JP2000338509A - Production of liquid crystal display panel having lead pin - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for the production of a liquid crystal display device having a lead pin on one substrate by which deformation of the other substrate due to contraction of a molding agent, when a lead pin is fixed with the molding agent, is eliminated so as to prevent production of a display irregularity caused by an incorrectness in the substrate gap in the region near the portion where a terminal is arranged of the liquid crystal display device. SOLUTION: At least the substrate gap on the outside of a sealing material 13 along the portion 11a, where a terminal is arranged, of one substrate 11 of a liquid crystal display device 10, and the end face of the other substrate 12, are preliminarily covered with a water-repellent substance 23A. Then a lead pin 20 is mounted on the portion 11a where the terminal is arranged, and a molding agent 24 is applied and hardened to fix the lead pin 20.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a liquid crystal display device with lead pins.

[0002]

2. Description of the Related Art In a liquid crystal display device with lead pins, a liquid crystal layer is provided in a region surrounded by a sealant between a pair of substrates joined via a frame-like sealant, and an inner surface of the pair of substrates is provided. An electrode for applying an electric field to the liquid crystal layer is provided, and at least one of the pair of substrates is formed so that at least one edge thereof is projected outward from an end surface of the other substrate. A terminal arrangement portion is provided, and a lead pin for connecting the terminal to a display drive circuit is provided on the terminal arrangement portion of the liquid crystal display element in which signal input terminals corresponding to the electrodes are arranged in the terminal arrangement portion. The lead pin has a clip portion at its base.

FIGS. 3 and 4 are cross-sectional views of a conventional liquid crystal display device with lead pins.
Reference numeral 0 denotes a plurality of segment electrodes having a shape corresponding to the display pattern on the inner surface of one of a pair of substrates (transparent substrates made of glass) 11 and 12 bonded via a frame-shaped sealing material 13. (Transparent electrode) 14 is formed, and a common electrode (transparent electrode) 15 facing the plurality of segment electrodes 14 is formed on the inner surface of the other substrate 12.

This segment display type liquid crystal display element 1
0, generally, one edge of one substrate (hereinafter, referred to as a segment substrate) on which the segment electrode 14 is formed is positioned outward of an end surface of the other substrate (hereinafter, referred to as a common substrate) 12 on which the common electrode 15 is formed. A plurality of signal input terminals 16 corresponding to the plurality of segment electrodes 14 and the common electrode 15, respectively, are arranged in the terminal array portion 11a.

The plurality of segment electrodes 14 formed on the segment substrate 11 are electrically connected to the segment electrode terminals 16 via lead wires (not shown) derived from the segment electrodes 14, respectively. And the common electrode 1 formed on the common substrate 12.
Reference numeral 5 denotes a lead wire (not shown) which is led from the common electrode 15 to the board joint portion by the sealing material 13 and a conductive cloth material (not shown) provided on the board joint portion corresponding to the lead wire. And is electrically connected to the common electrode terminal 16.

The inner surfaces of the pair of substrates 11 and 12 cover the electrodes 14 and 15, respectively.
And a liquid crystal layer 1 provided in a region surrounded by the sealing material 13 between the pair of substrates 11 and 12.
The alignment direction of the liquid crystal molecules 9 in the vicinity of the substrates 11 and 12 is regulated by the alignment films 17 and 18, and is aligned in a predetermined initial alignment state between the pair of substrates 11 and 12.

The liquid crystal display element 10 is generally of the TN (twisted nematic) type in which liquid crystal molecules are twisted at a predetermined twist angle between a pair of substrates 11 and 12. Although not shown, the TN type liquid crystal display element 10 includes a polarizing plate on the outer surfaces of the pair of substrates 11 and 12, respectively.

On the other hand, a lead pin 20 attached to the terminal arrangement portion 11a of the liquid crystal display element 10 has
A clip portion 21 for holding the terminal arrangement portion 11a from both sides thereof is provided.
The clip portion 21 is connected to the terminal 16 of the terminal arrangement portion 11a.
The clip portion 21 is fixed to the terminal array portion 11a by a molding agent 22 by being fitted to the portion and attached to the terminal array portion 11a.

