Piping connector 76, 78, 80, 82, 84 Piping connector

Claims (4)

[Claims] 1. A solid-state laser oscillator having a cooling medium passage, an external connection port connected to an excitation medium supply source via a pipe, and an internal connection port communicating with the external connection port via an internal passage. A first manifold having the internal connection port exposed to a predetermined connection surface; an external connection port connected to a cooling medium passage of the solid-state laser oscillator via a pipe; A second connection port having an internal connection port that communicates through a passage, wherein the internal connection port is provided to be exposed on a predetermined connection surface in a shape and size corresponding to the internal connection port of the first manifold. And coupling means for detachably coupling the first and second manifolds by abutting the respective connection surfaces so that the corresponding internal connection ports are hermetically connected to each other. A solid-state laser device comprising: 2. The solid-state laser device according to claim 1, wherein the second manifold includes a part of a base plate supporting the laser oscillator. 3. The solid-state laser oscillator, a slab-type solid-state laser medium, a heat-conductive holding unit that holds the solid-state laser medium in a state of being in contact with a cooling surface of the solid-state laser medium,
An oscillator chamber that includes an excitation unit that supplies excitation light to an excitation surface of the solid-state laser medium and the second manifold; and an optical resonator mirror that is disposed outside the oscillator chamber. The solid-state laser device according to claim 1, wherein a cooling medium passage is provided in each of the excitation units. 4. The coupling means is fixedly attached to a support member common to the first manifold, and is detachably engaged with a predetermined portion of the oscillator chamber to connect the second manifold to the first manifold. A positioning member for aligning the manifold with the manifold;
4. The solid-state laser device according to claim 3, further comprising: a fixing member that is fixed to said manifold to detachably fix said oscillator chamber.