CN110364917A - A kind of laser and cooling device - Google Patents
A kind of laser and cooling device Download PDFInfo
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- CN110364917A CN110364917A CN201810322099.5A CN201810322099A CN110364917A CN 110364917 A CN110364917 A CN 110364917A CN 201810322099 A CN201810322099 A CN 201810322099A CN 110364917 A CN110364917 A CN 110364917A
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- water
- service pipe
- cooled plate
- electronic device
- cavity
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- 238000001816 cooling Methods 0.000 title claims abstract description 22
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 287
- 230000005611 electricity Effects 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 229910000831 Steel Inorganic materials 0.000 claims description 2
- 239000004411 aluminium Substances 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 239000010959 steel Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 20
- 239000004065 semiconductor Substances 0.000 description 7
- 238000010276 construction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- JEGUKCSWCFPDGT-UHFFFAOYSA-N h2o hydrate Chemical compound O.O JEGUKCSWCFPDGT-UHFFFAOYSA-N 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/0407—Liquid cooling, e.g. by water
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
- H01S5/02423—Liquid cooling, e.g. a liquid cools a mount of the laser
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02438—Characterized by cooling of elements other than the laser chip, e.g. an optical element being part of an external cavity or a collimating lens
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- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Semiconductor Lasers (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Lasers (AREA)
Abstract
Present applicant proposes a kind of laser and cooling devices.The laser includes cavity, water-cooled plate and electronic device, and cavity is provided at least one water inlet and at least one water outlet；Water-cooled plate is arranged in the cavity, and water-cooled plate is provided at least one water service pipe；One end of water service pipe connects water inlet, and the other end of water service pipe connects water outlet；Electronic device is arranged in water-cooled plate, and in electronic device work, water-cooled plate is for radiating to electronic device.Water-cooled plate in the application laser can radiate to electronic device, prevent electronic device from damaging because temperature is excessively high, and then being capable of effective protection electronic device.
Description
Technical field
This application involves field of lasers, and in particular to a kind of laser and cooling device.
Background technique
Currently, the light source power of laser output constantly increases.While output power constantly increases, the power of power supply
Also constantly become larger, calorific value is also continuously increased.Since for dust-proof design consideration, laser has closed cavity, laser
The temperature of the big electronic device of power supply and calorific value in device increases, and is easily damaged power supply and electronic device.
Summary of the invention
The application provides a kind of laser and cooling device, to solve the above problem.
In order to solve the above technical problems, this application provides a kind of laser, the laser include: cavity, water-cooled plate and
Electronic device, cavity are provided at least one water inlet and at least one water outlet；Water-cooled plate is arranged in the cavity, and water-cooled plate is set
It is equipped at least one water service pipe；One end of water service pipe connects water inlet, and the other end of water service pipe connects water outlet；Electronic device is set
It sets in water-cooled plate, in electronic device work, water-cooled plate is for radiating to electronic device.
In order to solve the above technical problems, the cooling device includes cavity, water cooling present invention also provides a kind of cooling device
Plate and electronic device, cavity are provided at least one water inlet and at least one water outlet；Water-cooled plate is arranged in the cavity, water cooling
Plate is provided at least one water service pipe；One end of water service pipe connects water inlet, and the other end of water service pipe connects water outlet；Electronics device
Part is arranged in water-cooled plate, and in electronic device work, water-cooled plate is for radiating to electronic device.
In this application, laser includes cavity, water-cooled plate and electronic device, cavity be provided at least one water inlet and
At least one water outlet；Water-cooled plate is arranged in the cavity, and water-cooled plate is provided at least one water service pipe；One end of water service pipe connects
The other end of water inlet, water service pipe connects water outlet；Electronic device is arranged in water-cooled plate, in electronic device work, toward water
Water service pipe in cold plate injects cold water；Cold water enters from the inlet water service pipe, goes out from water outlet；In this process, electronics device
The heat of part is conducted into water-cooled plate, and cold water is flowed out by water service pipe by heat absorption and from water outlet, and then realizes electronics device
Part heat dissipation, reduces the temperature of electronic device, is effectively protected electronic device.