Generally, an anaerobic UV (ultraviolet ray) curing adhesive is used as the molding agent 22, and the molding agent 22 is provided on the terminal forming surface of the terminal arrangement portion 11a by the clip of the lead pin 20. It is applied to cover the part 21 and then cured by UV irradiation.

[0010]

However, the above-mentioned liquid crystal display device with lead pins has a problem in manufacturing the liquid crystal display element 1 at the time of manufacture.
Substrate spacing (cell gap) in the vicinity of terminal arrangement portion 11a of 0
Of the area, and display unevenness occurs in the area.

That is, in the above liquid crystal display device with lead pins, the lead pins 20 are attached to the terminal arrangement portions 11a of the liquid crystal display element 10 by fitting the clip portions 21 to the terminal arrangement portions 11a. A mold agent 22 is applied to the lead pin 20, and the clip portion 21 of the lead pin 20 is fixed to the terminal arrangement portion 1.
1a.

In the manufacture of the liquid crystal display device with lead pins, the molding agent 22 is applied in a relatively large amount in order to firmly fix the clip portion 21 of the lead pin 20 to the terminal arrangement portion 11a.

For this reason, the molding agent 22 applied to the terminal arrangement portion 11a has a substrate gap outside the sealing material 13 along the terminal arrangement portion 11a of the segment substrate 11, which is one substrate of the liquid crystal display element 20. In other words, the common board 12 enters the gap between the base of the terminal array portion 11a of the segment board 11 and the edge protruding outside the sealing material 13 of the common board 12 as the other board. Also adheres to the inner surface of the edge.

When the application amount of the molding agent 22 is further increased, the molding agent 22 not only enters the substrate gap and adheres to the inner surface of the edge of the common substrate 12 but also 12 also adheres to the end face.

In the liquid crystal display device with lead pins shown in FIG. 3, the molding compound 22 enters the gap between the substrates. In the liquid crystal display device with lead pins shown in FIG. The semiconductor chip enters the gap and adheres to the end surface of the common substrate 12.

The molding agent 22 applied to the terminal arrangement portion 11a is cured thereafter. However, the UV curing adhesive used as the molding agent 22 has a large shrinkage rate during curing. Substrate 1 made of glass
Due to the high adhesiveness to the molding agents 1 and 12,
2 is pulled in the direction of the terminal array portion 11a of the segment substrate 11, which is the other substrate, by the shrinkage of the molding compound 22 during curing, and the edge of the common substrate 12 As shown by the two-dot chain line in FIGS. 3 and 4, the vicinity of the sealing material 13 as a fulcrum, the edge protruding outside the sealing material 13 approaches the segment substrate 11, and Also, the inner portion is deformed so as to be separated from the segment substrate 11.

Therefore, in the conventional liquid crystal display device with lead pins, the substrate spacing (cell gap) near the terminal arrangement portion 11a of the liquid crystal display element 10, that is, the layer thickness of the liquid crystal layer 19 is inconsistent, and the liquid crystal birefringence Δn Δn of liquid crystal layer thickness d
The birefringence characteristics of the light determined by d
Differently in the vicinity of a, display unevenness such as a difference in brightness and color from other areas occurs in the area.

The present invention eliminates the deformation of the other substrate due to the shrinkage of the molding compound when fixing the lead pins mounted on the terminal arrangement portion of one substrate of the liquid crystal display device with the molding compound, and eliminates the terminal of the liquid crystal display device. It is an object of the present invention to provide a method for manufacturing a liquid crystal display device with lead pins, which can prevent display unevenness due to irregular substrate spacing in a region near an arrangement portion.

[0019]

According to the present invention, there is provided a method of manufacturing a liquid crystal display device with lead pins, comprising the steps of: providing a liquid crystal display element with a substrate gap outside a sealing material along a terminal arrangement portion of one substrate and an end surface of the other substrate; At least the substrate gap is covered with a water-repellent material in advance, and then a lead pin having a clip portion for clamping the terminal array portion from both sides thereof is fitted to the terminal portion of the terminal array portion. The clip is attached to the terminal arrangement portion, and then a molding agent is applied to the terminal arrangement portion, and the molding agent is cured to fix the clip portion of the lead pin to the terminal arrangement portion.

