JPH11218775A - Liquid crystal display device and its production - Google Patents

Abstract

PROBLEM TO BE SOLVED: To simplify production stages, to eliminate the need for a space in connecting both electrodes and to embody miniaturization by simultaneously executing the formation of a sealing frame assuring the prescribed cell gap between a main substrate and cover glass and the connection of both electrodes relating to a liquid crystal display device for sealing the main substrate and a cover substrate with the prescribed gap and process for producing the same. SOLUTION: This liquid crystal display device has the main substrate 1 formed with the electrodes and the cover substrate (cover glass) 4 formed with the electrodes 5 facing the electrodes 3 of the main substrate 1, is formed with the main substrate 1 and the cover substrate 4 to the prescribed cell gap by applying a resin contg. conductive particles of a prescribed grain size on the prescribed place of either or both of the main substrate 1 and the cover substrate 4 or placing a sheet consisting of this the formed to a semi-solidification state thereon and pressurizing and heating the resin and has simultaneously the sealing frame for connecting the corresponding electrodes 3, 5 of both.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display device for sealing a main substrate and a cover substrate with a predetermined cell gap, and a method of manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, as shown in FIG. 7, a sealing frame of a liquid crystal display section has a cell gap secured by applying a liquid resin at a predetermined position and then attaching a spacer having a predetermined particle size to the surface as shown in FIG. Then, the main substrate and the cover glass are bonded. Thereafter, the electrode portion of the predetermined cover glass and the opposing electrode portion of the main substrate are connected by a conductive resin.

FIG. 7 shows an explanatory diagram of the prior art. FIG. 7A shows a cross-sectional view taken along the line AA ′ of FIG. 7B, and FIG. 7B shows a plan view.

In FIGS. 7 (a) and 7 (b), a cell gap of several .mu.m is accurately and precisely provided by a spacer between a main substrate on which electrodes are formed and a cover glass on which electrodes (ITO) are formed as shown in FIG. The liquid crystal solution is uniformly provided, and the liquid crystal solution is put into the cell gap. At this time, the electrode of the cover glass is connected to the electrode of the main substrate with a conductive resin, and a voltage is applied between the electrode and another electrode on the main substrate to arrange the liquid crystal in a predetermined direction for display. Like that. Therefore, a complicated manufacturing process of providing a sealing frame between the main substrate and the cover glass with a resin as shown in the figure and connecting the electrodes from the cover glass to the main substrate with a conductive resin is required. I was

[0005]

As shown in FIG. 7 described above, a sealing frame is bonded to a main substrate and a cover glass in a state where a cell gap is secured by inserting a spacer having a predetermined particle size between the main substrate and the cover glass. After that, there is a problem that a complicated manufacturing process of bonding the electrode portion of the cover glass and the electrode portion of the main substrate with a conductive resin is performed.

[0006] The present invention solves these problems,
The formation of the sealing frame ensuring the predetermined cell gap between the main substrate and the cover glass and the connection of both electrodes are simultaneously performed,
It is an object of the present invention to simplify the manufacturing process and to reduce the size by eliminating the space for connecting both electrodes.

[0007]

Means for solving the problem will be described with reference to FIG. In FIG. 1, a main substrate 1 is a substrate on which electrodes and the like are formed.

[0008] The cover glass 4 is an example of a cover substrate and is a substrate on which electrodes facing the electrodes of the main substrate 1 are formed. The anisotropic conductive resin 11 is a resin containing conductive particles having a predetermined particle size, and is a liquid or semi-solidified sheet.

The conductive particles 12 are conductive particles,
Anisotropic conductive resin 1 containing the conductive particles 12 in a resin.
It is assumed to be 1. Next, a manufacturing method will be described.

Conductive particles having a predetermined particle size are contained in a predetermined position of one or both of a main substrate 1 on which electrodes are formed and a cover glass 4 which is a cover substrate on which electrodes facing the electrodes of the main substrate 1 are formed. A sheet on which the anisotropic conductive resin 11 is coated or the semi-solidified anisotropic conductive resin 11 is placed and pressed and heated to form the main substrate 1 and the cover glass 4 in a predetermined cell gap, and at the same time, to form To form a sealing frame for connecting the electrodes facing each other.