Detailed description of the invention
To describe the technical solutions in the embodiments of the present invention more clearly, make required in being described below to embodiment
Attached drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, for
For those of ordinary skill in the art, without creative efforts, it can also be obtained according to these attached drawings other
Attached drawing.Wherein:
Fig. 1 is the structural schematic diagram of the application laser embodiments one；
Fig. 2 is the diagrammatic cross-section of water-cooled plate in Fig. 1；
Fig. 3 is the diagrammatic cross-section of another embodiment of the application water-cooled plate；
Fig. 4 is the water route path schematic diagram of the application laser embodiments one；
Fig. 5 is the structural schematic diagram of the application laser embodiments two；
Fig. 6 is the water route path schematic diagram of the application laser embodiments two；
Fig. 7 is the structural schematic diagram of the application laser embodiments three；
Fig. 8 is the water route path schematic diagram of the application laser embodiments three；
Fig. 9 is the structural schematic diagram of the application laser embodiments four；
Figure 10 is the water route path schematic diagram of the application laser embodiments four；
Figure 11 is the structural schematic diagram of one embodiment of the application cooling device；
Figure 12 is the water route path schematic diagram of one embodiment of the application cooling device.
Specific embodiment
Below in conjunction with the attached drawing in the embodiment of the present application, technical solutions in the embodiments of the present application carries out clear, complete
Site preparation description.It is understood that specific embodiment described herein is only used for explaining the application, rather than to the limit of the application
It is fixed.It also should be noted that illustrating only part relevant to the application for ease of description, in attached drawing and not all knot
Structure.Based on the embodiment in the application, obtained by those of ordinary skill in the art without making creative efforts
Every other embodiment, shall fall in the protection scope of this application.
Referring to Figure 1~Fig. 4, Fig. 1 are the structural schematic diagrams of the application laser embodiments one；Fig. 2 is water-cooled plate in Fig. 1
Diagrammatic cross-section；Fig. 3 is the diagrammatic cross-section of another embodiment of the application water-cooled plate；Fig. 4 is the application laser embodiments
One water route path schematic diagram.Fig. 2 and Fig. 3 is diagrammatic cross-section of the laser shown in FIG. 1 along A-A '.
The water service pipe 321 of the application is arranged in water-cooled plate 32, as shown in Figure 2.Since water service pipe 321 is set to water-cooled plate
In 32, reduce the volume of water-cooled plate 32, and then reduce the volume of laser 300；When installing water-cooled plate, installation steps are reduced,
It is easily installed.
As shown in Figure 1, the laser 300 includes cavity 31, water-cooled plate 32 and electronic device 33.
Cavity 31 is the shell of laser 300, is oblong hollow-core construction.Cavity 31 is internally provided with water-cooled plate 32 and electricity
Sub- device 33, the side of cavity 31 are provided at least one water inlet 311 and at least one water outlet 312.
Water-cooled plate 32 is arranged in cavity 31, and water-cooled plate 32 is provided at least one water service pipe 321, and water service pipe 321 is arranged
In water-cooled plate 32.As shown in figure 4, the shape of water service pipe 321 is in curved waveform back and forth.In other embodiments, may be used
Using other shapes, such as bow font, it is not limited thereto.
The water inlet 311 of one end connection cavity 31 of water service pipe 321, the other end connection cavity 31 of water service pipe 321 go out
The mouth of a river 312.Cold water is input in water service pipe 321 from the water inlet 311 of cavity 31, is exported from 312 end of water outlet of cavity 31.Water
Cold plate 32 can be aluminium sheet, copper sheet, steel plate or other metal plates.Wherein, cold water concretely 15~26 DEG C of temperature of water.
Electronic device 33 is arranged in cavity 31, and specifically, electronic device 33 can be set in water-cooled plate 32.Electronics device
Part 33 and water-cooled plate 32 contact, and the heat of electronic device 33 can be transferred to water-cooled plate 32.Electronic device 33 includes Switching Power Supply
With the big device of calorific values such as metal-oxide-semiconductor.
When laser 300 works, the electronic devices such as Switching Power Supply and metal-oxide-semiconductor 33 generate heat, the heat of electronic device 33
Amount is transferred to water-cooled plate 32.The cold water of water-cooled plate 32 is input to the water service pipe 321 of water-cooled plate 32 from the water inlet 311 of cavity 31
In, the temperature of cold water is lower than the temperature of water-cooled plate 32, and cold water absorbs the heat of electronic device 33 when passing through water service pipe 321, inhales
Water after receiving heat is exported from the water outlet 312 of cavity 31.
In another embodiment, electronic device 33 can be set in the side of water-cooled plate 32, water service pipe 321 can be set in
The other side of water-cooled plate 32, specifically refers to Fig. 3.