That is, in this manufacturing method, the liquid crystal display element is provided with a water-repellent material that is formed in advance on the gap between the substrate outside the sealing material along the terminal arrangement portion of one of the substrates and at least the gap between the end faces of the other substrate. After that, mounting of the lead pin to the terminal arrangement portion and application of a molding agent and fixing of the lead pin by curing thereof are performed.

According to this manufacturing method, when the molding agent is applied after the lead pins are attached to the terminal arrangement portion, the molding agent is prevented from entering the gap between the substrates by the water-repellent substance, and the other substrate is prevented from being filled. Adhesion of the molding agent to the inner surface of the edge can be prevented.

The molding agent applied to the terminal arrangement portion shrinks due to subsequent curing, but the adhesiveness of the molding agent to the water-repellent substance is extremely small. Accordingly, the water-repellent substance is hardly deformed, so that the tensile force generated by the shrinkage of the molding agent does not act on the other substrate via the water-repellent substance to deform this substrate.

Therefore, according to the manufacturing method of the present invention, deformation of the other substrate due to shrinkage of the molding compound when fixing the lead pins mounted on the terminal arrangement portion of one substrate of the liquid crystal display element by the molding compound is prevented. It is possible to prevent the occurrence of display unevenness due to an irregular substrate interval in a region near the terminal arrangement portion of the liquid crystal display element.

[0024]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS As described above, the method of manufacturing a liquid crystal display device with lead pins according to the present invention provides a method of manufacturing a liquid crystal display device, the method comprising the steps of: By covering at least the substrate gap among the end faces with a water-repellent material in advance, and then mounting a lead pin to the terminal array portion and applying a molding agent and fixing the lead pin by curing the same, the Eliminating the deformation of the other substrate due to the shrinkage of the molding compound when fixing the lead pins mounted on the terminal arrangement portion of one substrate of the liquid crystal display element with the molding compound, and removing the substrate in the region near the terminal arrangement portion of the liquid crystal display element This is to prevent display irregularities due to irregular intervals.

In the manufacturing method according to the present invention, it is preferable that both the substrate gap and the end face of the other substrate are covered in advance with the water-repellent substance. To prevent the molding agent from adhering to both the inner surface and the end surface of the liquid crystal display device, to more reliably eliminate the deformation of the other substrate due to the shrinkage of the molding agent, and to reduce the distance between the substrates in the area near the terminal arrangement portion of the liquid crystal display element. The occurrence of display unevenness can be more effectively prevented.

[0026]

FIG. 1 is a sectional view of a liquid crystal display element and a lead pin mounting portion in each step showing a method of manufacturing a liquid crystal display device with lead pins according to a first embodiment of the present invention. In FIG. 1, the liquid crystal display element 10 and the lead pins 20 are the same as those shown in FIGS. 3 and 4, and the description thereof will be omitted by attaching the same reference numerals to the figures.

The manufacturing method of this embodiment will be described. In this embodiment, a liquid crystal display device with lead pins is manufactured through the following steps.

First, before carrying the liquid crystal display element 10 manufactured by a known manufacturing method to the lead pin mounting line, FIG.
As shown in FIG. 3A, a substrate gap outside the sealing material 13 along a terminal arrangement portion 11a of a segment substrate 11 which is one substrate of the liquid crystal display element 10, that is, a terminal arrangement portion of the segment substrate 11. A water-repellent substance 23A is applied to a gap between the base of the substrate 11a and an edge protruding outside the sealing material 13 of the common substrate 12, which is the other substrate. Cover.

In this embodiment, the water-repellent substance 2
As 3A, a water repellent containing a fluorine-based derivative as a main component and xylene hexafluoride as a solvent is used.