At this time, as the conductive particles 12 having a predetermined particle size of the conductive material to be contained in the anisotropic conductive resin 11, the conductive particles having a predetermined particle size of the conductive or non-conductive particles having a predetermined particle size are conductive. The particles are covered with a toxic substance.

Further, between the main substrate 1 and the cover glass 4, non-conductive particles slightly smaller than conductive particles having a predetermined particle diameter are put. Therefore, by simultaneously forming the sealing frame having a predetermined cell gap between the main substrate 1 and the cover glass 4 and connecting the two electrodes, the manufacturing process is simplified and the space for connecting the two electrodes is reduced. Becomes unnecessary, and miniaturization can be realized. In particular, as shown in FIG.
When an LSI is manufactured, the required area of the LSI can be reduced, and a large number of main substrates (LSIs) can be cut out from one substrate (eg, wafer).

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described in detail with reference to FIGS. FIG. 1 shows a structural diagram of one embodiment of the present invention.

In FIG. 1, a main substrate 1 is a substrate on which an alignment film 6, electrodes 2, 3 and the like are formed, and is made of glass,
It is formed on an LSI or the like. The electrode 2 applies a voltage between the electrode 2 and the cover glass 4 to arrange and display liquid crystals.

The electrode 3 is connected to the electrode of the cover glass 4 by an anisotropic conductive resin 11, and is for applying a voltage between the electrode of the cover glass 4 and the electrode of the main substrate 1. The electrode 5 is for applying an electric field between the electrode 5 of the main substrate 1 and aligning the liquid crystal in a predetermined direction.

The alignment film 6 is a film for aligning the liquid crystal in a predetermined direction. The cover glass 4 is a substrate on which the alignment film 6, the electrode 5, and the like are formed, and is an example of a cover substrate.

The anisotropic conductive resin 11 is a resin containing conductive particles 12 having a predetermined particle size, is a sheet in a liquid or semi-solid state, and is cured by pressing and heating. The conductive particles 12 are formed by coating the surface of conductive particles having a predetermined particle size or non-conductive particles with a conductive substance (described later with reference to FIG. 4).

Next, a method of manufacturing the liquid crystal display device of FIG. 1 will be described in detail according to the order shown in the flowchart of FIG. FIG. 2 shows a manufacturing flowchart of the present invention.

In FIG. 2, in S1, a spacer is applied on the main substrate 1. For this, a spacer, which is a non-insulating particle having a predetermined particle size (for example, about several μm), is applied on the main substrate 1 on which the electrodes 2, 3 and the alignment film 6 of FIG. In the small main substrate 1, the gap between the main substrate 1 and the cover glass 4 can be maintained by the conductive particles 12 having a predetermined particle size in the anisotropic conductive resin 11, so that the spacer need not be applied.

In step S2, a sealing frame (anisotropic conductive resin) is formed. For example, the anisotropic conductive resin 11 is printed, or a sheet in which the anisotropic conductive resin 11 is semi-solidified is cut into a predetermined shape and placed.

In step S3, the cover glass 4 is placed. At this time, the main substrate 1 and the cover glass 4 are aligned. S4 cures the sealing frame. The electrode 5 of the cover glass 4 and the electrode 3 on the main substrate 1 are pressed by the conductive particles 12 in the anisotropic conductive resin 11 by applying pressure so that a predetermined gap is formed between the main substrate 1 and the cover glass 4. And the main board 1 and the cover glass 4
Is formed at a predetermined distance (for example, several μm). Thereby, the sealing frame for sealing the liquid crystal is formed of the anisotropic conductive resin 11.

In step S5, liquid crystal is injected. This injects liquid crystal into the inside of the sealing frame formed in S4. S6 seals the liquid crystal filling port. As a result, the liquid crystal is sealed inside the sealing frame formed of the anisotropic conductive resin 11 in FIG. 1 to form a cell, thereby completing the display unit (cell).

As described above, by forming the sealing frame with the anisotropic conductive resin 11 as the sealing frame for sealing the liquid crystal, and simultaneously connecting the electrodes of the cover glass 4 and the electrodes of the main substrate 1 respectively. In addition, the formation of the sealing frame and the connection of the electrode of the cover glass 4 and the electrode of the main substrate 1 can be simultaneously performed by a simple manufacturing method.