When the present embodiment laser 300 works, the heat of electronic device 33 is radiated by the cold water of water service pipe 321,
It realizes that electronic device 33 radiates, reduces the temperature of electronic device 33, and then electronic device 33 can be effectively protected；Equally, originally
The water service pipe 321 of embodiment can be set in water-cooled plate 32, reduce the volume of water-cooled plate 32, and then reduce laser 300
Volume；When installing water-cooled plate, installation steps are reduced, are easily installed.
The structure of the application laser embodiments two refers to Fig. 5 and Fig. 6, and Fig. 5 is the application laser embodiments two
Structural schematic diagram；Fig. 6 is the water route path schematic diagram of the application laser embodiments two.As shown in figure 5, laser 500 includes
Cavity 51, water-cooled plate 52 and electronic device 53.
Cavity 51 is the shell of laser 500, is provided with water-cooled plate 52 and electronic device 53 in cavity 51.The one of cavity 51
Side is provided with a water inlet 511 and a water outlet 512.
Water-cooled plate 52 is arranged in cavity 51, and water-cooled plate 52 is provided with the first water service pipe 521 and the second water service pipe 522.Such as
Shown in Fig. 6, the first area 523 of water-cooled plate 52 is arranged in the first water service pipe 521, and the second water service pipe 522 is arranged in water-cooled plate 52
Second area 524.Wherein, first area 523 and second area 524 collectively cover the whole region of water-cooled plate 52.
The water inlet 511 of one end connection cavity 51 of one end of first water service pipe 521 and the second water service pipe 522, first is logical
The water outlet 512 of the other end connection cavity 51 of the other end of water pipe 521 and the second water service pipe 522.The covering of first area 523
Range is greater than the coverage area of second area 524, alternatively, the water route length of the first water service pipe 521 is greater than the second water service pipe 522
Water route length.Since the structure of above-mentioned water service pipe designs, the first water service pipe 521 and the second water service pipe 522 are respectively acting on difference
Electronic device 53, be effectively shortened the length of the first water service pipe 521 and the second water service pipe 522, and then reduce the first water flowing
The temperature elevated-levels of 522 inner cold water of pipe 521 and the second water service pipe.
Electronic device 53 is arranged in water-cooled plate 52.When electronic device 53 and water-cooled plate 52 contact, electronic device 53
Heat can be transferred to water-cooled plate 52.Electronic device 53 includes the big devices of calorific values such as Switching Power Supply and metal-oxide-semiconductor.
When laser 500 works, the electronic devices such as Switching Power Supply and metal-oxide-semiconductor 53 generate heat, the heat of electronic device 53
Amount is transferred to water-cooled plate 52.Cold water is inputted from the water inlet 511 of cavity 51, branches to 521 He of the first water service pipe of water-cooled plate 52
In second water service pipe 522.The temperature of cold water is lower than the temperature of water-cooled plate 52, and cold water absorbs water-cooled plate 52 when passing through water service pipe
Heat, and the water outlet of cavity 51 512 collaborate and export.Due to the length of the first water service pipe 521 and the second water service pipe 522
Shorten as far as possible, can reduce the temperature elevated-levels of 522 inner cold water of the first water service pipe 521 and the second water service pipe, improves cooling
Effect.
In the present embodiment, laser 500 further includes the first locator 541 and the second locator 542.One end of water service pipe
Water inlet 511 is connected by the first locator 541, i.e. one end of the first water service pipe 521 and one end of the second water service pipe 522 is logical
Cross the first locator 541 connection water inlet 511；The other end of water service pipe connects water outlet 512 by the second locator 542, i.e.,
The other end of the other end of first water service pipe 521 and the second water service pipe 522 passes through the second locator 542 connection water outlet 512；
First locator 541 is used to fix one end and the water inlet 511 of water service pipe, and the second locator 542 is for fixing the another of water service pipe
One end and water outlet 512.Further, the first locator 541 and the second locator 542 can be the sealing such as sealing ring or sealant
Structure.Therefore, the first locator 541 can be also used for preventing 511 leak of water inlet, and the second locator 542 can be also used for preventing
Only 512 leak of water outlet.
When the present embodiment laser 500 works, the heat of electronic device 53 passes through the first water service pipe 521 and the second water service pipe
522 cold water radiates, and realizes that electronic device 53 radiates, reduces the temperature of electronic device 53, and then can be effectively protected
Electronic device 53.