The water repellent 23A is injected into the base of the terminal array portion 11a of the segment substrate 11, the edge of the common substrate 12, and the sealing material 13 by injection means such as a syringe.
Is filled in the entire groove-shaped gap surrounded by the liquid crystal display element 1A to the lead pin mounting line.
Drying is performed by natural drying or forced drying using a carry-in waiting time of 0.

Next, the liquid crystal display device 10 is carried into a lead pin mounting line, and as shown in FIG. 1B, a clip portion 21 for holding the terminal arrangement portion 11a of the liquid crystal display device 10 from both sides thereof. Lead pin 20 having
The clip portion 21 is connected to the terminal 16 of the terminal arrangement portion 11a.
11a is attached to the terminal arrangement portion.

Next, as shown in FIG. 1C, a molding agent 24 made of an anaerobic UV (ultraviolet) curing adhesive is applied to the terminal forming surface of the terminal arrangement portion 11a. The terminal arrangement section 1
1a is applied to the end surface of the common substrate 12 on the opposite side to the segment substrate 11 having a thickness that does not adhere thereto, and then the mold agent 24 is cured by UV irradiation,
The clip part 21 of the lead pin 20 is fixed to the terminal arrangement part 11a.

In other words, the manufacturing method of this embodiment is based on the substrate gap outside the sealing material 13 along the terminal arrangement portion 11a of the liquid crystal display element 10 (the base of the terminal arrangement portion 11a of the segment substrate 11 and the other substrate). (A gap between the edge of the common substrate 12 and the edge protruding outside the sealing material 13) is previously covered with a water repellent 23A.
The mounting of the lead pins 20 to the terminal arrangement portion 11a and the fixing of the lead pins 20 by applying and curing a molding agent 24 are performed.

According to this manufacturing method, the liquid crystal cell 10
During the application of the molding agent 24 after the lead pins 20 are mounted on the terminal arrangement portions 11a of the segment substrate 11, the penetration of the molding agent 24 into the substrate gap is blocked by the water-repellent agent 23A, and the other substrate, the common substrate The adhesion of the molding agent 24 to the inner surface of the mold 12 can be prevented.

The molding agent 24 applied to the terminal arrangement portion 11a shrinks due to the subsequent curing, but the adhesiveness of the molding agent 24 to the water repellent agent 23A is extremely small. Since the water repellent agent 23A hardly deforms with the shrinkage of the agent 24, the tensile force generated by the shrinkage of the mold agent 24 acts on the common substrate 12 via the water repellent agent 23A, and 12 is not deformed.

Therefore, according to this manufacturing method, one substrate (segment substrate) 11 of the liquid crystal display element 10 is provided.
The deformation of the other substrate (common substrate) 12 due to shrinkage of the molding agent 24 when the lead pin 20 attached to the terminal arrangement portion 11a is fixed by the molding agent 24 is eliminated.
It is possible to prevent the occurrence of display unevenness due to an irregular substrate spacing in a region near the terminal arrangement portion 11a of the liquid crystal display element 10.

In the above embodiment, the water repellent 23A is
Although the entire groove-shaped gap surrounded by the base of the terminal array portion 11a of the segment substrate 11, the edge of the common substrate 12, and the sealing material 13 is filled, the water-repellent agent 23A is not necessarily filled in the groove-shaped space. It is not necessary to fill the entirety of the gap, and at least between the base of the terminal arrangement portion 11a of the segment substrate 11 and the edge of the common substrate 12 so as to cover the open surface of the groove-shaped clearance. For example, when the molding agent 24 is applied after the lead pins 20 are mounted, the molding agent 24 enters the substrate gap and the common substrate 12
Can be prevented from adhering to the inner surface of the sheet.

FIG. 2 is a cross-sectional view of a liquid crystal display element and a lead pin mounting portion in each step showing a method of manufacturing a liquid crystal display device with lead pins according to a second embodiment of the present invention. In FIG. 2, the liquid crystal display element 10 and the lead pins 20 are the same as those shown in FIGS. 3 and 4, and the description thereof will be omitted by attaching the same reference numerals to the figures.

The manufacturing method of this embodiment will be described. In this embodiment, a liquid crystal display device with lead pins is manufactured by the following steps.

