JPH11214115A - Electric contact and its manufacture - Google Patents
Electric contact and its manufactureInfo
- Publication number
- JPH11214115A JPH11214115A JP3215998A JP3215998A JPH11214115A JP H11214115 A JPH11214115 A JP H11214115A JP 3215998 A JP3215998 A JP 3215998A JP 3215998 A JP3215998 A JP 3215998A JP H11214115 A JPH11214115 A JP H11214115A
- Authority
- JP
- Japan
- Prior art keywords
- plating layer
- contact
- corrosion resistance
- electrical contact
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電気コンタクト及
びその製造方法、より詳細には金めっき層を有する耐蝕
性に優れた電気コンタクト及びその製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrical contact and a method for manufacturing the same, and more particularly, to an electrical contact having a gold plating layer and having excellent corrosion resistance, and a method for manufacturing the same.
【０００２】[0002]
【従来の技術】電気コネクタのコンタクトは、耐蝕性の
向上のために銅合金等の母材に種々のめっきを施したも
のが従来から使用されている。相手電気コネクタのコン
タクトとの接触圧が十分に高い場合は、母材に施すめっ
きの材料として錫が選択されることが多い。他方、接触
圧が低い場合には錫の酸化物を除去することが困難なの
で、電気的特性及び耐蝕性に優れた金が錫の代わりにめ
っき材料として選択されるのが一般的である。2. Description of the Related Art As a contact of an electric connector, a base material such as a copper alloy which has been subjected to various platings for improving corrosion resistance has been used. When the contact pressure with the contact of the mating electrical connector is sufficiently high, tin is often selected as a plating material applied to the base material. On the other hand, when the contact pressure is low, it is difficult to remove the oxide of tin, so that gold having excellent electrical properties and corrosion resistance is generally selected as a plating material instead of tin.
【０００３】[0003]
【発明が解決しようとする課題】金は高価であることか
ら、金めっきの厚さは減少傾向にある。ところが、金め
っきの厚さを薄くすると、金めっき層に発生するピンホ
−ル（ポロシティ）の数が増加する。このため、母材及
び金めっき層の間のニッケル等の下地金属、並びに母材
が腐蝕され易くなるので、コンタクト自体の耐蝕性が著
しく低下するという問題がある。Since gold is expensive, the thickness of gold plating tends to decrease. However, when the thickness of the gold plating is reduced, the number of pinholes (porosity) generated in the gold plating layer increases. For this reason, the base metal such as nickel between the base material and the gold plating layer and the base material are easily corroded, and there is a problem that the corrosion resistance of the contact itself is significantly reduced.
【０００４】また、高価な金の使用量を低減するため
に、相手コンタクトとの接点部分等の部分のみに選択的
に金めっきを施す、部分金めっきの手法も多用されつつ
ある。この場合、金の使用量は減少するものの、部分め
っきのために特別の設備、あるいは付加工程を必要とす
るので、コンタクトのコストを十分に低減することが困
難であるという問題がある。Further, in order to reduce the amount of expensive gold used, a technique of selective gold plating in which only a portion such as a contact portion with a counterpart contact is selectively plated with gold has been frequently used. In this case, although the amount of gold used is reduced, there is a problem that it is difficult to sufficiently reduce the cost of the contact because special equipment or an additional step is required for partial plating.
【０００５】従って、本発明は、耐蝕性を向上させる
か、又は耐蝕性を従来と同等で足りる場合は低コストの
電気コンタクト及びその製造方法を提供することを目的
とする。SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a low-cost electrical contact and a method of manufacturing the same, in which the corrosion resistance is improved or the corrosion resistance is equivalent to the conventional one.
【０００６】[0006]
【課題を解決するための手段】本発明の電気コンタクト
は、銅合金の母材の表面に下地金属めっき層を有し、そ
の上に金めっき層を有する電気コンタクトにおいて、前
記母材の表面粗度Ｒｙが０．０５μｍ〜０．７μｍであ
ることを特徴とする。According to the present invention, there is provided an electric contact having a base metal plating layer on a surface of a copper alloy base material, and a gold plating layer thereon. The degree Ry is 0.05 μm to 0.7 μm.