FIG. 3 is an explanatory view (part 1) of a main part of the present invention. FIG. 3A shows a state where an anisotropic conductive resin 11 is applied or a semi-solidified sheet is placed between the electrode 3 of the main substrate 1 and the electrode 5 of the cover glass 4. In this state, the conductive particles 12 float in the resin and the electrode 3 and the electrode 5 are not electrically connected.

FIG. 3B shows a state where pressure is applied and heated in the vertical direction in the state of FIG. In this state, the conductive particles 12 come into contact with the electrode 3 and the electrode 5, and the two are electrically connected to each other. At this time, by sieving the particle size of the conductive particles 12 to a predetermined particle size, it is possible to fix the distance between the main substrate 1 and the cover glass 4 (corresponding to a cell gap) substantially constant.

As described above, the anisotropic conductive resin 11 is applied or semi-solidified on the electrode 3 of the main substrate 1, and the cover glass 4 is placed on the sheet for positioning and pressing. The electrode 3 of the main substrate 1 is heated by heating
And the electrode 5 of the cover glass 4 are made of conductive particles 1 having a predetermined particle size.
2, the connection is made conductive, and the distance between the two can be set to a predetermined distance.

FIG. 4 is an explanatory view (part 2) of a main part of the present invention. This is a detailed structure and explanatory diagram of the conductive particles 12 contained in the anisotropic conductive resin 11 described above. FIG. 4A shows a configuration example of the conductive particles 12.

In FIG. 4A, the core material 21 is the following conductive particles or non-conductive particles obtained by sieving particles. -Conductive particles:-Metal particles: particles of a predetermined particle size obtained by sieving particles such as nickel-Non-metal particles: particles of a predetermined particle size obtained by granulating carbon and the like-Non-conductive particles : Particles of plastics: particles having a predetermined particle size such as divinylbenzene, ethoxy, etc. Particles of ceramics: particles having a predetermined particle size obtained by sieving particles such as alumina. Glass particles: predetermined particles obtained by sieving SiO2 particles. The soft metal 22 is a soft metal that covers the outer periphery of the core 21 as described below.

FIG. 4B shows a state in which the anisotropic conductive resin 11 containing the conductive particles 12 shown in FIG. 4A is applied and then pressurized and heated. Show. In this pressurized and heated state, the core 21 just fits between the electrode 3 of the main substrate 1 and the electrode 5 of the cover glass 4 as shown in the figure, and the soft metal 22 on the outer periphery of the core 21 is shown in the figure. And the electrodes 3 and 5 are connected as shown in FIG. This makes it possible to simultaneously and independently connect a large number of electrodes 3 on the main substrate 1 and a large number of opposing electrodes 5 on the cover glass 4, respectively, and to set the distance between the electrodes 3 and 5. The core 21
Can be fixed at a constant particle size.

As described above, by forming the conductive particles 12 by covering the periphery of the core 21 having a predetermined particle size with the soft metal, the sealing frame of S4 can be formed at the time of manufacturing according to the flowchart of FIG. At the time of curing, the distance between the electrode 3 of the main substrate 1 and the electrode 5 of the cover glass 4 can be set almost exactly at the interval of the predetermined particle size of the conductive particles 12.

FIG. 5 is an explanatory diagram of the present invention. FIG. 5 is a plan view of FIG. In the present invention, as shown in FIG.
The sealing frame of the cell and the connection between the electrode 5 of the cover glass 4 and the electrode 3 of the main substrate 1 are simultaneously performed by the anisotropic conductive resin 11, so that the conductive resin of FIG. This eliminates the need for a portion and eliminates the need for a space surrounded by a dotted line. As a result, the space of the main substrate 1 is reduced, and in particular, when the main substrate 1 is an LSI, a large number of LSIs (main substrate 1) can be obtained from one wafer, leading to a remarkable effect of reducing costs. . That is, in FIG. 5, the space between the electrode of the main substrate to which the conductive resin of FIG. 7 is applied and the electrode of the cover glass becomes unnecessary.

FIG. 6 is an explanatory view of a concrete example of the present invention. FIG. 6A shows a top view, and FIG. 6B shows a front side view. In FIG. 6A, the LSI is the main substrate 1 described above, and a portion described as a cell (800 × 600) is a portion for injecting and sealing liquid crystal, and a sealing frame around the portion. The portion indicated by a circle in the sealing frame is a portion where the electrode 3 of the LSI (main substrate 1) and the electrode (ITO) 5 of the cover glass 4 are connected by the anisotropic conductive resin 11. .