First, before the liquid crystal display element 10 manufactured by a known manufacturing method is carried into the lead pin mounting line, FIG.
As shown in FIG. 1A, a substrate gap (segment substrate 1) outside a seal material 13 along a terminal array portion 11a of a segment substrate 11 which is one substrate of the liquid crystal display element 10 is formed.
(A gap between the base of the first terminal array portion 11a and an edge protruding outside the sealing material 13 of the common substrate 12 as the other substrate) and the common substrate 12 as the other substrate.
A water repellent substance 23B is applied to both of the end surfaces of the substrate, and the gap between the substrates is covered with the water repellent substance 23B.

In this embodiment, the water repellent material 2
As 3B, an epoxy resin having a small shrinkage ratio during curing is used.

The epoxy resin 23B can be dropped, for example, by a dispenser or by brushing.
The open surface of the groove-shaped gap surrounded by the base of the terminal array portion 11a of the segment substrate 11, the edge of the common substrate 12, and the sealing material 13 is closed, and almost the entire end surface of the common substrate 12 is closed. Is applied so as to cover it, and then cured by heating to the curing temperature of the epoxy resin 23B.

In this case, the epoxy resin 23B is
Since the shrinkage at the time of curing is small, the edge of the common substrate 12 is not pulled and deformed in the direction of the segment substrate 11 when the epoxy resin 23B is cured.

Next, the liquid crystal display element 10 is carried into a lead pin mounting line, and as shown in FIG. 2B, a clip portion 21 for holding the terminal arrangement portion 11a of the liquid crystal display element 10 from both sides thereof. Lead pin 20 having
The clip portion 21 is connected to the terminal 16 of the terminal arrangement portion 11a.
11a is attached to the terminal arrangement portion.

Next, as shown in FIG. 2C, a mold agent 24 made of an anaerobic UV (ultraviolet ray) curing adhesive is placed on the terminal forming surface of the terminal arrangement portion 11a. The clip portion 21 is coated and applied. Thereafter, the molding agent 24 is cured by UV irradiation, and the clip portion 21 of the lead pin 20 is connected to the terminal arrangement portion 11a.
Fixed to.

In this case, in this embodiment, both the substrate gap of the liquid crystal display element 10 and the end face of the common substrate 12 are covered with the epoxy resin 23B. Is applied to a thickness that covers the common substrate 12, the mold agent 24 does not directly adhere to the end surface of the common substrate 12.

That is, in the manufacturing method of this embodiment, the substrate gap outside the sealing material 13 along the terminal arrangement portion 11a of the liquid crystal display element 10 and the opposite side of the segment substrate 11 having the terminal arrangement portion 11a are provided. An epoxy resin 23B having water repellency in advance on the end surface of the common substrate 12
After that, mounting of the lead pin 20 to the terminal arrangement portion 11a and application of the molding agent 24 and fixing of the lead pin 20 by curing thereof are performed.

According to this manufacturing method, the liquid crystal cell 10
When the molding agent 24 is applied after the lead pins 20 are attached to the terminal arrangement portions 11a of the segment substrate 11, the molding agent 24 enters the substrate gap and the inner surface of the edge of the common substrate 12 which is the other substrate. To prevent the common substrate 12 from being deformed due to the shrinkage of the molding compound 24, and to prevent the common substrate 12 from being attached to the terminal arrangement portion of the liquid crystal display element 10. It is possible to more effectively prevent the occurrence of display unevenness due to an irregular substrate spacing in the region.

In this embodiment, the water repellent substance 23B
As the water-repellent substance 23B, any other resin may be used as long as it has a small shrinkage rate during curing, and a fluorine-based derivative as a main component and xylene hexafluoride as a solvent. A water repellent or the like may be used.

In the first and second embodiments,
A molding agent 24 for fixing the clip portion 21 of the lead pin 20 to the terminal array portion 11a of the liquid crystal display element 10
The mold agent 24 is applied only on the terminal forming surface of the terminal array portion 11a, but is applied so as to cover the entire clip portion 21 from the terminal forming surface of the terminal array portion 11a to the opposite surface. By doing so, the mounting strength of the lead pin 20 can be further increased.