【０００７】本発明の電気コンタクトの製造方法は、銅
合金の母材の表面に下地金属めっき層を有し、その上に
金めっき層を有する電気コンタクトの製造方法におい
て、前記母材の条の少なくとも一方の主表面を研磨する
工程と、前記母材の条を電気コンタクトに成形する工程
と、前記電気コンタクトの表面に下地金属めっき層を形
成する工程と、前記下地金属めっき層の上に金めっき層
を形成する工程とからなることを特徴とする。According to a method of manufacturing an electrical contact of the present invention, there is provided a method of manufacturing an electrical contact having a base metal plating layer on a surface of a copper alloy base material and a gold plating layer thereon. A step of polishing at least one main surface, a step of forming the strip of the base material into an electrical contact, a step of forming a base metal plating layer on the surface of the electrical contact, and a step of forming a gold layer on the base metal plating layer. Forming a plating layer.
【０００８】また、本発明の別の電気コンタクトの製造
方法は、銅合金の母材の表面に下地金属めっき層を有
し、その上に金めっき層を有する電気コンタクトの製造
方法において、前記母材の条を電気コンタクトに成形す
る工程と、前記電気コンタクトの表面を研磨する工程
と、前記電気コネクタの表面に下地金属めっき層を形成
する工程と、前記下地金属めっき層の上に金めっき層を
形成する工程とからなることを特徴とする。In another aspect of the present invention, there is provided a method for manufacturing an electrical contact having a base metal plating layer on a surface of a copper alloy base material and a gold plating layer thereon. Forming a strip of material into an electrical contact, polishing the surface of the electrical contact, forming a base metal plating layer on the surface of the electrical connector, and forming a gold plating layer on the base metal plating layer. And a step of forming
【０００９】 〔発明の詳細な説明〕 以下、本発明の好適な実施の形態について説明する。[Detailed Description of the Invention] Hereinafter, a preferred embodiment of the present invention will be described.
【００１０】まず、本発明者は、耐蝕性に悪影響を与え
るピンホールの発生の原因を、めっき処理前のコンタク
ト（母材）の表面の微細な凹凸（傷を含む）や、コンタ
クト表面上に油、塵芥、酸化物等の不導体層が存在する
ことであると認識した。First, the inventor of the present invention described the cause of the occurrence of pinholes that adversely affect corrosion resistance on fine irregularities (including scratches) on the surface of a contact (base material) before plating and on the contact surface. It was recognized that the presence of a non-conductive layer such as oil, dust, oxides and the like.
【００１１】そこで、本発明者は、めっき処理前にコン
タクト表面に研磨（ポリッシング）処理を行ってコンタ
クト表面の粗度を小さくすることによって前述の凹凸又
は不導体層を除去すれば、金めっきを有するコンタクト
の耐蝕性が向上するのではないかという仮説を立てた。
後述の実験の結果、同一の金めっきの条件下では、ピン
ホールの数が著しく減少して耐蝕性を著しく向上させる
ことができ、また、薄い金めっきであっても、従来の比
較的厚い金めっきと同等の耐蝕性を得ることができた。Therefore, the inventor of the present invention intends to remove the above-mentioned unevenness or the non-conductive layer by performing a polishing (polishing) process on the contact surface before the plating process to reduce the roughness of the contact surface. The hypothesis was made that the corrosion resistance of the contact may be improved.
As a result of the experiment described below, under the same gold plating conditions, the number of pinholes was significantly reduced, and the corrosion resistance could be significantly improved. Corrosion resistance equivalent to plating could be obtained.
【００１２】研磨工程は、０．３μｍ以下、より具体的
には０．３μｍ、０．１μｍ及び０．０５μｍのアルミ
ナ砥粒を用いたバフ研磨であることが望ましいが、２０
００番以上の研磨紙を用いて研磨してもよい。研磨工程
は、めっき処理の前であればいつ行ってもよい。例え
ば、母材供給業者が母材である銅合金等の金属のインゴ
ッドを条材に圧延した後、条材の一主面又は両主面に研
磨を施して条材をコネクタ製造業者等に供給し、コネク
タ製造業者がその研磨後の条材をコンタクトに成形、即
ち、打抜き加工若しくは打抜き及び曲げ加工し、その
後、下地ニッケルめっき及び金めっきを施してもよい。
また、コネクタ製造業者等が、母材供給業者から供給さ
れた圧延後の金属条材をコンタクトに成形した後、少な
くとも相手コンタクトとの接触部分を研磨し、その後、
下地ニッケルめっき及び金めっきを施してもよい。後者
の場合は、研磨後の成形工程での傷、クラック等の発生
による表面粗度の悪化を招かないので、めっき後の最終
製品においても特に相手コンタクトと電気的に接触する
重要部分である接触部の表面粗度が維持できる利点があ
る。The polishing step is preferably buff polishing using alumina abrasive grains of 0.3 μm or less, more specifically, 0.3 μm, 0.1 μm and 0.05 μm.