The structure of the application laser embodiments three refers to Fig. 7 and Fig. 8, and Fig. 7 is the application laser embodiments three
Structural schematic diagram；Fig. 8 is the water route path schematic diagram of the application laser embodiments three.As shown in fig. 7, laser 700 includes
Cavity 71, water-cooled plate 72 and electronic device 73.
Cavity 71 is the shell of laser 700, is provided with water-cooled plate 72 and electronic device 73 in cavity 71.The one of cavity 71
Side is provided at least one water inlet and at least one water outlet；Water inlet includes the first water inlet 711 and the second water inlet
713, water outlet includes the first water outlet 712 and the second water outlet 714.
Water-cooled plate 72 is arranged in cavity 71, and water-cooled plate 72 is provided with the first water service pipe 721 and the second water service pipe 722.Such as
Shown in Fig. 8, the first area 723 of water-cooled plate 72 is arranged in the first water service pipe 721, and the second water service pipe 722 is arranged in water-cooled plate 72
Second area 724.First area 723 and second area 724 are not overlapped.
One end of first water service pipe 721 is connect with the first water inlet 711, and the other end of the first water service pipe 721 goes out with first
The mouth of a river 712 connects；One end of second water service pipe 722 is connect with the second water inlet 713, the other end of the second water service pipe 722 and
The connection of two water outlets 714.Since the structure of above-mentioned water service pipe designs, the first water service pipe 721 and the second water service pipe 722 are respectively corresponded
The different zones of water-cooled plate 72, and first area 723 and second area 724 are not overlapped, and can effectively reduce the first water service pipe
721 and second water service pipe 722 cooled region, and then reduce the first water service pipe 721 and 722 inner cold water of the second water service pipe temperature
Elevated-levels.
Electronic device 73 is arranged in water-cooled plate 72.Electronic device 73 and water-cooled plate 72 contact, the heat of electronic device 73
Water-cooled plate 72 can be transferred to.Electronic device 73 includes the big devices of calorific values such as Switching Power Supply and metal-oxide-semiconductor.
When laser 700 works, the electronic devices such as Switching Power Supply and metal-oxide-semiconductor 73 generate heat, the heat of electronic device 73
Amount is transferred to water-cooled plate 72.Cold water is input to the first water service pipe 721 from the first water inlet 711 of cavity 71, from the of cavity 71
Two water inlets 713 are input to the second water service pipe 722.The temperature of cold water is lower than the temperature of water-cooled plate 72, and cold water is logical by first
When water pipe 721 and the second water service pipe 722, the heat of water-cooled plate 72 is absorbed, and respectively from the first water outlet 712 of cavity 71 and the
The output of two water outlets 714.Due to the corresponding first area 723 of the first water service pipe 721 and corresponding secondth area of the second water service pipe 722
Domain 724 does not overlap, and the first water service pipe 721 and the second water service pipe 722 will not iterate through same area, can effectively shorten
The length of one water service pipe 721 and the second water service pipe 722 reduces the temperature of the first water service pipe 721 and 722 inner cold water of the second water service pipe
Elevated-levels improve cooling effect.
When the present embodiment laser 700 works, the heat of electronic device 73 passes through the first water service pipe 721 and the second water service pipe
722 cold water radiates, and realizes dissipation from electronic devices, reduces the temperature of electronic device 73, and then can be effectively protected electricity
Sub- device 73.
The structure of the application laser embodiments four refers to Fig. 9 and Figure 10, and Fig. 9 is the application laser embodiments four
Structural schematic diagram；Figure 10 is the water route path schematic diagram of the application laser embodiments four.As shown in figure 9, laser 900 includes
Cavity 91, water-cooled plate 92 and electronic device 93.
Cavity 91 is the shell of laser 900, is oblong hollow-core construction.Cavity 91 is internally provided with water-cooled plate 92 and electricity
Sub- device 93.The side of cavity 91 is provided at least one water inlet 911 and at least one water outlet 912.
Water-cooled plate 92 is arranged in cavity 91, and water-cooled plate 92 is provided at least one water service pipe 921.Such as Fig. 9 and Figure 10 institute
Show, the water inlet 911 of one end connection cavity 91 of water service pipe 921, the water outlet of the other end connection cavity 91 of water service pipe 921
912.Cold water is input in water service pipe 921 from the water inlet 911 of cavity 91, is exported from the water outlet 912 of cavity 91.
Electronic device 93 is arranged in cavity 91, and specifically, electronic device 93 is arranged in water-cooled plate 92.Electronic device 93
It is contacted with water-cooled plate 92, the heat of electronic device 93 can be transferred to water-cooled plate 92.Electronic device 93 includes Switching Power Supply and MOS
The big device of the calorific values such as pipe.