In FIG. 6B, the upper LSI 41
Is an LSI 41 shown in FIG. 6A and corresponds to the main board 1 shown in FIG. Lower cover glass 4
Is the cover glass 4 of FIG.
1 as shown in the figure, and a large number of electrodes and F
Many opposing electrodes of a PC (flexible printed circuit board) are connected and fixed to each other by an anisotropic conductive resin (ACF).

The FPC is electrically connected to the cover glass 4 and the LSI 41 from the FPC.
A voltage is applied between the first electrode and the electrode of the cover glass 4 to perform liquid crystal display. At this time, the LSI 41 corresponding to the main substrate 1 in FIG. 1 does not have a portion for connecting the electrode of the main substrate and the electrode of the cover glass with a conductive resin other than the sealing frame of the conventional FIG. Therefore, this part can be eliminated and a large number of LSIs 41 can be sampled from one wafer, which greatly contributes to cost reduction.

[0035]

As described above, according to the present invention,
Since a structure is adopted in which the formation of a sealing frame with a predetermined cell gap between the main substrate 1 and the cover glass 4 and the connection of both electrodes are simultaneously performed, the manufacturing process is simplified and both electrodes are connected. Space can be eliminated and downsizing can be realized. In particular, as shown in FIG.
When the LSI is manufactured by the method 1, the required area of the LSI 41 can be reduced, and a large number can be cut out from one substrate (for example, a wafer).

[Brief description of the drawings]

FIG. 1 is a structural diagram of one embodiment of the present invention.

FIG. 2 is a manufacturing flowchart of the present invention.

FIG. 3 is an explanatory diagram (part 1) of a main part of the present invention.

FIG. 4 is an explanatory view (part 2) of a main part of the present invention.

FIG. 5 is an explanatory diagram of the present invention.

FIG. 6 is an explanatory view of a specific example of the present invention.

FIG. 7 is an explanatory diagram of a conventional technique.

[Explanation of symbols]

 1: Main substrate 2, 3, 5: Electrode 4: Cover glass 6: Alignment film 11: Anisotropic conductive resin 12: Conductive particles 21: Core 22: Soft metal 41: LSI

Claims (6)

[Claims] 1. A liquid crystal display device for sealing a main substrate and a cover substrate with a predetermined cell gap, comprising: a main substrate on which electrodes are formed; a cover substrate on which electrodes facing the electrodes of the main substrate are formed; At a predetermined position on one or both of the substrate and the cover substrate, a resin containing conductive particles having a predetermined particle diameter is applied or a sheet in which the resin is in a semi-solid state is placed and pressurized and heated. A liquid crystal display device comprising: a cover frame formed with a predetermined cell gap; and a sealing frame for connecting corresponding electrodes of the two at the same time. 2. The method according to claim 1, wherein the conductive particles having a predetermined particle size are particles having a predetermined conductive particle size or non-conductive particles having a predetermined particle size covered with a conductive material. The liquid crystal display device according to claim 1. 3. A non-conductive particle having a particle diameter slightly smaller than the conductive particle having a predetermined particle diameter is inserted between the main substrate and the cover substrate. The liquid crystal display device according to claim 2. 4. A method of manufacturing a liquid crystal display device, wherein a main substrate and a cover substrate are sealed with a predetermined cell gap, wherein one of the main substrate on which electrodes are formed and the cover substrate on which electrodes facing the electrodes of the main substrate are formed. Alternatively, a resin containing conductive particles having a predetermined particle diameter is applied to both predetermined positions, or a sheet in which the resin is in a semi-solid state is placed thereon and pressurized and heated, and the main substrate and the cover substrate are separated from each other by a predetermined amount. A method of manufacturing a liquid crystal display device, comprising: forming a cell gap; fixing the cell gap; and simultaneously forming a sealing frame for connecting electrodes facing each other. 5. The method according to claim 1, wherein the conductive particles having a predetermined particle size are particles having a predetermined conductive particle size or nonconductive particles having a predetermined particle size covered with a conductive material. The method for manufacturing a liquid crystal display device according to claim 4. 6. A non-conductive particle having a particle size slightly smaller than the conductive particle having a predetermined particle size is provided between the main substrate and the cover substrate. A method for manufacturing a liquid crystal display device according to claim 5.