Polishing may be performed using a polishing paper of No. 00 or more. The polishing step may be performed at any time before the plating process. For example, after a base material supplier rolls an ingot of a metal such as a copper alloy as a base material into a strip, one or both main surfaces of the strip are polished and the strip is supplied to a connector manufacturer or the like. Alternatively, the connector manufacturer may form the polished strip into contacts, that is, punching or punching and bending, and then apply nickel plating and gold plating on the base.
Also, after the connector manufacturer and the like, after forming the metal strip material after rolling supplied from the base material supplier into a contact, at least the contact portion with the mating contact is polished,
Nickel plating and gold plating may be applied. In the latter case, since the surface roughness is not deteriorated due to the occurrence of scratches, cracks, etc. in the forming process after polishing, the contact, which is an important part of the final product after plating, which is particularly in electrical contact with the mating contact. There is an advantage that the surface roughness of the part can be maintained.
【００１３】[0013]
【実施例１】板厚０．２ｍｍの燐青銅条を打抜き加工で
作成したコンタクトサンプルの表面を以下の表面祖度Ｒ
ｙ（ＩＳＯ／ＪＩＳで規定された最大粗度）： ・サンプル１ ： Ｒｙ＝０．１４μｍ （バフ研磨に
よる） ・サンプル２ ： Ｒｙ＝０．１７μｍ（４０００番の
研磨紙による） ・サンプル３ ： Ｒｙ＝０．５６μｍ（２０００番の
研磨紙による） ・サンプル４ ： Ｒｙ＝０．８１μｍ（１２００番の
研磨紙による） ・サンプル５ ： Ｒｙ＝１．４０μｍ（８００番の研
磨紙による） にそれぞれ研磨加工した後、通常の方法で、１．３μｍ
のニッケル下地めっき及び０．２μｍの金めっきを施し
て、サンプルを作成した。次に、これらサンプルを７０
％硝酸５００ｍｌを入れた内径２５ｃｍのデジケータ内
に３０分間暴露し、さらに１２５°Ｃの恒温槽内で３０
分間加熱した後、サンプルの表面に発生した腐蝕点の数
をカウントした。その結果、図１に示されるグラフを得
た。なお、図１において、縦軸は、最も表面粗度が小さ
いサンプル１の腐蝕点数を１とした場合の腐蝕点数の比
として示してある。EXAMPLE 1 The surface of a contact sample prepared by punching a phosphor bronze strip having a thickness of 0.2 mm was subjected to the following surface roughness R
y (maximum roughness defined by ISO / JIS): Sample 1: Ry = 0.14 μm (by buffing) Sample 2: Ry = 0.17 μm (using 4000 paper) Sample 3: Ry = 0.56 μm (using abrasive paper # 2000) Sample 4: Ry = 0.81 μm (using abrasive paper # 1200) Sample 5: Ry = 1.40 μm (using abrasive paper # 800) After that, 1.3 μm
And a 0.2 μm gold plating was applied to prepare a sample. Next, these samples were
For 30 minutes in a 25 cm inner diameter digitator containing 500 ml of nitric acid, and further in a thermostat at 125 ° C. for 30 minutes.
After heating for one minute, the number of corrosion points generated on the surface of the sample was counted. As a result, a graph shown in FIG. 1 was obtained. In FIG. 1, the vertical axis represents the ratio of the corrosion points when the corrosion point number of sample 1 having the smallest surface roughness is set to 1.
【００１４】図１のグラフから、表面粗度Ｒｙが０．７
μｍで腐蝕点数の減少傾向が飽和していることが理解で
きよう。従って、耐蝕性の効果が高いのは表面粗度Ｒｙ
が０．７μｍ以下の場合であるといえる。尚、Ｒｙの値
が小さいほど腐蝕点数が減少することは明らかだが、Ｒ
ｙを０．０５μｍ未満にすることは実質的に実施不可能
なので、０．０５μｍを下限とする。From the graph of FIG. 1, the surface roughness Ry is 0.7
It can be understood that the decreasing tendency of the corrosion points is saturated at μm. Therefore, the effect of the corrosion resistance is high because of the surface roughness Ry.