Laser 900 in the present embodiment further includes at least one fan 94, and fan 94 is arranged on cavity 91.Specifically
Ground, outside the coverage area of water-cooled plate 92, fan 94 is arranged in 93 side of electronic device.Above-mentioned electronic device 93 is arranged in water cooling
On plate 92, or setting, in 92 side of water-cooled plate, electronic device 93 can be one or more in constant current plate, master control borad or relay
It is a.
The electronic device 93 work when, the fan 94 be used for by the air in the cavity 91 carry out circulation and with
Outside air exchange, and then radiate to the electronic device 93.
When laser 900 works, 93 temperature of the electronic devices such as Switching Power Supply and metal-oxide-semiconductor is increased, the heat of electronic device 93
Amount is transferred to water-cooled plate 92.Cold water is from the water service pipe 921 that the water inlet 911 of cavity 91 is input to water-cooled plate 92.The temperature of cold water
Degree is lower than the temperature of water-cooled plate 92, and cold water absorbs the heat of water-cooled plate 92, and going out from cavity 91 when passing through water service pipe 921
The mouth of a river 912 exports.Meanwhile the fan 94 on cavity 91 is also started to work, fan 94 is recycled the air in cavity 91 simultaneously
It is swapped with outside air, takes away the heat on 93 surface of electronic device, and then reduce the temperature of electronic device 93.
When the present embodiment laser 900 works, 93 heat of electronic device is radiated by the cold water of water service pipe 921
It radiates with by fan 94, realizes that electronic device 93 radiates, reduce the temperature of electronic device 93, and then electricity can be effectively protected
Sub- device 93.
Present invention also provides a kind of cooling devices 800, and specifically 1 and Figure 12, Figure 11 are the cooling dresses of the application referring to Figure 1
Set the structural schematic diagram of 800 1 embodiments.Figure 12 is the water route path schematic diagram of one embodiment of the application cooling device.Such as Figure 11
Shown, which includes cavity 81, water-cooled plate 82 and electronic device 83.
Cavity 81 is oblong hollow-core construction, and cavity 81 is internally provided with water-cooled plate 82 and electronic device 83.Wherein, cavity
81 side is provided at least one water inlet 811 and at least one water outlet 812.
Water-cooled plate 82 is arranged in cavity 81, and water-cooled plate 82 is provided with the first water service pipe 821 and the second water service pipe 822.Such as
Shown in Figure 12, the first area 823 of water-cooled plate 82 is arranged in the first water service pipe 821, and the second water service pipe 822 is arranged in water-cooled plate 82
Second area 824.First area 823 and second area 824 collectively cover the whole region of water-cooled plate 82.
The water inlet 811 of one end connection cavity 81 of one end of first water service pipe 821 and the second water service pipe 822；First is logical
The water outlet 812 of the other end connection cavity 81 of the other end of water pipe 821 and the second water service pipe 822.The covering of first area 823
Range is greater than the coverage area of second area 824, alternatively, the water route length of the first water service pipe 821 is greater than the second water service pipe 822
Water route length.Since the structure of above-mentioned water service pipe designs, the first water service pipe 821 and the second water service pipe 822 are respectively acting on difference
Electronic device 83, be effectively shortened the length of the first water service pipe 821 and the second water service pipe 822, and then reduce the first water flowing
The temperature elevated-levels of 822 inner cold water of pipe 821 and the second water service pipe.
Electronic device 83 is arranged in cavity 81, and specifically, electronic device 83 is arranged in water-cooled plate 82.Electronic device 83
It is contacted with water-cooled plate 82, the heat of electronic device 83 can be transferred to water-cooled plate 82.Electronic device 83 includes Switching Power Supply and MOS
The big device of the calorific values such as pipe.
When electronic device 83 works, 83 surface temperature of electronic device is increased, the heat transfer of electronic device 83 to water cooling
Plate 82.Cold water is inputted from the water inlet 811 of cavity 81, branches to the first water service pipe 821 and the second water service pipe 822 of water-cooled plate 82
In.The temperature of cold water is lower than the temperature of water-cooled plate 82, and cold water absorbs the heat of water-cooled plate 82 when passing through water service pipe, and in chamber
The water outlet 812 of body 81 collaborates and exports.Since the length of the first water service pipe 821 and the second water service pipe 822 shortens as far as possible, energy
The temperature elevated-levels of 822 inner cold water of the first water service pipe 821 and the second water service pipe are enough reduced, cooling effect is improved.