Further, the first and second embodiments are as follows.
Terminal arrangement portion 1 is provided only on one substrate (segment substrate) 11.
Liquid crystal display element 1 of segment display type provided with 1a
This is a method for manufacturing a liquid crystal display device with lead pins, in which lead pins 20 are attached to the terminal arrangement portions 11a of the liquid crystal display device. The present invention can also be applied to the manufacture of a liquid crystal display device with lead pins in which lead pins are attached to terminal arrangement portions of the pair of substrates of a display element (for example, a liquid crystal display element of a simple matrix display system).

[0052]

According to the method of manufacturing a liquid crystal display device with lead pins of the present invention, at least one of the gap between the substrates outside the sealing material along the terminal arrangement portion of one substrate of the liquid crystal display element and the end face of the other substrate. The gap between the substrates is covered with a water-repellent substance in advance, and thereafter, the mounting of the lead pins to the terminal arrangement portion and the fixing of the lead pins by applying and curing a molding agent are performed. Eliminates deformation of the other substrate due to shrinkage of the molding agent when fixing the lead pins mounted on the terminal arrangement portion of the substrate with the molding agent, and display due to irregular substrate spacing in the area near the terminal arrangement portion of the liquid crystal display element. The occurrence of unevenness can be prevented.

In the manufacturing method of the present invention, it is preferable that both the substrate gap and the end face of the other substrate are covered in advance with the water-repellent substance. To prevent the molding agent from adhering to both the inner surface and the end surface of the liquid crystal display device, to more reliably eliminate the deformation of the other substrate due to the shrinkage of the molding agent, and to reduce the distance between the substrates in the area near the terminal arrangement portion of the liquid crystal display element. The occurrence of display unevenness can be more effectively prevented.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a liquid crystal display element and a lead pin mounting portion in each step showing a method for manufacturing a liquid crystal display device with lead pins according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view of a liquid crystal display element and a lead pin mounting portion in each step showing a method for manufacturing a liquid crystal display device with lead pins according to a second embodiment of the present invention.

FIG. 3 is a cross-sectional view of a conventional liquid crystal display device with lead pins.

FIG. 4 is a cross-sectional view of a conventional liquid crystal display device with lead pins.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Liquid crystal display element 11, 12 ... Substrate 11a ... Terminal arrangement part 13 ... Sealing material 14, 15 ... Electrode 16 ... Terminal 20 ... Lead pin 21 ... Clip part 23A ... Water repellent substance (water repellent) 23B ... Water repellent substance ( Epoxy resin) 24 Mold agent

Claims (2)

[Claims] A liquid crystal layer is provided in a region surrounded by the sealant between a pair of substrates joined via a frame-shaped sealant, and an electric field is applied to the liquid crystal layer on inner surfaces of the pair of substrates. An electrode for applying voltage is provided, and at least one substrate of the pair of substrates is provided with a terminal array portion formed by projecting at least one end edge outward from an end surface of the other substrate. A liquid crystal display with lead pins, wherein lead pins for connecting the terminals to a display drive circuit are attached to the terminal arrangement portion of the liquid crystal display element in which signal input terminals corresponding to the electrodes are arranged in the terminal arrangement portion. In a method of manufacturing a device, at least the substrate out of a substrate gap outside the seal material along a terminal arrangement portion of the one substrate of the liquid crystal display element and an end surface of the other substrate The gap is covered with a water-repellent material in advance, and then a lead pin having a clip portion for sandwiching the terminal array portion from both sides thereof is fitted to the terminal portion of the terminal array portion by attaching the clip portion to the terminal portion of the terminal array portion. A method of manufacturing a liquid crystal display device with lead pins, comprising: applying a molding agent to the terminal arrangement portion; curing the molding agent; and fixing the clip portion of the lead pin to the terminal arrangement portion. 2. The method for manufacturing a liquid crystal display device with lead pins according to claim 1, wherein both the substrate gap and the end surface of the other substrate are covered in advance with the water-repellent substance.