Is 0.7 μm or less. Although it is clear that the smaller the value of Ry, the lower the number of corrosion points,
Since it is practically impossible to make y smaller than 0.05 μm, the lower limit is set to 0.05 μm.
【００１５】また、サンプル１及びサンプル３につい
て、試験後の接触抵抗を測定したところ、サンプル１
（Ｒｙ＝０．１４μｍ）については、６．９６ｍΩ（接
触力５ｇｆ時）、２．４６ｍΩ（接触力５０ｇｆ時）、
サンプル３（Ｒｙ＝０．５６μｍ）については９．１０
ｍΩ（接触力５ｇｆ時）、２．８２ｍΩ（接触力５０ｇ
ｆ時）であった。この結果、腐蝕環境下においても良好
な電気的性能が得られると共に、表面粗度Ｒｙが小さい
ほど、また、接触力（接圧）が大きいほど、より良好な
電気的性能が得られることが理解できよう。さらに、表
面粗度Ｒｙが小さい場合は、接触力が小さくても接触抵
抗が低くなることも理解できよう。The contact resistance of the samples 1 and 3 after the test was measured.
(Ry = 0.14 μm), 6.96 mΩ (at a contact force of 5 gf), 2.46 mΩ (at a contact force of 50 gf),
9.10 for sample 3 (Ry = 0.56 μm)
mΩ (at contact force of 5 gf), 2.82 mΩ (contact force of 50 g)
f)). As a result, it is understood that good electrical performance can be obtained even in a corrosive environment, and better electrical performance can be obtained as the surface roughness Ry is smaller and the contact force (contact pressure) is larger. I can do it. Further, it can be understood that when the surface roughness Ry is small, the contact resistance is reduced even if the contact force is small.
【００１６】[0016]
【実施例２】表面粗度Ｒｙを０．６μｍに研磨した銅合
金の表面に１．３μｍのニッケルめっき及び０．５μｍ
の金めっきを施したサンプル（サンプルＡ）、及び表面
粗度Ｒｙを１．０μｍに研磨した銅合金の表面に１．３
μｍのニッケルめっき及び０．９μｍの金めっきを施し
たサンプル（サンプルＢ）について、ＩＥＣ規格５１２
−１１−７、Ｍｅｔｈｏｄ ３のＭｉｘｅｄ Ｆｌｏｗ
ｉｎｇ Ｇａｓ試験、即ち３０°Ｃ、７５％ＲＨで２０
ｐｐｂのＣｌ2 ガス、２００ｐｐｂのＮＯ2 ガス及び１
００ｐｐｂのＨ2 Ｓガスの混合気内に１０日間放置する
試験をした。この結果、サンプルＡの腐蝕点数は１ｃｍ
2 当たり８９個であり、サンプルＢの腐蝕点数は１ｃｍ
2 当たり１０１個であった。従って、表面粗度Ｒｙ０．
６μｍ且つ金めっき０．５μｍのサンプルの耐蝕性は、
表面粗度Ｒｙ１．０μｍ且つ金めっき０．９μｍのサン
プルの耐蝕性と略同等であるといえる。このことから、
表面粗度が小さい場合は、金めっきの厚さが薄くても表
面粗度が比較的大きく且つ金めっきの厚さが比較的厚い
場合と同等の耐蝕性が得られることが理解できよう。EXAMPLE 2 A copper alloy polished to a surface roughness Ry of 0.6 μm was plated with nickel of 1.3 μm and 0.5 μm thick.
The surface of a gold-plated sample (Sample A) and a copper alloy polished to a surface roughness Ry of 1.0 μm were 1.3
The sample (sample B) plated with nickel of 0.9 μm and gold of 0.9 μm was subjected to IEC standard 512.
-11-7, Mixed Flow of Method 3
ing Gas test, ie 20 at 30 ° C., 75% RH
ppb Cl 2 gas, 200 ppb NO 2 gas and 1
A test was conducted in which the mixture was left for 10 days in a mixture of 00 ppb H 2 S gas. As a result, the corrosion score of sample A was 1 cm.
The number of corrosion points of Sample B was 1 cm.
There were 101 per 2 pieces. Therefore, the surface roughness Ry0.
The corrosion resistance of the sample of 6 μm and gold plating 0.5 μm is as follows.