When the present embodiment electronic device 83 works, the heat of electronic device 83 passes through the first water service pipe 821 and the second water flowing
The cold water of pipe 822 radiates, and realizes that electronic device 83 radiates, reduces the temperature of electronic device 83, and then can effectively protect
Protect electronic device 83.
Communication means provided by the embodiment of the present application and communication terminal are described in detail above, it is used herein
The principle and implementation of this application are described for specific case, and the above embodiments are only used to help understand
The present processes and its core concept；At the same time, for those skilled in the art is having according to the thought of the application
There will be changes in body embodiment and application range, in conclusion the content of the present specification should not be construed as to the application
Limitation.
Claims (10)
1. a kind of laser, which is characterized in that the laser includes cavity, water-cooled plate and electronic device, the cavity setting
There are at least one water inlet and at least one water outlet；In the cavity, the water-cooled plate is provided at least for the water-cooled plate setting
One water service pipe；One end of the water service pipe connects the water inlet, and the other end of the water service pipe connects the water outlet；Institute
It states electronic device to be arranged in the water-cooled plate, in electronic device work, the water-cooled plate is used for the electronics device
Part radiates.
2. laser according to claim 1, which is characterized in that the water service pipe includes the first water service pipe and the second water flowing
Pipe；The institute of the water-cooled plate is arranged at least provided with first area and second area, first water service pipe in the water-cooled plate
State first area；The second area of the water-cooled plate is arranged in second water service pipe.
3. laser according to claim 2, which is characterized in that the first area and the second area are not overlapped.
4. laser according to claim 3, which is characterized in that at least one described water inlet include the first water inlet and
Second water inlet, at least one described water outlet include the first water outlet and the second water outlet；One end of first water service pipe
It is connect with first water inlet, the other end of first water service pipe is connect with first water outlet；Second water flowing
One end of pipe is connect with second water inlet, and the other end of second water service pipe is connect with second water outlet.
5. laser according to claim 2, which is characterized in that first water service pipe and second water service pipe setting
In the water-cooled plate.
6. laser according to claim 1, which is characterized in that the laser further includes at least one fan, described
Fan is arranged on the cavity；In electronic device work, the fan is used to carry out the intracorporal air of the chamber
It recycles and is exchanged with outside air, and then radiate to the electronic device.
7. laser according to claim 1, which is characterized in that the water-cooled plate includes aluminium sheet, copper sheet and steel plate.
8. laser according to claim 1, which is characterized in that the laser further includes that the first locator and second are fixed
Position device；One end of the water service pipe connects the water inlet by first locator, and the other end of the water service pipe passes through
Second locator connects the water outlet.
9. a kind of cooling device, which is characterized in that the cooling device includes cavity, water-cooled plate and electronic device, the cavity
It is provided at least one water inlet and at least one water outlet；In the cavity, the water-cooled plate is provided with for the water-cooled plate setting
At least one water service pipe；One end of the water service pipe connects the water inlet, and the other end of the water service pipe connects the water outlet
Mouthful；The electronic device is arranged in the water-cooled plate, and in electronic device work, the water-cooled plate is used for the electricity
Sub- device radiates.
10. cooling device according to claim 9, which is characterized in that the water service pipe includes the first water service pipe and second
Water service pipe；The water-cooled plate is arranged at least provided with first area and second area, first water service pipe in the water-cooled plate
The first area；The second area of the water-cooled plate is arranged in second water service pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810322099.5A CN110364917A (en) | 2018-04-11 | 2018-04-11 | A kind of laser and cooling device |
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| CN201810322099.5A CN110364917A (en) | 2018-04-11 | 2018-04-11 | A kind of laser and cooling device |
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| CN112490842A (en) * | 2020-11-23 | 2021-03-12 | 常州莱特康光电科技有限公司 | Temperature control system for aging of pump laser |
| CN113612105A (en) * | 2021-07-09 | 2021-11-05 | 昂纳信息技术（深圳）有限公司 | Water cooling system and laser equipment |
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| CN112490842A (en) * | 2020-11-23 | 2021-03-12 | 常州莱特康光电科技有限公司 | Temperature control system for aging of pump laser |
| CN113612105A (en) * | 2021-07-09 | 2021-11-05 | 昂纳信息技术（深圳）有限公司 | Water cooling system and laser equipment |
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