It can be said that the corrosion resistance of the sample having the surface roughness Ry of 1.0 μm and the gold plating of 0.9 μm is substantially the same. From this,
It can be understood that when the surface roughness is small, even if the thickness of the gold plating is thin, the surface roughness is relatively large and the same corrosion resistance as when the thickness of the gold plating is relatively thick can be obtained.
【００１７】前述の実施形態では、下地金属としてニッ
ケルが使用されたが、パラジウム又はパラジウムニッケ
ル合金等の他の金属でもよい。ニッケルを選択した場合
の下地金属の厚さは、クラック等の生じ易さを考慮する
と１．２７〜４．０μｍの範囲であることが好ましい。
また、電気コンタクトは、電気コネクタ用に限定するこ
となく、スイッチ又はリレ−等の電気部品に使用されて
もよい。更に、研磨工程は、電気コンタクトの成形途
中、即ち電気コンタクトを形成するプレス機内で行って
もよい。In the above embodiment, nickel is used as the base metal, but other metals such as palladium or a palladium nickel alloy may be used. When nickel is selected, the thickness of the base metal is preferably in the range of 1.27 to 4.0 μm in consideration of the likelihood of cracks and the like.
Further, the electric contact is not limited to an electric connector, but may be used for an electric component such as a switch or a relay. Further, the polishing step may be performed during the formation of the electrical contact, that is, in a press for forming the electrical contact.
【００１８】[0018]
【発明の効果】請求項１に係る電気コンタクトによれ
ば、母材の表面粗度が０．０５μｍ〜０．７μｍである
ので、母材表面の凹凸が極めて小さく、電気コンタクト
の耐蝕性が向上するという効果を奏する。また、従来と
同等の耐蝕性で足りる場合は、金めっきの厚さが従来よ
り薄くて済む。従って、使用する金の量が少なくなるの
で、低コストの電気コンタクトが得られる利点がある。According to the electric contact according to the first aspect, since the surface roughness of the base material is 0.05 μm to 0.7 μm, the unevenness of the surface of the base material is extremely small and the corrosion resistance of the electric contact is improved. It has the effect of doing. In addition, when corrosion resistance equivalent to that of the related art is sufficient, the thickness of the gold plating may be smaller than that of the related art. Therefore, there is an advantage that a low-cost electric contact can be obtained because the amount of gold used is reduced.
【００１９】請求項２に係る電気コンタクトの製造方法
によれば、母材の条の少なくとも一方の主表面を研磨す
る工程と、前記母材の条を電気コンタクト成形する工程
と、前記電気コンタクトの表面に下地金属めっき層を形
成する工程と、前記下地金属めっき層の上に金めっき層
を形成する工程とからなり、凹凸、不導体層等が除去さ
れた母材の表面に下地金属めっき層及び金めっき層が形
成されるので、耐蝕性が向上した電気コンタクトが得ら
れるという効果を奏する。また、従来の同等の耐蝕性で
足りる場合は、金の使用量を低減することができるの
で、低コストの電気コンタクトが得られるという利点が
ある。According to a second aspect of the present invention, there is provided a method of manufacturing an electrical contact, comprising: polishing at least one main surface of a strip of a base material; forming an electrical contact on the strip of the base material; A step of forming a base metal plating layer on the surface, and a step of forming a gold plating layer on the base metal plating layer, wherein the base metal plating layer Also, since the gold plating layer is formed, an effect is obtained that an electrical contact with improved corrosion resistance can be obtained. In addition, when the conventional corrosion resistance is sufficient, the amount of gold used can be reduced, so that there is an advantage that a low-cost electrical contact can be obtained.
【００２０】請求項３に係る電気コンタクトの製造方法
は、母材の条を電気コンタクトに成形する工程と、前記
電気コンタクトの表面を研磨する工程と、前記電気コン
タクトの表面に下地金属めっき層を形成する工程と、前
記下地金属めっき層の上に金めっき層を形成する工程と
からなるので、凹凸、不導体層等が除去された母材の表
面に下地金属めっき層及び金めっき層が形成されるの
で、耐蝕性が向上した電気コンタクトが得られるという
効果を奏する。又、従来と同等の耐蝕性で足りる場合
は、金の使用量を低減することができるので、低コスト
の電気コンタクトが得られるという利点がある。さら
に、傷等が生じ易いコンタクト成形工程の後に研磨工程
があるので、最終製品の電気コンタクトの母材の表面粗
度が小さく維持されているので、より耐蝕性に優れると
いう利点がある。According to a third aspect of the present invention, there is provided a method of manufacturing an electric contact, comprising: forming a base material strip into an electric contact; polishing the surface of the electric contact; and forming a base metal plating layer on the surface of the electric contact. Forming, and forming a gold plating layer on the base metal plating layer, so that the base metal plating layer and the gold plating layer are formed on the surface of the base material from which the irregularities, the non-conductive layer, etc. have been removed. Therefore, there is an effect that an electrical contact with improved corrosion resistance can be obtained. In addition, when corrosion resistance equivalent to that of the related art is sufficient, the amount of gold used can be reduced, so that there is an advantage that a low-cost electric contact can be obtained. Furthermore, since the polishing step is performed after the contact forming step in which scratches and the like are likely to occur, the surface roughness of the base material of the electrical contact of the final product is kept small, so that there is an advantage that the corrosion resistance is more excellent.
【図１】母材の表面粗度Ｒｙとピンホールの数（比で表
した）との関係を示すグラフである。FIG. 1 is a graph showing the relationship between the surface roughness Ry of a base material and the number of pinholes (expressed as a ratio).
─────────────────────────────────────────────────────
────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成１０年３月１３日[Submission date] March 13, 1998
【手続補正２】[Procedure amendment 2]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】０００９[Correction target item name] 0009
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【０００９】[0009]
【発明の実施の形態】以下、本発明の好適な実施の形態
について説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a preferred embodiment of the present invention will be described.
Claims (3)
有し、その上に金めっき層を有する電気コンタクトにお
いて、 前記母材の表面粗度Ｒｙが０．０５μｍ〜０．７μｍで
あることを特徴とする電気コンタクト。1. An electrical contact having a base metal plating layer on a surface of a copper alloy base material and a gold plating layer thereon, wherein the surface roughness Ry of the base material is 0.05 μm to 0.7 μm. An electrical contact, characterized in that:
有し、その上に金めっき層を有する電気コンタクトの製
造方法において、 前記母材の条の少なくとも一方の主表面を研磨する工程
と、 前記母材の条を電気コンタクトに成形する工程と、 前記電気コンタクトの表面に下地金属めっき層を形成す
る工程と、 前記下地金属めっき層の上に金めっき層を形成する工程
と、からなることを特徴とする電気コネクタの製造方
法。2. A method for manufacturing an electrical contact having a base metal plating layer on a surface of a base material of a copper alloy and a gold plating layer thereon, wherein at least one main surface of the strip of the base material is polished. Forming a base metal plating layer on the surface of the electrical contact; forming a gold plating layer on the base metal plating layer; and A method for manufacturing an electrical connector, comprising:
有し、その上に金めっき層を有する電気コンタクトの製
造方法において、 前記母材の条を電気コンタクトに成形する工程と、 前記電気コンタクトの表面を研磨する工程と、 前記電気コンタクトの表面に下地金属めっき層を形成す
る工程と、 前記下地金属めっき層の上に金めっき層を形成する工程
と、からなることを特徴とする電気コンタクトの製造方
法。3. A method of manufacturing an electrical contact having a base metal plating layer on a surface of a copper alloy base material and a gold plating layer thereon, comprising: forming the base material strip into an electrical contact; Polishing the surface of the electrical contact; forming an underlying metal plating layer on the surface of the electrical contact; and forming a gold plating layer on the underlying metal plating layer. Method of manufacturing electrical contacts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3215998A JPH11214115A (en) | 1998-01-29 | 1998-01-29 | Electric contact and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3215998A JPH11214115A (en) | 1998-01-29 | 1998-01-29 | Electric contact and its manufacture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11214115A true JPH11214115A (en) | 1999-08-06 |
Family
ID=12351163
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3215998A Pending JPH11214115A (en) | 1998-01-29 | 1998-01-29 | Electric contact and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11214115A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003045533A (en) * | 2001-05-22 | 2003-02-14 | Enplas Corp | Contact pin and socket for electrical component |
| JP2004002989A (en) * | 2002-03-29 | 2004-01-08 | Nippon Mining & Metals Co Ltd | Copper alloy stock having satisfactory press working property and its production method |
| US7140929B2 (en) | 2004-03-09 | 2006-11-28 | Quasar System, Inc. | Electronic connector terminal, a method for plating, and a terminal stack |
| EP1915039A3 (en) * | 2006-10-18 | 2009-07-29 | Alps Electric Co., Ltd. | Method of manufacturing circuit board |
| JP2013525951A (en) * | 2010-04-16 | 2013-06-20 | アストリウム・リミテッド | Connector manufacturing method and connector |
| US10819058B2 (en) | 2018-05-11 | 2020-10-27 | Yazaki Corporation | Contact connection structure with an indent portion |
| JP2021156872A (en) * | 2020-03-25 | 2021-10-07 | 松田産業株式会社 | Palladium-cobalt alloy coating |
-
1998
- 1998-01-29 JP JP3215998A patent/JPH11214115A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003045533A (en) * | 2001-05-22 | 2003-02-14 | Enplas Corp | Contact pin and socket for electrical component |
| KR100943365B1 (en) * | 2001-05-22 | 2010-02-18 | 가부시키가이샤 엔프라스 | Contact pin and socket for electric parts |
| JP2004002989A (en) * | 2002-03-29 | 2004-01-08 | Nippon Mining & Metals Co Ltd | Copper alloy stock having satisfactory press working property and its production method |
| US7140929B2 (en) | 2004-03-09 | 2006-11-28 | Quasar System, Inc. | Electronic connector terminal, a method for plating, and a terminal stack |
| EP1915039A3 (en) * | 2006-10-18 | 2009-07-29 | Alps Electric Co., Ltd. | Method of manufacturing circuit board |
| US7922918B2 (en) | 2006-10-18 | 2011-04-12 | Alps Electric Co., Ltd. | Method of manufacturing circuit board used for switch device |
| JP2013525951A (en) * | 2010-04-16 | 2013-06-20 | アストリウム・リミテッド | Connector manufacturing method and connector |
| US10819058B2 (en) | 2018-05-11 | 2020-10-27 | Yazaki Corporation | Contact connection structure with an indent portion |
| JP2021156872A (en) * | 2020-03-25 | 2021-10-07 | 松田産業株式会社 | Palladium-cobalt alloy coating |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4024244B2 (en) | Conductive material for connecting parts and method for manufacturing the same | |
| KR100870334B1 (en) | Conductive material for connecting part and method for manufacturing the conductive material | |
| US7147933B2 (en) | Tin-silver coatings | |
| JP4934456B2 (en) | Plating material and electric / electronic component using the plating material | |
| JP2007024613A (en) | Contact terminal and connector for semiconductor device inspection using the same | |
| CN108886212B (en) | Electric contact and connector terminal pair | |
| JP4255939B2 (en) | Press-fit terminal and manufacturing method thereof | |
| JPH11214115A (en) | Electric contact and its manufacture | |
| JP2011042860A (en) | Tin plated copper or copper alloy material for connecting component used for connection with aluminum conductive member | |
| WO2017110859A1 (en) | Conductive material for connection component | |
| JP4090483B2 (en) | Conductive connection parts | |
| JPH051367A (en) | Copper alloy material for electric and electronic equipment | |
| JP2016091990A (en) | Terminal fitting and connector | |
| JP2011236499A (en) | Stainless steel and method of manufacturing the same | |
| JPH10226835A (en) | Copper base alloy for terminal and terminal using the same | |
| JPH0681189A (en) | Production of plated copper sheet or plated copper alloy sheet for producing electric connector | |
| JP3287080B2 (en) | Composite plated Cu or Cu alloy plate for electrical connection equipment production | |
| JP2003328157A (en) | Plated material, production method thereof and electrical and electronic parts obtained by using the same | |
| JP2004186152A (en) | Sparking plug and manufacturing method thereof | |
| KR101795887B1 (en) | ETCHING SOLUTION FOR Fe-Ni ALLOY STEEL SHEET AND ETCHING METHOD USING THE SAME | |
| JP3440635B2 (en) | Aluminum wire bonding pad and method of manufacturing the same | |
| JP7263203B2 (en) | Copper or copper alloy strip with surface coating layer | |
| JP2015083955A (en) | PROBE PIN MADE OF Pt-BASED ALLOY | |
| EP3428324A1 (en) | Ni-PLATED COPPER OR COPPER ALLOY MATERIAL, AND CONNECTOR TERMINAL, CONNECTOR, AND ELECTRONIC COMPONENT IN WHICH SAME IS USED | |
| JPS61239517A (en) | Manufacture of precious metal cover contact material |